CN107104187A - Flexible display substrates laser lift-off device and its laser-stripping method - Google Patents
Flexible display substrates laser lift-off device and its laser-stripping method Download PDFInfo
- Publication number
- CN107104187A CN107104187A CN201710245715.7A CN201710245715A CN107104187A CN 107104187 A CN107104187 A CN 107104187A CN 201710245715 A CN201710245715 A CN 201710245715A CN 107104187 A CN107104187 A CN 107104187A
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- Prior art keywords
- flexible display
- carrier film
- laser
- display device
- display substrates
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of flexible display substrates laser lift-off device and its laser-stripping method.Device is used to peel off flexible display device to be stripped, and device includes:Carrier film, vacuum suction workbench and the laser beam of continuous volume to volume;Carrier film, for carrying and transmitting flexible display device to be stripped to the correspondence position of vacuum suction workbench, and the flexible display substrates laminating carrier film in flexible display device to be stripped;Vacuum suction workbench is below carrier film, for starting vacuum suction flexible display substrates;Laser beam is located at carrier film top and correspondence vacuum suction workbench, for carrying out the thickness that the distance between laser lift-off, and laser beam and carrier film are more than or equal to flexible display device to be stripped to flexible display device to be stripped.The present invention can realize continous way and efficient production.
Description
Technical field
The present invention relates to flexible display technologies field, it is used for flexible display substrates laser lift-off engineering more particularly, to one kind
Continuous type manufacture flexible display substrates laser lift-off device and its laser-stripping method.
Background technology
Flexible display is made of flexible material, because its is lightweight, small volume, slimming, it is easy to carry;Resistance to height
Temperature, impact resistance, shock resistance are stronger, and adaptable working environment is wider;Rollable, profile is with more aesthetic feeling of Art Design etc.
Advantage has the advantages that impact resistance, lightweight, easy to carry, with the irrealizable function of traditional monitor and Consumer's Experience
Advantage, therefore flexible display technologies are increasingly valued by people.
With flexible display manufacturing technology mature increasingly, it is already possible to using accurate coating process that high temperature resistant is soft
Property film make on the glass substrate, and array (Array) and organic luminous layer (OLED) processing procedure are carried out, most after module engineering
(Module) again with laser lift-off (LLO, Laser Lift Off) and mechanically decoupled (Mechanical De-lamination)
Flexible display substrates are peeled off and removed by twice fabrication from glass substrate.
However, traditional flexible display substrates laser lift-off technique is during laser lift-off, using individual substrate laser
Engineering process is peeled off, production efficiency is relatively low, and then improves equipment investment and manufacturing cost.
Therefore, existing flexible display substrates laser lift-off mode has much room for improvement and developed.
The content of the invention
It is an object of the present invention to provide a kind of flexible display substrates laser lift-off device and its laser-stripping method, can
To realize continous way and efficient production.
To achieve the above object, the invention provides a kind of flexible display substrates laser lift-off device, for to be stripped
Flexible display device peeled off, the flexible display device to be stripped includes carrier substrate and is formed at the carrier base
Flexible display substrates on plate;Described device includes:Carrier film, vacuum suction workbench and the laser light of continuous volume to volume
Beam;The carrier film, for carrying and transmitting the flexible display device to be stripped to the vacuum suction workbench
Correspondence position, and the flexible display substrates laminating carrier film;The vacuum suction workbench is located at the carrier film
Lower section, for starting the flexible display substrates in flexible display device to be stripped described in vacuum suction;The laser light
Beam is located at carrier film top and the correspondence vacuum suction workbench, for the flexible display device to be stripped
Laser lift-off is carried out, and the laser beam and the distance between the carrier film are aobvious more than or equal to the flexibility to be stripped
Show the thickness of device.
To achieve the above object, present invention also offers a kind of flexible display substrates laser-stripping method, using the present invention
Described flexible display substrates laser lift-off device;Methods described includes:Flexible display device transfer lamination to be stripped is arrived
On the carrier film of volume to volume, and the flexible display substrates laminating carrier film in the flexible display device to be stripped;Adopt
Carried with the carrier film and transmit the flexible display device to be stripped to the correspondence position of vacuum suction workbench;Adopt
Start flexible display substrates described in vacuum suction with the vacuum suction workbench;Using laser beam to described to be stripped
Flexible display device carries out laser lift-off.
It is an advantage of the current invention that the present invention is by the way that flexible display substrates in flexible display device to be stripped are fitted to
The carrier film of continuous volume to volume is shifted, it is possible to achieve multiple substrate productions of continuous type, production efficiency is compared to individual substrate
Effectively lifting.Using the viscosity of carrier film, the Flexible Displays after laser lift-off are separated with carrier substrate substantially, and flexibility is aobvious
Show the basic laser cutting engineering for continuing to be loaded into lower one, realize continous way and efficient production, and then reduce equipment throwing
Money and manufacturing cost.
Brief description of the drawings
Fig. 1, the schematic diagram of the flexible display substrates laser lift-off device described in one embodiment of the invention;
Fig. 2, the flexible display substrates laser lift-off manufacturing flow chart described in one embodiment of the invention;
Fig. 3, the thin portion separation schematic diagram of the flexible display substrates laser lift-off described in one embodiment of the invention.
Fig. 4, the flow chart of the flexible display substrates laser-stripping method described in one embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawings and embodiment, the flexible display substrates laser lift-off device and its laser provided the present invention
Stripping means elaborates.Obviously, described embodiment is only a part of embodiment of the invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
Every other embodiment, belongs to the scope of protection of the invention.
With reference to Fig. 1-2, wherein, Fig. 1 is showing for the flexible display substrates laser lift-off device described in one embodiment of the invention
It is intended to, Fig. 2 is the flexible display substrates laser lift-off manufacturing flow chart described in one embodiment of the invention.
As shown in figure 1, described device is used to peel off flexible display device to be stripped, the flexibility to be stripped
Display device includes carrier substrate and the flexible display substrates being formed on the carrier substrate;The carrier substrate can be glass
Glass substrate.Described device includes:The carrier film 120 of continuous volume to volume (roll-to-roll), vacuum suction workbench 130 with
And laser beam 140.
The carrier film 120, for carrying and transmitting the flexible display device (not shown in figure 1) to be stripped to institute
State the correspondence position of vacuum suction workbench 130, and the flexible display substrates (not shown in figure 1) laminating carrier film
120.As shown in a parts in Fig. 2, in the flexible display device to be stripped, flexible display substrates 202 are formed at carrier substrate
On 201;Into before laser lift-off engineering, first flexible display device 180 degree to be stripped is overturn, makes flexible display substrates 202
Positioned at the lower section of carrier substrate 201.As shown in b parts in Fig. 2, the flexible display device to be stripped after upset is fitted to
On the carrier film 120 of volume to volume, and the flexible display substrates 202 are fitted the carrier film 120;Held afterwards by carrier film 120
Carry and be sent to the correspondence position of the vacuum suction workbench 130.Carry film thickness can according to carrier substrate thickness of glass with
Weight requirements are selected.The carrier film 120 of continuous volume to volume can be used for the continuous of flexible display substrates laser lift-off engineering
Type manufacture, the carrier film that flexible display substrates are fitted into continuous volume to volume is shifted, it is possible to achieve continuous type multiple
Substrate production, production efficiency is effectively lifted compared to individual substrate.
The vacuum suction workbench 130 is to be stripped described in vacuum suction for starting located at the lower section of carrier film 120
From flexible display device in the flexible display substrates.As shown in c parts in Fig. 2, carrier film 120 will be fitted to thereon
Flexible display device to be stripped is transferred to after the correspondence position of vacuum suction workbench 130, vacuum suction workbench 130
Start vacuum and flexible display substrates are fully adsorbed in workbench, be easy to use laser beam 140 and carry out flexible display substrates
Laser lift-off engineering.
The laser beam 140 is used located at the top of carrier film 120 and the correspondence vacuum suction workbench 130
Carried out in the flexible display device to be stripped between laser lift-off, and the laser beam 140 and the carrier film 120
Distance be more than or equal to the flexible display device to be stripped thickness.The type of laser of the laser beam 140 includes
Quasi-molecule or solid-state laser laser.As shown in c parts in Fig. 2, when any position of flexible display device to be stripped is transmitted
To the correspondence position of vacuum suction workbench 130, laser beam 140 can be to the corresponding of flexible display device to be stripped
Laser is launched at position, and up to the contact surface between carrier substrate and flexible display substrates, so as to reduce carrier substrate and flexibility
Adhesive force between display base plate, the purpose peeled off with the corresponding position reached flexible display substrates from carrier substrate.
With continued reference to Fig. 1, described device further comprises:Vacuum cup 150 located at the top of carrier film 120.Institute
Carrier film 120 is stated to be further used for carrying and transmit the flexible display device after laser lift-off to pair of the vacuum cup 150
Answer position;The vacuum cup 150, for starting the load in the flexible display device after laser lift-off described in vacuum suction
Structure base board (not shown in figure 1), the carrier substrate is separated with the flexible display substrates;The carrier film 120 is additionally operable to
The flexible display substrates (not shown in figure 1) after transmission separation.
Further, deposition has an easily release glue-line (not shown) on the carrier film 120, it is viscosity stabilized and it is easy from
The glue-line of type is easy to cling the flexible display substrates in flexible display device.Utilize the viscosity of the glue-line, the vacuum cup
It is easy to separate the carrier substrate with the flexible display substrates, and the carrier film can be by the flexibility after separation
Display base plate is sent to subsequent processing.Specifically, the flexibility after carrier film 120 is carried and transmits the laser lift-off shows
Show after device to the correspondence position of the vacuum cup, will be described by the vacuum cup 150 using the viscosity of the glue-line
Carrier substrate is separated with the flexible display substrates, is passed the flexible display substrates after separation by the carrier film 120
Deliver to subsequent processing.As shown in d parts in Fig. 2, complete after laser lift-off engineering, when the carrier film 120 is carried and transmits sharp
After flexible display device to the correspondence position (being illustrated as the end of carrier film 120) of vacuum cup after photospallation, the vacuum
Sucker 150 starts the carrier substrate 201 in the flexible display device after laser lift-off described in vacuum suction, utilizes the glue-line
Viscosity, the carrier substrate 201 is separated with the flexible display substrates 202, i.e., vacuum cup can be used in carrier substrate 201
150 blankings (blanking operation can use existing mode of operation, and here is omitted);Due to the viscosity of the glue-line, laser lift-off
Flexible display substrates 202 in flexible display device afterwards are still fitted on the carrier film 120, until and carrier substrate
201 are kept completely separate;The laser that carrier film 120 can continue the flexible display substrates 202 after separation to be loaded into lower one is cut
Cut engineering.
With reference to Fig. 3, the thin portion separation schematic diagram of the flexible display substrates laser lift-off described in one embodiment of the invention.As schemed
Shown in 3, because the vacuum suction of vacuum cup (not shown in Fig. 3) is acted on, the load in flexible display device after laser lift-off
Structure base board 201 according to moving upwards shown in arrow;And due to the viscosity of carrier film, it is soft in the flexible display device after laser lift-off
Property display base plate 202 is still fitted on the carrier film 120;In the vacuum suction effect of vacuum cup and gluing for carrier film
Property effect under, flexible display substrates 202 are finally kept completely separate with carrier substrate 201.Carrier film 120 can be by described in after separation
Flexible display substrates 202 continue to be loaded into lower laser cutting engineering together.The means of transportation 310 that laser cutting engineering is used
Structure is not limited to the carrier film of above-mentioned volume to volume, as long as can the flexible display substrates after separation be normally completed with laser cutting behaviour
Work.
Flexible display substrates laser lift-off device of the present invention, by Flexible Displays in flexible display device to be stripped
Baseplate-laminating is shifted to the carrier film of continuous volume to volume, it is possible to achieve multiple substrate productions of continuous type, production efficiency is compared
Effectively lifted in individual substrate.Using the viscosity of carrier film, the Flexible Displays after laser lift-off are separated with carrier substrate substantially,
And continue Flexible Displays substantially to be loaded into lower laser cutting engineering together, realize continous way and efficient production.
With reference to Fig. 4, the flow chart of the flexible display substrates laser-stripping method described in one embodiment of the invention.Methods described
Using flexible display substrates laser lift-off device of the present invention;Methods described comprises the following steps:S42:Will be to be stripped
Flexible display device transfer lamination is on the carrier film of volume to volume, and the Flexible Displays in the flexible display device to be stripped
Carrier film described in baseplate-laminating;S44:Carried using the carrier film and transmit the flexible display device to be stripped to vacuum
Adsorb the correspondence position of workbench;S46:Flexible Displays base described in vacuum suction is started using the vacuum suction workbench
Plate;S48:Laser lift-off is carried out to the flexible display device to be stripped using laser beam.Swash below to of the present invention
Photospallation method elaborates.
On step S42:By in flexible display device transfer lamination to be stripped to the carrier film of volume to volume, and described treat
The flexible display substrates laminating carrier film in the flexible display device of stripping, please also refer to a parts in Fig. 4 and Fig. 2.
In flexible display device to be stripped, flexible display substrates 202 are formed on carrier substrate 201;Into before laser lift-off engineering,
First flexible display device 180 degree to be stripped is overturn, flexible display substrates 202 is located at the lower section of carrier substrate 201.It is described to carry
Structure base board 201 can be with rigid glass substrate.
On step S44:Carried using the carrier film and transmit the flexible display device to be stripped to vacuum and inhaled
The correspondence position of attached workbench, please also refer to b parts in Fig. 4 and Fig. 2.The flexibility to be stripped after upset is shown
Show that device is fitted on the carrier film 120 of volume to volume, and the flexible display substrates 202 are fitted the carrier film 120;Afterwards by
Carrier film 120 carries and is sent to the correspondence position of the vacuum suction workbench 130.Carrying film thickness can be according to carrier substrate
Thickness of glass is selected with weight requirements.The carrier film 120 of continuous volume to volume can be used for flexible display substrates laser lift-off
The continuous type manufacture of engineering, the carrier film that flexible display substrates are fitted into continuous volume to volume is shifted, it is possible to achieve
Multiple substrate productions of continuous type, production efficiency is effectively lifted compared to individual substrate.
On step S46:Using flexible display substrates described in vacuum suction workbench startup vacuum suction, one is asked
And with reference to c parts in Fig. 4 and Fig. 2.The flexible display device to be stripped fitted to thereon is transferred to vacuum by carrier film 120
After the correspondence position for adsorbing workbench 130, vacuum suction workbench 130 starts vacuum and fully adsorbs flexible display substrates
In workbench, the laser lift-off engineering that laser beam 140 carries out flexible display substrates is easy to use.
On step S48:Laser lift-off is carried out to the flexible display device to be stripped using laser beam, please in the lump
With reference to c parts in Fig. 4 and Fig. 2.Put down when any position of flexible display device to be stripped is transferred into vacuum suction work
After the correspondence position of platform 130, laser beam 140 can launch laser to the corresponding site of flexible display device to be stripped, and
Until the contact surface between carrier substrate and flexible display substrates, so as to reduce attached between carrier substrate and flexible display substrates
Put forth effort, the purpose peeled off with the corresponding position reached flexible display substrates from carrier substrate.The laser beam 140 swash
Light type includes quasi-molecule or solid-state laser laser.
Described device further comprises vacuum cup, and the vacuum cup is above the carrier film;Methods described is entered
One step includes:S49:Carried using the carrier film and transmit the flexible display device after laser lift-off to the vacuum cup
Correspondence position;Start the carrier base in the flexible display device after laser lift-off described in vacuum suction using the vacuum cup
Plate, the carrier substrate is separated with the flexible display substrates;Transmit described flexible aobvious after separation using the carrier film
Show substrate.
Further, deposition has easily release glue-line on the carrier film;Step S49 further comprises:When the carrying
Film is carried and transmitted after the flexible display device after the laser lift-off to the correspondence position of the vacuum cup, utilizes the glue
The viscosity of layer, the carrier substrate is separated, pass through the carrier film by the vacuum cup with the flexible display substrates
The flexible display substrates after separation are sent to subsequent processing.
On step S49, please also refer to d parts in Fig. 4 and Fig. 2.Complete after laser lift-off engineering, when the carrying
Film 120, which carries and transmits the correspondence position of the flexible display device after laser lift-off to vacuum cup, (is illustrated as carrier film 120
End) after, the vacuum cup 150 starts the carrier substrate in the flexible display device after laser lift-off described in vacuum suction
201, using the viscosity of the glue-line, the carrier substrate 201 is separated with the flexible display substrates 202, i.e. carrier substrate
201 can be used the blanking of vacuum cup 150 (blanking operation can use existing mode of operation, and here is omitted);Due to the glue
The flexible display substrates 202 in flexible display device after the viscosity of layer, laser lift-off still fit in the carrier film 120
On, until being kept completely separate with carrier substrate 201;Carrier film 120 can continue the flexible display substrates 202 after separation to carry
Enter lower laser cutting engineering together.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of flexible display substrates laser lift-off device, described to treat for being peeled off to flexible display device to be stripped
The flexible display device of stripping includes carrier substrate and the flexible display substrates being formed on the carrier substrate, and its feature exists
In described device includes:Carrier film, vacuum suction workbench and the laser beam of continuous volume to volume;
The carrier film, for carrying and transmitting the flexible display device to be stripped to the vacuum suction workbench
Correspondence position, and the flexible display substrates laminating carrier film;
The vacuum suction workbench is below the carrier film, for starting flexible display substrates described in vacuum suction;
The laser beam is located at carrier film top and the correspondence vacuum suction workbench, for described to be stripped
Flexible display device carry out the distance between laser lift-off, and the laser beam and described carrier film be more than or equal to it is described
The thickness of flexible display device to be stripped.
2. device as claimed in claim 1, it is characterised in that the carrier substrate is glass substrate.
3. device as claimed in claim 1, it is characterised in that the type of laser of the laser beam includes quasi-molecule or solid-state
Laser.
4. device as claimed in claim 1, it is characterised in that described device further comprises:Above the carrier film
Vacuum cup;
The carrier film is further used for carrying and transmits the flexible display device after laser lift-off to pair of the vacuum cup
Answer position;
The vacuum cup, for starting the carrier base in the flexible display device after laser lift-off described in vacuum suction
Plate, the carrier substrate is separated with the flexible display substrates;
The carrier film is additionally operable to the flexible display substrates after transmission separation.
5. device as claimed in claim 4, it is characterised in that deposition has easily release glue-line on the carrier film;
The flexible display device after carrier film is carried and transmits the laser lift-off is to the corresponding position of the vacuum cup
Postpone, using the viscosity of the glue-line, separated the carrier substrate with the flexible display substrates by the vacuum cup,
The flexible display substrates after separation are sent to by subsequent processing by the carrier film.
6. a kind of flexible display substrates laser-stripping method, it is characterised in that using the flexible display substrates described in claim 1
Laser lift-off device;Methods described includes:
By in flexible display device transfer lamination to be stripped to the carrier film of volume to volume, and the flexible display to be stripped
The flexible display substrates laminating carrier film in part;
Carried using the carrier film and transmit the flexible display device to be stripped to the correspondence of vacuum suction workbench
Position;
Flexible display substrates described in vacuum suction are started using the vacuum suction workbench;
Laser lift-off is carried out to the flexible display device to be stripped using laser beam.
7. method as claimed in claim 6, it is characterised in that the carrier substrate is glass substrate.
8. method as claimed in claim 6, it is characterised in that the type of laser of the laser beam includes quasi-molecule or solid-state
Laser.
9. method as claimed in claim 6, it is characterised in that described device further comprises vacuum cup, the vacuum is inhaled
Disk is above the carrier film;Methods described further comprises:
Carried using the carrier film and transmit the flexible display device after laser lift-off to the correspondence position of the vacuum cup;
Start the carrier substrate in the flexible display device after laser lift-off described in vacuum suction using the vacuum cup, by institute
Carrier substrate is stated to separate with the flexible display substrates;
The flexible display substrates after separation are transmitted using the carrier film.
10. method as claimed in claim 9, it is characterised in that deposition has easily release glue-line on the carrier film;
The flexible display device after carrier film is carried and transmits the laser lift-off is to the corresponding position of the vacuum cup
Postpone, using the viscosity of the glue-line, separated the carrier substrate with the flexible display substrates by the vacuum cup,
The flexible display substrates after separation are sent to by subsequent processing by the carrier film.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019056438A1 (en) * | 2017-09-22 | 2019-03-28 | 武汉华星光电技术有限公司 | Device and method for separating flexible panel and glass substrate |
CN109616573A (en) * | 2018-10-31 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board |
CN109873015A (en) * | 2019-02-27 | 2019-06-11 | 武汉华星光电半导体显示技术有限公司 | Organic LED panel and its manufacturing method |
WO2019114056A1 (en) * | 2017-12-13 | 2019-06-20 | 武汉华星光电半导体显示技术有限公司 | Method and device for separating glass substrate from flexible oled display panel |
CN111843187A (en) * | 2020-07-30 | 2020-10-30 | 广东大族粤铭激光集团股份有限公司 | Laser screen separation method |
CN114171709A (en) * | 2021-12-07 | 2022-03-11 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of flexible display panel and equipment for preparing display panel |
TWI803872B (en) * | 2020-05-18 | 2023-06-01 | 南韓商未來股份有限公司 | Appratus for removing thin film and method for removing thin film |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456900A (en) * | 2013-08-20 | 2013-12-18 | Tcl集团股份有限公司 | Flexible display device manufacturing method |
CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
CN105549340A (en) * | 2016-02-24 | 2016-05-04 | 上海大学 | Photoetching method and device of roll to roll flexible substrate |
CN106158904A (en) * | 2015-04-03 | 2016-11-23 | 昆山工研院新型平板显示技术中心有限公司 | A kind of high-resolution flexible display screen and preparation method thereof |
-
2017
- 2017-04-14 CN CN201710245715.7A patent/CN107104187A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456900A (en) * | 2013-08-20 | 2013-12-18 | Tcl集团股份有限公司 | Flexible display device manufacturing method |
CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
CN106158904A (en) * | 2015-04-03 | 2016-11-23 | 昆山工研院新型平板显示技术中心有限公司 | A kind of high-resolution flexible display screen and preparation method thereof |
CN105549340A (en) * | 2016-02-24 | 2016-05-04 | 上海大学 | Photoetching method and device of roll to roll flexible substrate |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019056438A1 (en) * | 2017-09-22 | 2019-03-28 | 武汉华星光电技术有限公司 | Device and method for separating flexible panel and glass substrate |
WO2019114056A1 (en) * | 2017-12-13 | 2019-06-20 | 武汉华星光电半导体显示技术有限公司 | Method and device for separating glass substrate from flexible oled display panel |
CN109616573A (en) * | 2018-10-31 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board |
CN109873015A (en) * | 2019-02-27 | 2019-06-11 | 武汉华星光电半导体显示技术有限公司 | Organic LED panel and its manufacturing method |
TWI803872B (en) * | 2020-05-18 | 2023-06-01 | 南韓商未來股份有限公司 | Appratus for removing thin film and method for removing thin film |
CN111843187A (en) * | 2020-07-30 | 2020-10-30 | 广东大族粤铭激光集团股份有限公司 | Laser screen separation method |
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