JP2021509426A - 優れた機械的及び耐食特性を有するポリアリーレンスルフィド樹脂組成物 - Google Patents
優れた機械的及び耐食特性を有するポリアリーレンスルフィド樹脂組成物 Download PDFInfo
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- JP2021509426A JP2021509426A JP2020536273A JP2020536273A JP2021509426A JP 2021509426 A JP2021509426 A JP 2021509426A JP 2020536273 A JP2020536273 A JP 2020536273A JP 2020536273 A JP2020536273 A JP 2020536273A JP 2021509426 A JP2021509426 A JP 2021509426A
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- transition metal
- polyarylene sulfide
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- 239000011342 resin composition Substances 0.000 title claims abstract description 65
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 33
- 230000007797 corrosion Effects 0.000 title abstract description 15
- 238000005260 corrosion Methods 0.000 title abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 229910052723 transition metal Inorganic materials 0.000 claims description 33
- 150000003624 transition metals Chemical class 0.000 claims description 33
- 239000002923 metal particle Substances 0.000 claims description 28
- 239000002667 nucleating agent Substances 0.000 claims description 22
- 239000011256 inorganic filler Substances 0.000 claims description 21
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 21
- 239000000155 melt Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 10
- 229910000077 silane Inorganic materials 0.000 claims description 10
- 150000004756 silanes Chemical class 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
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- 239000010936 titanium Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
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- 239000012748 slip agent Substances 0.000 claims description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
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- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- ZVTQDOIPKNCMAR-UHFFFAOYSA-N sulfanylidene(sulfanylideneboranylsulfanyl)borane Chemical compound S=BSB=S ZVTQDOIPKNCMAR-UHFFFAOYSA-N 0.000 claims description 2
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- JYVATDLODMRIPD-UHFFFAOYSA-N ethyl carbamate silane Chemical class [SiH4].CCOC(N)=O JYVATDLODMRIPD-UHFFFAOYSA-N 0.000 claims 1
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- 150000001491 aromatic compounds Chemical class 0.000 description 9
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- 229910052796 boron Inorganic materials 0.000 description 8
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- BBOLNFYSRZVALD-UHFFFAOYSA-N 1,2-diiodobenzene Chemical compound IC1=CC=CC=C1I BBOLNFYSRZVALD-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
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- 229910021540 colemanite Inorganic materials 0.000 description 2
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- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
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- 229910052740 iodine Inorganic materials 0.000 description 2
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- 239000003505 polymerization initiator Substances 0.000 description 2
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- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 2
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- GPYDMVZCPRONLW-UHFFFAOYSA-N 1-iodo-4-(4-iodophenyl)benzene Chemical group C1=CC(I)=CC=C1C1=CC=C(I)C=C1 GPYDMVZCPRONLW-UHFFFAOYSA-N 0.000 description 1
- SCCCFNJTCDSLCY-UHFFFAOYSA-N 1-iodo-4-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=C(I)C=C1 SCCCFNJTCDSLCY-UHFFFAOYSA-N 0.000 description 1
- 229940069744 2,2'-dithiobisbenzothiazole Drugs 0.000 description 1
- VALABLHQPAMOBO-UHFFFAOYSA-N 2,4-diiodo-1-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=C(I)C=C1I VALABLHQPAMOBO-UHFFFAOYSA-N 0.000 description 1
- JEVDBSPYZIVTGM-UHFFFAOYSA-N 2,6-diiodonaphthalene Chemical compound C1=C(I)C=CC2=CC(I)=CC=C21 JEVDBSPYZIVTGM-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- MHKLKWCYGIBEQF-UHFFFAOYSA-N 4-(1,3-benzothiazol-2-ylsulfanyl)morpholine Chemical compound C1COCCN1SC1=NC2=CC=CC=C2S1 MHKLKWCYGIBEQF-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- WGINUBKWLUSQGI-UHFFFAOYSA-N C1(=CC=CC=C1)C1=CC=CC=C1.[I] Chemical group C1(=CC=CC=C1)C1=CC=CC=C1.[I] WGINUBKWLUSQGI-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
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- DIFCZTZSUFXWEJ-UHFFFAOYSA-N s-(4-butyl-1,3-benzothiazol-2-yl)thiohydroxylamine Chemical compound CCCCC1=CC=CC2=C1N=C(SN)S2 DIFCZTZSUFXWEJ-UHFFFAOYSA-N 0.000 description 1
- YWWOEPOBDHZQEJ-UHFFFAOYSA-N s-(4-cyclohexyl-1,3-benzothiazol-2-yl)thiohydroxylamine Chemical compound C1=CC=C2SC(SN)=NC2=C1C1CCCCC1 YWWOEPOBDHZQEJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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Abstract
Description
を有する熱可塑性樹脂である。ポリアリーレンスルフィドは、鋼の代替品及び構造材料として有利に使用される。特に、ポリフェニレンスルフィド(PPS)は、その構造上の特徴により耐薬品性において優れている。それによって、従来のポリエステル樹脂やポリアミド樹脂によって置き換えることができなかった自動車部品や電気及び電子部品に幅広く使用されている(韓国公開特許公報2013−0020860、韓国特許番号10−1082636及び10−1475658を参照)。
遷移金属粒子は、樹脂組成物の総重量に対して0.05〜5重量%の量で用いられ得る。具体的には、遷移金属粒子は樹脂組成物の総重量に対して0.05〜3.0重量%、0.1〜3.0重量%、0.1〜2.0重量%、又は0.1〜1.0重量%の量で用いられ得る。より具体的には、0.2〜0.7重量%又は0.2〜1.0重量%の量で用いられ得る。
繊維状無機フィラーは樹脂組成物の耐熱性及び機械的強度を改善するのに役立つ。
無機核形成剤は、結晶成長を促進し、結晶サイズを減少しながら結晶化速度を増加させるために、結晶性ポリマーの初期の結晶核として作用する。
樹脂組成物はさらに相容化剤を含んで成り得る。
本発明は、樹脂組成物を成形することにより生成される成形品を供する。
以下に、下記実施例を参照して、本発明をより詳細に説明する。しかしながら、それら実施例は本発明を例示するために述べ、本発明の範囲はそれらに限定されない。
反応器内部の温度を測定することができる熱電対並びに窒素パージ及び真空に適用することができる真空ラインを備えた5リットル反応器に、5130gのパラ二ヨウ化ベンゼン(p−DIB)及び450gの硫黄を入れた。次いで、反応器を180℃に加熱し、p−DIBと硫黄を完全に溶解し混合した。その後、徐々に、初期反応条件である220℃及び350トルから最終反応条件である300℃及び0.6〜0.9トルへと、温度が上昇し圧力が低下し、各添加における1回量が19gで硫黄を7回添加しながら重合反応を実施した。重合反応の進捗を、「(現在の粘度/目標年度)×100%」の式により目標年度に対する現在の粘度の相対比として測定した。目標年度を2000ポアズに設定し、現在の粘度は重合反応の間に採取したサンプルを粘度計で測定した。重合反応が完成の80%進行した際、重合停止剤としてジフェニルジスルフィド35gを加え、反応を1時間行った。その後、真空を0.1〜0.5トルで徐々に適用して目標粘度に到達し、反応を停止してポリフェニレンスルフィド樹脂(PPS−1樹脂)を合成した。このようにして作製した樹脂を小さなストランドカッターを用いてペレットの形状に加工した。
温度を示差走査熱量測定(DSC)で10℃/分の速度で30℃から320℃まで昇温し、その後30℃に冷却し、再度温度を10℃/分の速度で30℃から320℃まで昇温し、融点を測定した。
PPS樹脂を0.4重量%の濃度で1−クロロナフタレンに250℃で25分間撹拌しながら溶解し、サンプルを作製した。次いで、高温ゲルパーミエーションクロマトグラフィ(GPC)システム(210℃)で1ml/分の流速でサンプルを流し、異なる分子量を有するポリフェニレンスルフィドをカラム内で順次分離した。その後、異なる分子量を有する分離したポリフェニレンスルフィドの強度をRI検出器で測定した。既知の分子量を有する標準資料(即ち、ポリスチレン)で検量線を作製し、サンプルの数平均分子量(Mn)及び多分散指数(PDI)を計算した。
溶融粘度は回転ディスク粘度計を用いて300℃で測定した。スイープ周波数法による測定において、0.6rad/秒〜500rad/秒まで角周波数を測定し、1.84rad/秒での粘度を溶融粘度と規定した。
PPS−2樹脂を、目標粘度を調整したことを除き、作製例1のような同様の方法で作製した。PPS−2は1980ポアズの溶融粘度、281℃の融点、17290g/モルのMn、2.9のPDIを有した。
作製例1で得られた59.3重量%のPPS−1樹脂、アミノシランで表面処理された40重量%のガラス繊維、0.2重量%のホウ素系核形成剤、及び0.5重量%の遷移金属粒子を混合用二軸スクリュー押出機に供給し、樹脂組成物を作製した。
下記表2に示されるような成分及び量であることを除き、PPS樹脂組成物を実施例1のような同じ方法で作製した。
実施例1〜6及び比較例1〜4で作製されたPPS樹脂組成物の物理特性を下記のような方法に従って各々測定し、測定結果を下記表3に示す。まず、実施例1〜6及び比較例1〜4で作製されたPPS樹脂組成物を310℃で各々射出成形し、物理特性を測定する射出成形の検体を作製した。
試験検体の引張強度及び伸びを、ISO527の方法に従って、ユニバーサル・テスト・マシン(Universal Testing Machine)(Zwick Roell Z010)を用いて測定した。
80mm×10mm×4mm(長さ×幅×厚さ)の射出成形の検体の衝撃強度を、ISO179の方法に従って、シャルピー衝撃試験機(東洋精機)を用いて測定した。
80mm×10mm×4mm(長さ×幅×厚さ)の射出成形の検体の曲げ強度及び曲げ弾性率を、ISO178の方法に従った測定した。
80mm×10mm×4mm(長さ×幅×厚さ)の射出成形の検体の熱変形温度(HDT)を、ISO75の方法に従って測定した。
鋼板及び射出成形の検体を、加圧装置を備えたサイクルオーブン中に置いた。試験片を鋼板で挟み、2kgの重さでプレスし、及び85℃、85%の湿度の条件下で放置した。同じ組成の検体10個をチャンバー内に置き、腐食を確認するために2分毎にそれらの内の1個を取り出した。その場合、最初の腐食が発生した時間を記録した。射出成形の検体のサイズは60mm×40mm×2mmであった。耐食−1の鋼板はステンレス鋼(ポスコ(Posco)製、商品名:304LN)、及び耐食−2の鋼板はニッケルメッキ鋼(シンスン(Shinsung)ケミカル株式会社製、商品名:ニクラド(NiKlad)752)であった。
実施例1と比較例1のペレット型サンプル(10mg)を、等温熱重量分析装置(TGA)を用いて320℃で30分間各々維持し、5分の増分で発生する放出ガス(アウトガス;outgas)の量(即ち、発生割合(%))を測定した。測定結果を下記表4に示す。
実施例1及び比較例1の80mm×10mm×4mmの射出成形の検体を230℃、5時間各々維持し、試験前後のヘーズ(曇り又は曇り度;haze)の変化を測定した。測定結果を下記表5に示す。
実施例1及び2並びに比較例1及び2の0.8mmのASTM曲げ検体が、250℃の高温オーブンで7分及び14分間各々エイジングされ、21分のサイクルエイジングを受け(7分のエイジングと7分の休止を3回)、耐熱性を評価した。エイジング前に測定した曲げ強度を100%として、エイジング前の曲げ強度に対するエイジング後の曲げ強度を測定することにより耐熱性を測定した。
Claims (13)
- 樹脂組成物であって、
ポリアリーレンスルフィド樹脂、遷移金属粒子、繊維状無機フィラー、及び無機核形成剤を含んで成り、
前記樹脂組成物は該組成物の総重量に対して0.05〜5.0重量%の遷移金属粒子を含んで成る、
樹脂組成物。 - 前記ポリアリーレンスルフィド樹脂が300℃で300〜10000ポアズの溶融粘度及び7000〜30000g/モルの数平均分子量を有する、請求項1に記載の樹脂組成物。
- 前記遷移金属粒子が0.1〜10μmの平均径及び球状、プレート形状、アモルファス形状、又はそれらの混合物を有する、請求項1に記載の樹脂組成物。
- 前記遷移金属粒子が銅、ニッケル、チタン、亜鉛、クロム、及び金から成る群から選択される少なくとも1つの遷移金属を含んで成る、請求項1に記載の樹脂組成物。
- 前記繊維状無機フィラーが、6〜15μmの平均径及び1〜5mmの平均長さを有し、並びにアミノ系シラン、エポキシ系シラン、ウレタン系シラン及びこれらの組合せから成る群から選択されるシランで表面処理される、請求項1に記載の樹脂組成物。
- 前記繊維状無機フィラーがアルミノホウケイ酸ガラス繊維である、請求項1に記載の樹脂組成物。
- 前記無機核形成剤が、ホウ酸塩、硫化ホウ素(B2S3)、塩化ホウ素(BCl3)、ホウ酸(H3BO3)、灰硼石、ホウ酸亜鉛、炭化ホウ素(B4C)、窒化ホウ素(BN)、及び酸化ホウ素(B2O3)から成る群から選択される少なくとも1つを含んで成る、 請求項1に記載の樹脂組成物。
- 40〜65重量%のポリアリーレンスルフィド樹脂、30〜55重量%の繊維状無機フィラー及び0.1〜2重量%の無機核形成剤を含んで成る、請求項1に記載の樹脂組成物。
- エポキシ系シラン、メルカプト系シラン、及びアミノ系シランから成る群から選択される少なくとも1つの相溶化剤をさらに含んで成る、請求項1に記載の樹脂組成物。
- 熱安定剤、潤滑剤、帯電防止剤、スリップ剤及び顔料から成る群から選択される少なくとも1つの添加剤をさらに含んで成る、請求項1に記載の樹脂組成物。
- 請求項1〜10のいずれかに記載の樹脂組成物を成形することにより生成される成形品。
- 自動車部品、電気部品、又は電子部品である、請求項11に記載の成形品。
- 薄層成形品又は射出成形品である、請求項11に記載の成形品。
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KR101457745B1 (ko) | 2011-08-19 | 2014-11-03 | 주식회사 엘지화학 | 폴리페닐렌 설파이드 제조 방법 및 이로부터 제조된 폴리페닐렌 설파이드 |
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KR102503262B1 (ko) * | 2016-05-19 | 2023-02-22 | 에이치디씨폴리올 주식회사 | 내화학성이 우수한 폴리아릴렌 설파이드 수지 조성물 |
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KR102625849B1 (ko) | 2024-01-16 |
KR20190080766A (ko) | 2019-07-08 |
CN111712545A (zh) | 2020-09-25 |
WO2019132513A1 (ko) | 2019-07-04 |
EP3733778A1 (en) | 2020-11-04 |
TWI788496B (zh) | 2023-01-01 |
US11332617B2 (en) | 2022-05-17 |
TW201936791A (zh) | 2019-09-16 |
US20210095123A1 (en) | 2021-04-01 |
JP7366905B2 (ja) | 2023-10-23 |
CN111712545B (zh) | 2023-06-02 |
EP3733778A4 (en) | 2021-09-08 |
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