JP2021186876A - コンタクトチップ - Google Patents
コンタクトチップ Download PDFInfo
- Publication number
- JP2021186876A JP2021186876A JP2020106536A JP2020106536A JP2021186876A JP 2021186876 A JP2021186876 A JP 2021186876A JP 2020106536 A JP2020106536 A JP 2020106536A JP 2020106536 A JP2020106536 A JP 2020106536A JP 2021186876 A JP2021186876 A JP 2021186876A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- contact tip
- welding
- silicon dioxide
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000003466 welding Methods 0.000 claims abstract description 36
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 20
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 20
- 239000012212 insulator Substances 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000003780 insertion Methods 0.000 claims abstract description 11
- 230000037431 insertion Effects 0.000 claims abstract description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010953 base metal Substances 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 238000007747 plating Methods 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000011651 chromium Substances 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 4
- 239000003517 fume Substances 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 229910019974 CrSi Inorganic materials 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QZLJNVMRJXHARQ-UHFFFAOYSA-N [Zr].[Cr].[Cu] Chemical compound [Zr].[Cr].[Cu] QZLJNVMRJXHARQ-UHFFFAOYSA-N 0.000 description 2
- YDHWWBZFRZWVHO-UHFFFAOYSA-H [oxido-[oxido(phosphonatooxy)phosphoryl]oxyphosphoryl] phosphate Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O YDHWWBZFRZWVHO-UHFFFAOYSA-H 0.000 description 2
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 2
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 2
- ZZBBCSFCMKWYQR-UHFFFAOYSA-N copper;dioxido(oxo)silane Chemical compound [Cu+2].[O-][Si]([O-])=O ZZBBCSFCMKWYQR-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910018139 Cu5Si Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- PTTFMBKETMBPGI-UHFFFAOYSA-N [Si]([O-])([O-])([O-])O[Si]([O-])([O-])[O-].[Ni+2].[Ni+2].[Ni+2] Chemical compound [Si]([O-])([O-])([O-])O[Si]([O-])([O-])[O-].[Ni+2].[Ni+2].[Ni+2] PTTFMBKETMBPGI-UHFFFAOYSA-N 0.000 description 1
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical compound [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- XQCUWCZUYXJXRL-UHFFFAOYSA-N copper dioxosilane Chemical compound [Si](=O)=O.[Cu] XQCUWCZUYXJXRL-UHFFFAOYSA-N 0.000 description 1
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- VXPFEVUAMVPPQU-UHFFFAOYSA-N dioxosilane nickel Chemical compound [Ni].O=[Si]=O VXPFEVUAMVPPQU-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- OBSZRRSYVTXPNB-UHFFFAOYSA-N tetraphosphorus Chemical compound P12P3P1P32 OBSZRRSYVTXPNB-UHFFFAOYSA-N 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Images
Landscapes
- Arc Welding In General (AREA)
Abstract
Description
2 溶接用ワイヤ
3 挿通孔
6 母材
7 ニッケルメッキ被膜
8 銅メッキ被膜
Claims (3)
- 溶接用ワイヤを挿通する挿通孔を形成し、溶接用ワイヤを案内するとともに、溶接電流を供給するコンタクトチップにおいて、二酸化珪素と反応して絶縁物が生成されない銅合金製の母材に、二酸化珪素と反応して絶縁物が生成されない導電性の被膜を施したことを特徴とするコンタクトチップ。
- 前記母材がクロム銅製であり、前記被膜が銅メッキであることを特徴とする請求項1に記載のコンタクトチップ。
- 前記銅メッキ被膜の下層にニッケルメッキ被膜を施したことを特徴とした請求項2に記載のコンタクトチップ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020106536A JP2021186876A (ja) | 2020-05-25 | 2020-05-25 | コンタクトチップ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020106536A JP2021186876A (ja) | 2020-05-25 | 2020-05-25 | コンタクトチップ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021186876A true JP2021186876A (ja) | 2021-12-13 |
JP2021186876A5 JP2021186876A5 (ja) | 2023-06-23 |
Family
ID=78847918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020106536A Pending JP2021186876A (ja) | 2020-05-25 | 2020-05-25 | コンタクトチップ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2021186876A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022010356A (ja) * | 2017-02-17 | 2022-01-14 | 株式会社三洋物産 | 遊技機 |
-
2020
- 2020-05-25 JP JP2020106536A patent/JP2021186876A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022010356A (ja) * | 2017-02-17 | 2022-01-14 | 株式会社三洋物産 | 遊技機 |
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