JP5403960B2 - Solid-state imaging device manufacturing method and solid-state imaging device - Google Patents

Description

  The present invention relates to a method for manufacturing a solid-state imaging device in which a solid-state imaging device is mounted in a recess of a package, and a solid-state imaging device.

  In line sensors used in digital copying machines and image scanners for office automation (OA) equipment, a solid-state image sensor such as a long CCD or CMOS is mounted in a ceramic or resin package with a recess. ing. The same applies to two-dimensional sensors used in digital still cameras and digital video cameras.

In Patent Document 1, when manufacturing an image sensor that does not take dust, in an assembly process, dust attached to an object to be cleaned such as a chip of an image sensor or an envelope is removed in order to prevent generation of defective products. A blow cleaning device is described.
Japanese Patent Laid-Open No. 4-48977

  In the case of a hollow type package, the above-described cleaning is performed in order to remove foreign matters on the pixels formed on the surface of the solid-state imaging device before the step of bonding the transparent member, so that the solid-state imaging including the concave interior is performed. In general, the element surface is cleaned.

  This is because, when a foreign substance is attached on the pixel of the solid-state image sensor, the foreign substance blocks the incident light, thereby causing an abnormality in the electro-optical characteristics of the solid-state image sensor.

  As a method for cleaning the recess of the package, there are various methods such as wet process cleaning such as ultrasonic cleaning, cleaning using a fluid such as air, UV (Ultra Violet) cleaning, and ozone cleaning. In particular, cleaning using a fluid can be realized by a very simple process of scanning a fluid ejected from a fluid nozzle, and is a powerful cleaning method because of its short tact.

  However, when fluid cleaning is performed on a semiconductor package having a recess, there are the following problems.

  8A and 8B are schematic views showing a solid-state imaging device constituting a conventional line sensor, where FIG. 8A is a plan view and FIG. 8B is a cross-sectional view along A-A ′.

  In FIG. 8, reference numeral 801 denotes a solid-state image sensor, and 802 denotes a package, which has a recess 806 inside. Reference numeral 803 denotes a metal wire such as a gold wire, which electrically and mechanically connects an electrode (not shown) formed on the surface of the solid-state image sensor 801 and the inner lead 804.

  Reference numeral 805 denotes a transparent member such as glass, and the hermeticity in the recess 806 is maintained by bonding to the upper surface of the hollow package.

  In the manufacturing method of such a solid-state imaging device, the following is performed. That is, the solid-state imaging device 801 is bonded and fixed to the bottom surface of the recess 806 of the hollow package. Thereafter, in order to electrically and mechanically connect the electrode formed on the surface of the solid-state imaging device 801 and the inner lead of the package, wire bonding is performed with a wire such as gold.

  After the wire bonding, the solid-state imaging device 812 is completed by bonding and fixing the transparent member 805 to the upper part of the package.

  FIG. 9 is an enlarged view of the dotted line part of FIG. 8A, schematically showing the state of fluid scanning and foreign matter removal.

  In FIG. 9, reference numeral 801 denotes a solid-state image sensor, and 802 denotes a package. A circular portion 903 indicates a fluid ejection region from a fluid nozzle disposed on the top of the solid-state image sensor 801. The ejection region 903 is similarly scanned by scanning the nozzle in the direction of an arrow 911. A state of scanning is shown in FIG. Further, reference numerals 904 to 906 denote foreign substances adhering to the solid-state imaging device.

  By causing the nozzle to scan in the direction of the arrow 911 while ejecting fluid from the nozzle, the adhered foreign matter is detached from the solid-state imaging device 801 and scattered in a random direction. At this time, most foreign matters such as the foreign matter 904 and the foreign matter 905 are removed while being scattered in the scanning direction while receiving the pressure of the fluid.

  However, there is a problem that the foreign matter that scatters in the direction perpendicular to the scanning direction of the nozzle and travels toward the inner wall of the recess 806 is reflected back to the inner wall as it is and returns to the inner wall. .

  Due to such a phenomenon, there has been a problem that foreign matter remains despite fluid cleaning. In particular, in the long solid-state imaging device, the pixel region and the inner wall of the package are close to each other, so there are many residual foreign matters due to the reflection, which is particularly remarkable.

  In view of such problems, it is an object of the present invention to provide a method for manufacturing a solid-state imaging device and a solid-state imaging device that can reduce the reattachment of foreign matter on the solid-state imaging device.

The present invention includes a solid-state imaging device, a first side wall extending in a longitudinal direction of the solid-state imaging device, a second side wall extending in the longitudinal direction and spaced from the first side wall, A first end wall provided between a first end of one side wall and a first end of the second side wall; and a second end of the first side wall; A second end face wall provided between the second end face of the second side face wall, the first side face wall, the second side face wall, the first end face wall, and the second end face wall; And a concave portion surrounded by the first side wall, the second side wall, the first end wall, the second side wall, and the bottom surface part. there is formed, wherein the solid-state imaging device is a manufacturing method of the bottom portion of the deployed upcoming solid-state imaging device started surface in the recess, a fluid by a nozzle in the solid- To have a cleaning process to attach can. Here, a distance between a surface of the first side wall facing the concave portion and a surface perpendicular to the bottom surface portion and parallel to the longitudinal direction is defined as a first distance. A distance between a surface of the second side wall facing the recess and a surface perpendicular to the bottom surface and parallel to the longitudinal direction is defined as a second distance.

In the method for manufacturing a solid-state imaging device, in the first aspect, the surface facing the recess of the first side wall and the recess of the second side wall in a direction perpendicular to the longitudinal direction. The distance from the facing surface differs depending on the position in the longitudinal direction, and in the cleaning step, the distance from the first position in the longitudinal direction is longer than the first position. The nozzle is scanned toward a second position in the direction.
In the method for manufacturing the solid-state imaging device, in the second aspect, the first distance and the second distance change depending on the position in the longitudinal direction, and the first distance and the second distance are changed. The distance becomes longer as it goes from the first end face wall to the second end face wall, and in the cleaning step, the nozzle is scanned from the first end face wall toward the second end face wall. It is characterized by.
In the method of manufacturing the solid-state imaging device, in the third aspect, the first distance and the second distance change depending on the position in the longitudinal direction, and the first distance at the central portion in the longitudinal direction is changed. 1 distance and the second distance are shorter than the first distance and the second distance at both ends in the longitudinal direction, respectively, and in the cleaning step, the two nozzles are placed in the longitudinal center. Scanning from both ends to the both ends in the longitudinal direction.
In the method of manufacturing the solid-state imaging device, in the fourth aspect, the first distance and the second distance change depending on the position in the longitudinal direction, and the first distance in the central portion in the longitudinal direction. The distance 1 and the second distance are longer than the first distance and the second distance at both ends in the longitudinal direction, respectively, and the two nozzles are placed at both ends in the longitudinal direction in the cleaning step. Scanning from the center toward the center in the longitudinal direction.

  According to the present invention, it is possible to reduce the reattachment of foreign matters on the solid-state imaging device in the cleaning process, and it is possible to improve the production yield.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

[Embodiment 1]
1A is a front view of a solid-state imaging device showing a first embodiment of the present invention, FIG. 1B is a sectional view taken along line XX ′, and FIG. 1C is a sectional view taken along line YY ′. FIG.

  In FIG. 1, reference numeral 101 denotes a solid-state image sensor, and 102 denotes a package portion made of ceramic or resin. Reference numeral 103 denotes a metal wire such as a gold wire, which electrically and mechanically connects an electrode (not shown) formed on the surface of the solid-state imaging device 101 and the inner lead 104.

  The package part 102 includes a first side wall 102-1, a second side wall 102-2, a first end part 102-3, a second end part 102-4, and a bottom part 102-5. The first side wall 102-1 is spaced from the second side wall 102-2, and the first end 102-3 is spaced from the second end 102-4. Yes. The first end wall 102-3 is provided between the first end of the first side wall 102-1 and the first end of the second side wall 102-2. The second end face wall 102-4 is provided between the second end of the first side wall 102-1 and the second end of the second side wall 102-2.

  Reference numeral 105 denotes a transparent member such as glass, and the airtightness of the recess 106 is maintained by bonding to the upper surface of the hollow package 102.

  The recess 106 is formed by five surfaces of inner wall surfaces 107 to 111, and among these, surfaces along the longitudinal direction of the solid-state imaging device are 107 to 109.

  The present embodiment is characterized in that the inner wall surface 107 and the inner wall surface 108 are not parallel to the longitudinal direction of the solid-state imaging device 101 but are inclined with a certain degree of inclination. Accordingly, the distance between the surface of the first side wall 102-1 facing the recess 106 and the surface of the second side wall 102-2 facing the recess 106 differs depending on the position in the longitudinal direction. Further, by providing this inclination, the cross-sectional area of the recess 106 in a plane perpendicular to the longitudinal direction of the recess 106 is continuously changed.

  Here, the case where the cross-sectional area continuously changes includes the case where the inner wall surfaces 107 and 108 that are not parallel to the longitudinal direction of the solid-state imaging device 101 are formed of a flat surface or a curved surface.

  FIG. 2 is an enlarged view of a dotted line portion of FIG. FIG. 2 schematically shows the fluid scanning and foreign matter removal according to the present invention. In FIG. 2, 101 indicates a solid-state image sensor, and 102 indicates a package unit. A circular portion 203 indicates a fluid ejection area from a fluid nozzle disposed on the upper part of the solid-state imaging device 101, and the ejection area is similarly indicated by an arrow 201 by scanning the nozzle. A state of scanning is shown in FIG. Further, reference numerals 204 to 206 denote foreign substances adhering to the solid-state image sensor 101.

  By causing the nozzle and fluid to scan in the longitudinal direction of the solid-state image sensor 101 while ejecting the fluid from the nozzle, the adhered foreign matter is detached from the solid-state image sensor 101 and scattered in a random direction. At this time, most of the foreign matters such as the foreign matter 204 and the foreign matter 205 are removed while being scattered in the nozzle moving direction according to the scanning of the nozzle under the influence of the pressure of the fluid.

  Even when the foreign matter 206 is scattered perpendicularly to the nozzle traveling direction toward the inner wall 108 of the recess 106, the direction of reflection of the foreign matter 206 by the surface of the inner wall 108 can be made to coincide with the nozzle traveling direction. it can. This is because the surface of the inner wall 108 is inclined. This also allows the foreign matter 206 to be swept away in the nozzle traveling direction.

  Due to the above-described operation, the foreign matter remaining in the conventional configuration can be efficiently removed in the present invention, the foreign matter removal probability can be increased, and the yield can be improved.

  7A to 7E are schematic views showing the manufacturing process of the solid-state imaging device of the present invention.

  As a method for manufacturing such a solid-state imaging device, first, the above-described package 102 is prepared (FIG. 7A), and the solid-state imaging element 101 is bonded and fixed to the bottom surface of the recess 106 of the package 102 (FIG. 7B). ).

  Next, in order to electrically and mechanically connect the electrode formed on the surface of the solid-state imaging device 101 and the inner lead of the package, wire bonding is performed with a wire 103 such as gold (FIG. 7C). ). Further, the foreign matter existing on and around the surface of the solid-state imaging device 101 in the recess of the package 102 is removed (FIG. 7D). Finally, the transparent member 105 is bonded and fixed to the upper part of the package to complete the solid-state imaging device 112 (FIG. 7E).

  Here, in FIG. 7D, 721 indicates a nozzle, and 722 indicates a fluid. By scanning the fluid 722 from the nozzle 721 along the longitudinal direction on the solid-state image sensor 101, the solid-state image sensor 101 is scanned. It is possible to remove (clean) the foreign matter.

  At this time, the scanning is performed in the direction indicated by the arrow 723 in the drawing as the fluid scanning direction. That is, the cross-sectional area in a plane perpendicular to the longitudinal direction of the concave portion 106 is characterized by scanning from a narrow position toward a wide position. That is, the distance (hereinafter referred to as “first distance”) between the surface of the first side wall 102-1 facing the recess 106 and the surface perpendicular to the bottom surface portion 102-5 and parallel to the longitudinal direction. ) Becomes longer and the distance between the surface facing the recess 106 of the second side wall 102-2 and the surface perpendicular to the bottom surface portion 102-5 and parallel to the longitudinal direction (hereinafter referred to as “the first surface”). “Distance 2”) is also characterized by scanning in a longer direction.

  By scanning the fluid 722 in such a direction, the reflection direction of the foreign matter with respect to the inner wall surface can include the nozzle traveling direction, and the foreign matter can be pushed forward.

  In the present embodiment, the case where the two side wall surfaces 107 and 108 in the longitudinal direction are inclined has been described. In this case, the reflected foreign matter from the two side wall surfaces 107 and 108 is pushed away. Is possible and is most preferred.

  However, there is no need for the two surfaces 107 and 108 in particular, and at least one surface of the inner wall surfaces 107 and 108 is not parallel to the longitudinal direction of the semiconductor element 101, thereby improving the ability to remove foreign matter. It is also possible.

  The inclination angle of the inner wall surfaces 107 and 108 with respect to the longitudinal direction of the semiconductor element 101 is not particularly limited. However, when the inclination angle is small, the probability that the traveling direction of the foreign matter reflected from the inner wall surfaces 107 and 108 includes the fluid traveling direction is low. On the other hand, when the inclination angle is large, the package 102 becomes large, resulting in an increase in package cost. From these considerations, the inclination angle is preferably 1 to 30 degrees with respect to the longitudinal direction of the solid-state imaging device 101.

  Moreover, in the manufacturing method of this embodiment, the case where a washing | cleaning process was performed after a wire bonding process was demonstrated. However, the cleaning step may be performed after any step as long as it is before the step of sealing (FIG. 7E) after mounting the solid-state imaging device 101 (FIG. 7B), and there is no limitation. Moreover, you may provide a washing | cleaning process between each other process at maximum according to a condition.

  Moreover, as a solid-state imaging device of the present invention, in the long-type solid-state imaging device using a long-type solid-state imaging device, the above-described effects can be exhibited, The ratio of the short side is suitable for a long solid-state imaging device having long side / short side = 2 or more.

[Embodiment 2]
FIG. 3 is a front view of the solid-state imaging device showing the second embodiment of the present invention.

  In FIG. 3, 101 is a solid-state image sensor, 302 is a package part made of ceramic or resin, 103 is a metal wire such as a gold wire, and an electrode (not shown) formed on the surface of the solid-state image sensor 101 and an inner The lead 104 is electrically and mechanically connected.

  The package part 302 includes a first side wall 302-1, a second side wall 302-2, a first end part 302-3, a second end part 302-4, and a bottom surface part 302-5. The first side wall 302-1 is spaced from the second side wall 302-2, and the first end 302-3 is spaced from the second end 302-4. Yes. The first end wall 302-3 is provided between the first end of the first side wall 302-1 and the first end of the second side wall 302-2. The second end wall 302-4 is provided between the second end of the first side wall 302-1 and the second end of the second side wall 302-2.

  Reference numeral 105 denotes a transparent member such as glass, and the hermeticity of the concave portion 306 is maintained by adhering to the upper surface of the hollow package 302.

  The concave portion 306 is formed by five surfaces of inner wall surfaces 307 to 311, and among these, the surfaces along the longitudinal direction of the solid-state imaging device are 307 to 309.

  In the present embodiment, the inner wall surface 307 and the inner wall surface 308 are not parallel to the longitudinal direction of the solid-state imaging element 301 but are inclined at a certain angle. Accordingly, the distance between the surface of the first side wall 302-1 facing the recess 306 and the surface of the second side wall 302-2 facing the recess 306 differs depending on the position in the longitudinal direction.

  Further, by providing the inclination, the cross-sectional area in a plane perpendicular to the longitudinal direction of the concave portion 306 continuously decreases from one end in the longitudinal direction toward the central portion in the longitudinal direction. And it increases continuously from the center part of a longitudinal direction toward the other end of a longitudinal direction. That is, the first distance and the second distance at the central portion in the longitudinal direction described above are shorter than the first distance and the second distance at both ends in the longitudinal direction, respectively.

  FIG. 4 is a schematic diagram showing an optimal solid-state imaging device cleaning process in the second embodiment. Here, in FIG. 4, 421 indicates a nozzle and 422 indicates a fluid. The scanning directions of the two nozzles 421 and the two fluids 422 are respectively directed from the central portion in the longitudinal direction of the package toward the two outer directions in the longitudinal direction of the package. That is, the scanning is performed from a position where the cross-sectional area in a plane perpendicular to the longitudinal direction of the concave portion 306 is narrow to a wide position.

  The two fluids 422 from the two nozzles 421 are scanned from the central portion in the longitudinal direction of the solid-state imaging device 312 on the solid-state imaging device 101 in two outer directions in the longitudinal direction of the solid-state imaging device 312. Accordingly, it is possible to remove (clean) foreign matter on the solid-state imaging device by the same operation as in the first embodiment.

[Embodiment 3]
FIG. 5 is a front view of a solid-state imaging device showing a third embodiment of the present invention.

  In FIG. 5, 101 is a solid-state image sensor, and 502 is a package portion made of ceramic or resin. Reference numeral 103 denotes a metal wire such as a gold wire, which electrically and mechanically connects an electrode (not shown) formed on the surface of the solid-state imaging device 101 and the inner lead 104.

  The package unit 502 includes a first side wall 502-1, a second side wall 502-2, a first end 502-3, a second end 502-4, and a bottom surface 502-5. The first side wall 502-1 is spaced apart from the second side wall 502-2, and the first end 502-3 is spaced away from the second end 502-4. Yes. The first end wall 502-3 is provided between the first end of the first side wall 502-1 and the first end of the second side wall 502-2. The second end surface wall 502-4 is provided between the second end portion of the first side wall 502-1 and the second end portion of the second side wall 502-2.

  Reference numeral 105 denotes a transparent member such as glass, and the confidentiality of the recess 506 is maintained by adhering to the upper surface of the hollow package 502.

  The recess 506 is formed by five surfaces of inner wall surfaces 507 to 511, and among these, the surfaces along the longitudinal direction of the solid-state imaging device are 507 to 509.

  In the present embodiment, the inner wall surface 507 and the inner wall surface 508 are not parallel to the longitudinal direction of the solid-state image sensor 501 but are inclined at a certain angle. Accordingly, the distance between the surface of the first side wall 502-1 facing the recess 506 and the surface of the second side wall 502-2 facing the recess 506 differs depending on the position in the longitudinal direction.

  Further, by providing the above-described inclination, the cross-sectional area in a plane perpendicular to the longitudinal direction of the concave portion 506 is continuously increased from one side in the longitudinal direction toward the central portion in the longitudinal direction. And it reduces continuously from the center part of a longitudinal direction toward the other end of a longitudinal direction. That is, the first distance and the second distance at the central portion in the longitudinal direction are longer than the first distance and the second distance at both ends in the longitudinal direction, respectively.

  FIG. 6 is a schematic diagram showing an optimal solid-state imaging device cleaning process in the third embodiment. Here, in FIG. 6, 621 indicates a nozzle and 622 indicates a fluid. The scanning directions of the two nozzles 621 and the two fluids 622 are respectively directed from the outer two directions in the package longitudinal direction toward the central portion in the package longitudinal direction. That is, a feature is that scanning is performed from a position where the cross-sectional area in a plane perpendicular to the longitudinal direction of the recess 506 is narrow to a wide position.

  The two fluids 622 from the two nozzles 621 are respectively scanned from the two longitudinal outer sides of the solid-state imaging device 512 on the solid-state imaging device 101 to the center of the package 312. Accordingly, it is possible to remove (clean) foreign matter on the solid-state imaging device by the same operation as in the first embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the solid-state imaging device of the 1st Embodiment of this invention, (a) is a front view, (b) is X-X 'sectional drawing, (c) is Y-Y' sectional drawing. It is a schematic diagram of the foreign material removal method of the solid-state imaging device by embodiment of this invention. It is the schematic which shows the solid-state imaging device of the 2nd Embodiment of this invention, (a) is a front view, (b) is X-X 'sectional drawing, (c) is Y-Y' sectional drawing. It is a schematic diagram which shows the washing | cleaning process of the solid-state imaging device of the 2nd Embodiment of this invention. It is the schematic which shows the solid-state imaging device of the 3rd Embodiment of this invention, (a) is a front view, (b) is X-X 'sectional drawing, (c) is Y-Y' sectional drawing. It is a schematic diagram which shows the washing | cleaning process of the solid-state imaging device of the 3rd Embodiment of this invention. It is the schematic which shows the solid-state imaging device manufacturing process of the 1st Embodiment of this invention. It is the schematic which shows the conventional solid-state imaging device, (a) is a front view, (b) is A-A 'sectional drawing. It is a schematic diagram of the foreign material removal method of the conventional solid-state imaging device.

Explanation of symbols

101, 301, 501, 801 Solid-state imaging device 102, 302, 502, 802 Package 103, 803 Wire 104, 804 Inner lead 105, 805 Transparent member 106, 306, 506, 806 Recess 107-111, 307-308, 507- 508 Inner wall surface 112, 312, 512, 812 Solid-state imaging device 203, 903 Fluid ejection area 204-206, 904-906 Foreign matter 421, 621, 721 Nozzle 422, 622, 722 Fluid

Claims (5)

A solid-state image sensor;
A first side wall extending in the longitudinal direction of the solid-state imaging device ;
A second side wall extending in the longitudinal direction and spaced from the first side wall;
A first end face wall provided between a first end of the first side wall and a first end of the second side wall;
A second end face wall provided between a second end of the first side wall and a second end of the second side wall;
A bottom portion connecting the bottom surfaces of the first side wall, the second side wall, the first end face wall, and the second end face wall;
With
A recess surrounded by the first side wall, the second side wall, the first end wall, the second side wall, and the bottom surface portion is formed, and the solid-state imaging element is formed on the bottom surface portion. a manufacturing method of a solid-state imaging device disposed started surface in the recess,
The distance between the surface of the first side wall facing the recess and the surface of the second side wall facing the recess in the direction perpendicular to the longitudinal direction depends on the position in the longitudinal direction. Are different,
A cleaning step of blowing fluid through nozzles in the solid-the In the washing step, the longitudinal from direction a first position, the distance is long than the first position, the longitudinal direction of the second A method of manufacturing a solid-state imaging device, wherein the nozzle is scanned toward the position of the solid-state imaging device. A solid-state image sensor;
A first side wall extending in the longitudinal direction of the solid-state imaging device;
A second side wall extending in the longitudinal direction and spaced from the first side wall;
A first end face wall provided between a first end of the first side wall and a first end of the second side wall;
A second end face wall provided between a second end of the first side wall and a second end of the second side wall;
A bottom portion connecting the bottom surfaces of the first side wall, the second side wall, the first end face wall, and the second end face wall;
With
A recess surrounded by the first side wall, the second side wall, the first end wall, the second side wall, and the bottom surface portion is formed, and the solid-state imaging element is formed on the bottom surface portion. A method of manufacturing a solid-state imaging device disposed on a surface facing a recess ,
A first distance between a surface of the first side wall facing the recess and a surface perpendicular to the bottom surface and parallel to the longitudinal direction; and the recess of the second side wall. A second distance between the facing surface and a surface perpendicular to the bottom surface portion and parallel to the longitudinal direction varies depending on the position in the longitudinal direction, and the first distance and the A second distance increases from the first end face wall toward the second end face wall;
A solid-state imaging device, comprising: a cleaning step of spraying a fluid onto the solid-state imaging element by a nozzle , wherein the nozzle is scanned from the first end face wall toward the second end face wall. Manufacturing method. A solid-state image sensor;
A first side wall extending in the longitudinal direction of the solid-state imaging device;
A second side wall extending in the longitudinal direction and spaced from the first side wall;
A first end face wall provided between a first end of the first side wall and a first end of the second side wall;
A second end face wall provided between a second end of the first side wall and a second end of the second side wall;
A bottom portion connecting the bottom surfaces of the first side wall, the second side wall, the first end face wall, and the second end face wall;
With
A recess surrounded by the first side wall, the second side wall, the first end wall, the second side wall, and the bottom surface portion is formed, and the solid-state imaging element is formed on the bottom surface portion. A method of manufacturing a solid-state imaging device disposed on a surface facing a recess ,
A first distance between a surface of the first side wall facing the recess and a surface perpendicular to the bottom surface and parallel to the longitudinal direction; and the recess of the second side wall. The second distance between the facing surface and a surface perpendicular to the bottom surface portion and parallel to the longitudinal direction varies depending on the position in the longitudinal direction, and The first distance and the second distance are shorter than the first distance and the second distance at both ends in the longitudinal direction, respectively.
A solid-state image pickup device having a cleaning step of spraying a fluid onto the solid-state imaging device by a nozzle, wherein the two nozzles are scanned from the central portion in the longitudinal direction toward both end portions in the longitudinal direction. Manufacturing method of imaging apparatus. A solid-state image sensor;
A first side wall extending in the longitudinal direction of the solid-state imaging device;
A second side wall extending in the longitudinal direction and spaced from the first side wall;
A first end face wall provided between a first end of the first side wall and a first end of the second side wall;
A second end face wall provided between a second end of the first side wall and a second end of the second side wall;
A bottom portion connecting the bottom surfaces of the first side wall, the second side wall, the first end face wall, and the second end face wall;
With
A recess surrounded by the first side wall, the second side wall, the first end wall, the second side wall, and the bottom surface portion is formed, and the solid-state imaging element is formed on the bottom surface portion. A method of manufacturing a solid-state imaging device disposed on a surface facing a recess ,
A first distance between a surface of the first side wall facing the recess and a surface perpendicular to the bottom surface and parallel to the longitudinal direction; and the recess of the second side wall. The second distance between the facing surface and a surface perpendicular to the bottom surface portion and parallel to the longitudinal direction varies depending on the position in the longitudinal direction, and The first distance and the second distance are longer than the first distance and the second distance at both ends in the longitudinal direction, respectively.
A solid-state imaging device having a cleaning step of spraying a fluid by a nozzle, and in the cleaning step, the two nozzles are scanned from both end portions in the longitudinal direction toward the central portion in the longitudinal direction. Manufacturing method of imaging apparatus. The method for manufacturing a solid-state imaging device according to claim 1, wherein the surface of the first side wall and the surface of the second side wall are not parallel to the longitudinal direction.

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