PL3776648T3 - Struktura nośna i chłodząca obwodu - Google Patents

Struktura nośna i chłodząca obwodu

Info

Publication number
PL3776648T3
PL3776648T3 PL19717033.5T PL19717033T PL3776648T3 PL 3776648 T3 PL3776648 T3 PL 3776648T3 PL 19717033 T PL19717033 T PL 19717033T PL 3776648 T3 PL3776648 T3 PL 3776648T3
Authority
PL
Poland
Prior art keywords
cooling structure
circuit supporting
supporting
circuit
cooling
Prior art date
Application number
PL19717033.5T
Other languages
English (en)
Inventor
Susan C. Trulli
Christopher M. Laighton
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Publication of PL3776648T3 publication Critical patent/PL3776648T3/pl

Links

Classifications

    • H10W40/22—
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H03F1/301—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in MOSFET amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/211—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H10W40/037—
    • H10W40/25—
    • H10W44/20—
    • H10W70/05—
    • H10W70/611—
    • H10W70/65—
    • H10W74/01—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/255—Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/33—Bridge form coupled amplifiers; H-form coupled amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/423—Amplifier output adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H10W40/258—
    • H10W40/70—
    • H10W44/216—
    • H10W44/226—
    • H10W44/251—
    • H10W72/381—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Waveguides (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
PL19717033.5T 2018-04-09 2019-03-26 Struktura nośna i chłodząca obwodu PL3776648T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/948,404 US10785863B2 (en) 2018-04-09 2018-04-09 Circuit support and cooling structure
PCT/US2019/023988 WO2019199443A1 (en) 2018-04-09 2019-03-26 Circuit support and cooling structure

Publications (1)

Publication Number Publication Date
PL3776648T3 true PL3776648T3 (pl) 2023-04-17

Family

ID=66102769

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19717033.5T PL3776648T3 (pl) 2018-04-09 2019-03-26 Struktura nośna i chłodząca obwodu

Country Status (8)

Country Link
US (1) US10785863B2 (pl)
EP (1) EP3776648B1 (pl)
JP (1) JP7072669B2 (pl)
KR (1) KR102250940B1 (pl)
MY (1) MY205141A (pl)
PL (1) PL3776648T3 (pl)
SG (1) SG11202009487QA (pl)
WO (1) WO2019199443A1 (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY192051A (en) * 2016-12-29 2022-07-25 Intel Corp Stacked dice systems
US11152279B2 (en) 2018-03-26 2021-10-19 Raytheon Company Monolithic microwave integrated circuit (MMIC) cooling structure
US11075141B2 (en) 2018-09-14 2021-07-27 Raytheon Company Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
US10896861B2 (en) * 2019-04-22 2021-01-19 Raytheon Company Heterogeneous multi-layer MMIC assembly
JP7177918B2 (ja) * 2019-04-23 2022-11-24 京セラ株式会社 配線基板、電子装置及び電子モジュール
US11545297B2 (en) * 2019-06-06 2023-01-03 Toyota Motor Engineering & Manufacturing North America, Inc. Functionally graded thermal vias for inductor winding heat flow control
US11252811B2 (en) * 2020-01-15 2022-02-15 Cisco Technology, Inc. Power distribution from point-of-load with cooling
US11032947B1 (en) 2020-02-17 2021-06-08 Raytheon Company Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones
US11406007B2 (en) 2020-02-19 2022-08-02 Raytheon Company Radio frequency (RF) energy transmission line transition structure
EP4307338B1 (en) * 2022-07-12 2024-11-27 Comet AG Radio frequency generator
US12238898B2 (en) * 2022-10-06 2025-02-25 Ciena Corporation Method and apparatus for managing heat distribution in a semiconductor device
US12496648B2 (en) 2022-11-22 2025-12-16 Raytheon Company Furnace braze cycle enhancement
CN118693499B (zh) * 2024-08-28 2024-11-15 四川中久防务科技有限公司 一种基于MEMS工艺的3dB电桥的生产方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3156091A (en) 1961-07-19 1964-11-10 Curtiss Wright Corp Multi-layer anisotropic heat shield construction
US3980105A (en) 1974-07-10 1976-09-14 Hitco Laminated article comprising pyrolytic graphite and a composite substrate therefor
US4057610A (en) 1975-07-25 1977-11-08 Monsanto Company Hose reinforced with discontinuous fibers oriented in the radial direction
US4627472A (en) 1978-07-31 1986-12-09 Monsanton Company Hose reinforced with discontinuous fibers oriented in the radial direction
DE3573973D1 (en) 1984-02-13 1989-11-30 Victor Company Of Japan Playback apparatus for audiovisual disc records
US5241450A (en) * 1992-03-13 1993-08-31 The United States Of America As Represented By The United States Department Of Energy Three dimensional, multi-chip module
US5545924A (en) * 1993-08-05 1996-08-13 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits
US5434362A (en) * 1994-09-06 1995-07-18 Motorola, Inc. Flexible circuit board assembly and method
JP3282608B2 (ja) 1999-03-23 2002-05-20 日本電気株式会社 多層基板
US6075701A (en) 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6387462B1 (en) 1999-12-10 2002-05-14 Ucar Graph-Tech Inc. Thermal insulating device for high temperature reactors and furnaces which utilize highly active chemical gases
JP4272329B2 (ja) 2000-03-15 2009-06-03 京セラ株式会社 半導体素子収納用パッケージ
US20020006523A1 (en) 2000-07-07 2002-01-17 Obeshaw Dale Francis Structural members containing vibration damping mechanisms and methods for making the same
US20020157819A1 (en) * 2001-04-04 2002-10-31 Julian Norley Graphite-based thermal dissipation component
US6538892B2 (en) 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6686654B2 (en) 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
US6758263B2 (en) 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20130271905A1 (en) * 2002-10-22 2013-10-17 Jason A. Sullivan Systems and methods for providing dynamic computing systems
US6717813B1 (en) 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
JP4391366B2 (ja) 2003-09-12 2009-12-24 古河電気工業株式会社 ヒートパイプを備えたヒートシンクおよびその製造方法
KR100586698B1 (ko) 2003-12-23 2006-06-08 삼성전자주식회사 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈
US20070053168A1 (en) 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US7005584B2 (en) * 2004-02-13 2006-02-28 Honeywell International Inc. Compact navigation device assembly
US7677299B2 (en) 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
US7303005B2 (en) 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
US7307491B2 (en) * 2005-11-21 2007-12-11 Harris Corporation High density three-dimensional RF / microwave switch architecture
US7471175B2 (en) * 2006-04-26 2008-12-30 Ems Technologies, Inc. Planar mixed-signal circuit board
US7532073B2 (en) * 2007-09-12 2009-05-12 Viasat, Inc. Solid state power amplifier with multi-planar MMIC modules
US20090091892A1 (en) * 2007-09-26 2009-04-09 Rohm Co., Ltd. Semiconductor Device
JP2010129806A (ja) 2008-11-28 2010-06-10 Mitsubishi Electric Corp 電力用半導体装置および製造方法
US20100177796A1 (en) 2009-01-09 2010-07-15 Newport Corporation Laser device and heat sink with core to manage stress due to thermal expansion
US8085531B2 (en) 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
US8339790B2 (en) * 2010-09-10 2012-12-25 Raytheon Company Monolithic microwave integrated circuit
US10347559B2 (en) 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
DE102011078674A1 (de) 2011-07-05 2013-01-10 Siemens Aktiengesellschaft Kühlbauteil
US9746248B2 (en) 2011-10-18 2017-08-29 Thermal Corp. Heat pipe having a wick with a hybrid profile
US8866291B2 (en) * 2012-02-10 2014-10-21 Raytheon Company Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
US9093442B1 (en) * 2013-03-15 2015-07-28 Lockheed Martin Corporation Apparatus and method for achieving wideband RF performance and low junction to case thermal resistance in non-flip bump RFIC configuration
US9261924B2 (en) 2013-09-05 2016-02-16 Dell Inc. Heat pipe assemblies
EP3090609B1 (en) * 2014-01-02 2017-06-28 Philips Lighting Holding B.V. Method for manufacturing a non-planar printed circuit board assembly
US9318450B1 (en) 2014-11-24 2016-04-19 Raytheon Company Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)
US9674986B2 (en) * 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US9889624B2 (en) 2015-10-09 2018-02-13 Raytheon Company Anisotropic thermal conduit
US20170284647A1 (en) * 2016-03-31 2017-10-05 Osram Sylvania Inc. Flexible interconnection between substrates and a multi-dimensional light engine using the same
US9913376B2 (en) * 2016-05-04 2018-03-06 Northrop Grumman Systems Corporation Bridging electronic inter-connector and corresponding connection method
US9978698B1 (en) * 2017-01-25 2018-05-22 Raytheon Company Interconnect structure for electrical connecting a pair of microwave transmission lines formed on a pair of spaced structure members
US11152279B2 (en) 2018-03-26 2021-10-19 Raytheon Company Monolithic microwave integrated circuit (MMIC) cooling structure

Also Published As

Publication number Publication date
KR102250940B1 (ko) 2021-05-11
JP7072669B2 (ja) 2022-05-20
SG11202009487QA (en) 2020-10-29
US10785863B2 (en) 2020-09-22
US20190313522A1 (en) 2019-10-10
EP3776648A1 (en) 2021-02-17
MY205141A (en) 2024-10-03
WO2019199443A1 (en) 2019-10-17
KR20200133388A (ko) 2020-11-27
JP2021518990A (ja) 2021-08-05
EP3776648B1 (en) 2023-01-04

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