JP2021168350A - Bundle winding high-temperature superconducting coil device - Google Patents

Abstract

To provide a bundle winding high-temperature superconducting coil device capable of effectively exerting an improvement effect of an electromagnetic force resistance performance by a reinforcement wire.SOLUTION: A bundle winding high-temperature superconducting coil device 30 is formed by: a bundle wire formed by bundling a plurality of high-temperature superconducting wires 1c and 1d in which superconducting layers 4c and 4d are formed, and at least one or more reinforcement wire 20 in a circumference of a winding frame together. The reinforcement wire 20 arranged to each high-temperature superconducting wire on which a tape face on the side near the superconducting layer in each bundle wire is arranged directed to a coil outer peripheral side is provided so as to be directly contacted to the tape face on the side near the superconducting layer 4c of each high-temperature superconducting wire.SELECTED DRAWING: Figure 3

Description

An embodiment of the present invention relates to a bundle-wound high-temperature superconducting coil device in which a plurality of high-temperature superconducting wires are wound around a winding frame, and particularly relates to a reinforcing structure for electromagnetic force of the bundle-wound high-temperature superconducting coil device.

The superconducting wire can be energized at an extremely high current density as compared with the normal conducting wire, and the superconducting coil can generate a high magnetic field. Examples of the superconducting wire used for such a superconducting coil include metal-based low-temperature superconducting wires such as NbTi and Nb3Sn, and Bi ₂
There are high-temperature superconducting wires of oxides such as Sr ₂ Ca ₂ Cu ₃ O _{10 + x} wire and RE ₁ B ₂ C ₃ O _{7 (REBCO) wire.} High-temperature superconducting wire is 20K ~ compared to conventional low-temperature superconducting wire.
It can be operated even at a high temperature of 77K, and has a higher critical current density characteristic than the low temperature superconducting wire. Therefore, the high-temperature superconducting coil around which the high-temperature superconducting wire is wound enables a magnet design that generates a strong magnetic field having a smaller number of turns and a winding volume of more than 10 T than the conventional low-temperature superconducting coil.

However, the superconducting coil generates an electromagnetic force in the superconducting wire in the winding portion by the magnetic field generated by itself or an external magnetic field. In particular, the electromagnetic force in the direction of swelling in the coil radial direction becomes a tensile stress in the longitudinal direction of the wire, a so-called hoop stress, for the high-temperature superconducting wire. Therefore, in order to withstand the hoop stress caused by such a strong magnetic field, in the case of REBCO wire, on a high-strength metal substrate such as Hastelloy (registered trademark, trade name manufactured by Haynes, USA) or Ni-based alloy with NiW. An oxide superconducting layer is formed in.

However, in a superconducting magnet that generates a strong magnetic field exceeding 10 T, a hoop stress exceeding the allowable strain of the high-temperature superconducting wire is generated. Therefore, as in Patent Document 1, for example, a method has been proposed in which a high-strength metal tape is further added to the high-temperature superconducting wire as a reinforcing wire and the hoop stress is shared to suppress the strain below the allowable strain of the high-temperature superconducting wire. Further, as in Patent Document 2, co-winding (bundle winding) while directly contacting a plurality of high-temperature superconducting wires.
By doing so, when the critical current characteristic is lowered by the electromagnetic force, a structure has been proposed that electrically reinforces the current by allowing the current to be commutated between the high-temperature superconducting wires.

Japanese Unexamined Patent Publication No. 2011-40176 Japanese Unexamined Patent Publication No. 2019-62005

As shown in FIG. 9, a plurality of high-temperature superconducting wires 1x, 1y are combined with the above-mentioned conventional techniques.
It is considered that a further reinforcing effect can be obtained by co-winding the reinforcing wire rod (high-strength metal tape) 24 around the bundle-wound high-temperature superconducting coil device 25.

However, when a reinforcing wire 24 such as a high-strength metal tape is simply added to the bundle-wound high-temperature superconducting wire (bundle wire) 1x and 1y, an electromagnetic force in the direction of swelling in the coil radial direction is generated in each superconducting layer. As for the high-temperature superconducting wire 1y, in addition to the metal substrate having higher strength being arranged on the outer peripheral side of the coil than the superconducting layer, the reinforcing wire 2 adjacent to the superconducting wire 2
Distortion is reduced by suppressing the deformation according to 4.

However, since the high-temperature superconducting wire 1x is located away from the reinforcing wire 24, the strain generated inside the wire is distributed in the coil radial direction from a microscopic point of view, which exceeds the allowable strain of the high-temperature superconducting wire. Therefore, there is a problem that the critical current characteristics may be deteriorated.

The present invention has been made in view of the above problems, and the bundle-wound high-temperature superconducting coil device in the present invention includes a bundled wire rod obtained by bundling a plurality of high-temperature superconducting wire rods on which a superconducting layer is formed, and at least one or more bundled wire rods. A bundle-wound high-temperature superconducting coil device in which a reinforcing wire is co-wound and wound around a winding frame, and the tape surface of the bundled wire near the superconducting layer is directed toward the outer periphery of the coil. The reinforcing wire rod arranged on the arranged high-temperature superconducting wire is provided in direct contact with the tape surface on the side close to the superconducting layer of the high-temperature superconducting wire.

Further, in the bundle-wound high-temperature superconducting coil device of the present invention, a bundle wire obtained by bundling a plurality of high-temperature superconducting wires on which a superconducting layer is formed and at least one reinforcing wire are co-wound around the winding frame. A high-temperature superconducting coil device that is wound around the same structure, wherein the wire tape surface on the side closer to the superconducting layer of the bundled wires is arranged on the high-temperature superconducting wire arranged toward the outer periphery of the coil. The wire is provided in direct contact with the wire tape surface on the side close to the superconducting layer of the high-temperature superconducting wire, and the wire tape surface on the side close to the superconducting layer located at the end of the bundle wire is the outer periphery of the coil. The high-temperature superconducting wire arranged toward the side is characterized in that an electrode extending from the end of the reinforcing wire to input and output a current from the outside is provided.

In the embodiment of the present invention, by effectively exerting the effect of improving the electromagnetic force resistance performance of the coil by the reinforcing wire, it is possible to prevent the critical current characteristics of the high-temperature superconducting wire from deteriorating and to stably generate a strong magnetic field in a bundle winding. A high temperature superconducting coil device can be provided.

The block diagram which shows an example of the high-temperature superconducting wire used for the bundle-wound high-temperature superconducting coil device which concerns on embodiment of this invention. (A) A schematic view showing an example of a pancake coil used in the bundle-wound high-temperature superconducting coil device according to the embodiment of the present invention, (b) is a cross-sectional view of the bundle-wound high-temperature superconducting coil device shown in (a). (A) is an enlarged cross-sectional view of a main part of a bundled wire rod bundled with a bundle-wound high-temperature superconducting tape wire according to the present embodiment, and (b) is a partial cross-sectional view of a winding portion of a bundle-wound high-temperature superconducting coil device according to the present embodiment. .. FIG. 3 is a partial cross-sectional view of a winding portion of a bundle-wound high-temperature superconducting coil device showing a modified example of the first embodiment of the present invention. FIG. 3 is a partial cross-sectional view of a winding portion of a bundle-wound high-temperature superconducting coil device showing a second embodiment of the present invention. A partial cross-sectional view of a part of a winding portion of a bundle-wound high-temperature superconducting coil device showing a third embodiment of the present invention as viewed from the upper surface of the coil. FIG. 3 is a partial cross-sectional view of the end of the winding portion of the bundle-wound high-temperature superconducting coil device showing the fourth embodiment of the present invention as viewed from the upper surface of the coil. FIG. 3 is a partial cross-sectional view of the end of the winding portion of the bundle-wound high-temperature superconducting coil device showing a modified example of the fourth embodiment of the present invention as viewed from the upper surface of the coil. FIG. 3 is a partial cross-sectional view of a winding portion of a bundle-wound high-temperature superconducting coil device in a conventional example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(High-temperature superconducting wire)

FIG. 1 is a configuration diagram showing an example of a superconducting tape wire (high-temperature superconducting wire material) 1 used in the bundle-wound high-temperature superconducting coil device 30 according to the embodiment of the present invention.

The superconducting tape wire 1 has at least a tape substrate 2, an intermediate layer 3, and a superconducting layer 4, both of which are covered with a stabilizing layer 5.

Further, if necessary, an orientation layer 6 may be provided between the tape substrate 2 and the intermediate layer 3, and a protective layer 7 may be provided between the superconducting layer 4 and the stabilizing layer 5.

The tape substrate 2 is formed of, for example, a material such as a high-strength metal of a Ni-based alloy such as Hastelloy (registered trademark) or NiW.

The intermediate layer 2 is a diffusion prevention layer, and is made of, for example, a material such as cerium oxide, YSZ, magnesium oxide, yttrium oxide, ytterbium oxide, and barium zirconia, and is formed on the tape substrate 1.

The superconducting layer 4 is made of, for example, a superconductor thin film having _{a RE123-based composition (RE 1} B ₂ C ₃ O _{7, etc.).} In addition, "RE" of "RE ₁ B ₂ C ₃ O ₇ " is a rare earth element (for example, neodymium (Nd), gadolinium (Gd), holmium (Ho), samarium (Sm), etc.).
And at least one of the yttrium elements, "B" means barium (Ba), "C" means copper (Cu), and "O" means oxygen (O).

The stabilizing layer 5 is provided for the purpose of preventing the superconducting layer 4 from burning when excessive electricity flows through the superconducting layer 4, and is formed of conductive silver or the like.

The alignment layer 6 is provided for the purpose of aligning and forming the intermediate layer 3 on the tape substrate 2, and is formed of magnesium oxide (MgO) or the like. It can be omitted when an oriented substrate is used.

The protective layer 7 is provided for the purpose of preventing the superconducting layer 4 from deteriorating due to contact with moisture in the air, and is formed of silver or the like. The protective layer 7 also plays a role of preventing the superconducting layer 4 from burning when excessive electricity flows through the superconducting layer 4.

The tape width w of the superconducting tape wire 1 composed of such multiple layers is, for example, 4 to 12 mm, and the tape thickness t is 0.1 to 0.2 mm. Further, the superconducting tape wire 1 has a feature that while it is excellent in mechanical strength in the longitudinal direction B, it is vulnerable to tensile stress (peeling stress) in the direction perpendicular to the wire tape surface (tape thickness t direction). There is.

Further, an insulating coated superconducting tape wire in which the periphery of the superconducting tape wire 1 is coated with an insulating material such as polyimide or polyimide amide may be used.

(Bundled pancake coil)

An example of the configuration of the bundle-wound pancake coil (bundle-wound high-temperature superconducting coil device) 10 will be described with reference to FIG.

As shown in FIG. 2B, for example, a bundle wire in which two high-temperature superconducting tape wires 1a and 1b on which superconducting layers 4a and 4b are arranged and an insulating tape wire 8 are overlapped with each other to form a glass fiber. A so-called pancake-shaped winding portion wound in a spiral shape is formed around a winding frame 9 made of an insulating material such as reinforced plastic or reinforced PTFE (polytetrafluoroethylene).
Further, if necessary, an insulating layer 50 is formed on the upper and lower surfaces of the winding portion 11, and a so-called pancake-shaped superconducting coil as shown in FIG. 2A is formed to form a bundle-wound pancake coil 10.

(Example 1)

The bundle-wound high-temperature superconducting coil device 30 according to the first embodiment will be described with reference to FIGS. 3 and 4.

FIG. 3 (a) is an enlarged cross-sectional view of a main part of the bundled wire rod bundled with the bundle-wound high-temperature superconducting wire according to the present embodiment, and FIG. 3 (b) is a winding of the bundle-wound high-temperature superconducting coil device according to the present embodiment. It is a partial cross-sectional view of a part. Further, FIG. 4 shows a modified example of the bundle-wound high-temperature superconducting coil device according to the present embodiment.

The bundled wire rod 12 of the bundle-wound high-temperature superconducting coil device 30 of the present embodiment is shown in FIG. 3 (a).
), The reinforcing wires 20 are arranged adjacent to each other so as to be sandwiched between the high-temperature superconducting tape wires 1c and 1d, and the bundle wire 12 is a wire tape on the side close to the superconducting layers 4c and 4d. The surfaces are arranged so as to face each other and overlap each other. The high-temperature superconducting tape wires 1c and 1d and the reinforcing wire 20 may be slidable only in contact with each other at the time of winding, or may be integrated via a bonding layer such as solder. ..

Further, as shown in FIG. 3B, the bundle wire 12 is wound around a winding frame together with the insulating tape wire 8 to form a bundle-wound high-temperature superconducting coil device 25. In the case of a resin-impregnated coil, a thin resin layer is formed in the gap between the winding portions such as between turns, and is integrated after winding.

As the material of the reinforcing wire 20, a material having a higher Young's modulus than the high-temperature superconducting wire 1a is preferable in order to obtain a reinforcing effect. For example, Ni-based alloys such as stainless steel, Hastelloy (registered trademark), and NiW, copper alloys, and silver alloys. High-strength metals such as are applied.

The thickness of the reinforcing wire 20 is designed so that the strain generated in the high-temperature superconducting wires 1c and 1d due to the hoop stress generated by the high-temperature superconducting coil device is equal to or less than the allowable strain of the respective superconducting layers 4c and 4d. It is preferable that the thickness is the same as or thicker than that of the high-temperature superconducting wires 1d and 1c.

For example, when the generated hoop stress is 650 MPa, assuming that the Young's modulus of the high-temperature superconducting wire is 150 GPa and the allowable strain is 0.4%, the generated strain is 0.43% when there is no reinforcing wire, and the allowable strain is set. Therefore, the critical current characteristics of the high-temperature superconducting wire material deteriorate. On the other hand, when the reinforcing wire 20 is provided, assuming that the Young's modulus of the reinforcing wire 20 is 200 GPa, if the thickness of the reinforcing wire 20 is set to be the same as the thickness of one of the high-temperature superconducting wires 1c and 1d, two of them are provided. The apparent Young's modulus of the entire bundled wire including the high-temperature superconducting wires 1c and 1d and the reinforcing wire 20 is 150 × 2 / (2 + 1) + 200 × 1 / (2 + 1) ≈166.
It will be 7 GPa. At this time, the strain generated in the high-temperature superconducting wires 1c and 1d is reduced to 0.39%, and the allowable strain is suppressed to 0.4% or less.

In the embodiment of the present embodiment, among the bundled wires 12, the high-temperature superconducting tape wire 1c in which the wire tape surface C on the side closer to the superconducting layer 4 is arranged toward the outer periphery of the coil is the wire tape on the side closer to the superconducting layer 4c. The reinforcing wire 20 is arranged adjacent to the surface C on the outer peripheral side of the coil.

According to the present embodiment, the high-temperature superconducting tape wire 1c in which the wire tape surface C on the side close to the superconducting layer 4 is arranged toward the outer peripheral side of the coil is adjacent to the wire tape surface C on the side close to the superconducting layer 4c. Since the reinforcing wire 20 is arranged adjacent to the outer peripheral side of the coil, the high-temperature superconducting tape wire 1c
When an electromagnetic force in the direction of swelling in the coil radial direction is generated in the superconducting layer 4c of the above, the strain generated by suppressing the deformation by the adjacent reinforcing wire 20 is reduced from a microscopic point of view, and the coil by the reinforcing wire 20 is reduced. It is possible to provide a bundle-wound high-temperature superconducting coil device 25 capable of effectively exhibiting the effect of improving electromagnetic resistance performance, preventing deterioration of the critical current characteristics of the high-temperature superconducting wire, and stably generating a strong magnetic field.

On the other hand, for the high-temperature superconducting wire 1d in which the wire tape surface D closer to the superconducting layer 4 is arranged toward the inner peripheral side of the coil, a metal substrate having higher strength is arranged on the outer peripheral side of the coil than the superconducting layer 4d. Therefore, the structure is such that the reinforcing wire is not provided on the outer peripheral side of the coil adjacent to the high temperature superconducting wire 1d, but as shown in the modified example shown in FIG. 4, the tape facing the side of the high temperature superconducting wire 1d close to the superconducting layer 4d. Reinforcing wire 21 can be additionally installed on the outer peripheral side of the coil adjacent to the surface.

In this embodiment, an example in which the reinforcing wire is co-wound over all turns of the winding portion is shown, but for turns that do not exceed the allowable strain of the high-temperature superconducting wires 1c and 1d depending on the distribution of hoop stress, It is not necessary to wind the reinforcing wire together.

Further, in the present embodiment, an example of a so-called pancake-shaped superconducting coil (pancake coil) that is wound concentrically is shown, but two pancake coils are laminated in the central axis direction.
Moreover, it can be applied to the so-called double pancake type superconducting coil in which the high-temperature superconducting wire is transferred in the axial direction at the innermost circumference. The same effect can be obtained with the non-circular coil shape of.

(Example 2)

Next, the second embodiment will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and duplicate description will be omitted.

The bundle-wound high-temperature superconducting coil device 31 of the present embodiment has a configuration in which the reinforcing wire rod 20 of the first embodiment is divided as shown in the partial cross-sectional view of the winding portion shown in FIG. 21b, 22a, and 22b are bundled and configured. Here, in each reinforcing wire, for example, 21b and 22a, 22b are formed of different materials, and therefore have different Young's modulus.

Further, as described above, the reinforcing wires 21b, 22a and 22b are high-temperature superconducting wires 1c and 1d.
A material having a higher Young's modulus is preferable. In the present embodiment, the Young's modulus of the reinforcing wires 22a and 22b in contact with the high-temperature superconducting wires 1c and 1d is set to be lower than the Young's modulus of the reinforcing wire 21b and higher than the Young's modulus of the high-temperature superconducting wires 1c and 1d. ing. For example, when the Young's modulus of the high-temperature superconducting wires 1c and 1d is 150 GPa, the Young's modulus of the reinforcing wires 21b is set to 250 GPa, and the Young's modulus of the reinforcing wires 22a and 22b is set to 200 GPa in the middle. That is, the plurality of reinforcing wires 21b, 22a, and 22b are bundled adjacent to the high-temperature superconducting wires 1c and 1d in the order in which the Young's modulus is closer to the Young's modulus of the high-temperature superconducting wires 1c and 1d.

In the present embodiment configured as described above, a reinforcing wire having a Young's modulus intermediate between the Young's modulus of each is arranged between the reinforcing wire 21b and the high-temperature superconducting wire.

According to the present embodiment, the reinforcing wires 22a and 22b having a Young ratio intermediate to the respective Young ratios are arranged between the reinforcing wires 21b and the high-temperature superconducting wires 1c and 1d. The distribution of strain generated inside the high-temperature superconducting wires 1c and 1d in the coil radial direction can be further relaxed as compared with Example 1, and the deterioration of the critical current characteristics of the high-temperature superconducting wires can be prevented more reliably. It is possible to provide a bundle-wound high-temperature superconducting coil device capable of stably generating a strong magnetic field.

In the present embodiment, the reinforcing wire is divided into three pieces, but the number may be further increased. In that case, the distribution of the strain generated inside the high-temperature superconducting wire in the coil radial direction is further increased. It can be relaxed.

(Example 3)

Next, the third embodiment will be described with reference to FIG. In addition, the same reference numerals are given to the same configurations as those of Example 1 or Example 2, and duplicate description will be omitted. FIG. 6 is a partial cross-sectional view of a part of the winding portion of the bundle-wound high-temperature superconducting coil device 32 according to the present embodiment as viewed from the upper surface of the coil.

In the bundle-wound high-temperature superconducting coil device 32 of the present embodiment, a solder layer 13 is formed on a part of the winding portion.
A connection portion A is provided via the above, and the high-temperature superconducting wire 1e is erected. The high-temperature superconducting wire 1e reduces the connection resistance between the high-temperature superconducting wires, so that the superconducting layer 4e
The wire tape surface E on the side closer to is arranged toward the inner peripheral side of the coil, but the reinforcing wire 21c
Is extended and is co-wound with the connecting portion and the high-temperature superconducting wire 1e.

In the third embodiment configured in this way, even when the connecting portion A is provided in a part of the winding portion, the reinforcing wire rod 21c is continuously arranged inside the winding portion and is not cut. ..

According to this embodiment, even when the connecting portion A is provided in a part of the winding portion, the reinforcing wire rod 21c
Is continuously arranged inside the winding part, so the electromagnetic force in the direction of swelling in the coil radial direction is
For the high-temperature superconducting wires 1a and 1b and the reinforcing wire 21c, the tensile stress in the longitudinal direction of the wire,
When the so-called hoop stress occurs, the stress generated in the reinforcing wire 21c becomes discontinuous and local stress is not applied to the high-temperature superconducting wires 1a and 1b, and the connecting portion A is provided in a part of the winding portion. Even in this case, it is possible to provide a bundle-wound high-temperature superconducting coil device 32 that can surely prevent deterioration of the critical current characteristics of the high-temperature superconducting wires 1a and 1b and can stably generate a strong magnetic field.

(Example 4)

Next, Example 4 will be described with reference to FIGS. 7 and 8. The same configurations as those in Examples 1 to 3 are designated by the same reference numerals, and redundant description will be omitted. FIG. 7 is a partial cross-sectional view of the end of the winding portion of the bundle-wound high-temperature superconducting coil device according to the present embodiment as viewed from the upper surface of the coil. Further, FIG. 8 shows a modified example of the bundle-wound high-temperature superconducting coil device according to the present embodiment.

As shown in FIG. 7, the bundle-wound high-temperature superconducting coil device 33 of the present embodiment is provided with an electrode 14 at the end of the winding portion, which extends to the end of the reinforcing wire 23 to input and output a current from the outside. The electrode 14 is electrically connected to the high-temperature superconducting wires 1a and 1b via a solder layer 13b. Further, it is preferable that the electrode 14 and the reinforcing wire 23 are mechanically connected by a solder layer 13b.

In order to energize the bundle-wound high-temperature superconducting coil device 33, an electrode capable of inputting and discharging an electric current from the outside is required. However, the bundled wire 1 as shown in FIG. 3 of Example 1
Even if an electrode is simply connected to 2, the wire is connected to the wire tape surface on the side close to the tape substrate 2, so that the connection resistance becomes high, local heat is generated, and the material becomes thermally unstable. In the present embodiment configured as described above, even when the electrode 14 is provided at the end of the winding portion, the high-temperature superconducting wires 1a and 1b are on the side close to the superconducting layers 4a and 4b which can be connected to a low resistance. Tape surfaces C, D
The connection with the electrode 14 is secured.

According to this embodiment, even when the electrode 14 is provided at the end of the winding portion, the high-temperature superconducting wires 1a and 1b are electrodes on the wire tape surfaces C and D on the side close to the superconducting layer that can be connected to the low resistance. Since the connection with 14 is secured, it is possible to provide the bundle-wound high-temperature superconducting coil device 33 capable of stably generating a strong magnetic field without causing thermal instability.

The electrode 14 does not have to be rectangular, and by extending to the outer peripheral side of the coil as shown by the electrode 14b shown in FIG. 8, the outer peripheral surface of the coil at the end of the winding portion can be kept circular. Further, the electrode is not applied only to the so-called mouth-out electrode for inputting / outputting current from an external power source, but is also applied to the coil-to-coil connection electrode for electrically connecting pancake coils to each other. The effect of is obtained. Further, the electrode does not have to be formed by one member, and a plurality of members may be combined and integrated via a solder layer.

1, 1a, 1b, 1c, 1d, 1e, 1x, 1y ... High-temperature superconducting wire (superconducting tape wire), 2
... Tape substrate, 3 ... Intermediate layer, 4, 4a, 4b, 4c, 4d, 4e ... Superconducting layer, 5 ... Stabilizing layer, 6 ... Alignment layer, 7 ... Protective layer, 8 ... Insulating tape wire, 9 ... Winding frame 10, 10 ... Bundled pancake coil, 11 ... Winding part, 12 ... Bundled wire, 13, 13b ... Solder layer, 14, 14
b ... Electrodes, 20, 21, 21b, 21c, 22a, 22b, 23, 24 ... Reinforcing wire, 25
, 30, 31, 32, 33 ... Bundled high-temperature superconducting coil device, 50 ... Insulation layer.

Claims (8)

A bundled wire that bundles multiple high-temperature superconducting wires on which a superconducting layer is formed, and
A bundle-wound high-temperature superconducting coil device in which at least one reinforcing wire is wound together around a winding frame.
Among the bundled wires, the reinforcing wire arranged on the high-temperature superconducting wire having the wire tape surface closer to the superconducting layer arranged toward the outer periphery of the coil is the side closer to the superconducting layer of the high-temperature superconducting wire. A bundle-wound high-temperature superconducting coil device provided in direct contact with the wire tape surface. The bundle winding according to claim 1, wherein the bundled wire is laminated so that the wire tape surfaces on the side close to the superconducting layer constituting the high-temperature superconducting wire are overlapped with each other of the two high-temperature superconducting wires facing each other. High-temperature superconducting coil device. The bundle-wound high-temperature superconducting coil device according to claim 1 or 2, wherein the reinforcing wire is made of a metal material having a Young's modulus higher than that of the high-temperature superconducting wire. The bundle-wound high-temperature superconducting coil device according to claim 1, wherein the reinforcing wire is formed by bundling a plurality of reinforcing wires made of different materials. The bundle-wound high-temperature superconducting coil device according to claim 4, wherein the plurality of reinforcing wires are bundled adjacent to the high-temperature superconducting wire in the order in which the Young's modulus is close to the Young's modulus of the high-temperature superconducting wire. .. The bundled wire includes a connection portion in the high-temperature superconducting wire, and the superconducting layer after the high-temperature superconducting wire having the wire tape surface closer to the superconducting layer arranged toward the outer periphery of the coil is connected. The bundle-wound high-temperature superconductivity according to claim 1 to 5, wherein the reinforcing tape wire is co-wound even in the winding portion where the wire tape surface on the side closer to the coil is arranged toward the inner peripheral side of the coil. Coil device. A bundled wire that bundles multiple high-temperature superconducting wires on which a superconducting layer is formed, and
A high-temperature superconducting coil device in which at least one or more reinforcing wires are co-wound around a winding frame and wound around the winding frame.
Among the bundled wires, the reinforcing wire arranged on the high-temperature superconducting wire having the wire tape surface on the side close to the superconducting layer arranged toward the outer peripheral side of the coil is on the side close to the superconducting layer of the high-temperature superconducting wire. It is provided in direct contact with the wire tape surface, and is provided.
In the high-temperature superconducting wire rod in which the wire rod tape surface on the side close to the superconducting layer located at the end of the bundle wire rod is arranged toward the outer peripheral side of the coil.
A bundle-wound high-temperature superconducting coil device characterized in that an electrode is provided at the end of the reinforcing wire rod to input and output an external current. The bundle-wound high-temperature superconducting coil device according to claim 7, wherein the electrode is mechanically connected to the end of the reinforcing wire.

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