CN107104187A - Flexible display substrates laser lift-off device and its laser-stripping method - Google Patents

Flexible display substrates laser lift-off device and its laser-stripping method Download PDF

Info

Publication number
CN107104187A
CN107104187A CN201710245715.7A CN201710245715A CN107104187A CN 107104187 A CN107104187 A CN 107104187A CN 201710245715 A CN201710245715 A CN 201710245715A CN 107104187 A CN107104187 A CN 107104187A
Authority
CN
China
Prior art keywords
flexible display
carrier film
laser
display device
display substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710245715.7A
Other languages
Chinese (zh)
Inventor
蔡哲汶
王思元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to CN201710245715.7A priority Critical patent/CN107104187A/en
Publication of CN107104187A publication Critical patent/CN107104187A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a kind of flexible display substrates laser lift-off device and its laser-stripping method.Device is used to peel off flexible display device to be stripped, and device includes:Carrier film, vacuum suction workbench and the laser beam of continuous volume to volume;Carrier film, for carrying and transmitting flexible display device to be stripped to the correspondence position of vacuum suction workbench, and the flexible display substrates laminating carrier film in flexible display device to be stripped;Vacuum suction workbench is below carrier film, for starting vacuum suction flexible display substrates;Laser beam is located at carrier film top and correspondence vacuum suction workbench, for carrying out the thickness that the distance between laser lift-off, and laser beam and carrier film are more than or equal to flexible display device to be stripped to flexible display device to be stripped.The present invention can realize continous way and efficient production.

Description

Flexible display substrates laser lift-off device and its laser-stripping method
Technical field
The present invention relates to flexible display technologies field, it is used for flexible display substrates laser lift-off engineering more particularly, to one kind Continuous type manufacture flexible display substrates laser lift-off device and its laser-stripping method.
Background technology
Flexible display is made of flexible material, because its is lightweight, small volume, slimming, it is easy to carry;Resistance to height Temperature, impact resistance, shock resistance are stronger, and adaptable working environment is wider;Rollable, profile is with more aesthetic feeling of Art Design etc. Advantage has the advantages that impact resistance, lightweight, easy to carry, with the irrealizable function of traditional monitor and Consumer's Experience Advantage, therefore flexible display technologies are increasingly valued by people.
With flexible display manufacturing technology mature increasingly, it is already possible to using accurate coating process that high temperature resistant is soft Property film make on the glass substrate, and array (Array) and organic luminous layer (OLED) processing procedure are carried out, most after module engineering (Module) again with laser lift-off (LLO, Laser Lift Off) and mechanically decoupled (Mechanical De-lamination) Flexible display substrates are peeled off and removed by twice fabrication from glass substrate.
However, traditional flexible display substrates laser lift-off technique is during laser lift-off, using individual substrate laser Engineering process is peeled off, production efficiency is relatively low, and then improves equipment investment and manufacturing cost.
Therefore, existing flexible display substrates laser lift-off mode has much room for improvement and developed.
The content of the invention
It is an object of the present invention to provide a kind of flexible display substrates laser lift-off device and its laser-stripping method, can To realize continous way and efficient production.
To achieve the above object, the invention provides a kind of flexible display substrates laser lift-off device, for to be stripped Flexible display device peeled off, the flexible display device to be stripped includes carrier substrate and is formed at the carrier base Flexible display substrates on plate;Described device includes:Carrier film, vacuum suction workbench and the laser light of continuous volume to volume Beam;The carrier film, for carrying and transmitting the flexible display device to be stripped to the vacuum suction workbench Correspondence position, and the flexible display substrates laminating carrier film;The vacuum suction workbench is located at the carrier film Lower section, for starting the flexible display substrates in flexible display device to be stripped described in vacuum suction;The laser light Beam is located at carrier film top and the correspondence vacuum suction workbench, for the flexible display device to be stripped Laser lift-off is carried out, and the laser beam and the distance between the carrier film are aobvious more than or equal to the flexibility to be stripped Show the thickness of device.
To achieve the above object, present invention also offers a kind of flexible display substrates laser-stripping method, using the present invention Described flexible display substrates laser lift-off device;Methods described includes:Flexible display device transfer lamination to be stripped is arrived On the carrier film of volume to volume, and the flexible display substrates laminating carrier film in the flexible display device to be stripped;Adopt Carried with the carrier film and transmit the flexible display device to be stripped to the correspondence position of vacuum suction workbench;Adopt Start flexible display substrates described in vacuum suction with the vacuum suction workbench;Using laser beam to described to be stripped Flexible display device carries out laser lift-off.
It is an advantage of the current invention that the present invention is by the way that flexible display substrates in flexible display device to be stripped are fitted to The carrier film of continuous volume to volume is shifted, it is possible to achieve multiple substrate productions of continuous type, production efficiency is compared to individual substrate Effectively lifting.Using the viscosity of carrier film, the Flexible Displays after laser lift-off are separated with carrier substrate substantially, and flexibility is aobvious Show the basic laser cutting engineering for continuing to be loaded into lower one, realize continous way and efficient production, and then reduce equipment throwing Money and manufacturing cost.
Brief description of the drawings
Fig. 1, the schematic diagram of the flexible display substrates laser lift-off device described in one embodiment of the invention;
Fig. 2, the flexible display substrates laser lift-off manufacturing flow chart described in one embodiment of the invention;
Fig. 3, the thin portion separation schematic diagram of the flexible display substrates laser lift-off described in one embodiment of the invention.
Fig. 4, the flow chart of the flexible display substrates laser-stripping method described in one embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawings and embodiment, the flexible display substrates laser lift-off device and its laser provided the present invention Stripping means elaborates.Obviously, described embodiment is only a part of embodiment of the invention, rather than whole implementation Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made Every other embodiment, belongs to the scope of protection of the invention.
With reference to Fig. 1-2, wherein, Fig. 1 is showing for the flexible display substrates laser lift-off device described in one embodiment of the invention It is intended to, Fig. 2 is the flexible display substrates laser lift-off manufacturing flow chart described in one embodiment of the invention.
As shown in figure 1, described device is used to peel off flexible display device to be stripped, the flexibility to be stripped Display device includes carrier substrate and the flexible display substrates being formed on the carrier substrate;The carrier substrate can be glass Glass substrate.Described device includes:The carrier film 120 of continuous volume to volume (roll-to-roll), vacuum suction workbench 130 with And laser beam 140.
The carrier film 120, for carrying and transmitting the flexible display device (not shown in figure 1) to be stripped to institute State the correspondence position of vacuum suction workbench 130, and the flexible display substrates (not shown in figure 1) laminating carrier film 120.As shown in a parts in Fig. 2, in the flexible display device to be stripped, flexible display substrates 202 are formed at carrier substrate On 201;Into before laser lift-off engineering, first flexible display device 180 degree to be stripped is overturn, makes flexible display substrates 202 Positioned at the lower section of carrier substrate 201.As shown in b parts in Fig. 2, the flexible display device to be stripped after upset is fitted to On the carrier film 120 of volume to volume, and the flexible display substrates 202 are fitted the carrier film 120;Held afterwards by carrier film 120 Carry and be sent to the correspondence position of the vacuum suction workbench 130.Carry film thickness can according to carrier substrate thickness of glass with Weight requirements are selected.The carrier film 120 of continuous volume to volume can be used for the continuous of flexible display substrates laser lift-off engineering Type manufacture, the carrier film that flexible display substrates are fitted into continuous volume to volume is shifted, it is possible to achieve continuous type multiple Substrate production, production efficiency is effectively lifted compared to individual substrate.
The vacuum suction workbench 130 is to be stripped described in vacuum suction for starting located at the lower section of carrier film 120 From flexible display device in the flexible display substrates.As shown in c parts in Fig. 2, carrier film 120 will be fitted to thereon Flexible display device to be stripped is transferred to after the correspondence position of vacuum suction workbench 130, vacuum suction workbench 130 Start vacuum and flexible display substrates are fully adsorbed in workbench, be easy to use laser beam 140 and carry out flexible display substrates Laser lift-off engineering.
The laser beam 140 is used located at the top of carrier film 120 and the correspondence vacuum suction workbench 130 Carried out in the flexible display device to be stripped between laser lift-off, and the laser beam 140 and the carrier film 120 Distance be more than or equal to the flexible display device to be stripped thickness.The type of laser of the laser beam 140 includes Quasi-molecule or solid-state laser laser.As shown in c parts in Fig. 2, when any position of flexible display device to be stripped is transmitted To the correspondence position of vacuum suction workbench 130, laser beam 140 can be to the corresponding of flexible display device to be stripped Laser is launched at position, and up to the contact surface between carrier substrate and flexible display substrates, so as to reduce carrier substrate and flexibility Adhesive force between display base plate, the purpose peeled off with the corresponding position reached flexible display substrates from carrier substrate.
With continued reference to Fig. 1, described device further comprises:Vacuum cup 150 located at the top of carrier film 120.Institute Carrier film 120 is stated to be further used for carrying and transmit the flexible display device after laser lift-off to pair of the vacuum cup 150 Answer position;The vacuum cup 150, for starting the load in the flexible display device after laser lift-off described in vacuum suction Structure base board (not shown in figure 1), the carrier substrate is separated with the flexible display substrates;The carrier film 120 is additionally operable to The flexible display substrates (not shown in figure 1) after transmission separation.
Further, deposition has an easily release glue-line (not shown) on the carrier film 120, it is viscosity stabilized and it is easy from The glue-line of type is easy to cling the flexible display substrates in flexible display device.Utilize the viscosity of the glue-line, the vacuum cup It is easy to separate the carrier substrate with the flexible display substrates, and the carrier film can be by the flexibility after separation Display base plate is sent to subsequent processing.Specifically, the flexibility after carrier film 120 is carried and transmits the laser lift-off shows Show after device to the correspondence position of the vacuum cup, will be described by the vacuum cup 150 using the viscosity of the glue-line Carrier substrate is separated with the flexible display substrates, is passed the flexible display substrates after separation by the carrier film 120 Deliver to subsequent processing.As shown in d parts in Fig. 2, complete after laser lift-off engineering, when the carrier film 120 is carried and transmits sharp After flexible display device to the correspondence position (being illustrated as the end of carrier film 120) of vacuum cup after photospallation, the vacuum Sucker 150 starts the carrier substrate 201 in the flexible display device after laser lift-off described in vacuum suction, utilizes the glue-line Viscosity, the carrier substrate 201 is separated with the flexible display substrates 202, i.e., vacuum cup can be used in carrier substrate 201 150 blankings (blanking operation can use existing mode of operation, and here is omitted);Due to the viscosity of the glue-line, laser lift-off Flexible display substrates 202 in flexible display device afterwards are still fitted on the carrier film 120, until and carrier substrate 201 are kept completely separate;The laser that carrier film 120 can continue the flexible display substrates 202 after separation to be loaded into lower one is cut Cut engineering.
With reference to Fig. 3, the thin portion separation schematic diagram of the flexible display substrates laser lift-off described in one embodiment of the invention.As schemed Shown in 3, because the vacuum suction of vacuum cup (not shown in Fig. 3) is acted on, the load in flexible display device after laser lift-off Structure base board 201 according to moving upwards shown in arrow;And due to the viscosity of carrier film, it is soft in the flexible display device after laser lift-off Property display base plate 202 is still fitted on the carrier film 120;In the vacuum suction effect of vacuum cup and gluing for carrier film Property effect under, flexible display substrates 202 are finally kept completely separate with carrier substrate 201.Carrier film 120 can be by described in after separation Flexible display substrates 202 continue to be loaded into lower laser cutting engineering together.The means of transportation 310 that laser cutting engineering is used Structure is not limited to the carrier film of above-mentioned volume to volume, as long as can the flexible display substrates after separation be normally completed with laser cutting behaviour Work.
Flexible display substrates laser lift-off device of the present invention, by Flexible Displays in flexible display device to be stripped Baseplate-laminating is shifted to the carrier film of continuous volume to volume, it is possible to achieve multiple substrate productions of continuous type, production efficiency is compared Effectively lifted in individual substrate.Using the viscosity of carrier film, the Flexible Displays after laser lift-off are separated with carrier substrate substantially, And continue Flexible Displays substantially to be loaded into lower laser cutting engineering together, realize continous way and efficient production.
With reference to Fig. 4, the flow chart of the flexible display substrates laser-stripping method described in one embodiment of the invention.Methods described Using flexible display substrates laser lift-off device of the present invention;Methods described comprises the following steps:S42:Will be to be stripped Flexible display device transfer lamination is on the carrier film of volume to volume, and the Flexible Displays in the flexible display device to be stripped Carrier film described in baseplate-laminating;S44:Carried using the carrier film and transmit the flexible display device to be stripped to vacuum Adsorb the correspondence position of workbench;S46:Flexible Displays base described in vacuum suction is started using the vacuum suction workbench Plate;S48:Laser lift-off is carried out to the flexible display device to be stripped using laser beam.Swash below to of the present invention Photospallation method elaborates.
On step S42:By in flexible display device transfer lamination to be stripped to the carrier film of volume to volume, and described treat The flexible display substrates laminating carrier film in the flexible display device of stripping, please also refer to a parts in Fig. 4 and Fig. 2. In flexible display device to be stripped, flexible display substrates 202 are formed on carrier substrate 201;Into before laser lift-off engineering, First flexible display device 180 degree to be stripped is overturn, flexible display substrates 202 is located at the lower section of carrier substrate 201.It is described to carry Structure base board 201 can be with rigid glass substrate.
On step S44:Carried using the carrier film and transmit the flexible display device to be stripped to vacuum and inhaled The correspondence position of attached workbench, please also refer to b parts in Fig. 4 and Fig. 2.The flexibility to be stripped after upset is shown Show that device is fitted on the carrier film 120 of volume to volume, and the flexible display substrates 202 are fitted the carrier film 120;Afterwards by Carrier film 120 carries and is sent to the correspondence position of the vacuum suction workbench 130.Carrying film thickness can be according to carrier substrate Thickness of glass is selected with weight requirements.The carrier film 120 of continuous volume to volume can be used for flexible display substrates laser lift-off The continuous type manufacture of engineering, the carrier film that flexible display substrates are fitted into continuous volume to volume is shifted, it is possible to achieve Multiple substrate productions of continuous type, production efficiency is effectively lifted compared to individual substrate.
On step S46:Using flexible display substrates described in vacuum suction workbench startup vacuum suction, one is asked And with reference to c parts in Fig. 4 and Fig. 2.The flexible display device to be stripped fitted to thereon is transferred to vacuum by carrier film 120 After the correspondence position for adsorbing workbench 130, vacuum suction workbench 130 starts vacuum and fully adsorbs flexible display substrates In workbench, the laser lift-off engineering that laser beam 140 carries out flexible display substrates is easy to use.
On step S48:Laser lift-off is carried out to the flexible display device to be stripped using laser beam, please in the lump With reference to c parts in Fig. 4 and Fig. 2.Put down when any position of flexible display device to be stripped is transferred into vacuum suction work After the correspondence position of platform 130, laser beam 140 can launch laser to the corresponding site of flexible display device to be stripped, and Until the contact surface between carrier substrate and flexible display substrates, so as to reduce attached between carrier substrate and flexible display substrates Put forth effort, the purpose peeled off with the corresponding position reached flexible display substrates from carrier substrate.The laser beam 140 swash Light type includes quasi-molecule or solid-state laser laser.
Described device further comprises vacuum cup, and the vacuum cup is above the carrier film;Methods described is entered One step includes:S49:Carried using the carrier film and transmit the flexible display device after laser lift-off to the vacuum cup Correspondence position;Start the carrier base in the flexible display device after laser lift-off described in vacuum suction using the vacuum cup Plate, the carrier substrate is separated with the flexible display substrates;Transmit described flexible aobvious after separation using the carrier film Show substrate.
Further, deposition has easily release glue-line on the carrier film;Step S49 further comprises:When the carrying Film is carried and transmitted after the flexible display device after the laser lift-off to the correspondence position of the vacuum cup, utilizes the glue The viscosity of layer, the carrier substrate is separated, pass through the carrier film by the vacuum cup with the flexible display substrates The flexible display substrates after separation are sent to subsequent processing.
On step S49, please also refer to d parts in Fig. 4 and Fig. 2.Complete after laser lift-off engineering, when the carrying Film 120, which carries and transmits the correspondence position of the flexible display device after laser lift-off to vacuum cup, (is illustrated as carrier film 120 End) after, the vacuum cup 150 starts the carrier substrate in the flexible display device after laser lift-off described in vacuum suction 201, using the viscosity of the glue-line, the carrier substrate 201 is separated with the flexible display substrates 202, i.e. carrier substrate 201 can be used the blanking of vacuum cup 150 (blanking operation can use existing mode of operation, and here is omitted);Due to the glue The flexible display substrates 202 in flexible display device after the viscosity of layer, laser lift-off still fit in the carrier film 120 On, until being kept completely separate with carrier substrate 201;Carrier film 120 can continue the flexible display substrates 202 after separation to carry Enter lower laser cutting engineering together.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art Member, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be regarded as Protection scope of the present invention.

Claims (10)

1. a kind of flexible display substrates laser lift-off device, described to treat for being peeled off to flexible display device to be stripped The flexible display device of stripping includes carrier substrate and the flexible display substrates being formed on the carrier substrate, and its feature exists In described device includes:Carrier film, vacuum suction workbench and the laser beam of continuous volume to volume;
The carrier film, for carrying and transmitting the flexible display device to be stripped to the vacuum suction workbench Correspondence position, and the flexible display substrates laminating carrier film;
The vacuum suction workbench is below the carrier film, for starting flexible display substrates described in vacuum suction;
The laser beam is located at carrier film top and the correspondence vacuum suction workbench, for described to be stripped Flexible display device carry out the distance between laser lift-off, and the laser beam and described carrier film be more than or equal to it is described The thickness of flexible display device to be stripped.
2. device as claimed in claim 1, it is characterised in that the carrier substrate is glass substrate.
3. device as claimed in claim 1, it is characterised in that the type of laser of the laser beam includes quasi-molecule or solid-state Laser.
4. device as claimed in claim 1, it is characterised in that described device further comprises:Above the carrier film Vacuum cup;
The carrier film is further used for carrying and transmits the flexible display device after laser lift-off to pair of the vacuum cup Answer position;
The vacuum cup, for starting the carrier base in the flexible display device after laser lift-off described in vacuum suction Plate, the carrier substrate is separated with the flexible display substrates;
The carrier film is additionally operable to the flexible display substrates after transmission separation.
5. device as claimed in claim 4, it is characterised in that deposition has easily release glue-line on the carrier film;
The flexible display device after carrier film is carried and transmits the laser lift-off is to the corresponding position of the vacuum cup Postpone, using the viscosity of the glue-line, separated the carrier substrate with the flexible display substrates by the vacuum cup, The flexible display substrates after separation are sent to by subsequent processing by the carrier film.
6. a kind of flexible display substrates laser-stripping method, it is characterised in that using the flexible display substrates described in claim 1 Laser lift-off device;Methods described includes:
By in flexible display device transfer lamination to be stripped to the carrier film of volume to volume, and the flexible display to be stripped The flexible display substrates laminating carrier film in part;
Carried using the carrier film and transmit the flexible display device to be stripped to the correspondence of vacuum suction workbench Position;
Flexible display substrates described in vacuum suction are started using the vacuum suction workbench;
Laser lift-off is carried out to the flexible display device to be stripped using laser beam.
7. method as claimed in claim 6, it is characterised in that the carrier substrate is glass substrate.
8. method as claimed in claim 6, it is characterised in that the type of laser of the laser beam includes quasi-molecule or solid-state Laser.
9. method as claimed in claim 6, it is characterised in that described device further comprises vacuum cup, the vacuum is inhaled Disk is above the carrier film;Methods described further comprises:
Carried using the carrier film and transmit the flexible display device after laser lift-off to the correspondence position of the vacuum cup;
Start the carrier substrate in the flexible display device after laser lift-off described in vacuum suction using the vacuum cup, by institute Carrier substrate is stated to separate with the flexible display substrates;
The flexible display substrates after separation are transmitted using the carrier film.
10. method as claimed in claim 9, it is characterised in that deposition has easily release glue-line on the carrier film;
The flexible display device after carrier film is carried and transmits the laser lift-off is to the corresponding position of the vacuum cup Postpone, using the viscosity of the glue-line, separated the carrier substrate with the flexible display substrates by the vacuum cup, The flexible display substrates after separation are sent to by subsequent processing by the carrier film.
CN201710245715.7A 2017-04-14 2017-04-14 Flexible display substrates laser lift-off device and its laser-stripping method Pending CN107104187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710245715.7A CN107104187A (en) 2017-04-14 2017-04-14 Flexible display substrates laser lift-off device and its laser-stripping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710245715.7A CN107104187A (en) 2017-04-14 2017-04-14 Flexible display substrates laser lift-off device and its laser-stripping method

Publications (1)

Publication Number Publication Date
CN107104187A true CN107104187A (en) 2017-08-29

Family

ID=59675184

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710245715.7A Pending CN107104187A (en) 2017-04-14 2017-04-14 Flexible display substrates laser lift-off device and its laser-stripping method

Country Status (1)

Country Link
CN (1) CN107104187A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019056438A1 (en) * 2017-09-22 2019-03-28 武汉华星光电技术有限公司 Device and method for separating flexible panel and glass substrate
CN109616573A (en) * 2018-10-31 2019-04-12 武汉华星光电半导体显示技术有限公司 For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board
CN109873015A (en) * 2019-02-27 2019-06-11 武汉华星光电半导体显示技术有限公司 Organic LED panel and its manufacturing method
WO2019114056A1 (en) * 2017-12-13 2019-06-20 武汉华星光电半导体显示技术有限公司 Method and device for separating glass substrate from flexible oled display panel
CN111843187A (en) * 2020-07-30 2020-10-30 广东大族粤铭激光集团股份有限公司 Laser screen separation method
CN114171709A (en) * 2021-12-07 2022-03-11 深圳市华星光电半导体显示技术有限公司 Preparation method of flexible display panel and equipment for preparing display panel
TWI803872B (en) * 2020-05-18 2023-06-01 南韓商未來股份有限公司 Appratus for removing thin film and method for removing thin film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103456900A (en) * 2013-08-20 2013-12-18 Tcl集团股份有限公司 Flexible display device manufacturing method
CN203910868U (en) * 2014-06-25 2014-10-29 京东方科技集团股份有限公司 Laser lift-off device
CN105549340A (en) * 2016-02-24 2016-05-04 上海大学 Photoetching method and device of roll to roll flexible substrate
CN106158904A (en) * 2015-04-03 2016-11-23 昆山工研院新型平板显示技术中心有限公司 A kind of high-resolution flexible display screen and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103456900A (en) * 2013-08-20 2013-12-18 Tcl集团股份有限公司 Flexible display device manufacturing method
CN203910868U (en) * 2014-06-25 2014-10-29 京东方科技集团股份有限公司 Laser lift-off device
CN106158904A (en) * 2015-04-03 2016-11-23 昆山工研院新型平板显示技术中心有限公司 A kind of high-resolution flexible display screen and preparation method thereof
CN105549340A (en) * 2016-02-24 2016-05-04 上海大学 Photoetching method and device of roll to roll flexible substrate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019056438A1 (en) * 2017-09-22 2019-03-28 武汉华星光电技术有限公司 Device and method for separating flexible panel and glass substrate
WO2019114056A1 (en) * 2017-12-13 2019-06-20 武汉华星光电半导体显示技术有限公司 Method and device for separating glass substrate from flexible oled display panel
CN109616573A (en) * 2018-10-31 2019-04-12 武汉华星光电半导体显示技术有限公司 For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board
CN109873015A (en) * 2019-02-27 2019-06-11 武汉华星光电半导体显示技术有限公司 Organic LED panel and its manufacturing method
TWI803872B (en) * 2020-05-18 2023-06-01 南韓商未來股份有限公司 Appratus for removing thin film and method for removing thin film
CN111843187A (en) * 2020-07-30 2020-10-30 广东大族粤铭激光集团股份有限公司 Laser screen separation method
CN114171709A (en) * 2021-12-07 2022-03-11 深圳市华星光电半导体显示技术有限公司 Preparation method of flexible display panel and equipment for preparing display panel
CN114171709B (en) * 2021-12-07 2023-10-17 深圳市华星光电半导体显示技术有限公司 Method and apparatus for manufacturing flexible display panel

Similar Documents

Publication Publication Date Title
CN107104187A (en) Flexible display substrates laser lift-off device and its laser-stripping method
TWI618131B (en) Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point
CN113421839B (en) Micro light emitting diode transfer method and manufacturing method
CN105493631B (en) The processing unit (plant) and processing method of laminated body
WO2009037797A1 (en) Display device manufacturing method and laminated structure
CN108323215B (en) Micro light emitting diode transfer method, manufacturing method and display device
EP2080219A1 (en) Chip pickup method and chip pickup apparatus
WO2008129976A1 (en) Method for manufacturing chip with adhesive
CN105552247A (en) Composite substrate, flexible display device and preparation method thereof
WO2007019277A3 (en) Method of forming semiconductor layers on handle substrates
JP6566386B2 (en) Substrate laminating apparatus, laminating method, and electronic device manufacturing method
JP2015116694A (en) Method for manufacturing support substrate with resin layer, method for manufacturing glass laminate, and method for manufacturing electronic device
MY160284A (en) Adhesive, adhesive sheet, and process for producing electronic components
CN106935547B (en) Manufacturing method of flexible display device and flexible display device
CN112390536A (en) Ultrathin glass cover plate, ultrathin strengthened glass cover plate and preparation method thereof
JP2005322815A (en) Manufacturing apparatus and manufacturing method of semiconductor apparatus
JP2009283155A (en) Manufacturing method of display device, display device, and electronic apparatus
WO2017065155A1 (en) Device for delaminating laminate, delamination method, and method for manufacturing electronic device
WO2008112883A3 (en) Die attachment method with a covex surface underfill
TWI663060B (en) Peeling device and method of laminated body, and manufacturing method of electronic device
US20170266943A1 (en) Substrate suction device, substrate bonding device, substrate bonding method, and electronic device manufacturing method
KR102009889B1 (en) Display device and method for manufacturing of the same
JP2005217278A5 (en)
CN109742254A (en) A kind of efficient OLED micro-display device and manufacturing method
KR101827869B1 (en) Apparatus and method of processing simultaneous delamination and adhesion

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170829

RJ01 Rejection of invention patent application after publication