TWI803872B - Appratus for removing thin film and method for removing thin film - Google Patents

Abstract

Embodiments of the present invention provide a thin film removal device and a thin film removal method. A thin film removal device according to an embodiment of the present invention includes: a film attaching device that attaches a protective film to a thin film disposed on a workpiece; a laser processing unit that irradiates a laser beam to The thin film and the protective film are integrally separated from the workpiece; and a film removing unit that separates the thin film from the workpiece.

Description

Thin film removal device and thin film removal method

Embodiments of the present invention relate to a thin film removal device and a thin film removal method.

In order to protect the workpiece from external impact or inflow of oxygen or moisture, a protective film may be placed on the workpiece. The protective film is a member in the form of a thin film arranged outside the workpiece, which can cut off the contact between the workpiece and the outside and improve the durability of the workpiece.

However, when a film placed on a workpiece is stained with foreign matter or the film is defective during the manufacturing process, the corresponding film will adversely affect other workpieces or finished products, and the yield of the product will decrease. Therefore, there is a need to remove bad or contaminated films.

As a conventional method, there is a method of directly removing foreign matter attached to a film by using an adhesive tape. However, this method is performed manually, and thus foreign substances cannot be removed perfectly, and it takes a long time to remove them, resulting in a decrease in throughput. In addition, since a large amount of manpower is required, in order to increase the yield, labor costs are increased.

In addition, as a conventional method for removing a contaminated thin film or a defective thin film, there is a method using a laser. However, in the process of processing thin films with laser, fine foreign matter such as fume is generated, which causes secondary pollution on other workpieces and/or thin films. In addition, in order to remove fine foreign matter such as smoke generated during laser processing, it is necessary to continuously activate the suction device, so cost becomes a problem.

The aforementioned prior art, as technical information that the inventor has kept or learned during the process of exporting the present invention, cannot be said to be a known technology that must be disclosed to the general public before the application of the present invention.

An object of an embodiment of the present invention is to provide a thin film removal device and a thin film removal method capable of removing a thin film disposed on a workpiece without secondary pollution of the workpiece. However, the aforementioned problems are examples of the present invention, and the purpose and technical problems to be solved of the present invention are not limited thereto.

A thin film removal device according to an embodiment of the present invention includes: a film attaching device that attaches a protective film to a thin film disposed on a workpiece; a laser processing unit that irradiates a laser beam to The thin film and the protective film are integrally separated from the workpiece; and a film removing unit that separates the thin film from the workpiece.

In the thin film removing device according to one embodiment of the present invention, the protective film may have a shape corresponding to the thin film, and in a state attached to the thin film, an end may protrude outside the thin film.

In the thin film removal device according to an embodiment of the present invention, the wavelength of the laser beam may be 440 nm to 1500 nm, and pass through the protective film to remove a part of the thin film.

In the thin film removal device according to one embodiment of the present invention, the laser processing unit can irradiate the laser beam on the inner area of the thin film, so that the thin film is raised from the top of the workpiece (or ablation), irradiating the laser beam on the edge of the film to separate the edge of the film from the upper surface of the processed object.

In the thin film removal device according to one embodiment of the present invention, the film removal unit can move in a preset direction while holding the end of the protective film, so that the thin film and the protective film can move from the The workpiece is separated as a whole.

A thin film removal method according to another embodiment of the present invention includes: a step of attaching a protective film to a thin film arranged on a workpiece; irradiating a laser beam to integrally separate the thin film and the protective film from the workpiece. steps; and a step of releasing the thin film from the workpiece.

In the thin film removal method in another embodiment of the present invention, the wavelength of the laser beam may be 440 nm to 1500 nm, and pass through the protective film to remove a part of the thin film.

In another embodiment of the thin film removal method of the present invention, the step of integrally separating the thin film from the protective film includes: irradiating the laser beam on the inner area of the thin film to make the thin film separate from the protective film. a step of lifting the upper surface of the workpiece; and a step of irradiating the laser beam on the edge of the film to separate the edge of the film from the upper surface of the workpiece.

In the thin film removal method according to another embodiment of the present invention, the step of detaching the thin film can be moved to a preset direction while holding the end of the protective film, so that the thin film and the protective film are separated from each other. The workpiece is separated integrally.

Other aspects, features, and advantages other than those mentioned above will become clearer through the following specific implementation methods, patent claims, and drawings.

In the thin film removal device and thin film removal method according to one embodiment of the present invention, a protective film is attached to the thin film placed on the workpiece, and a laser beam is irradiated to separate the upper surface of the workpiece from the thin film, thereby preventing the occurrence of the thin film removal process. The flying and diffusion of foreign matter such as flue gas can prevent foreign matter from causing secondary pollution of other processed objects.

The thin film removal device and the thin film removal method according to one embodiment of the present invention carry out the manufacturing process in the state where the thin film and the protective film are attached, so that other processed objects can be effectively prevented from being polluted again. In addition, the thin film removal device and the thin film removal method according to an embodiment of the present invention do not need to be equipped with additional suction devices or exhaust devices, which can greatly save costs.

While the present invention can be subjected to various transformations and has various embodiments, specific embodiments will be illustrated by way of example in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that all transformations, equivalents, and substitutions included within the spirit and technical scope of the present invention are included. In describing the present invention, even if different embodiments are shown, the same reference numerals are used for the same components.

Terms such as first and second may be used to describe various constituent elements, but the constituent elements shall not be limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another.

The terms used in the present invention are used only to describe specific embodiments, and are not intended to limit the present invention. In the present invention, terms such as "comprising" or "having" should be understood as specifying the existence of features, digits, steps, actions, constituent elements, parts or their combinations described in the specification, without precluding one or more than one The existence or additional possibility of other features or digits, steps, actions, constituent elements, parts or their combinations.

1 is a diagram showing a thin film removal device 10 according to an embodiment of the present invention, FIG. 2 is a diagram showing the operation state of the film adhesion unit 200 in FIG. 1 , and FIG. 3 is a diagram showing various forms of the protective film PF in FIG. 2 .

Referring to FIG. 1 to FIG. 3 , a thin film removal device 10 according to an embodiment of the present invention can be used to remove a thin film TF. More specifically, the thin film removing device 10 can be used to remove thin films TF to which foreign matter is attached or defective thin films TF among the thin films TF disposed on the plurality of workpieces W included in the substrate S.

However, the thin film TF is not necessarily limited to the thin film TF to which foreign matter adheres or the defective thin film TF, and may be thin films TF in various states that need to be removed. In this specification, for convenience of the invention, the description will be centered on the thin film TF to which foreign matter adheres or the defective thin film TF.

The thin film removal device 10 in one embodiment of the present invention may include a platform 100 , a film attachment unit 200 , a laser processing unit 300 , and a film removal unit 400 .

The substrate S is placed on the platform 100 . As an example, in order to prevent the substrate S from shaking or vibrating during processing, the platform 100 may include a fixing member (not shown in the figure). For example, the platform 100 may include grippers (not shown in the figure) for pressurizing and fixing the upper surface of the substrate S or suction holes (not shown in the figure) for absorbing the lower surface of the substrate S.

The platform 100 can be maintained in a fixed state during processing, or can move sideways or rotate in at least a certain direction by means of the operation of a controller (not shown in the figure).

The film attaching unit 200 attaches the protective film PF to the workpiece W placed on the stage 100 . As an example, the film attaching unit 200 may attach the protective film PF on the thin film TF disposed on the workpiece W. As shown in FIG.

The material of the protective film PF is not particularly limited. As an example, the protective film PF may be made of polyethylene terephthalate (PET) as a laser-transmissive material for processing. More specifically, the protection film PF is a material through which the laser beam L with a wavelength of 440 nm to 1500 nm irradiated by the laser processing unit 300 passes, and may be a transparent or opaque material.

As an example, the protective film PF may include an optical adhesive, and the optical adhesive may be OCA (optical clear adhesive: optically transparent adhesive) or OCR (optical clear resin: optically transparent resin).

The film attachment unit 200 of one embodiment of the present invention may include a suction pad 210 and a first roller 220 .

The adsorption pad 210 absorbs the protection film PF and makes it adhere to the thin film TF. As an example, the adsorption pad 210 may absorb and lift the protection film PF loaded by the loading unit (not shown in the figure). Furthermore, after the suction pad 210 has moved to the film TF with foreign matter or defective film TF, it moves downward to attach the protective film PF to the film TF with foreign matter or defective film TF (see (a) of FIG. 2 ). .

The first roller 220 may press the protective film PF attached to the thin film TF. As one example, the first roller 220 may press the protective film PF from top to bottom while moving in the moving direction of the film attaching unit 200 . Therefore, the thin film TF and the protective film PF can be adhered more tightly, especially, air bubbles between the thin film TF and the protective film PF can be removed, and the adhesion between the thin film TF and the protective film PF can be improved.

As one example, the protection film PF may have a shape corresponding to the shape of the thin film TF. More specifically, as shown in FIG. 3 , the protective film PF may have the same shape as the thin film TF having various shapes.

The size of the protective film PF is not particularly limited. As an example, the protective film PF is preferably larger than the thin film TF by a preset ratio. That is, the protective film PF has a shape corresponding to that of the thin film TF, and may be larger in size than the thin film TF. Therefore, in a state where the protective film PF is attached to the thin film TF, the end of the protective film PF protrudes outside the thin film TF, and then the thin film TF can be easily removed by the film removing unit 400 .

FIG. 4 is a diagram showing an example of the laser processing unit 300 of FIG. 1 , and FIGS. 5 and 6 are diagrams showing the operating state of the laser processing unit 300 of FIG. 4 .

The thin film removal device 10 according to one embodiment of the present invention can separate the thin film TF arranged on the workpiece W by using the laser processing unit 300 . The laser processing unit 300 can irradiate a laser beam with a predetermined wavelength and energy to integrally separate the thin film TF and the protective film PF from the workpiece W.

Referring to FIG. 4 , as an embodiment, the laser processing unit 300 may include a laser oscillator 310 , an optical instrument 320 , and a laser controller 330 .

The laser oscillator 310 can generate a laser beam L by exciting a specific medium. The medium used for the laser oscillator 310 is not particularly limited, and liquid, gas, solid, or semiconductor can be used.

The wavelength of the laser beam L excited by the laser oscillator 310 is not particularly limited. Preferably, the laser light beam L may have a wavelength of 440 nm to 1500 nm as a blue laser (blue laser) to a near infrared laser (near infrared laser).

As an example, the laser oscillator 310 can generate a pulse laser (pulse laser). The laser oscillator 310 may be equipped with a Q-switching (Q-switching) device, and thus can generate a laser beam L having an ultrashort pulse width from ps to fs.

The optics 320 can control the optical path of the laser beam L generated by the laser oscillator 310 , generate a spot of the laser beam L irradiated on the workpiece W, or the like.

The optical instrument 320 of one embodiment of the present invention may include two vibrating mirrors 321 a , 321 b , and a flat-field focusing (F-theta) lens 322 .

The vibrating mirrors 321a and 321b can control the optical path of the incident laser beam L by means of a servo motor (not shown in the figure) and a laser controller 330 that controls it. The vibrating mirrors 321a and 321b can rotate around at least a certain axis, such as the X axis or the Y axis. Therefore, the laser beam L excited by the laser oscillator 310 can move along a path preset by means of the galvanometer mirrors 321a, 321b.

The laser beam L passing through the vibrating mirrors 321 a and 321 b may enter the f-field focusing lens 322 . The f-field focusing lens 322 can condense the laser beam L to irradiate the preset position of the workpiece W placed on the platform 100 .

The laser controller 330 can control the laser oscillator 310 , the optical instrument 320 and the platform 100 . As an example, the laser controller 330 can control the irradiation time of the laser beam L excited by the laser oscillator 310 in consideration of the position of the workpiece W placed on the platform 100, the moving speed of the laser beam L, the irradiation position, etc. arrange. Alternatively, the laser controller 330 may control the output, wavelength, etc. of the laser beam L irradiated by the laser oscillator 310 .

In addition, the laser controller 330 can control the optical instrument 320, that is, control the positions of the vibrating mirrors 321a, 321b and the flat-field focusing lens 322, and control the optical path and irradiation position of the laser beam L, etc.

In addition, the laser controller 330 may move the laser processing unit 300 itself in the processing direction during laser processing, or move the platform 100 in the processing direction to perform laser processing.

As another embodiment, the laser processing unit 300 may include a beam splitter for splitting the laser beam L excited by the laser oscillator 310 into two laser beams. In this case, the beam splitter functions as a polarizing beam splitter (PBS), and uses the laser beams as laser beams having different polarization states from each other.

Therefore, the laser processing unit 300 of the present invention can only use the laser beam with a specific polarization state to improve the quality of laser processing. Alternatively, the laser beam split into two can be used entirely to increase the laser processing speed.

Referring to FIG. 5 , the laser beam L irradiated by the laser processing unit 300 may be irradiated on the thin film TF. As an example, the laser beam L may have a wavelength of 440 nm to 1500 nm, and the protective film PF may be made of a material that allows the laser beam L of a corresponding wavelength to pass through. Therefore, as shown in (a) of FIG. 5 , the laser beam L can pass through the protective film PF and be irradiated on the lower surface of the thin film TF. Furthermore, by means of the laser beam L, while a part of the thin film TF is being removed, the upper surface of the workpiece W and at least a part of the thin film TF can be separated from each other. At this time, since the thin film TF and the protective film PF may be in a state of being attached to each other, the thin film TF and the protective film PF can be integrally separated from the upper surface of the workpiece W.

Referring to FIG. 6 , the laser beam L irradiated by the laser processing unit 300 irradiates the inner region of the thin film TF when viewed from a plane, for example, the XY plane, so that the thin film TF is lifted from the upper surface of the workpiece W. In addition, when viewed from the XY plane, the laser beam L is irradiated along the edge of the thin film TF, so that the edge of the thin film TF can be separated from the upper surface of the workpiece W.

That is, in laser processing, since the protective film PF is attached to the thin film TF, the thin film removal device 10 according to one embodiment of the present invention can eliminate foreign matter such as smoke generated during the process of irradiating the laser beam L. Scatter is minimized. Therefore, the problem of secondary contamination of other thin films TF by foreign substances can be prevented.

FIG. 7 is a diagram showing an operating state of the film removal unit 400 .

Referring to FIG. 7 , the film removing unit 400 can remove the thin film TF separated from the workpiece W by the laser processing unit 300 .

The film removing unit 400 of one embodiment of the present invention may include a second roller 410 and a gripper 420 .

If the upper surface of the workpiece W and the thin film TF are separated from each other by means of the laser processing unit 300 , the film removing unit 400 may move onto the stage 100 . The film removing unit 400 can be moved up after adhering to the protective film PF by the second roller 410 , so that a part of the film TF can be separated from the upper surface of the workpiece W. As shown in FIG.

As an example, a predetermined adhesive member may be disposed on the outer peripheral surface of the second roller 410 . Here, the upper surface of the workpiece W and the thin film TF are separated by the laser processing unit 300 , whereas the thin film TF is in an attached state to the protective film PF. Therefore, when the second roller 410 moves vertically or laterally while in contact with the upper surface of the protective film PF, the protective film PF also moves in the same direction while attached to the second roller 410 .

The film removing unit 400 can move the second roller 410 in a predetermined direction to separate the end of the film TF from the upper surface of the workpiece W (see FIG. 7( a )).

The gripper 420 can completely detach the thin film TF from the upper surface of the workpiece W. As shown in FIG.

As an example, the gripper 420 can hold the end of the protective film PF in a state where the film TF is separated from the upper surface of the workpiece W by the second roller 410 .

The film removing unit 400 can move in a predetermined direction with the gripper 420 holding the end of the protective film PF to integrally separate the thin film TF and the protective film PF from the workpiece W (see FIG. 7( b )).

FIG. 8 is a diagram showing before and after the thin film removal process of the comparative example and the inventive example.

In Fig. 8, the thin film TF is attached to the workpiece W before the process. Comparative Example 1 shows the state where the thin film TF is removed by the laser irradiation device and suction device. Comparative Example 2 shows the state where the thin film TF is cleaned by ultrasonic cleaning The machine removes the thin film TF, and the invention example shows the state where the thin film TF is removed by the thin film removing device 10 according to an embodiment of the present invention.

As shown in FIG. 8 , when the thin film TF is removed by a conventional laser irradiation device, foreign matter such as smoke is generated, and such foreign matter remains without being sucked by the suction device, causing secondary contamination of the workpiece W to be processed. In addition, it is not economical since the suction device needs to be continuously activated during the removal process.

Similarly, even if the thin film TF is removed by a conventional ultrasonic cleaner, there is a possibility that the workpiece W may be recontaminated by foreign matter generated in the process.

In contrast, the thin film removal apparatus 10 of the present invention irradiates the laser beam L in a state where the protective film PF is attached to the thin film TF to be removed, thereby minimizing the scattering of foreign matter such as smoke and the like during the process, thereby enabling Prevent other processed objects W from secondary pollution by foreign matter.

In particular, the thin film removal device 10 according to one embodiment of the present invention can maintain the state where the protective film PF is attached to the thin film TF until the thin film TF is removed by the film removal unit 400 after the protective film PF is attached to the thin film TF. Secondary contamination of other thin films TF and workpiece W can be more reliably prevented.

Referring to FIG. 1 again, the thin film removal device 10 according to an embodiment of the present invention may further include an inspection unit 500 .

The inspection unit 500 can detect the position of the workpiece W, and transmit the detected position-related information to at least one of the film attaching unit 200 , the laser processing unit 300 , and the film removing unit 400 .

As an example, the inspection unit 500 may include a visual camera (not shown in the figure). The inspection unit 500 can use the visual camera to capture the processed object W placed on the platform 100 to obtain an image. Furthermore, the inspection unit 500 can discriminate a contaminated workpiece W or a defective workpiece W (more specifically, a contaminated or defective workpiece W with a thin film TF) based on the captured image.

In addition, the inspection unit 500 can detect the position of the contaminated or defective workpiece W based on the captured image, and transmit the position information to the film attachment unit 200 , the laser processing unit 300 , and the film removal unit 400 .

The film attaching unit 200 may attach the protective film PF to the upper surface of the corresponding workpiece W based on the position information of the workpiece W received and transmitted.

The laser processing unit 300 may irradiate the upper surface of the corresponding workpiece W with the laser beam L based on the position information of the workpiece W received and transmitted. In addition, the laser controller 330 can control the optical instrument 320 based on the position information of the processed object W received and transmitted, and control the optical path and irradiation position of the laser beam L, and the like.

The film removing unit 400 may detach the thin film TF from the upper surface of the corresponding workpiece W based on the received positional information of the workpiece W.

As an example, the inspection unit 500 may re-inspect the surface of the workpiece W from which the thin film TF has been detached, and check whether the thin film TF is detached normally.

On the other hand, although the film attachment unit 200, the laser processing unit 300, the film removal unit 400, and the inspection unit 500 are operated close to the platform 100 while the workpiece W is placed on the platform 100, it is not Limited to this.

For example, the film attaching unit 200, the laser processing unit 300, the film removing unit 400, and the inspection unit 500 are arranged on a line, and the processing of the workpiece W can be realized while the platform 100 moves in one direction along the line. .

FIG. 9 is a diagram showing a thin film removal method according to another embodiment of the present invention.

Referring to FIG. 9 , the thin film removal method of the present invention may include: a step S100 of attaching a protective film PF on the thin film TF disposed on the workpiece W; Step S200 of integrally separating W; Step S300 of detaching the thin film TF from the workpiece W.

First, referring to FIGS. 1 to 9 , in a state where the workpiece W is placed on the platform 100 by means of a transfer unit (not shown) or the like, the protective film PF is attached to the workpiece by the film attaching unit 200 . On the thin film TF arranged on the workpiece W.

More specifically, the protective film PF loaded on the loading unit (not shown in the figure) is adsorbed and supported by the adsorption pad 210 of the film attachment unit 200 . Then, the film attaching unit 200 is lowered in a state where the film attaching unit 200 is positioned on the thin film of the workpiece W, and the protective film PF is attached to the thin film TF. Under the protection film PF, an adhesive such as OCR or OCA may be included.

After the protective film PF is attached to the film TF, the protective film PF is pressed by the first roller 220 of the film attaching unit 200 . Therefore, the protective film PF and the thin film TF adhere more closely, and air bubbles existing between the protective film PF and the thin film TF can be removed.

Then, the thin film TF to which the protective film PF is attached is processed by the laser processing unit 300 . As an example, the laser oscillator 310 of the laser processing unit 300 generates the laser beam L, controls the optical instrument 320, controls the irradiation position and optical path of the laser beam L, and irradiates the workpiece W on top.

At this time, the wavelength of the laser beam L can be 440 nm to 1500 nm, and the laser beam L with the corresponding wavelength passes through the protective film PF and irradiates the lower part of the thin film TF attached on the workpiece W. Therefore, the thin film TF and the protective film PF can be integrally separated from the upper surface of the workpiece W at the same time as a part of the thin film TF is removed.

As an example, the step S200 of separating the thin film TF may include: a hatching step, that is, a step of irradiating a laser beam L on the inner region of the thin film TF; a trimming step, that is, a step of A step of irradiating the edge of the TF with a laser beam L.

In the hatching step, when viewed from the XY plane of FIG. 6 , the laser beam L is irradiated on the inner region of the thin film TF, so that the thin film TF can lift up from the upper surface of the workpiece W as a whole. As an example, in the hatching step, the vibrating mirrors 321a and 321b of the optical instrument 320 are controlled to quickly control the irradiation position of the laser beam L, so that the step can be quickly implemented.

In the trimming step, the edge of the film TF may be separated from the upper surface of the workpiece W by irradiating the laser beam L along the edge of the film TF as viewed from the XY plane of FIG. 6 .

As an example, the trimming step may be performed after the hatching step is performed. That is, in the hatching step, the edge of the thin film TF may be attached to the upper surface of the workpiece W. As shown in FIG. Therefore, in the hatching step, it is possible to prevent the edge of the thin film TF from lifting, and to separate the thin film TF more precisely.

Then, the separated thin film TF is detached from the upper surface of the workpiece W by the film removal unit 400 . As one example, the second roller 410 of the film removing unit 400 is brought into contact with the upper surface of the protective film PF. The second roller 410 has a predetermined adhesive member arranged on the outer peripheral surface of the roller, and the protective film PF can be moved in the same direction by moving the second roller 410 in a preset direction.

Here, the thin film TF is in a state of being separated from the upper surface of the workpiece W or is in a state of being attached to the protective film PF. Therefore, the protective film PF and the film TF can be lifted up integrally while the second roller 410 is attached to the edge of the protective film PF.

Then, the thin film TF is detached from the upper surface of the workpiece W by the gripper 420 of the film removing unit 400 . The claw 420 can hold the end of the protective film PF raised by the second roller 410, and move the claw 420 in a preset direction, so that the protective film PF and the film TF can be separated from the upper surface of the workpiece W integrally. .

As an example, a step of using the inspection unit 500 to detect the position of the workpiece W may be further included. More specifically, before the protective film PF is attached to the thin film TF disposed on the workpiece W, the image of the workpiece W may be captured by the vision camera of the inspection unit 500 .

Then, the inspection unit 500 may calculate position-related information of the workpiece W based on the captured image.

In addition, it may further include a step in which the inspection unit 500 transmits the position information of the workpiece W to at least one of the film attaching unit 200 , the laser processing unit 300 , and the film removing unit 400 .

Therefore, in the step of attaching the protective film PF, the film attaching unit 200 may position the protective film PF on the thin film TF based on the position information of the workpiece W received and transferred.

In addition, in the step of separating the thin film TF, the laser processing unit 300 can perform laser processing by controlling the laser oscillator 310 and the optical instrument 320 based on the position information of the workpiece W received and transmitted.

In addition, in the step of detaching the thin film TF, the film removing unit 400 may detach the thin film TF from the upper surface of the workpiece W based on the position information of the workpiece W received and transferred.

As an embodiment, a step of using the inspection unit 500 to inspect the processed area may be further included. More specifically, after the thin film TF is removed by the film removing unit 400 , the upper surface of the workpiece W from which the thin film TF has been removed can be photographed by the inspection unit 500 . The inspection unit 500 can determine the contamination state on the workpiece W or whether the thin film TF has been removed based on the captured image.

The thin film removal device 10 and the thin film removal method according to one embodiment of the present invention can attach the protective film PF to the thin film TF disposed on the contaminated or defective workpiece W, and irradiate the laser beam L passing through the protective film PF, so that The thin film TF and the protective film PF are integrally detached from the upper surface of the workpiece W, so that secondary contamination of the workpiece W by foreign matter generated during laser irradiation can be prevented.

The thin film removal device 10 and the thin film removal method according to one embodiment of the present invention carry out the manufacturing process with the thin film TF and the protective film PF attached, so that other workpieces W to be processed can be reliably prevented from being polluted again.

In this specification, although the examples which limited the present invention were mainly described, various examples are possible within the scope of the present invention. In addition, although not described, equivalent means can also be directly incorporated in the present invention. Therefore, the true scope of protection of the present invention should be determined according to the scope of the following claims.

10: Thin film removal device 100: Platform 200: membrane attachment unit 210: adsorption pad 220: first roll 300:Laser processing unit 310:Laser oscillator 320: optical instrument 321a, 321b: vibrating mirror 322:Flat focusing lens 330:Laser controller 400: membrane removal unit 410: second roll 420: Claw 500: check unit L: laser beam PF: protective film TF: thin film S: Substrate S100, S200, S300: steps W: processed object

FIG. 1 is a diagram showing a thin film removing apparatus of one embodiment of the present invention. FIG. 2 is a diagram showing an operating state of the film adhesion unit shown in FIG. 1 . FIG. 3 is a diagram showing various forms of the protective film of FIG. 2 . FIG. 4 is a diagram showing an example of the laser processing unit of FIG. 1 . 5 and 6 are diagrams showing the operating state of the laser processing unit of FIG. 4 . Fig. 7 is a diagram showing an operating state of a film removal unit. FIG. 8 is a diagram showing before and after the thin film removal process of the comparative example and the inventive example. FIG. 9 is a diagram showing a thin film removal method according to another embodiment of the present invention.

10: Thin film removal device

100: Platform

200: membrane attachment unit

300:Laser processing unit

400: membrane removal unit

500: check unit

S: Substrate

W: processed object

Claims (7)

A thin film removal device, comprising: an inspection unit, which detects the position of a contaminated or defective workpiece based on a captured image, and generates position information; a film attachment device, which For the position information of the processed object, a protective film is attached to the film disposed on the processed object; the laser processing unit irradiates the laser beam on the inner area of the film, so that the a film is lifted from the upper surface of the workpiece, and the film to which the protective film is attached is separated from the upper surface of the workpiece; While moving the end of the protective film to a preset direction, the film and the protective film are integrally separated from the upper surface of the workpiece, and the contaminated or defective film is released from the workpiece. Removal of artifacts. The thin film removing device according to claim 1, wherein the protective film has a shape corresponding to the thin film, and in a state attached to the thin film, an end protrudes outside the thin film. The thin film removal device according to claim 1, wherein the laser beam has a wavelength of 440nm to 1500nm, passes through the protective film, and removes a part of the thin film. The film removing device according to claim 1, wherein the laser processing unit irradiates the laser beam on the edge of the film to separate the edge of the film from the upper surface of the workpiece . A thin film removal method, comprising: using an inspection unit to detect the position of a contaminated or defective workpiece based on a captured image to generate position information; according to the position information of the processed object, the The step of adhering a protective film on the film of the workpiece; irradiating a laser beam on the inner area of the film, so that the film is lifted from the top of the workpiece, so that all the parts to which the protective film is attached The step of separating the film from the upper surface of the workpiece; and moving in a preset direction while holding the end of the protective film, so that the film and the protective film are separated from the workpiece The step of integrally detaching the upper surface and removing the contaminated or defective film from the workpiece. The thin film removal method according to claim 5, wherein the laser beam has a wavelength of 440nm to 1500nm and penetrates through the protective film to remove a part of the thin film. The thin film removal method according to claim 5, wherein the step of integrally separating the thin film from the protective film includes irradiating the laser beam on the edge of the thin film so that the edge of the thin film is removed from the The above separation step of the workpiece.

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