JP2021502700A - 無線周波数回路におけるアディティブ製造技術(amt)ファラデー境界 - Google Patents
無線周波数回路におけるアディティブ製造技術(amt)ファラデー境界 Download PDFInfo
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Abstract
Description
る、請求項11に記載の方法。
Claims (20)
- 少なくとも1つの誘電体基板と、
前記誘電体基板内に形成されたトレンチと、
前記トレンチ内の電気的に連続した導電材料と、
を有する無線周波数回路。 - 前記電気的に連続した導電材料は、当該無線周波数回路の限られた領域内に電磁場を少なくとも部分的に閉じ込めるように構成されている、請求項1に記載の無線周波数回路。
- 前記電気的に連続した導電材料は、前記少なくとも1つの誘電体基板の層内に配置された第1の回路部分を、前記少なくとも1つの誘電体基板の前記層内に配置された第2の回路部分から、少なくとも部分的にアイソレートするように構成されている、請求項1に記載の無線周波数回路。
- 前記第1の回路部分及び前記第2の回路部分のうち少なくとも一方は、マイクロ波周波数レンジ又はミリメートル波周波数レンジのうち少なくとも一方内で動作するように構成されている、請求項3に記載の無線周波数回路。
- 前記第1の回路部分は、第1の周波数レンジ内で動作するように構成され、前記第2の回路部分は、前記第1の周波数レンジと重なり合う第2の周波数レンジ内で動作するように構成されている、請求項3に記載の無線周波数回路。
- 前記第1の回路部分は、第1の周波数レンジ内で動作するように構成され、前記第2の回路部分は、第2の周波数レンジ内で動作するように構成され、前記第2の周波数レンジ内の少なくとも1つの周波数は、前記第1の周波数レンジ内の少なくとも1つの周波数の1オクターブ内にある、請求項3に記載の無線周波数回路。
- 第1の誘電体基板及び第2の誘電体基板を更に有し、前記トレンチは、前記第1及び第2の誘電体基板内に形成されている、請求項1に記載の無線周波数回路。
- 前記第2の基板の底面上に配置された第1のグランドプレーンと、前記第2の基板の頂面上に配置された第2のグランドプレーンとを更に有し、前記第2のグランドプレーンの一部が、端子パッドを含む信号トレースを形成している、請求項7に記載の無線周波数回路。
- 前記信号トレースの前記端子パッドに固定された縦方向導体、を更に有する請求項8に記載の無線周波数回路。
- 前記電気的に連続した導電材料は、前記縦方向導体を少なくとも部分的に取り囲んでいる、請求項9に記載の無線周波数回路。
- 電磁回路を製造する方法であって、
少なくとも1つの誘電体基板を用意し、
前記少なくとも1つの誘電体基板内にトレンチを機械加工し、
前記トレンチを導電材料で充填して、電気的に連続した導体を形成する、
ことを有する方法。 - 前記少なくとも1つの誘電体基板を用意することは、第1の誘電体基板及び第2の誘電体基板を用意することを含み、前記トレンチは、前記第1及び第2の誘電体基板内に形成される、請求項11に記載の方法。
- 前記第2の基板の底面上に第1のグランドプレーンを形成し、前記第2の基板の頂面上に第2のグランドプレーンを形成し、前記第2のグランドプレーンの一部が、端子パッドを含む信号トレースを形成する、ことを更に有する請求項12に記載の方法。
- 前記信号トレースの前記端子パッドに縦方向導体を固定する、ことを更に有する請求項13に記載の方法。
- 前記電気的に連続した導体は、前記縦方向導体を少なくとも部分的に取り囲む、請求項14に記載の方法。
- 電磁回路を製造する方法であって、
第1の基板上に配置された導電材料をミリングして信号トレースを形成し、該信号トレースは端子パッドを含み、
前記第1の基板に第2の基板を接合して、前記信号トレース及び端子パッドを前記第1の基板と前記第2の基板との間に実質的に封入し、
前記第2の基板に孔を開けて、前記端子パッドへのアクセス孔を設け、
前記第1及び第2の基板中にミリングしてトレンチを形成し、該トレンチは少なくとも部分的に前記端子パッドの周りに位置付けられ、
前記アクセス孔の中に導電体を堆積させ、該導電体が前記端子パッドへの電気接続をなし、
前記トレンチの中に導電性インクを堆積させて、前記第1及び第2の基板内に電気的に連続した導体を形成する、
ことを有する方法。 - 前記電気的に連続した導体は、前記第1の基板内に配置された第1の回路部分を、前記第2の基板内に配置された第2の回路部分から、少なくとも部分的にアイソレートするように構成される、請求項16に記載の方法。
- 前記第1の回路部分及び前記第2の回路部分のうち少なくとも一方は、マイクロ波周波数レンジ又はミリメートル波周波数レンジのうち少なくとも一方内で動作するように構成される、請求項17に記載の方法。
- 前記第1の回路部分は、第1の周波数レンジ内で動作するように構成され、前記第2の回路部分は、前記第1の周波数レンジと重なり合う第2の周波数レンジ内で動作するように構成される、請求項17に記載の方法。
- 前記第1の回路部分は、第1の周波数レンジ内で動作するように構成され、前記第2の回路部分は、第2の周波数レンジ内で動作するように構成され、前記第2の周波数レンジ内の少なくとも1つの周波数は、前記第1の周波数レンジ内の少なくとも1つの周波数の1オクターブ内にある、請求項17に記載の方法。
Applications Claiming Priority (11)
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US201762584264P | 2017-11-10 | 2017-11-10 | |
US201762584260P | 2017-11-10 | 2017-11-10 | |
US62/584,264 | 2017-11-10 | ||
US62/584,260 | 2017-11-10 | ||
US201862636375P | 2018-02-28 | 2018-02-28 | |
US201862636364P | 2018-02-28 | 2018-02-28 | |
US62/636,375 | 2018-02-28 | ||
US62/636,364 | 2018-02-28 | ||
US201862673491P | 2018-05-18 | 2018-05-18 | |
US62/673,491 | 2018-05-18 | ||
PCT/US2018/059841 WO2019094600A1 (en) | 2017-11-10 | 2018-11-08 | Additive manufacturing technology (amt) faraday boundaries in radio frequency circuits |
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JP2021502700A true JP2021502700A (ja) | 2021-01-28 |
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US (1) | US10813210B2 (ja) |
EP (1) | EP3707970A1 (ja) |
JP (1) | JP7155261B2 (ja) |
KR (1) | KR102479633B1 (ja) |
CN (1) | CN111567148B (ja) |
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US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
SG11202004215XA (en) | 2017-11-10 | 2020-06-29 | Raytheon Co | Additive manufacturing technology (amt) low profile radiator |
EP3760014B1 (en) | 2018-02-28 | 2022-09-28 | Raytheon Company | Snap-rf interconnections |
JP7000589B2 (ja) | 2018-02-28 | 2022-01-19 | レイセオン カンパニー | アディティブ製造技術(amt)低プロファイル信号分割器 |
US11089673B2 (en) | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
DE102020104038A1 (de) | 2020-02-17 | 2021-08-19 | Friedrich-Alexander Universität Erlangen-Nürnberg | Verfahren zur Herstellung von hochfrequenztechnischen Funktionsstrukturen |
CN114025465A (zh) * | 2021-09-27 | 2022-02-08 | 中国航空无线电电子研究所 | 一种带隔离结构的pcb板 |
CN115513662B (zh) * | 2022-10-28 | 2024-04-26 | 中国电子科技集团公司第二十九研究所 | 一种曲面天线曲面电阻结构及其原位增材制造方法 |
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- 2018-11-08 WO PCT/US2018/059841 patent/WO2019094600A1/en unknown
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- 2018-11-08 EP EP18812470.5A patent/EP3707970A1/en not_active Withdrawn
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CN111567148B (zh) | 2023-07-28 |
KR20200078578A (ko) | 2020-07-01 |
EP3707970A1 (en) | 2020-09-16 |
US10813210B2 (en) | 2020-10-20 |
SG11202003802SA (en) | 2020-05-28 |
WO2019094600A1 (en) | 2019-05-16 |
KR102479633B1 (ko) | 2022-12-22 |
US20190150271A1 (en) | 2019-05-16 |
CN111567148A (zh) | 2020-08-21 |
JP7155261B2 (ja) | 2022-10-18 |
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