JP2021181118A - Thin film removal device and thin film removal method - Google Patents

Abstract

To provide a thin film removal device and a thin film removal method.SOLUTION: A thin film removal device includes: a film adhesion unit that makes a protective film adhere onto a thin film arranged on workpiece; a laser processing unit for integrally separating the thin film and the protective film from the workpiece by applying a laser beam; and a film removal unit for disengaging the thin film from the workpiece.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to a thin film removing device and a thin film removing method.

A protective film can be placed on the workpiece to protect it from external impacts or the influx of oxygen and moisture. The protective film is a member in the form of a thin film arranged outside the workpiece, and can block contact between the workpiece and the outside to enhance the durability of the workpiece.

However, if foreign matter adheres to the thin film placed on the work piece, or if the thin film is defective during the manufacturing process, the thin film adversely affects other work pieces or finished products, and the product Yield may decrease. Therefore, it is necessary to remove the defective thin film or the contaminated thin film.

As a conventional method, there is a method of directly removing foreign matter adhering to the thin film by using an adhesive tape. However, since the method is performed manually, the foreign matter is not completely removed, it takes a long time to remove the foreign matter, and the production amount may decrease. In addition, since a large amount of human power must be invested, labor costs will increase in order to increase the yield.

Further, as a conventional method for removing a contaminated thin film or a defective thin film, there is a method using a laser. However, in the process of processing a thin film with a laser, fine foreign matter such as fume is generated, which may cause secondary contamination of other workpieces and / or the thin film. In addition, since the suction device must be continuously operated in order to remove fine foreign substances such as fumes generated during laser processing, cost becomes a problem.

The above-mentioned background technology is technical information possessed by the inventor for the derivation of the present invention or acquired in the process of deriving the present invention, and is not necessarily known to the general public before the filing of the present invention. It cannot be a technology.

It is an object of the present invention to provide a thin film removing device and a thin film removing method capable of removing a thin film arranged on the upper surface of a work piece without secondary contamination of the work piece. However, the above-mentioned problems are based on the embodiments of the present invention, and the object of the present invention and the problems to be solved are not limited thereto.

The thin film removing device according to the embodiment of the present invention is a film adhering device for adhering a protective film on a thin film arranged on a work piece, and a laser beam is irradiated from the work piece to the thin film and the protective film. Includes a laser processing unit that integrally separates the thin film and a film removing unit that separates the thin film from the work piece.

In the thin film removing device according to the embodiment of the present invention, the protective film has a shape corresponding to the thin film, and the end portion may protrude to the outside of the thin film while being attached to the upper surface of the thin film. ..

In the thin film removing device according to the embodiment of the present invention, the laser beam has a wavelength of 440 nm to 1500 nm and may pass through the protective film to remove a part of the thin film.

In the thin film removing device according to the embodiment of the present invention, the laser processing unit irradiates the inner region of the thin film with the laser beam so that the thin film is lifted (or ablated) from the upper surface of the work piece. The laser beam may be applied to the edge of the thin film to separate the edge of the thin film from the upper surface of the workpiece.

In the thin film removing device according to the embodiment of the present invention, the film removing unit moves in a predetermined direction while grasping the end portion of the protective film, and integrates the thin film and the protective film from the workpiece. You may leave it to.

The thin film removing method according to another embodiment of the present invention includes a step of adhering a protective film on a thin film arranged on a work piece, and irradiating the laser beam with the thin film and the protective film from the work piece. Includes a step of integrally separating the thin film and a step of separating the thin film from the workpiece.

In the thin film removing method according to another embodiment of the present invention, the laser beam has a wavelength of 440 nm to 1500 nm and may pass through the protective film to remove a part of the thin film.

In the thin film removing method according to another embodiment of the present invention, the step of integrally separating the thin film and the protective film is to irradiate the inner region of the thin film with the laser beam and to irradiate the thin film from the upper surface of the workpiece. The step of raising the surface and the laser beam may be applied to the edge of the thin film to separate the edge of the thin film from the upper surface of the workpiece.

In the thin film removing method according to another embodiment of the present invention, the step of separating the thin film moves in a predetermined direction while grasping the end portion of the protective film, and the thin film and the protection are removed from the workpiece. The film may be detached integrally.

Other aspects, features and advantages other than those mentioned above will be apparent from the embodiments, claims and drawings for carrying out the invention below.

In the thin film removing device and the thin film removing method according to the embodiment of the present invention, a protective film is attached on the thin film arranged on the upper surface of the workpiece, a laser beam is irradiated, and the upper surface of the workpiece and the thin film are separated. By doing so, it is possible to prevent foreign matter such as fume generated in the thin film removing step from being scattered and diffused, so that it is possible to prevent other workpieces from being secondarily contaminated by the foreign matter.

The thin film removing device and the thin film removing method according to the embodiment of the present invention ensure that other workpieces are prevented from being secondarily contaminated by proceeding with the process in a state where the thin film and the protective film are attached. Can be done. Further, the thin film removing device and the thin film removing method according to the embodiment of the present invention do not need to be provided with a separate suction device or exhaust device, and the cost can be drastically reduced.

It is an example of the drawing which shows the thin film removing apparatus by one Embodiment of this invention. It is an example of the drawing which shows the operating state of the film attachment unit of FIG. It is an example of the drawing which shows various forms of the protective film of FIG. It is a drawing which shows an example of the laser processing unit of FIG. It is an example of the drawing which shows the operating state of the laser processing unit of FIG. It is another example of the drawing which shows the operating state of the laser processing unit of FIG. It is an example of the drawing which shows the operating state of a film removal unit. It is an example of the drawing which shows before and after the thin film removal process of a comparative example and an invention example. It is an example of the drawing which shows the thin film removal method by another embodiment of this invention.

The present invention can be subjected to various transformations and can have various embodiments, but specific embodiments are exemplified in the drawings and described in detail by detailed description. However, they should be understood not to limit the invention by any particular embodiment, but to include all transformations, equivalents or alternatives contained within the ideas and technical scope of the invention. In describing the present invention, the same identification code will be used for the same components, even if illustrated in other embodiments.

Terms such as first and second are used to describe various components, but such terms do not limit the components. The term is used only to distinguish one component from the other.

The terms used in this application are used solely to describe a particular embodiment and are not intended to limit the invention. In this application, terms such as "include" or "have" indicate that the features, numbers, stages, actions, components, parts, or combinations thereof described herein are present. It must be understood that it does not preclude the existence or addition of one or more other features, numbers, stages, actions, components, parts, or combinations thereof.

FIG. 1 is an example of a drawing showing a thin film removing device 10 according to an embodiment of the present invention, FIG. 2 is an example of a drawing showing an operating state of the film adhesion unit 200 of FIG. 1, and FIG. 3 is a diagram. 2 is an example of a drawing showing various forms of the protective film PF.

Referring to FIGS. 1 to 3, the thin film removing device 10 according to the embodiment of the present invention can be used to remove the thin film TF. More specifically, the thin film removing device 10 selects a thin film TF to which foreign matter is attached or a defective thin film TF among the thin film TFs arranged on the upper surface of the plurality of workpieces W contained in the substrate S. It is available to remove.
However, the thin film TF is not necessarily limited to the thin film TF to which foreign matter is attached or the defective thin film TF, and may be a thin film TF in various states that need to be removed. In the present specification, for convenience of the invention, a thin film TF to which a foreign substance is attached or a defective thin film TF can be mainly described.

The thin film removing device 10 according to the embodiment of the present invention can include a stage 100, a film adhesion unit 200, a laser processing unit 300, and a film removing unit 400.

The substrate S is placed on the upper surface of the stage 100. In one embodiment, the stage 100 may include a fixing member (not shown) in order to prevent the substrate S from shaking or vibrating during processing. For example, the stage 100 can include a gripper (not shown) for pressurizing and fixing the upper surface of the substrate S, and a suction hole (not shown) for sucking the lower surface of the substrate S.

The stage 100 can remain fixed during machining or can be translated or rotated in at least one direction by operating a controller (not shown).

The film adhesion unit 200 adheres the protective film PF on the workpiece W placed on the stage 100. As one embodiment, the film adhesion unit 200 can adhere the protective film PF on the thin film TF arranged on the upper surface of the workpiece W.

The material of the protective film PF is not particularly limited. In one embodiment, the protective film PF is a material through which the laser used for processing is transmitted and can be made of PET. More specifically, the protective film PF is a material through which the laser beam L having a wavelength of 440 nm to 1500 nm irradiated from the laser processing unit 300 is transmitted, and is also a transparent or opaque material.

In one embodiment, the protective film PF may contain an optical adhesive, which is also OCA (optical clearance) or OCR (optic clearance).

The film attachment unit 200 according to an embodiment of the present invention can include a suction pad 210 and a first roller 220.

The suction pad 210 sucks the protective film PF and adheres it on the thin film TF. In one embodiment, the suction pad 210 can suck and lift the protective film PF loaded on the loading unit (not shown). Then, the suction pad 210 moves to the thin film TF to which the foreign matter is attached or the defective thin film TF and then moves downward, and the protective film PF is placed on the thin film TF to which the foreign matter is attached or the defective thin film TF. It can be attached (see (a) in FIG. 2).

The first roller 220 can pressurize the protective film PF adhered on the thin film TF. In one embodiment, the first roller 220 can pressurize the protective film PF from above to below while moving in the moving direction of the film adhesion unit 200. Thereby, the thin film TF and the protective film PF can be adhered more closely, and in particular, the bubbles between the thin film TF and the protective film PF are removed, and the adhesive force between the thin film TF and the protective film PF is removed. Can be enhanced.

In one embodiment, the protective film PF can have a shape corresponding to the shape of the thin film TF. More specifically, as shown in FIG. 3, the protective film PF can have the same shape as the thin film TF having various shapes.

The size of the protective film PF is not particularly limited. In one embodiment, the protective film PF is preferably larger than the thin film TF by a predetermined ratio. That is, the protective film PF has a shape corresponding to the shape of the thin film TF, but its size is larger than that of the thin film TF. Thereby, in a state where the protective film PF is adhered on the thin film TF, the end portion of the protective film PF protrudes to the outside of the thin film TF, and thereafter, the thin film TF can be easily removed by using the film removing unit 400. can

4 is a drawing showing an example of the laser machining unit 300 of FIG. 1, and FIGS. 5 and 6 are examples of drawings showing an operating state of the laser machining unit 300 of FIG. 1 of FIG.

The thin film removing device 10 according to the embodiment of the present invention can separate the thin film TF arranged on the workpiece W by using the laser processing unit 300. The laser processing unit 300 can irradiate a laser beam having a predetermined wavelength and energy to integrally separate the thin film TF and the protective film PF from the workpiece W.

Referring to FIG. 4, as one embodiment, the laser processing unit 300 can include a laser oscillator 310, an optical system 320, and a laser controller 330.

The laser oscillator 310 can excite a specific medium to generate a laser beam L. The medium used in the laser oscillator 310 is not particularly limited, and liquid, gas, solid or semiconductor can be used.

The wavelength of the laser beam L oscillated by the laser oscillator 310 is not particularly limited. Preferably, the laser beam L is a blue laser or a near infrared laser and can have a wavelength of 440 nm to 1500 nm.

In one embodiment, the laser oscillator 310 can generate a pulsed laser. The laser oscillator 310 may include a Q-switching device, which can generate a laser beam L with an ultrashort pulse width of ps or fs.

The optical system 320 can control the optical path of the laser beam L generated by the laser oscillator 310, or can form a spot of the laser beam L to be irradiated on the workpiece W.

The optical system 320 according to one embodiment of the present invention can include two galvanometers 321a and 321b and an F-theta lens 322.

The galvanometers 321a and 321b can control the optical path of the incident laser beam L by a servomotor (not shown) and a laser controller 330 that controls the servomotor (not shown). The galvanometers 321a, 321b can rotate about at least one axis, eg, the X-axis or the Y-axis. Thereby, the laser beam L oscillated by the laser oscillator 310 can be moved along a predetermined path by the galvanometers 321a and 321b.

The laser beam L that has passed through the galvanometers 321a and 321b can be incident on the F theta lens 322. The F-theta lens 322 can focus the laser beam L and irradiate it at a predetermined position of the workpiece W placed on the stage 100.

The laser controller 330 can control the laser oscillator 310, the optical system 320, and the stage 100. As one embodiment, the laser controller 330 takes into consideration the position of the workpiece W placed on the stage 100, the moving speed of the laser beam L, the irradiation position, and the like, and the laser beam L oscillated by the laser oscillator 310. The irradiation timing of the laser can be controlled. Alternatively, the laser controller 330 can control the output or wavelength of the laser beam L emitted from the laser oscillator 310.

Further, the laser controller 330 can control the positions of the optical system 320, that is, the galvanometers 321a and 321b and the F theta lens 322, and can control the optical path and the irradiation position of the laser beam L.

Further, the laser controller 330 can perform laser machining by moving the laser machining unit 300 itself in the machining direction or moving the stage 100 in the machining direction during laser machining.

As another embodiment, the laser processing unit 300 can include a beam splitter that splits the laser beam L oscillated by the laser oscillator 310 into two laser beams. At this time, the beam splitter is a polarizing beam splitter (PBS), and a laser beam having different polarization states can be used.
Thereby, the laser processing unit 300 according to the present invention can improve the laser processing quality by using only the laser beam having a specific polarization state, or can utilize both of the laser beams divided into two. Therefore, the laser processing speed can be increased.

Referring to FIG. 5, the laser beam L irradiated from the laser processing unit 300 can irradiate the thin film TF. In one embodiment, the laser beam L has a wavelength of 440 nm to 1500 nm, and the protective film PF can be made of a material that transmits the laser beam L of the wavelength. As a result, as shown in FIG. 5A, the laser beam L can pass through the protective film PF and irradiate the lower surface of the thin film TF. Then, the laser beam L can separate the upper surface of the workpiece W and at least a part of the thin film TF from each other while removing a part of the thin film TF. At this time, since the thin film TF and the protective film PF are in a state of being adhered to each other, the thin film TF and the protective film PF can be integrally separated from the upper surface of the workpiece W.

Referring to FIG. 6, the laser beam L irradiated from the laser processing unit 300 is irradiated to the inner region of the thin film TF in a plan view, for example, in an XY plan view, and the thin film TF is applied from the upper surface of the workpiece W. Make it float. Further, the laser beam L is irradiated along the edge of the thin film TF in the XY plan view, and the edge of the thin film TF can be separated from the upper surface of the workpiece W.

That is, since the thin film removing device 10 according to the embodiment of the present invention has the protective film PF adhered to the upper surface of the thin film TF during laser processing, foreign matter such as fumes generated in the step of irradiating the laser beam L is generated. Can be minimized from scattering. Thereby, it is possible to prevent the problem that other thin film TFs are secondarily contaminated by foreign matter.

FIG. 7 is an example of a drawing showing an operating state of the film removing unit 400.

Referring to FIG. 7, the film removing unit 400 can remove the thin film TF separated from the upper surface of the workpiece W by the laser processing unit 300.

The film removing unit 400 according to an embodiment of the present invention can include a second roller 410 and a gripper 420.

If the upper surface of the workpiece W and the thin film TF are separated from each other by the laser processing unit 300, the film removing unit 400 can be moved onto the stage 100. The film removing unit 400 can be lifted after being adhered to the protective film PF by using the second roller 410 to separate a part of the thin film TF from the upper surface of the workpiece W.

As one embodiment, a predetermined adhesive member can be arranged on the outer peripheral surface of the second roller 410. Here, the upper surface of the workpiece W and the thin film TF are in a state of being separated by the laser processing unit 300, while the thin film TF is in a state of being adhered to the protective film PF. As a result, if the second roller 410 moves in the vertical direction or the left-right direction while being in contact with the upper surface of the protective film PF, the protective film PF also moves in the same direction while being attached to the second roller 410. It will be.

The film removing unit 400 can move the second roller 410 in a predetermined direction to separate the end portion of the thin film TF from the upper surface of the workpiece W (see (a) in FIG. 7).

The gripper 420 can completely separate the thin film TF from the upper surface of the workpiece W.

As one embodiment, the gripper 420 can grip the end portion of the protective film PF with the thin film TF separated from the upper surface of the workpiece W by the second roller 410.

The film removing unit 400 moves in a predetermined direction while the gripper 420 grips the end portion of the protective film PF, and can integrally separate the thin film TF and the protective film PF from the workpiece W (FIG. 7). (B)).

FIG. 8 is an example of a drawing showing before and after the thin film removing step between the comparative example and the invention example.

FIG. 8 shows a state in which the thin film TF is attached to the upper surface of the workpiece W before the step, and Comparative Example 1 shows a state in which the thin film TF is removed by using a laser irradiation device and a suction device for comparison. Example 2 shows a state in which the thin film TF is removed by using an ultrasonic cleaner, and Example 2 shows a state in which the thin film TF is removed by using the thin film removing device 10 according to the embodiment of the present invention.

As shown in FIG. 8, when the thin film TF is removed by using a conventional laser irradiation device, foreign matter such as fume is generated, and the foreign matter remains without being sucked by the suction device, and the workpiece W is removed. Can be contaminated next. It is also uneconomical as the inhaler must continue to operate during the removal process.

Similarly, even if the thin film TF is removed by using a conventional ultrasonic cleaner, foreign matter generated in the process may secondarily contaminate the workpiece W.

On the other hand, the thin film removing device 10 according to the present invention irradiates the laser beam L with the protective film PF attached to the upper surface of the thin film TF to be removed, so that foreign substances such as fumes generated in the process are scattered. By minimizing the above, it is possible to prevent the other workpiece W from being secondarily contaminated by foreign matter.

In particular, in the thin film removing device 10 according to the embodiment of the present invention, after the protective film PF is attached on the thin film TF, the protective film PF is formed on the upper surface of the thin film TF before the thin film TF is removed by the film removing unit 400. Since the adhered state can be maintained, it is possible to more reliably prevent the other thin film TF and the workpiece W from being secondarily contaminated.

Referring to FIG. 1 again, the thin film removing device 10 according to the embodiment of the present invention may further include an inspection unit 500.

The inspection unit 500 may detect the position of the workpiece W and transmit information about the detected position to at least one of the film adhesion unit 200, the laser processing unit 300, and the film removal unit 400. can.

In one embodiment, the inspection unit 500 can include a vision camera (not shown). The inspection unit 500 can use the vision camera to take an image of the workpiece W placed on the stage 100 and acquire an image. Then, the inspection unit 500 is based on the captured image, and the contaminated workpiece W or the defective workpiece W (more specifically, the thin film TF is contaminated or defective. Object W) can be discriminated.

Further, the inspection unit 500 detects the position of the work piece W that is contaminated or defective based on the captured image, and provides the position information to the film adhesion unit 200, the laser processing unit 300, and the film removal unit. It can be transmitted to 400.

The film attachment unit 200 can attach the protective film PF to the upper surface of the workpiece W based on the transmitted position information of the workpiece W.

The laser processing unit 300 can irradiate the upper surface of the workpiece W with the laser beam L based on the transmitted position information of the workpiece W. Further, the laser controller 330 can control the optical system 320 based on the transmitted position information of the workpiece W, and can control the optical path and the irradiation position of the laser beam L.

The film removing unit 400 can separate the thin film TF from the upper surface of the workpiece W based on the transmitted position information of the workpiece W.

As one embodiment, the inspection unit 500 can inspect the upper surface of the workpiece W from which the thin film TF has been removed again to check whether or not the thin film TF has been correctly removed.

On the other hand, with the workpiece W placed on the upper surface of the stage 100, the film adhesion unit 200, the laser processing unit 300, the film removal unit 400, and the inspection unit 500 operate in close proximity to the stage 100. It is shown as, but is not limited to it.

For example, a film adhesion unit 200, a laser processing unit 300, a film removal unit 400, and an inspection unit 500 are arranged on one line, and the stage 100 moves in one direction along the line while moving in one direction. Processing may be performed on the workpiece W.

FIG. 9 is an example of a drawing showing a thin film removing method according to another embodiment of the present invention.

Referring to FIG. 9, the thin film removing method according to the present invention comprises step S100 of adhering the protective film PF on the thin film TF arranged on the workpiece W, and irradiating the laser beam L from the workpiece W. The step S200 for integrally separating the thin film TF and the protective film PF and the step S300 for separating the thin film TF from the workpiece W can be included.

First, referring to FIGS. 1 to 9, the work piece W is placed on the stage 100 by a transfer unit (not shown) or the like, and the work piece W is placed on the thin film TF placed on the upper surface of the work piece W. The protective film PF is attached to the film by using the film adhesion unit 200.

More specifically, the suction pad 210 of the film adhesion unit 200 sucks and supports the protective film PF loaded on the loading unit (not shown). Next, the film adhesion unit 200 is lowered while being positioned on the thin film of the workpiece W, and the protective film PF is adhered on the thin film TF. The lower surface of the protective film PF may contain an adhesive such as OCR or OCA.

After adhering the protective film PF on the thin film TF, the protective film PF is pressed by the first roller 220 of the film adhering unit 200. Thereby, the protective film PF and the thin film TF are adhered more closely, and the bubbles existing between the protective film PF and the thin film TF can be removed.

Next, the thin film TF to which the protective film PF is attached is processed by the laser processing unit 300. As one embodiment, the laser beam L is generated by the laser oscillator 310 of the laser processing unit 300, the optical system 320 is controlled, the irradiation position and the optical path of the laser beam L are controlled, and the upper surface of the workpiece W is irradiated. ..

At this time, the wavelength of the laser beam L is 440 nm to 1500 nm, and the laser beam L having the wavelength passes through the protective film PF and is irradiated to the lower portion of the thin film TF attached to the upper surface of the workpiece W. .. As a result, the thin film TF and the protective film PF can be integrally separated from the upper surface of the workpiece W while a part of the thin film TF is removed.

As one embodiment, the step S200 for separating the thin film TF is a step of irradiating the inner region of the thin film TF with the laser beam L, that is, a hatching step and a step of irradiating the laser beam L along the edge of the thin film TF, that is, , Trimming steps and so on.

In the hatching step, in the XY plan view of FIG. 6, the laser beam L can be applied to the inner region of the thin film TF so that the thin film TF is totally lifted from the upper surface of the workpiece W. As one embodiment, the hatching step can be carried out quickly by controlling the galvanometers 321a and 321b of the optical system 320 and controlling the irradiation position of the laser beam L at a high speed.

In the trimming step, in the XY plan view of FIG. 6, the laser beam L can be irradiated along the edge of the thin film TF so that the edge of the thin film TF is separated from the upper surface of the workpiece W.

As one embodiment, after performing the hatching step, the trimming step can be carried out. That is, in the hatching step, the edge of the thin film TF is also in a state of being attached to the upper surface of the workpiece W. Thereby, the edge of the thin film TF can be prevented from being lifted during the hatching step, and the thin film TF can be separated more precisely.

Next, the separated thin film TF is separated from the upper surface of the workpiece W by the film removing unit 400. In one embodiment, the second roller 410 of the film removing unit 400 is brought into contact with the upper surface of the protective film PF. Since a predetermined adhesive member is arranged on the outer peripheral surface of the roller of the second roller 410, the protective film PF can be moved in the same direction by moving the second roller 410 in a predetermined direction.

Here, the thin film TF is in a state of being separated from the upper surface of the workpiece W, but is in a state of being adhered to the protective film PF. Therefore, the second roller 410 can be lifted upward with the second roller 410 attached to the edge of the protective film PF, and the protective film PF and the thin film TF can be lifted integrally.

Next, the thin film TF is separated from the upper surface of the workpiece W by the gripper 420 of the film removing unit 400. The gripper 420 can grip the end portion of the protective film PF lifted by the second roller 410, and by moving the gripper 420 in a predetermined direction, the protective film PF and the thin film TF are integrally formed on the workpiece W. Can be detached from the upper surface of the.

As one embodiment, the inspection unit 500 may further include a step of detecting the position of the workpiece W. More specifically, before the protective film PF is attached on the thin film TF arranged on the upper surface of the workpiece W, the image of the workpiece W is imaged by using the vision camera of the inspection unit 500. be able to.

Next, the inspection unit 500 can calculate information about the position of the workpiece W based on the captured image.

Further, the inspection unit 500 may further include a step of transmitting the position information of the workpiece W to at least one of the film adhesion unit 200, the laser processing unit 300, and the film removal unit 400.

Thereby, in the step of adhering the protective film PF, the film adhering unit 200 can position the protective film PF on the thin film TF based on the transmitted position information of the workpiece W.

Further, in the step of separating the thin film TF, the laser processing unit 300 can perform laser processing by controlling the laser oscillator 310 and the optical system 320 based on the transmitted position information of the workpiece W. ..

Further, in the step of separating the thin film TF, the film removing unit 400 can separate the thin film TF from the upper surface of the workpiece W based on the transmitted position information of the workpiece W.

As one embodiment, the inspection unit 500 may further include a step of inspecting the work area. More specifically, after the thin film TF is removed by the film removing unit 400, the upper surface of the workpiece W from which the thin film TF has been removed can be imaged by the inspection unit 500. The inspection unit 500 can determine the contaminated state of the upper surface of the workpiece W, whether or not the thin film TF has been removed, and the like, based on the captured image.

In the thin film removing device 10 and the thin film removing method according to the embodiment of the present invention, the protective film PF is adhered on the thin film TF arranged on the upper surface of the work piece W which is contaminated or defective, and the protective film PF is formed. The thin film TF and the protective film PF can be integrally separated from the upper surface of the workpiece W by irradiating the transmitted laser beam L, and the workpiece W is secondarily contaminated by foreign matter generated by the laser irradiation. It can be prevented.

In the thin film removing device 10 and the thin film removing method according to the embodiment of the present invention, the other workpiece W is secondarily contaminated by proceeding with the process in a state where the thin film TF and the protective film PF are attached. It can be reliably prevented.

In the present specification, the present invention has been described with a focus on limited embodiments, but various embodiments are possible within the scope of the present invention. Also, although not mentioned, it can be said that equal means are directly coupled to the present invention. Therefore, the true scope of protection of the present invention must be determined by the following claims.

Claims (9)

A film adhering device that adheres a protective film on a thin film placed on a work piece,
A laser processing unit that irradiates a laser beam and integrally separates the thin film and the protective film from the work piece.
A thin film removing device including a film removing unit that separates the thin film from the workpiece. The thin film removing device according to claim 1, wherein the protective film has a shape corresponding to the thin film, and the end portion protrudes to the outside of the thin film in a state of being attached to the upper surface of the thin film. .. The thin film removing device according to claim 1, wherein the laser beam has a wavelength of 440 nm to 1500 nm, passes through the protective film, and removes a part of the thin film. The laser processing unit irradiates the inner region of the thin film with the laser beam so that the thin film floats from the upper surface of the workpiece.
The thin film removing device according to claim 1, wherein the laser beam is applied to the edge of the thin film to separate the edge of the thin film from the upper surface of the workpiece. The first aspect of the present invention is characterized in that the film removing unit moves in a predetermined direction while gripping the end portion of the protective film, and integrally separates the thin film and the protective film from the workpiece. The thin film removing device according to the description. The step of adhering the protective film on the thin film placed on the work piece,
A step of irradiating a laser beam to integrally separate the thin film and the protective film from the workpiece.
A method for removing a thin film, which comprises a step of separating the thin film from the workpiece. The thin film removing method according to claim 6, wherein the laser beam has a wavelength of 440 nm to 1500 nm, passes through the protective film, and removes a part of the thin film. The step of integrally separating the thin film and the protective film is a step of irradiating the inner region of the thin film with the laser beam so that the thin film is lifted from the upper surface of the workpiece, and a step of irradiating the laser beam with the thin film. The thin film removing method according to claim 6, further comprising a step of irradiating the edge of the thin film to separate the edge of the thin film from the upper surface of the workpiece. A claim characterized in that the step of separating the thin film moves in a predetermined direction while grasping the end portion of the protective film, and integrally separates the thin film and the protective film from the workpiece. 6. The thin film removing method according to 6.

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