JP6871117B2 - High-temperature superconducting coil device and high-temperature superconducting magnet device - Google Patents

Description

An embodiment of the present invention relates to a high-temperature superconducting coil device in which a tape-shaped high-temperature superconducting wire is wound, and a high-temperature superconducting magnet device using the same.

The superconducting wire has a range of current, temperature, and magnetic field that can maintain the superconducting state, that is, a so-called critical current, a critical temperature, and a critical magnetic field. Therefore, even if the electric resistance is almost zero, an infinite current cannot flow, and when any of the critical values is exceeded, a transition phenomenon to the normal conduction state, that is, quenching occurs.

Joule heat generation in the normal conduction transition region due to such quenching causes the superconducting coil to run away instantaneously, and in the worst case, there is a risk of burning. Therefore, protection technology against quenching is indispensable.

As a conventional technique for quench protection, for example, there is a method of connecting a protection resistor in parallel with a superconducting coil. This method is a method of detecting an increase in the coil voltage or an increase in temperature generated by the transition to the normal conduction state, and using this detection result as a trigger to shut off the exciting power supply. After the power is cut off, the circuit of the superconducting coil and the protection resistor is closed. Therefore, the stored energy of the superconducting coil is consumed by the Joule heat generation of the protection resistor arranged at room temperature, and the current flowing through the superconducting coil can be attenuated.

Examples of the superconducting wire used for such a superconducting coil include a high-temperature superconducting wire such as _{Bi 2} Sr ₂ Ca ₂ Cu ₃ O _{10 + x} wire and RE ₁ B ₂ C ₃ O _{7 wire.} Here, "RE" is a rare earth element, "B" means barium (Ba), "C" means copper (Cu), and "O" means oxygen (O). A superconducting coil using a high-temperature superconducting wire has a high critical current density even at a high temperature of 20K to 50K as compared with a conventional low-temperature superconducting wire such as NbTi, so that high-current density operation at a high temperature is possible.

However, when quenching occurs during high current density operation, the expansion of the normal conduction transition region is slow in the temperature range of 20K to 50K because the specific heat is larger than the operating temperature of the superconducting magnet using the low temperature superconducting wire. Further, since the heat generation density becomes high when the high current density operation is performed, the above-mentioned conventional quench protection method causes thermal runaway locally before detection and burns out.

Therefore, for example, Patent Document 1 proposes a technique in which a high-temperature superconducting wire is partially laminated on a winding portion having a severe empirical magnetic field and a low critical current inside the high-temperature superconducting coil. According to this technique, even if the current value or temperature that normally quenches is reached, the current can be transferred to the bonded high-temperature superconducting wire. Therefore, the current sharing of the high-temperature superconducting wire per wire is reduced to about half, and Joule heat generation is suppressed, so that thermal runaway can be prevented. Further, by partially laminating, the decrease in current density can be minimized.

Japanese Unexamined Patent Publication No. 2006-313923

By the way, in Patent Document 1, for example, a connection method of 0.01 μΩ level with a lap length of 100 mm is proposed as a joining method of bonding high-temperature superconducting wires, and usually, a solder connection is used as a connection method of a resistor of this order. There is. Other bonding methods include diffusion bonding, welding, ultrasonic bonding and the like.

However, since the two stacked high-temperature superconducting wires 1 and 2 connected as shown in FIG. 10 are integrated via the joint layer 3, the bending strain ε = (t'/2) when coiled. / R is twice that of one sheet. Here, R indicates the average radius of curvature, and t'indicates the sum of the thicknesses of the two high-temperature superconducting wires 1 and 2 including the thickness of the bonding layer 3 t'= t ₁ + t ₂ + t ₃ . Further, t ₁ and t ₂ indicate the thickness of the two high-temperature superconducting wires 1 and 2, and t ₃ indicates the thickness of the bonding layer 3.

Further, since the two-layered high-temperature superconducting wires 1 and 2 have high rigidity in the wire thickness direction, it becomes difficult to wind them around a circular winding portion with a uniform curvature at the time of winding. Therefore, when bent with a non-uniform curvature, the allowable bending strain is locally exceeded, and the critical current characteristics of the high-temperature superconducting wires 1 and 2 are deteriorated. As a result, not only could it not be possible to prevent thermal runaway due to the commutation of the current that was originally intended, but there was also the possibility of thermal runaway and burning due to the heat generated by the nodules at the deteriorated part.

The problem to be solved by the present embodiment is to provide a high-temperature superconducting coil device and a high-temperature superconducting magnet device capable of preventing local thermal runaway inside without deteriorating the critical current characteristics of the high-temperature superconducting wire. It is in.

In order to solve the above problems, the high-temperature superconducting coil device according to the present embodiment is a high-temperature superconducting coil device in which a tape-shaped high-temperature superconducting wire is wound, and at least one position of a winding portion exceeding at least one turn A plurality of the high-temperature superconducting wires are wound, and the plurality of high-temperature superconducting wires are electrically connected by direct contact, and the plurality of high-temperature superconducting wires form a first high-temperature superconducting wire and a second high-temperature superconducting wire. A tape-shaped metal wire is provided on at least one surface of the first high-temperature superconducting wire and the second high-temperature superconducting wire to which the first high-temperature superconducting wire and the second high-temperature superconducting wire are not in direct contact with each other. Is electrically connected by direct contact .

The high-temperature superconducting magnet device according to the present embodiment is characterized by including the high-temperature superconducting coil device according to the present embodiment.

According to this embodiment, it is possible to prevent local thermal runaway inside the high-temperature superconducting coil device without deteriorating the critical current characteristics of the high-temperature superconducting wire.

It is a block diagram which shows an example of the high-temperature superconducting wire material used for the high-temperature superconducting coil device of each embodiment. (A) is a schematic perspective view showing an example of a pancake coil of the high-temperature superconducting coil device of each embodiment, (b) is a schematic sectional view of (a), and (c) is an enlarged sectional view of (b). It is sectional drawing which shows the high temperature superconducting coil apparatus of 1st Embodiment. It is the figure which looked at the high temperature superconducting wire immediately after winding in 1st Embodiment from the upper surface of a coil. It is a graph which shows the relationship between the number of turns of the winding part which is co-wound in 1st Embodiment, and the voltage per unit length. FIG. 5 is an enlarged cross-sectional view showing a portion in which the first high-temperature superconducting wire and the second high-temperature superconducting wire are co-wound in the second embodiment. It is sectional drawing which shows the high temperature superconducting coil apparatus of 3rd Embodiment. It is sectional drawing which shows the high temperature superconducting coil apparatus of 4th Embodiment. It is a vertical cross-sectional view which shows an example of the high temperature superconducting magnet apparatus which applied the high temperature superconducting coil apparatus of each embodiment. It is the figure which looked at the high temperature superconducting wire immediately after winding in a conventional example from the upper surface of a coil.

Hereinafter, the high-temperature superconducting coil device and the high-temperature superconducting magnet device according to the present embodiment will be described with reference to the drawings.

(High-temperature superconducting wire)
FIG. 1 is a configuration diagram showing an example of a high-temperature superconducting wire material (superconducting tape wire) used in the high-temperature superconducting coil device of each embodiment.

The same or corresponding parts as those in the conventional example will be described with the same reference numerals. Further, in the following description, when the first high-temperature superconducting wire and the second high-temperature superconducting wire are described separately, they will be described with reference numerals 1 and 2, respectively. Further, when the first high-temperature superconducting wire and the second high-temperature superconducting wire are collectively described, only reference numeral 1 will be added for description.

As shown in FIG. 1, the high-temperature superconducting wire 1 is entirely formed in a tape shape. The high-temperature superconducting wire 1 has at least a tape substrate 4, an intermediate layer 5, and a superconducting layer 6, both of which are covered with a stabilizing layer 7.

If necessary, the high-temperature superconducting wire 1 may be provided with an orientation layer 8 between the tape substrate 4 and the intermediate layer 5, and a protective layer 9 between the superconducting layer 6 and the stabilizing layer 7.

The tape substrate 4 is made of a material such as stainless steel, a nickel alloy such as Hastelloy, or a silver alloy.

The intermediate layer 5 is a diffusion prevention layer, and is made of, for example, a material such as cerium oxide, yttria-stabilized zirconia (YSZ), magnesium oxide, yttrium oxide, ytterbium oxide, barium zirconia, etc., and is formed on the tape substrate 4.

The superconducting layer 6 is made of, for example, a superconductor thin film having _{a RE123-based composition (RE 1} B ₂ C ₃ O _{7 or the like).} In addition, "RE" of "RE ₁ B ₂ C ₃ O ₇ " is at least one of rare earth elements (for example, neodymium (Nd), gadolinium (Gd), holmium (Ho), samarium (Sm), etc.) and ittrium element. , "B" means samarium (Ba), "C" means copper (Cu), and "O" means oxygen (O).

The stabilizing layer 7 is provided for the purpose of preventing the superconducting layer 6 from burning when excessive electricity flows through the superconducting layer 6, and is formed of highly conductive silver or the like.

The alignment layer 8 is provided for the purpose of orienting the intermediate layer 5 on the tape substrate 4, and is formed of magnesium oxide (MgO) or the like. The alignment layer 8 can be omitted when an oriented substrate is used.

The protective layer 9 is provided for the purpose of preventing the superconducting layer 6 from being deteriorated by contact with moisture in the air, and is formed of silver or the like. The protective layer 9 also plays a role of preventing the superconducting layer 6 from burning when excessive electricity flows through the superconducting layer 6.

The tape width w of the high-temperature superconducting wire 1 composed of such a multilayer is, for example, 4 to 12 mm, and the tape thickness t is 0.1 to 0.2 mm. Further, the high-temperature superconducting wire 1 is excellent in mechanical strength in the longitudinal direction, but has a feature that it is vulnerable to tensile stress (peeling stress) in the direction perpendicular to the tape surface.

Further, the insulation-coated superconducting tape wire may be obtained by coating the periphery of the high-temperature superconducting wire 1 with an insulating material such as polyimide or polyimideamide.

(High-temperature superconducting coil device)
2 (a) is a schematic perspective view showing an example of a pancake coil of the high-temperature superconducting coil device of each embodiment, FIG. 2 (b) is a schematic sectional view of FIG. 2 (a), and FIG. 2 (c) is FIG. It is an enlarged sectional view of (b).

As shown in FIGS. 2 (b) and 2 (c), the high-temperature superconducting wire 1 is superposed on the insulating tape wire 11 and is made of an insulating material such as glass fiber reinforced plastic (FRP) or reinforced PTFE (polytetrafluoroethylene). A so-called pancake-shaped winding portion 13 wound in a spiral shape is formed around the winding frame 12. Further, by forming insulating layers 14 on both the upper and lower surfaces of the winding portion 13 as needed, a so-called pancake-shaped high-temperature superconducting coil device 10 as shown in FIG. 2A, that is, a pancake coil is formed. To.

(First Embodiment)
(Constitution)
FIG. 3 is a cross-sectional view showing the high-temperature superconducting coil device of the first embodiment. FIG. 4 is a view of the high-temperature superconducting wire immediately after winding in the first embodiment as viewed from the upper surface of the coil. FIG. 5 is a graph showing the relationship between the number of turns of the co-wound winding portion and the voltage per unit length in the first embodiment.

In the high-temperature superconducting coil device 10 of the present embodiment, as shown in FIG. 3, the first high-temperature superconducting wire 1 wound around the outer periphery of the winding frame 12 has a first high-temperature superconducting wire 1 in the winding portion 13 having at least one turn. A second high-temperature superconducting wire 2 is co-wound adjacent to the high-temperature superconducting wire 1. The first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 are not fixed via a bonding layer such as solder as in the conventional case, but are electrically connected by direct contact. The second high-temperature superconducting wire 2 has the same multi-layer structure, tape width w, and thickness t of the high-temperature superconducting wire 1.

Here, the winding portion 13 having at least one turn to be co-wound may be provided at at least one position according to the design of quench protection. In this embodiment, for example, in a coil having a total number of turns of 100 turns. It is co-wound in two places, 10 to 30 turns and 90 to 100 turns.

_{The resistance R join} of the electrical connection per unit length due to direct contact between the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 has a ripple current of an exciting power supply of approximately 0.1 to 1. It is a few percent. As a result, in order to obtain the effect of commutation, the commutation ratio of the first high-temperature superconducting wire 1 to the second high-temperature superconducting wire 2 needs to be at least 1/1000 or more.

On the other hand, since the voltage per unit length generated in the high-temperature superconducting wires 1 and 2 before and after quenching is about 1 μV / cm, the resistance value is a value calculated by dividing 1 μV / cm by the operating current value. ..

Thus, direct contact electrical connection of the resistor R _joint per unit length due to, per unit length of the voltage 1 uV / cm operation between the first high temperature superconducting wire 1 and the second high-temperature superconducting wire 2 It is preferably 1000 times or less the resistance value calculated by dividing by the current value.

As an example, when the operating current value is 100 A, the resistance value per unit length generated in the high-temperature superconducting wires 1 and 2 before and after quenching is ^10-8 Ω / cm. Therefore, the first high-temperature superconductivity the wire 1 resistor R _joint electrical connections per unit length due to direct contact between the second high-temperature superconducting wire 2, may be set below 10 ^-5 Ω / cm.

Further, the second high-temperature superconducting wire 2 is the same as the first high-temperature superconducting wire 1, in addition to the high-temperature superconducting wire having RE ₁ B ₂ C ₃ O ₇ as the superconducting layer, (Bi, Pb) ₂ Ca ₂ Sr. ₁ Cu ₂ O _{10 + x} , (Bi, Pb) ₂ Ca ₂ Sr ₂ Cu ₃ O _{10 + x} , (Bi, Pb) ₂ Ca ₂ Sr ₃ Cu ₄ O _{10 + x,} etc. It may be.

Such bismuth-based superconducting tape is a so-called multi-core tape wire rod in which a plurality of filamentous bismuth-based high-temperature superconducting materials are injected into a silver base material, and depending on the design, a high-strength metal tape for reinforcement. Is attached.

(For use)
As described above, in the conventional example, since the two-layered high-temperature superconducting wires 1 and 2 are integrated by the bonding layer 3 such as solder, the thickness is double that of the case of one sheet, and when coiled. The bending distortion of the sheet is also double that of one sheet. Since the rigidity in the wire thickness direction is increased, it becomes difficult to wind the wire around the circular winding portion 13 with a uniform curvature at the time of winding. Therefore, if the bending is performed with a non-uniform curvature, the allowable bending strain is locally exceeded, and the critical current characteristics of the high-temperature superconducting wires 1 and 2 are deteriorated. As a result, not only can it not be possible to prevent thermal runaway due to the commutation of the current that was originally intended, but there is also the possibility of thermal runaway and burning due to the heat generated by the nodules at the deteriorated part.

On the other hand, in the present embodiment, the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 are not integrated by a bonding layer 3 such as solder, but are electrically connected by direct contact. There is. Therefore, the second high-temperature superconducting wire 2 can slide in the direction of the arrow shown in FIG. 4 at the time of winding.

Therefore, in this embodiment, the second high-temperature superconducting wire 2, the first high-temperature superconducting wire 1 and likewise can be bent in the one sheet bending strain _{ε = (t 2/2)} / R. Further, at the time of winding, the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 can be wound around the circular winding portion 13 with a uniform curvature as in the first high-temperature superconducting wire 1. It does not deteriorate the critical current characteristics. Then, when the first high-temperature superconducting wire 1 is quenched, the current can be translocated to the second high-temperature superconducting wire 2, and Joule heat generation is suppressed, so that the locality inside the high-temperature superconducting coil device 10 is suppressed. It is possible to prevent thermal runaway.

Specifically, in the present embodiment, for example, in a coil having a total number of turns (total number of turns N) of 100 turns, the first high-temperature superconducting wire 1 has a second position of 10 to 30 turns and 90 to 100 turns. The high-temperature superconducting wire 2 is co-wound. As shown in FIG. 5, when the first high-temperature superconducting wire 1 is quenched, the voltage per unit length generated in the first high-temperature superconducting wire 1 is generated at two locations, 10 to 30 turns and 90 to 100 turns. V (V / cm) changes from the waveform shown by the solid line to the waveform shown by the wavy line. This means that when the first high-temperature superconducting wire 1 is quenched, the current is reliably transferred to the second high-temperature superconducting wire 2, so that the voltage V per unit length is reduced. ..

(Effect)
As described above, according to the present embodiment, since the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 are electrically connected by direct contact, the first high-temperature superconducting wire 1 and the second It is possible to prevent local thermal runaway inside the high-temperature superconducting coil device 10 without deteriorating the critical current characteristics of the critical current characteristics of the high-temperature superconducting wire 2.

In the present embodiment, an example of a so-called pancake-shaped pancake coil that is wound concentrically as the high-temperature superconducting coil device 10 is shown, but the present invention is not limited to this, and the pancake coil is rotated in the central axis direction by 2. It can also be applied to a so-called double pancake type high-temperature superconducting coil device in which one is laminated and the high-temperature superconducting wire is axially transferred at the innermost circumference. Further, the pancake coils 10 may be configured to be laminated in three or more in the central axis direction. Further, the planar shape of the coil is not limited to a circular shape, and the same effect can be obtained with a non-circular coil shape such as a D shape, an elliptical shape, a race track shape, or a three-dimensional shape.

(Second Embodiment)
(Constitution)
FIG. 6 is an enlarged cross-sectional view showing a portion in which the first and second high-temperature superconducting wires are co-wound in the second embodiment. The second embodiment is a modification of the first embodiment. In the second embodiment, the same or corresponding parts as those in the first embodiment are designated by the same reference numerals, duplicate description is omitted, and only different configurations and operations are described. The same applies to other embodiments.

As shown in FIG. 6, in the high-temperature superconducting coil device 10 of the present embodiment, the superconducting layer 15 of the first high-temperature superconducting wire 1 and the superconducting layer 16 of the second high-temperature superconducting wire 2 are provided close to one side. ..

Then, in the high-temperature superconducting coil device 10 of the present embodiment, the tape surface on the side close to the superconducting layer 15 of the first high-temperature superconducting wire 1 and the tape surface on the side close to the superconducting layer 16 of the second high-temperature superconducting wire 2 Are configured adjacent to each other.

(For use)
In the present embodiment configured as described above, the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 are arranged so that the tape surfaces on the sides close to the superconducting layers 15 and 16 are adjacent to each other. Therefore, the resistance of the electrical connection can be made lower than in the case where both the high-temperature superconducting wires 1 and 2 face the tape surface on the side closer to the tape substrate 4.

(Effect)
As described above, according to the present embodiment, the resistance of the electrical connection between the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 can be made lower, so that the first high-temperature superconducting wire 1 can be used. When quenching, the current is easily commutated to the second high-temperature superconducting wire 2, and the local thermal runaway inside the high-temperature superconducting coil device 10 is more reliably prevented as compared with the first embodiment. Will be possible.

(Third Embodiment)
(Constitution)
FIG. 7 is a cross-sectional view showing the high-temperature superconducting coil device of the third embodiment.

As shown in FIG. 7, the high-temperature superconducting coil device 10 of the present embodiment is configured such that the tape-shaped metal wire 17 is electrically connected by direct contact adjacent to the second high-temperature superconducting wire 2. .. As the material of the metal wire rod 17, pure metals such as copper, gold, silver and indium, and alloys such as stainless steel, copper alloys and silver alloys can be used.

(For use)
In the present embodiment configured as described above, since the tape-shaped metal wire 17 is electrically connected adjacent to the second high-temperature superconducting wire 2 by direct contact, the first high-temperature superconducting wire 1 is connected. When quenching, the region where the current can be commutated expands, and the heat capacity of the winding portion 13 for one turn increases, so that the temperature rise due to Joule heat generation can be suppressed.

(Effect)
As described above, according to the present embodiment, when the first high-temperature superconducting wire 1 is quenched, the region where the current can be commutated is expanded and the heat capacity of the winding portion 13 for one turn is increased. Since the temperature rise due to heat generation can be suppressed, it is possible to prevent local thermal runaway inside the high-temperature superconducting coil device 10 more reliably than in the first embodiment and the second embodiment.

(Modification example)
In the high-temperature superconducting coil device 10 of the present embodiment, the tape-shaped metal wire 17 is electrically connected to the second high-temperature superconducting wire 2 by direct contact, and the metal wire 17 has a first high temperature. It may be electrically connected to the superconducting wire 1 by direct contact. Further, the metal wire 17 may be electrically connected to both the second high-temperature superconducting wire 2 and the first high-temperature superconducting wire 1 by direct contact. In short, the metal wire 17 may be electrically connected to at least one of the second high-temperature superconducting wire 2 and the first high-temperature superconducting wire 1 by direct contact.

(Fourth Embodiment)
(Constitution)
FIG. 8 is a cross-sectional view showing the high-temperature superconducting coil device of the fourth embodiment.

As shown in FIG. 8, in the high-temperature superconducting coil device 10 of the present embodiment, the second high-temperature superconducting wire 2 is more taped than the second high-temperature superconducting wire 2 described in the first to third embodiments. It is thinly formed.

That is, the second high-temperature superconducting wire 2 described in the first to third embodiments has the same tape thickness as the first high-temperature superconducting wire 1, but the second high-temperature superconducting wire of the present embodiment has the same tape thickness. The wire rod 2 is formed to have a thinner tape than the first high-temperature superconducting wire rod 1.

For example, assuming that the tape thickness of the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 according to the first to third embodiments is 0.17 mm, the second high-temperature superconducting wire of the present embodiment is used. The tape thickness of the wire rod 2 is 0.1 mm.

(For use)
In the present embodiment configured as described above, the tape thickness of the second high-temperature superconducting wire 2 is formed thinner than that of the first high-temperature superconducting wire 1, and therefore, as compared with the first to third embodiments. Although the heat capacity of the winding portion 13 in one turn is reduced, the cross-sectional area of the winding portion 13 can be made smaller.

(Effect)
As described above, according to the present embodiment, although the heat capacity of the winding portion 13 in one turn is reduced as compared with the first to third embodiments, the cross-sectional area of the winding portion 13 can be made smaller. Therefore, it is possible to suppress a decrease in current density due to the influence of co-winding.

(Modification example)
The second high-temperature superconducting wire 2 of the present embodiment has a tape thickness t higher than that of the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 described in the first to third embodiments. Although it is formed thin, the tape width w may be formed narrower than that of the second high-temperature superconducting wire 2 described in the first to third embodiments. As described above, the first high-temperature superconducting wire 1 and the second high-temperature superconducting wire 2 do not necessarily have the same tape thickness t or tape width w.

(High-temperature superconducting magnet device)
FIG. 9 is a vertical cross-sectional view showing an example of a high-temperature superconducting magnet device to which the high-temperature superconducting coil device of each embodiment is applied.

As shown in FIG. 9, in the high-temperature superconducting magnet device 20, the high-temperature superconducting coil device 10 of any of the above-described embodiments is housed in the vacuum container 21. The high-temperature superconducting coil device 10 is supported by a support member (not shown).

The refrigerator 22 is thermally connected to the high-temperature superconducting coil device 10 in the vacuum container 21 via the heat transfer plate 23. Two current introduction terminals 24, 24 are provided on the outside of the vacuum vessel 21. One end of the current leads 25, 25 is connected to each of these two current introduction terminals 24, 24, and the other end of these current leads 25, 25 is connected to the high-temperature superconducting coil device 10. The current leads 25 and 25 are thermally connected to the cooling end of the refrigerator 22 via a thermal anchor 26.

Therefore, by accommodating the high-temperature superconducting coil device 10 of each embodiment in the high-temperature superconducting magnet device 20 configured in this way, thermal runaway inside the high-temperature superconducting coil device 10 can be prevented.

(Other embodiments)
Although embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. This embodiment can be implemented in various other forms, and various omissions, replacements, changes, and combinations can be made without departing from the gist of the invention. This embodiment and its modifications are included in the scope and gist of the invention, as well as in the scope of the invention described in the claims and the equivalent scope thereof.

In the high-temperature superconducting coil device 10 of each of the above embodiments, an example in which two high-temperature superconducting wires, that is, a first high-temperature superconducting wire 1 and a second high-temperature superconducting wire 2 are co-wound has been described, but the present invention is not limited to this. For example, three or more tape-shaped high-temperature superconducting wires may be electrically connected by direct contact.

Further, in the high-temperature superconducting coil device 10 of the first embodiment, an example in which two high-temperature superconducting wires 1 and 2 are co-wound at two locations of the winding portion 13 has been described, but the present invention is not limited to this. Two high-temperature superconducting wires 1 and 2 may be co-wound at at least one place.

Further, the features of the high-temperature superconducting coil device 10 of each of the above embodiments can be combined and implemented.

1 ... 1st high-temperature superconducting wire, 2 ... 2nd high-temperature superconducting wire, 3 ... bonding layer, 4 ... tape substrate, 5 ... intermediate layer, 6 ... superconducting layer, 7 ... stabilizing layer, 8 ... oriented layer, 9 ... Protective layer, 10 ... High-temperature superconducting coil device (pancake coil), 11 ... Insulating tape wire, 12 ... Winding frame, 13 ... Winding part, 14 ... Insulating layer, 15, 16 ... Superconducting layer, 17 ... Metal wire, 20 ... High-temperature superconducting magnet device, 21 ... Vacuum container, 22 ... Refrigerator, 23 ... Heat transfer plate, 24 ... Current introduction terminal, 25 ... Current lead, 26 ... Thermal anchor

Claims (7)

A high-temperature superconducting coil device in which a tape-shaped high-temperature superconducting wire is wound.
A plurality of the high-temperature superconducting wires are wound at at least one position of the winding portion exceeding at least one turn, and the plurality of high-temperature superconducting wires are electrically connected by direct contact.
The plurality of high-temperature superconducting wires include a first high-temperature superconducting wire and a second high-temperature superconducting wire.
A tape-shaped metal wire is directly attached to at least one surface of the first high-temperature superconducting wire and the second high-temperature superconducting wire to which the first high-temperature superconducting wire and the second high-temperature superconducting wire are not in direct contact with each other. A high-temperature superconducting coil device characterized by being electrically connected by contact. The high-temperature superconducting coil device according to claim 1 , wherein the first high-temperature superconducting wire and the second high-temperature superconducting wire are co-wound. The high-temperature superconducting coil device according to claim 1 or 2 , wherein the first high-temperature superconducting wire and the second high-temperature superconducting wire are wound around the outer periphery of the winding frame together with an insulating material. The first high-temperature superconducting wire and the second high-temperature superconducting wire are each provided with a superconducting layer close to one side, and the first high-temperature superconducting wire and the second high-temperature superconducting wire are close to the superconducting layer. The high-temperature superconducting coil device according to any one of claims 1 to 3 , wherein the side surfaces are adjacent to each other. The high-temperature superconducting coil device according to any one of claims 1 to 4 , wherein the second high-temperature superconducting wire has a tape thickness thinner than that of the first high-temperature superconducting wire. The resistance of the electrical connection per unit length due to direct contact between the first high-temperature superconducting wire and the second high-temperature superconducting wire is the voltage of 1 μV / cm per unit length divided by the operating current value. The high-temperature superconducting coil device according to any one of claims 1 to 5 , wherein the resistance value is 1000 times or less the calculated resistance value. A high-temperature superconducting magnet device comprising the high-temperature superconducting coil device according to any one of claims 1 to 6.

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