JP2021185588A - Lid for optical device, package for optical device, and optical device - Google Patents

Abstract

To provide: a lid for an optical device, capable of alleviating uneven stress; a package for an optical device, including such a lid for an optical device; and an optical device.SOLUTION: A lid (130) for an optical device includes: a frame body (133) having a first wall part (H1), a second wall part (H2) higher than the first wall part (H1), and a third wall part (H3) and a fourth wall part (H4) connected to the first wall part (H1) and the second wall part (H2), the frame body surrounding a through hole; and a light transmitting member (135) closing one opening of the through hole in the frame body (133). Inside corner portions (P1, P2) between the first wall part (H1) and the fourth wall part (H4) and between the first wall part (H1) and the third wall part (H3), respectively, include respective loose corner portions (P1a, P2a) having the degree of bending looser than inside corner portions (P3, P4) between the second wall part (H2) and the third wall part (H3) and between the second wall part (H2) and the fourth wall part (H4), respectively.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a lid for an optical device, a package for an optical device, and an optical device.

Patent Document 1 discloses a lid that seals a mounting portion of an optical element in an optical device. The lid has a glass plate that allows light to pass through and a frame that holds the glass plate, and is joined to a substrate on which an optical element is mounted. The glass plate of the lid is held at an angle to the propagation path so that the reflected light does not enter the propagation path of the incident light or the emitted light of the optical element.

Japanese Unexamined Patent Publication No. 2017-017058

Stress may be applied to the lid, for example, when the lid is joined to the substrate. Since the lid for the optical device has anisotropy in structure such as the glass plate being held at an angle, the stress applied to the frame may be biased.

It is an object of the present disclosure to provide an optical device lid capable of alleviating stress bias, an optical device package having such an optical device lid, and an optical device.

The lid for an optical device of the present disclosure is
The frame that surrounds the through hole and
A translucent member that closes one opening of the through hole in the frame body,
Equipped with
The frame has a first wall portion, a second wall portion higher than the first wall portion, and a third wall portion and a fourth wall portion connected to the first wall portion and the second wall portion. death,
The inner corner between the first wall, the third wall, and the fourth wall is between the second wall, the third wall, and the fourth wall, respectively. Includes loose corners that are less curved than the inner corners of.

The optical device package of the present disclosure is
A substrate having a mounting part on which an optical element is mounted,
The lid for the optical device that seals the mounting portion, and
To prepare for.

The optical device of the present disclosure is
With the above optical device package,
The optical element mounted on the mounting part and
To prepare for.

According to the present disclosure, it is possible to provide a lid for an optical device capable of alleviating stress bias. Further, it is possible to provide an optical device package and an optical device having such an optical device lid.

It is a perspective view which shows the optical apparatus which concerns on embodiment of this disclosure. It is a separated perspective view explaining the component of the optical apparatus and a lid of FIG. 1. It is a top view of the optical apparatus of FIG. FIG. 3 is a cross-sectional view taken along the line AA of FIG. It is a perspective view (A), a plan view (B), a side view (C), and a bottom view (D) which show the frame body of a lid body. It is a perspective view (A), a plan view (B), a side view (C), and a bottom view (D) which show the frame body of the lid body of the modification 1. FIG. It is a plan view (A) which shows the frame body of the lid body of the modification 2 and a plan view (B) which shows the modification of the chamfered portion. It is a plan view (A)-(C) which shows the frame body of the lid body of the modification 3-5.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an optical device according to an embodiment of the present disclosure. FIG. 2 is a separated perspective view illustrating the components of the optical device and the lid of FIG. 1. FIG. 3 is a plan view of the optical device of FIG. FIG. 4 is a cross-sectional view taken along the line AA of FIG.

<Basic structure>
In the optical device 100 of the present embodiment, the substrate 110 having the mounting portion R1 of the optical element 102, the optical element 102 mounted on the mounting portion R1, and the lid 130 joined to the substrate 110 to seal the mounting portion R1. And. The substrate 110 and the lid 130 correspond to the package for the optical device, and the lid 130 corresponds to the lid for the optical device.

The optical element 102 is a MEMS (Micro Electro Mechanical Systems) element such as a mirror device having a mirror and a driving unit that changes the angle of the mirror. The mirror device reflects an incident light and the angle at which the light is reflected is controlled to project an image or the like on a screen outside the optical device 100. The optical element 102 may be any element that incidents or emits light, such as a MEMS element other than a mirror device, a light emitting element such as a light emitting diode, a light receiving element such as an optical sensor, or an imaging element such as a line sensor or an area sensor. Such an element may be used.

As shown in FIG. 2, the lid 130 has a metal frame 131 bonded to the substrate 110, a frame 133 bonded to the metal frame 131 via a bonding material 132, and a bonding material 134 to the frame body 133. A translucent member (for example, a glass plate) 135 to be joined is provided. The metal frame 131 is joined to the lower surface of the frame 133, and the translucent member 135 is joined to the upper surface of the frame 133.

The metal frame 131 and the frame body 133 have an annular shape that surrounds through holes that penetrate vertically. Further, the upper surface and the lower surface of the metal frame 131 have a shape corresponding to the joint surface of the substrate 110 such as a flat surface, and a shape corresponding to the lower surface of the frame body 133. The metal frame 131 includes a portion facing the lower surface of the frame body 133 and a margin portion 131b (outside the alternate long and short dash line in FIG. 2) protruding outside the lower surface of the frame body 133. The margin portion 131b extends over the entire circumference, and an electrode is applied to the margin portion 131b so that the metal frame 131 can be seam welded to the substrate 110. When the metal frame 131 and the substrate 110 are joined via a joining material such as a brazing material, the margin portion 131b may be omitted.

The frame body 133 has a first wall portion H1, a second wall portion H2, a third wall portion H3, and a fourth wall portion H4 that surround the through hole (see FIGS. 2 to 4). The first wall portion H1, the third wall portion H3, the second wall portion H2, and the fourth wall portion H4 are connected in this order so as to surround the through hole. The first wall portion H1 and the second wall portion H2 face each other, and the first wall portion H1 is lower than the second wall portion H2. The upper surfaces of the third wall portion H3 and the fourth wall portion H4 are inclined, the first wall portion H1 side is low, and the second wall portion H2 side is high.

The translucent member 135 is joined to the entire circumference of the upper surface of the frame body 133, that is, the upper surface of the first wall portion H1 to the fourth wall portion H4, and closes the upper opening of the through hole in the frame body 133. The upper surface of the frame body 133, that is, the upper surface of the first wall portion H1 to the fourth wall portion H4 has a shape corresponding to the joint portion of the translucent member 135, for example, a flat surface.

The frame 133 is integrally formed of, for example, a ceramic material (ceramic sintered body), has a higher rigidity than the translucent member 135, and has a coefficient of thermal expansion different from that of the metal frame 131.

The bonding material 132 may be a brazing material containing an active metal. The bonding material 134 may be low melting point glass.

The substrate 110 includes a substrate 111, a seal ring 112 that surrounds the mounting portion R1, and a wiring conductor 114. The substrate 111 is composed of an insulator such as a ceramic material (ceramic sintered body). The substrate 111 has a recess 111a in the center of the upper surface, and the mounting portion R1 of the optical element 102 is located in the recess 111a. The recess 111a may be omitted. The optical element 102 is bonded to the mounting portion R1 via a bonding material e1 (FIG. 4) such as a brazing material.

The seal ring 112 is an annular plate of metal, and is bonded to the substrate 111 via a bonding material e2 (FIG. 4) such as an active metal brazing material. The seal ring 112 is joined to the metal frame 131 of the lid 130 by seam welding or brazing material.

The wiring conductor 114 is located inside the internal electrode 114A located inside the seal ring 112 on the upper surface of the substrate 111, the external electrode 114B located outside the seal ring 112 on the upper surface of the substrate 111, and the substrate 111. It includes an internal conductor 114C connecting the internal electrode 114A and the external electrode 114B. The inner conductor 114C includes via conductors 114Ca and 114Cb and a film-like conductor 114Cc. The internal electrode 114A is electrically connected to the optical element 102 by wire bonding or the like. The external electrode 114B may be configured to be exposed on the lower surface of the substrate 111.

<Frame shape>
5A and 5B are a perspective view (A), a plan view (B), a side view (C), and a bottom view (D) showing a frame body of the lid. Of the first wall portion H1, the second wall portion H2, the third wall portion H3, and the fourth wall portion H4 constituting the frame body 133, the outer corner portion between two adjacent portions (on the outer peripheral side around the through hole). Corner portion) Q1 to Q4 may have a chamfered shape such as an R surface or a C surface. Of the first wall portion H1, the second wall portion H2, the third wall portion H3, and the fourth wall portion H4 constituting the frame body 133, the inner corner portion between two adjacent portions (inner peripheral side around the through hole). (Corner portion) P1 to P4 have an R surface.

The inner corners P1 and P2 are corners between the first wall H1 and the third wall H3, and corners between the first wall H1 and the fourth wall H4, and are inner corners. The portions P3 and P4 are corners between the second wall portion H2 and the third wall portion H3, and corners between the second wall portion H2 and the fourth wall portion H4.

The inner corners P1 and P2 include loose corners P1a and P2a having a looser degree of bending than the inner corners P3 and P4. A loose degree of bending means that the curvature is small (the radius of curvature is large) if it is an R surface. The loose corners P1a and P2a are located at the lower ends of the inner corners P1 and P2 (the ends far from the translucent member 135). The degree of bending of the inner corners P1 and P2 may change gently from the upper part to the lower part, and the degree of bending of the upper part may be the same as the degree of bending of the inner corners P3 and P4.

The outer corner portions Q1 to Q4 may have the same degree of bending. The first wall portion H1 to the fourth wall portion H4 may have the same thickness as each other.

<Stress of the lid>
The optical device 100 is manufactured by mounting the optical element 102 on the substrate 110 and then joining the lid 130 to the substrate 110. The joining step of the lid 130 includes a step of applying heat to the metal frame 131, and stress may be applied to the frame 133 due to the above heating.

The frame body 133 has anisotropy such that the first wall portion H1 is lower than the second wall portion H2, and the rigidity of the first wall portion H1 side is lowered by the shorter height of the first wall portion H1. .. Since the above anisotropy and the rigidity on the first wall portion H1 side are lowered, stress tends to be concentrated on the inner corner portions P1 and P2 on the first wall portion H1 side. Further, in the frame body 133, stress tends to be concentrated on the substrate 110 side where heat is applied to the joining process of the lid body 130. However, according to the lid 130 of the present embodiment, the lower ends of the inner corners P1 and P2 of the frame 133 include the loose corners P1a and P2a, and the degree of bending of the portion where stress is likely to be concentrated is loosened. The stress in this portion can be dispersed to prevent the stress from concentrating on a part of the frame 133.

Further, according to the lid 130 of the present embodiment, since the loose corner portions P1a and P2a are included in the lower end portions of the inner corner portions P1 and P2 and are not included in the upper portion, the opening closed by the translucent member 135. The area of the part can be large. Further, according to the lid body 130 of the present embodiment, the loose corner portions P1a and P2a have an R surface. Therefore, even if the gentle corners P1a and P2a are locally focused, the stress is dispersed and the concentration of fine stress can be suppressed.

(Modification 1)
FIG. 6 is a perspective view (A), a plan view (B), a side view (C), and a bottom view (D) showing the frame body of the lid body of the modified example 1. Modification 1 is the same as the lid 130 and the optical device 100 of the first embodiment except that the frame 133A is different.

The entire area of the frame body 133A from the upper part to the lower part of the inner corner portions P1 and P2 is the loose corner portions P1a and P2a. The loose corners P1a and P2a may have the same degree of bending from the upper part to the lower part, and the degree of bending changes between the upper part and the lower part in a range looser than the degree of bending in the inner corners P3 and P4. May be.

According to the lid 130 of the first modification, the degree of bending of the portion where stress is likely to be concentrated (lower parts of the inner corners P1 and P2) due to the influence of the joining process between the lid 130 and the substrate 110 is loosened to reduce the stress concentration. Can be relaxed. When the height of the first wall portion H1 is low and the upper surface and the lower surface of the first wall portion H1 are close to each other, the stress in the lower portion may be transmitted to the upper portion and the stress may be concentrated in the upper portion as well. However, according to the lid 130 of the modified example 1, since the entire area of the inner corners P1 and P2 is the loose corners P1a and P2a, the stress is dispersed even in the upper part of the inner corners P1 and P2 to relax the stress concentration. Can be done. The thickness of the first wall portion H1 to the fourth wall portion H4 is reduced, and the average height of the miniaturized lid 130 and frame 133A (the plane area when viewed from above is small) is lowered, and the height is reduced. In the lid 130 which is miniaturized in the direction or the lid 130 having both of these structures, it is particularly effective to be able to disperse the stress on the upper portions of the inner corners P1 and P2. According to the miniaturized lid 130 described above, the optical device 100 can be miniaturized. Further, according to the lid body 130 of the modification 1, by having the loose corner portions P1a and P2a over the entire inner corner portions P1 and P2, it is possible to obtain the effect that the formability of the frame body 133 can be improved.

(Modification 2)
FIG. 7A is a plan view showing the frame of the lid of the modified example 2. Modification 2 is the same as the lid 130 and the optical device 100 of the first embodiment except that the frame 133B is different.

In the frame body 133B, the inner corners P1 to P4 have a C surface. The inner corners P1 and P2 include loose corners P1a and P2a that are looser than the degree of bending of the C surface in the inner corners P3 and P4. The example of FIG. 7A shows an example in which the entire area is the loose corners P1a and P2a from the upper part to the lower part. Parts P1a and P2a may not be included. A loose degree of bending on the C surface means that the dimensions of the C surface are large.

FIG. 7B is a plan view showing a modified example of the chamfered portion. As shown in FIG. 7, the inner corner portions P1 to P4 or the loose corner portions P1a and P2a of the modified example 2 are n (n is 2 or more) instead of the C surface having a chamfered corner. It may be a chamfered portion having a shape chamfered by the surface W of (an integer of). Each of the ridges between the two adjacent surfaces W and W out of the n surfaces W extends in the direction (vertical direction) along the corner portion and has an obtuse angle.

Further, the chamfered portions of the inner corner portions P1 to P4 and the loose corner portions P1a and P2a of the modified example 2 have different shapes such as an R surface, a C surface, and a chamfered portion chamfered by n surfaces W. The chamfered portion may be mixed and applied. The comparison of the looseness of the R surface, the C surface, and the chamfered portion chamfered by the n surfaces W is inside the corner portion (indicated by the alternate long and short dash line in FIG. 7B) without chamfering. Based on the cross-sectional area S of the overhanging portion, it can be defined that the larger the area S, the looser the area.

In the lid body 130 of the modified example 2, as in the case of the lid body 130 of the first embodiment and the modified example 1, the portion where stress is likely to be concentrated in the joining step of the lid body 130 or the like (lower part of the inner corner portions P1 and P2). The degree of bending can be loosened to alleviate stress concentration.

(Variations 3 to 5)
FIG. 8 is a plan view (A) to (C) showing a frame body of the lid body of the modified examples 3 to 5. Modifications 3 to 5 are the same as those of the lid 130 and the optical device 100 of the first embodiment, except that the frames 133C to 133E of the lid 130 are different.

The frame bodies 133C to 133E of the modified examples 3 to 5 include the loose corner portions P1a and P2a in the inner corner portions P1 and P2 as in the first embodiment or the modified example 1. In the modified examples 3 to 5, the inner corner portions P1 to P4 and the loose corner portions P1a and P2a have the shapes of the plurality of types of chamfered portions described in the modified example 2 (R surface, C surface, chamfered shape by n surfaces W). ) May be adopted.

As shown in FIG. 8A, in the frame body 133C of the modified example 3, in addition to the above configuration, the thickness of the first wall portion H1 is thicker than that of the second wall portion H2 to the fourth wall portion H4. According to the lid 130 of the modified example 3, in addition to having the loose corner portions P1a and P2a, the first wall portion H1 having a low profile but a thick thickness allows the first wall portion H1 to the fourth wall portion H4. Rigidity and strength can be equalized. Therefore, the stress concentration on the inner corners P1 and P2 on the first wall portion H1 side can be further relaxed.

As shown in FIG. 8B, in addition to having the loose corner portions P1a and P2a, the frame body 133D of the modified example 4 has the outer surface O3 of the third wall portion H3 and the outer side of the fourth wall portion H4. The closer the distance (L1, L2, etc.) to the surface O4 is to the first wall portion H1, the longer it is. Further, in the third wall portion H3 and the fourth wall portion H4, the portion close to the first wall portion H1 is thicker than the portion close to the second wall portion H2. Even if the distance between the inner surface I3 of the third wall portion H3 and the inner surface I4 of the fourth wall portion H4 is substantially constant from the side close to the first wall portion H1 to the side close to the second wall portion H2. good.

According to the lid 130 of the modified example 4, in addition to having the loose corner portions P1a and P2a, the periphery of the inner corner portions P1 and P2 of the third wall portion H3 and the fourth wall portion H4 becomes thicker, and the inner corner portion The rigidity and strength around P1 and P2 are increased. Therefore, the stress concentration on the inner corners P1 and P2 can be further relaxed.

Further, according to the lid body 130 of the modified example 4, the thickness of the third wall portion H3 and the fourth wall portion H4 is gradually increased, while the inner surfaces can be brought close to each other in parallel. Therefore, it is possible to make the cross-sectional shape of the upper opening of the lid 130 into which light is input / output from the inner region of the seal ring 112 of the substrate 110 closer to a rectangle. Therefore, when the planar shape of the optical element 102 is rectangular, the inner space of the lid 130 suitable for the optical element 102 can be realized.

As shown in FIG. 8C, the frame body 133E of the modified example 5 has the loose corner portions P1a and P2a, and in addition, the inner surface I3 of the third wall portion H3 and the inner surface of the fourth wall portion H4. The closer the distance (L3, L4, etc.) to the surface I4 is to the first wall portion H1, the shorter it is. Further, in the third wall portion H3 and the fourth wall portion H4, the portion close to the first wall portion H1 is thicker than the portion close to the second wall portion H2. Even if the distance between the outer surface O3 of the third wall portion H3 and the outer surface O4 of the fourth wall portion H4 is substantially constant from the side close to the first wall portion H1 to the side close to the second wall portion H2. good.

According to the lid 130 of the modified example 5, in addition to having the loose corner portions P1a and P2a, the periphery of the inner corner portions P1 and P2 of the third wall portion H3 and the fourth wall portion H4 becomes thicker, and the inner corner portion The rigidity and strength around P1 and P2 are increased. Therefore, the stress concentration on the inner corners P1 and P2 can be further relaxed.

Further, according to the lid 130 of the modified example 5, the thicknesses of the third wall portion H3 and the fourth wall portion H4 are gradually increased, while the outer surfaces can be brought close to each other in parallel. Therefore, the planar shape of the outer circumference of the lid 130 can be made closer to a rectangle, and the workability when joining the lid 130 to the substrate 110 can be improved.

<Manufacturing method of lid, substrate and optical device>
Frame 133 may, for example, consists of aluminum oxide _(Al 2 _{O 3)} quality sintered body or aluminum nitride (AlN) quality sintered body or the like. For example, in the case of an aluminum oxide sintered body, first, _{an organic solvent suitable for a raw material powder of alumina (Al 2} O ₃ ) and silica (SiO ₂ ), calcia (CaO), magnesia (MgO) or the like. , A solvent is added and mixed to obtain a silica-like or granular material. Then, by extrusion molding from this material, a tubular molded body is formed in which the wall portions H1 to H4 of the frame body 133 extend vertically, and the molded body is inclined with respect to the lower surface and the lower surface of the frame body 133. It can be produced by cutting at a portion corresponding to the upper surface and firing. Further, the above-mentioned granular material may be press-molded using a mold to form a molded body having a shape corresponding to the frame body 133, and may be produced by firing.

After the frame body 133 is manufactured, the metal frame 131 is joined to the frame body 133. When the metal frame 131 is joined by a joining material 132 such as an active metal brazing material, the active metal brazing material paste is printed and applied to at least one of the joining surfaces of each member by using a well-known screen printing or the like. Then, after the metal frame 131 is placed on the frame body 133, the metal frame 131 is heated in a vacuum, in a non-oxidizing atmosphere such as a hydrogen gas atmosphere or a nitrogen gas atmosphere while applying a load to the brazing material paste. Bonding is performed by converting an organic solvent, a solvent, and a dispersant into a gas to dissipate the gas and melting the brazing material. Since corrosion can be suppressed by providing a plating layer of nickel or the like on the metal frame 131, for example, a nickel layer or the like may be provided by using a plating method after joining with the frame body 133.

The metal frame 131 is not directly bonded to the frame body 133 via the bonding material 132, but is bonded to the frame body 133 using a soft metal (not shown) such as a copper plate using an active metal brazing material to bond the copper plate. And the metal frame 131 may be joined with a brazing material.

Next, the translucent member 135 is joined to the frame body 133. When the translucent member 135 is a glass plate and low melting point glass is used as the bonding material 134, the low melting point is used by using a screen printing method over the outer peripheral edge of the lower main surface of the translucent member 135 and the entire circumference of the side surface. Form a paste that becomes glass. Then, after the paste is heated to evaporate the solvent, the translucent member 135 is placed on the upper surface of the frame 133 to which the metal frame 131 is bonded, and the temperature is maintained at a temperature equal to or higher than the melting point of the low melting point glass. , Melted and bonded. Thereby, the lid body 130 including the metal frame 131, the frame body 133, and the translucent member 135 can be manufactured.

When the substrate 111 of the substrate 110 is made of a ceramic material, an example thereof is an aluminum oxide sintered body, an aluminum nitride sintered body, or the like. When the substrate 111 is made of an aluminum oxide sintered body, first, an appropriate organic solvent and solvent are added and mixed with the raw material powder of alumina and silica, calcia, magnesia, etc. to form a slurry, which is well known. A ceramic green sheet (hereinafter, also referred to as a green sheet) is obtained by molding into a sheet using a doctor blade method, a calendar roll method, or the like. Next, a metallize layer to be a wiring conductor 114 and a conductor paste layer to be a metallize layer to which the bonding material e2 is applied are formed at predetermined positions on the green sheet by using a screen printing method or the like. The conductor paste is prepared by kneading a metal powder having a high melting point such as tungsten (W), molybdenum (Mo) or molybdenum-manganese (Mo-Mn) alloy with an appropriate resin binder and solvent. If necessary, these green sheets are laminated and pressure-bonded to form a laminated body, and the laminated body is fired to produce a mother substrate having a wiring conductor 114 or the like formed on the substrate 111. A plating layer such as nickel may be formed on the metallized layer of the calcined mother substrate.

Next, on the metallized layer where the seal ring 112 of the mother substrate is bonded, for example, a bonding material e2 (FIG. 4) such as a brazing material using a silver-copper eutectic alloy is formed into a predetermined shape using an assembly jig. It will be provided. Then, for example, the seal ring 112 is arranged on the bonding material e2 of the silver-copper eutectic alloy. The seal ring 112 is manufactured by forming an alloy into a predetermined shape using a well-known press working method or the like. Then, for example, by keeping the temperature exceeding the melting point of the bonding material e2 in a reducing atmosphere, the metallized layer for bonding (not shown) on the substrate 111 and the seal ring 112 are bonded via the bonding material e2. This makes the substrate 110.

After that, the optical element 102 is bonded to the mounting portion R1 of the substrate 110 via the bonding material e1 (FIG. 4), and the internal electrode 114A and the electrode of the optical element 102 are electrically connected by wire bonding or the like. Next, the lid 130 is placed on the substrate 110, and the metal frame 131 and the seal ring 112 are seam welded, so that the optical element 102 is hermetically sealed and the optical device 100 is manufactured. Instead of seam welding, a joining method by local heating such as laser welding or electron beam welding may be applied.

The embodiments of the present disclosure have been described above. However, the present invention is not limited to the above embodiment. For example, in the above embodiment, the first wall portion H1, the second wall portion H2, the third wall portion H3, and the fourth wall portion H4 of the frame body 133 are shown in a flat plate shape, but the present invention is not limited to the flat plate. One or more of the plurality of wall portions may have a curved plate shape. In addition, the details shown in the embodiment can be appropriately changed without departing from the spirit of the invention.

100 Optical device 102 Optical element 110 Substrate (Package for optical device)
111 Base 112 Seal ring 114 Wiring conductor 130 Cover (cover for optical device, package for optical device)
131 Metal frame 133, 133A to 133E Frame body 135 Translucent member H1 1st wall part H2 2nd wall part H3 3rd wall part H4 4th wall part I3, I4 Inner surface O3, O4 Outer surface P1 to P4 Inner Corners P1a, P2a Loose corners R1 mounting part

Claims (11)

The frame that surrounds the through hole and
A translucent member that closes one opening of the through hole in the frame body,
Equipped with
The frame has a first wall portion, a second wall portion higher than the first wall portion, and a third wall portion and a fourth wall portion connected to the first wall portion and the second wall portion. death,
The inner corner between the first wall, the third wall, and the fourth wall is between the second wall, the third wall, and the fourth wall, respectively. Includes loose corners that are less curved than the inner corners of
Cover for optical devices. The gentle corner portion is located at the end on the side far from the translucent member.
The lid for an optical device according to claim 1. The gentle corner portion is located from the end portion on the side closer to the translucent member to the end portion on the far side.
The lid for an optical device according to claim 1 or 2. The first wall portion is thicker than the second wall portion.
The lid for an optical device according to any one of claims 1 to 3. In the third wall portion and the fourth wall portion, the portion close to the first wall portion is thicker than the portion close to the second wall portion.
The lid for an optical device according to any one of claims 1 to 4. The closer the distance between the inner surface of the third wall portion and the inner surface of the fourth wall portion is to the first wall portion, the shorter the distance.
The lid for an optical device according to claim 5. The closer the distance between the outer surface of the third wall portion and the outer surface of the fourth wall portion is to the first wall portion, the longer the distance.
The lid for an optical device according to claim 5. The gentle corner has an R surface.
The lid for an optical device according to any one of claims 1 to 7. A metal frame joined to the side opposite to the translucent member of the frame body is further provided.
The lid for an optical device according to any one of claims 1 to 8. A substrate having a mounting part on which an optical element is mounted,
The lid for an optical device according to any one of claims 1 to 9, which seals the mounting portion.
Package for optics. The package for an optical device according to claim 10,
The optical element mounted on the mounting part and
An optical device equipped with.

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