JP2021158381A - Spinner cleaning device - Google Patents

Abstract

To provide a spinner cleaning device capable of handling multiple semiconductor wafers simultaneously, and capable of performing suction/release reliably even if not all of the wafers are aligned.SOLUTION: A spinner cleaning device includes a rotating chuck table 13 having a rotating table body 19, and multiple suction holding parts 20a-20e provided at substantially equal intervals on a concentric circle with the table body 19 while having a prescribed phase-angle, and capable of suction holding semiconductor wafers W individually, a negative pressure generation source 22, multiple suction ports 18A-18E provided corresponding to the suction holding parts 20a-20e, respectively, and applying a negative pressure, generated in the negative pressure generation source 22, to the suction holding parts 20a-20e, individually, and cleaning fluid supply means 23 having a nozzle 23a for jetting the cleaning fluid toward the semiconductor wafers W suction held on the suction holding parts 20a-20e.SELECTED DRAWING: Figure 3

Description

The present invention relates to a spinner cleaning device, and more particularly to a spinner cleaning device used after grinding a semiconductor wafer or the like.

Conventionally, in the semiconductor manufacturing process, after grinding a semiconductor wafer, a process of cleaning and drying the semiconductor wafer with a spinner cleaning device is performed.

As a conventional spinner cleaning device, a rotating chuck table having a planar suction holding portion for sucking and holding a semiconductor wafer and an upper surface of the semiconductor wafer being sucked and held on the suction holding portion of the chuck table are directed. Drying that blows off the cleaning fluid remaining on the semiconductor wafer by blowing drying air toward the upper surface of the semiconductor wafer that is adsorbed and held on the adsorption holding part after cleaning and the cleaning fluid supply means that injects the cleaning fluid. A spinner cleaning device having an air supply means for use is generally used (see, for example, Patent Document 1).

Further, the spinner cleaning device shown in Patent Document 1 includes one suction holder that sucks and holds the central region of one semiconductor wafer by a suction holding surface portion and rotates, and the semiconductor wafer is centered on the suction holding body. It has a structure that rotates by arranging the central area (approximately the center).

Japanese Unexamined Patent Publication No. 2003-273005 Japanese Patent No. 4727859

In the spinner cleaning apparatus shown in Patent Document 1, since the central region of one semiconductor wafer is suction-held and processed on the suction-holding surface portion of one suction-holding body, there is a problem that workability is poor.

Further, the suction holder rotates around the central region of the semiconductor wafer. Therefore, the cleaning fluid remaining on the outer peripheral side is easily removed from the semiconductor wafer by receiving the centrifugal force during rotation, but remains in the central region (substantially the center) of the semiconductor wafer because it is not subjected to the centrifugal force. Easy to do. Therefore, there is a problem that it takes a long time to perform the drying process by the next drying air supply means.

Therefore, there arises a technical problem to be solved in order to provide a spinner cleaning device having a structure capable of handling a plurality of semiconductor wafers at the same time and facilitating cleaning and drying processing. An object of the present invention is to solve this problem.

The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a spinner cleaning device for cleaning a semiconductor wafer, the rotating table main body portion, and the table main body portion. A chuck table provided on concentric circles at substantially equal intervals with predetermined phase angles, each having a suction holding portion capable of individually sucking and holding the semiconductor wafer, a negative pressure generation source, and the suction holding portion. In addition to being provided corresponding to each, a plurality of suction ports for individually applying the negative pressure generated by the negative pressure generation source to the suction holding portion, and suction holding on the suction holding portion. Provided is a spinner cleaning device including a cleaning fluid supply means having a nozzle for injecting a cleaning fluid toward the semiconductor wafer.

According to this configuration, semiconductor wafers are arranged and suction-held in a plurality of suction-holding portions provided on one rotating table body, and the plurality of semiconductor wafers sucked and held can be cleaned. Can be done at the same time. Further, since it has a plurality of suction ports capable of individually applying a negative pressure to each suction holding portion of the chuck table, for example, a semiconductor wafer is arranged in all the suction holding portions for cleaning and the like. The semiconductor wafer can be adsorbed / released by arranging it only in the required adsorption / holding portion without performing the above-mentioned processing. Further, at the time of suction / release, the minimum pressure required for the suction ports can be applied to each of the plurality of suction ports to perform suction / release, so that the semiconductor wafer is not stressed and cracks or cracks occur. Defects can be prevented.

The invention according to claim 2 provides a port control means for applying an independent negative pressure to each suction holding portion between the negative pressure generation source and the plurality of suction ports in the configuration according to claim 1. Provided is a spinner cleaning device provided.

According to this configuration, when the negative pressure supplied from the negative pressure generation source to the suction port is turned on / off by the port control means, only the on / off port control means can be independently sucked / released. .. As a result, it is possible to make a wide range of production plans, such as arranging semiconductor wafers in all of a plurality of suction holding parts to perform cleaning processing, or arranging semiconductor wafers only in specific suction holding parts to perform cleaning processing. become. Further, since the negative pressure can be adjusted for each suction port according to individual differences, it is possible to prevent the semiconductor wafer from being stressed more than necessary.

According to the third aspect of the present invention, in the configuration according to the second aspect, the port control means adjusts the negative pressure applied to each suction holding portion and the air pressure applied to each suction holding portion at the time of release. Provide a spinner cleaning device that is possible.

According to this configuration, the port control means can adjust, for example, the release air pressure supplied from the negative pressure generation source to the suction port. Therefore, the release air pressure can be adjusted for each suction port according to individual differences. As a result, it is possible to prevent unnecessary stress applied to the semiconductor wafer.

The invention according to claim 4 has a nozzle for injecting drying air toward the semiconductor wafer which is suction-held on the suction-holding portion in the configuration according to claim 1, 2 or 3. Provided is a spinner device including a drying air supply means.

According to this configuration, after the cleaning treatment, drying air can be injected from the nozzle toward the semiconductor wafer to blow off the cleaning fluid remaining on the semiconductor wafer and dry the semiconductor wafer.

The invention according to claim 5 comprises a cover for preventing scattering of the cleaning fluid ejected from the nozzle of the cleaning fluid supply means in the configuration according to claim 1, 2, 3 or 4. Provides a spinner device including a tubular side cover arranged so as to cover the outer peripheral side portion of the chuck table, and an upper cover that covers the upper surface opening of the side cover so as to be openable and closable.

According to this configuration, the upper portion and the side portion of the chuck table can be completely covered with the side cover and the upper cover to prevent the cleaning fluid from scattering when cleaning the semiconductor wafer.

According to a sixth aspect of the present invention, in the configuration according to the first, second, third, fourth or fifth aspect, the semiconductor wafer is placed on the suction holding portion, the centrifugal force generated when the chuck table is rotated, and the semiconductor wafer. Provided is a spinner device for sucking and holding a wafer so that the wafers do not face each other at a right angle.

According to this configuration, the semiconductor wafer is arranged on the suction holding portion so that the centrifugal force generated when the chuck table rotates and the orientation flare of the semiconductor wafer do not face each other at a right angle, so that the cleaning fluid on the semiconductor wafer is also included. The cleaning fluid on the chuck table can be cut well. That is, when a plurality of semiconductor wafers are arranged on the chuck table with the olifra facing the center, that is, when the olifra is arranged so as to face the centrifugal force of the chuck table at right angles, the chuck table rotates. When the cleaning fluid is brought closer to the outer peripheral side, the cleaning fluid at the step between the tilter and the suction holding part hits directly at right angles to the side surface of the tilter and loses the place of flow, and remains at the step. It is easy and hard to cut. However, if the orifra is arranged so as to face the outer peripheral side instead of facing the center, the stepped portion has an inclination with respect to the direction of the centrifugal force and is arranged so as to face the outer peripheral side of the chuck table. The cleaning fluid that hits the side surface of the ori-fla is flowed along the side surface of the ori-fla toward the outer peripheral side of the chuck table. As a result, the cleaning fluid on the chuck table can be satisfactorily cut, including the cleaning fluid at the step portion between the tilter and the suction holding portion.

According to the invention, semiconductor wafers are arranged and suction-held on a plurality of suction-holding portions provided on one rotating table main body, and cleaning treatment and the like of the plurality of semiconductor wafers held by suction are performed. Since it can be performed at the same time, workability can be improved.

Further, since a plurality of independent suction ports for individually applying negative pressure to each suction holding part of the chuck table are provided, the semiconductor wafer is arranged only in a specific suction holding part among the plurality of suction holding parts. The suction / release operation becomes possible in the state of being made. As a result, a wide range of production plans can be made and the work can be performed, such as arranging semiconductor wafers on all of a plurality of suction holding parts to perform cleaning processing, or arranging semiconductor wafers only on specific suction holding parts and performing cleaning processing. It can be carried out.

Further, since the minimum pressure can be applied to each suction port at the time of suction / release, the semiconductor wafer can be prevented from being cracked or chipped without giving unnecessary stress.

It is a perspective view of the whole structure of the spinner cleaning apparatus shown as the embodiment of this invention. It is a side view of the spinner cleaning apparatus shown in FIG. It is a top view seen from the direction of the arrow of the line AA of FIG. It is a perspective view which shows the arrangement structure on the chuck table in the spinner cleaning apparatus shown in FIG. It is a top view of the spinner cleaning apparatus shown as another embodiment of this invention. It is a side view of the spinner cleaning apparatus shown in FIG.

The present invention provides a spinner cleaning device capable of handling a plurality of semiconductor wafers at the same time and reliably adsorbing / releasing even if all the plurality of semiconductor wafers are not prepared. In order to achieve the above object, a spinner cleaning device for cleaning a semiconductor wafer, a rotating chuck table having a plurality of adsorption holding portions for individually adsorbing and holding the semiconductor wafer, a negative pressure generation source, and the above. A plurality of suction ports are provided corresponding to the suction holding portions, and the negative pressure generated by the negative pressure generation source is individually applied to the suction holding portion, and suction is performed on the suction holding portion. This was realized by the configuration including a cleaning fluid supply means having a nozzle for injecting a cleaning fluid toward the held semiconductor wafer.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements are designated by the same reference numerals throughout the description of the embodiment. Further, in the following description, the expressions indicating the directions such as up / down and left / right are not absolute, and are appropriate when each part of the spinner cleaning device of the present invention is drawn. Should be changed and interpreted according to the change in posture.

1 to 3 show the spinner cleaning device 10 according to the present invention, FIG. 1 is a perspective view of the entire configuration, FIG. 2 is a side view thereof, and FIG. It is a plan view as seen. The spinner cleaning device 10 has a function of cleaning and drying the semiconductor wafer W that has been ground and the like.

The spinner cleaning device 10 shown in FIGS. 1 to 3 includes a rotating main body 12 rotatably supported by the device main body 11, a chuck table 13 that rotates integrally with the rotating main body 12, and a rotating main body 12. A rotating pulley 14, a rotary joint 15 arranged coaxially with the rotating main body 12 on the lower side of the pulley 14, a cleaning fluid supply means 23, a drying air supply means 24, and a cover 25 for preventing scattering. To be equipped. Further, between the chuck table 13 and the rotary joint 15, five suction ports 18A, 18B, 18C, 18D, which penetrate the inside of the rotary main body 12 and the rotary joint 15 and are independent of each other, 18E is provided. In FIGS. 1, 3, and 4, reference numeral 31 is a screw 31 for fixing the chuck table 13 to the rotating main body portion 12.

The device main body 11 can be moved in the vertical direction while maintaining the horizontal position. The rotary main body 12 is rotatably supported by a bearing (not shown) on the device main body 11.

The pulley 14 is fixed to the rotating main body 12 on the lower end side of the rotating main body 12. The pulley 14 is power-connected to the output shaft of the motor 16 fixed to the lower surface of the apparatus main body 11 via a pulley (not shown) and a transmission belt 17 rotatably attached to the output shaft. ing. When the motor 16 is rotationally driven, the pulley 14 receives the rotation of the motor 16 via the transmission belt 17 and rotates integrally with the rotating main body 12.

The rotary joint 15 covers an inner case (not shown) that rotates integrally with the rotating main body 12, and an outer surface that covers the outer peripheral surface of the inner case, is concentric with the inner case, and is non-rotatably fixed to the inner case. A case 15a is provided. Further, as shown in FIG. 2, intake ports 18a to 18e of the suction ports 18A to 18E are provided on the outer peripheral surface of the outer case 15a side by side in the vertical direction. Each of the intake ports 18a to 18e is connected to the negative pressure generation source (vacuum source) 22 via the port control means 21.

The rotary joint 15 communicates with the suction ports 18A to 18E on the rotating inner case side and the intake ports 18a to 18e on the fixed outer case 15a side, and the internal structure thereof is already known ( For example, see Patent Document 2). Therefore, in the case of the illustrated embodiment, the intake port 18a and the suction port 18A, the intake port 18b and the suction port 18B, the intake port 18c and the suction port 18C, the intake port 18d and the suction port 18D, and the intake port 18e and the suction port 18E are It is always in communication, and even if the inner case rotates with respect to the outer case 15a, the air in the suction ports 18A to 18E can be evacuated from the intake ports 18a to 18e on the outer case 15a side. There is.

FIG. 4 schematically shows the operation of only the chuck table 13 in a state where the semiconductor wafer W is not placed. The chuck table 13 includes a table main body 19 formed in a disk shape and five suction holding portions 20 provided on the upper surface side of the table main body 19.

The table main body 19 is fixed to the upper end of the rotary main body 12 and is rotatably arranged in a horizontal plane integrally with the rotation of the rotary main body 12.

The suction holding portions 20 are formed of a ceramic porous material in a disk shape, and are embedded in recesses (not shown) of the table main body portion 19 in a state of five (reference numerals 20a, 20b, 20c, 20d, 20e). The five planar suction holding portions shown below) are provided. In the case of the illustrated embodiment, the five planar suction holding portions 20 (20a to 20e) have a predetermined phase angle (72 degrees in the case of this embodiment) on a concentric circle with the rotation center of the table body portion 19. Are arranged at equal intervals. The diameter of each suction holding portion 20 has substantially the same size as the diameter of the semiconductor wafer W. Further, one ends of the five independent suction ports 18A to 18E are connected to the five suction holding portions 20 in a one-to-one relationship. That is, one end of the suction port 18A is connected to the suction holding portion 20a, one end of the suction port 18B is connected to the suction holding portion 20b, one end of the suction port 18C is connected to the suction holding portion 20c, and one end of the suction port 18D is connected to the suction holding portion 20d. One end of the suction port 18E is independently connected to the suction holding portion 20e.

Then, in each of the suction holding portions 20a to 20e, with the semiconductor wafer W mounted on the suction holding portions 20a to 20e, the suction ports 18A to 18A to the suction ports 18A to 20e are placed by the negative pressure generation source 22 which is a vacuum source via the port control means 21. When the air in 18E is evacuated, a negative pressure is created on the suction holding portions 20a to 20e, and the semiconductor wafer W can be suction-held on the suction holding portions 20a to 20e, respectively. On the contrary, when air is blown into the suction ports 18A to 18E at the time of release, the suction holding of the semiconductor wafer W can be released.

The port control means 21 removes the air in the suction ports 18A to 18E from the negative pressure generation source 22, and the negative pressure generated in the suction ports 18A to 18E, that is, the negative pressure supplied in the suction ports 18A to 18E. It has a function to turn on / off and adjust the size of negative pressure, and a function to adjust the size to blow air at the time of release. The negative pressure and the size of the air are adjusted according to the individual differences of the suction ports 18A to 18E so as not to apply more stress than necessary to the semiconductor wafer W. Further, by doing so, cracking or chipping of the semiconductor wafer W can be prevented.

The cleaning fluid supply means 23 and the drying air supply means 24 are located outside the chuck table 13 and adjacent to the chuck table 13, respectively, in a horizontal plane via a support shaft 30 having one end side attached to the rotating main body portion 12. It is arranged so that it can be rotated. Further, the cleaning fluid supply means 23 is a nozzle 23a having an outlet directed to the lower side (semiconductor wafer W side) for injecting the cleaning fluid onto the semiconductor wafers W that are adsorbed and held on the suction holding portions 20a to 20e. The drying air supply means 24 injects drying air onto the semiconductor wafers W that are suction-held on the suction holding portions 20a to 20e, respectively, and ejects the drying air toward the lower side (semiconductor wafer W side). It has a nozzle 24a with an outlet.

Each of the cleaning fluid supply means 23 and the drying air supply means 24 can reciprocate in a fan shape from the outside of the chuck table 13 through the center of the chuck table 13 with one end side, that is, the support shaft 30 as a fulcrum. .. Therefore, when the cleaning fluid supply means 23 reciprocates, when the cleaning fluid is injected from the nozzle 23a of the cleaning fluid supply means 23 toward the semiconductor wafer W, the semiconductors attracted and held on the suction holding portions 20a to 20e. The cleaning fluid hits the wafer W to clean the upper surface of the semiconductor wafer W. Further, after cleaning, when the drying air is reciprocally swirled while being injected from the nozzle 24a of the drying air supply means 24 toward the semiconductor wafer W, the semiconductor wafer W is adsorbed and held on the suction holding portions 20a to 20e. The cleaning fluid remaining on the surface can be blown off by the air to dry the semiconductor wafer W.

The shatterproof cover 25 is composed of a side cover 25a and an upper cover 25b. The side cover 25a is a cylindrical cover having an open upper surface, which is arranged so as to cover the outer peripheral side of the chuck table 13, and the lower end side is fixed to the device main body 11. The cleaning fluid supply means 23 and the drying air supply means 24 are also arranged in the side cover 25a, and both can be reciprocally swiveled in the side cover 25a. Further, the height of the side cover 25a, that is, the upper end of the side cover 25a is slightly lower than the upper surface (the surface where the suction holding portion 20 is provided) of the chuck table 13 (lower side), and the semiconductor wafer W is sucked and held. It is set so as not to interfere with the work of transporting / carrying out onto the unit 20.

The upper cover 25b is a cap-shaped cover whose upper surface is closed and whose lower surface is open so as to face the side cover 25a. Further, the inner diameter of the upper cover 25b is formed to be slightly larger than the outer diameter of the side cover 25a, and is arranged so as to be vertically movable substantially directly above the side cover 25a. Then, the upper cover 25b is lowered when the spinner cleaning device 10 cleans and dries the semiconductor wafer W, and the upper end of the side cover 25a is penetrated into the upper cover 25b from the lower surface opening of the upper cover 25b to the side. The upper surface opening of the portion cover 25a is closed.

Therefore, when the upper cover 25b closes the upper opening of the side cover 25a, the inside of the shatterproof cover 25 becomes a substantially sealed space, and the chuck table 13 and the cleaning fluid are supplied into the closed space. The means 23 and the drying air supply means 24 are arranged, and by performing cleaning and drying in this enclosed space, it is possible to prevent the cleaning fluid and the like from scattering to the surroundings.

Next, the operation of the spinner cleaning device 10 configured in this way will be described. First, the upper cover 25b is arranged at the raised position to open the upper surface opening of the side cover 25a. Further, in a state where the upper surface opening of the side cover 25a is open, the ground semiconductor wafer W is sent to the spinner cleaning device 10 by a transfer device (not shown), and the suction holding portions 20a to the chuck table 13 are sent. Each is arranged on 20e. Note that FIGS. 1 and 3 show a state in which the ground semiconductor wafers W are arranged on the suction holding portions 20a to 20e, respectively. As shown in the figure, all the semiconductor wafers W here are set so that the orientation flat 26 is arranged on the outer peripheral side of the chuck table 13.

Next, the negative pressure generation source 22 is driven, the air in the suction ports 18A to 18E is sucked through the port control means 21, and the suction of the air generates a negative pressure on the suction holding portions 20a to 20e. The semiconductor wafers W are suction-held on the suction-holding portions 20a to 20e, respectively. In this case, the port control means 21 adjusts the magnitude of the negative pressure according to the individual differences of the suction ports 18A to 18E.

Subsequently, the upper cover 25b is lowered to close the shatterproof cover 25. When the shatterproof cover 25 is closed, the motor 16 is driven to rotate the chuck table 13 together with the rotating main body 12 in a horizontal plane. Further, at the same time as this rotation, the cleaning fluid supply means 23 is ejected from the outside of the chuck table 13 to the chuck table 13 while injecting the cleaning fluid from the nozzle 23a of the cleaning fluid supply means 23 toward the semiconductor wafer W on the chuck table 13. It is reciprocally swiveled in a fan shape through the center. Reference numeral 27 in FIG. 3 indicates a swirling movement locus of the cleaning fluid supply means 23. By spraying the cleaning fluid and the rotational centrifugal force of the chuck table 13, contamination and the like adhering to each semiconductor wafer W are removed, and cleaning is completed.

After cleaning is completed, while the chuck table 13 is rotating, drying air is injected onto the chuck table 13 from the nozzle 24a of the drying air supply means 24 instead of the cleaning fluid supply means 23. While, the drying air supply means 24 is reciprocally swiveled from the outside of the chuck table 13 through the center of the chuck table 13 in a fan shape. Reference numeral 28 in FIG. 3 indicates a swirling movement locus of the drying air supply means 24. By blowing the drying air and the rotational centrifugal force of the chuck table 13, the cleaning fluid and the like remaining on the semiconductor wafer W are blown off and dried.

In this drying process, in the case of the illustrated embodiment, the olifra 26 is arranged on the outer peripheral side of the chuck table 13 in each semiconductor wafer W, and the centrifugal force generated when the chuck table 13 rotates and the olifra 26 do not face each other at right angles. Therefore, the cleaning fluid at the step portion between the orientation flat 26 and the suction holding portions 20a to 20e also flows toward the outer peripheral side of the chuck table 13.

That is, when a plurality of semiconductor wafers W are arranged on the chuck table 13 with the ori-fla 26 facing the center, that is, when the ori-fla 26 is arranged so as to face the centrifugal force of the chuck table 13 at right angles, the chuck is chucked. When the table 13 rotates and the cleaning fluid is brought closer to the outer peripheral side, the cleaning fluid at the step portion between the olifra 26 and the suction holding portions 20a to 20e hits the side surface of the olifra 26 at right angles and flows. It loses its place and tends to remain on the step, making it difficult to cut. However, if the Orifla 26 is arranged so as to face the outer peripheral side instead of facing the center, the stepped portion has an inclination with respect to the direction of the centrifugal force and is arranged so as to face the outer peripheral side of the chuck table 13. Therefore, the cleaning fluid that hits the side surface of the ori-fla 26 is flowed toward the outer peripheral side of the chuck table 13 along the side surface of the ori-fla 26. As a result, the cleaning fluid on the chuck table 13 can be satisfactorily cut, including the cleaning fluid at the step portion between the orientation flat 26 and the suction holding portions 20a to 20e.

When the drying process by the drying air supply means 24 is completed, the driving of the motor 16 is stopped and the rotation of the chuck table 13 is also stopped. Next, the suction of air to the suction ports 18A to 18E by the negative pressure generation source 22 is released, and air is blown into the suction ports 18A to 18E from the port control means 21 side to release the suction holding of the semiconductor wafer W. .. That is, the semiconductor wafer W is released.

Next, the upper cover 25b is moved to the ascending position to open the shatterproof cover 25. Then, each semiconductor wafer W that has been washed and dried is adsorbed and held by a transfer device (not shown) and transferred to the next step. This completes a series of washing and drying processes.

The above description has described the case where the semiconductor wafers W are arranged on all of the five suction holding portions 20a to 20e on the chuck table 13 and the cleaning and drying operations are performed. However, depending on the production plan or the like, the semiconductor wafer W is not placed on all of the five suction holding portions 20a to 20e, and the semiconductor wafer W is placed on three of the suction holding portions 20a, 20c, and 20d for cleaning. And may be dried. In this case, the port control means 21 closes the intake ports 18b and 18e and opens the three intake ports 18a, 18c and 18d for processing. In this way, the suction holding portions 20b and 20e are separated from the negative pressure generation source 22, and only the suction holding portions 20a, 20c and 20d can be connected to the negative pressure generation source 22 for processing. That is, since the suction ports 18A to 18E for applying negative pressure to the suction holding portions 20a to 20e of the chuck table 13 are independent of each other, the semiconductor wafers W are arranged on all the suction holding portions 20a to 20e. The semiconductor wafer W can be placed only on the required suction holding portions 20a to 20e for suction / release without performing treatments such as cleaning and drying.

In the above embodiment, the case where the five suction holding portions 20a to 20e are provided on the chuck table 13 has been described, but the number is not limited to five, and two or more or a plurality of the suction holding portions 20a to 20e are provided. It's okay.

Further, in the case of the above embodiment, the case where the intake ports 18A to 18E are independent of each other has been described as the best embodiment, but the intake ports 18A to 18E are not independent of each other, for example, FIGS. 5 and 6. The spinner cleaning device 100 having a structure as shown in the above may be used.

The spinner cleaning device 100 shown in FIGS. 5 and 6 has a plurality of (five in the illustrated example) suction holding portions 102 having a surface shape for individually sucking and holding semiconductor wafers (not shown) on a rotating chuck table 101. In addition to being provided, the cleaning fluid supply means 103 and the drying air supply means 104 are arranged on the outside of the chuck table 101 adjacent to the chuck table 101.

In the case of this example shown in the figure, the five planar suction holding portions 102 are arranged at equal intervals on a concentric circle with the rotation center of the chuck table 101 with a predetermined phase angle (72 degrees in the case of this embodiment). ing.

In this spinner cleaning device 100, there is only one suction port 105 connecting the suction holding portion 102 of the chuck table 101 and the negative pressure generation source (vacuum source) (not shown), and the suction ports 105 to 5 thereof. The structure is such that the branch suction port 105a of the book is branched, and each of the five branch suction ports 105a is connected to the corresponding suction holding portion 102.

Then, when a semiconductor wafer is placed on each suction holding unit 102 and then the air in the suction port 105 is sucked by the negative pressure generation source to generate a negative pressure in each suction holding unit 102, each suction holding unit 102 is generated. Each of the semiconductor wafers arranged on the 102 is sucked (sucked and held) by each suction holding portion 102. Further, while rotating the chuck table 101 while sucking and holding the semiconductor wafer, the cleaning fluid supply means 103 is passed through the center of the chuck table 101 from the outside of the chuck table 101 while injecting the cleaning fluid toward the semiconductor wafer. The semiconductor wafer can be washed by reciprocating in a fan shape.

Further, after cleaning, while the chuck table 101 is rotating, the drying air supply means 104 is injected from the outside of the chuck table 101 to the center of the chuck table 101 while injecting drying air toward the semiconductor wafer W. By reciprocating in a fan shape through the wafer, the cleaning fluid remaining on the semiconductor wafer can be blown off by air to dry the semiconductor wafer. Further, when the negative pressure on each suction holding portion 102 due to the negative pressure generation source is eliminated after the cleaning and drying treatment is completed, the suction of each suction holding portion 102 to the semiconductor wafer is released, and the semiconductor wafer can be released. can.

Therefore, even in the spinner cleaning apparatus 100 shown in FIGS. 5 and 6, semiconductor wafers are arranged and suction-held on a plurality of suction-holding portions 102 provided on one rotating chuck table 101, and these suction-holding portions are held. It is possible to simultaneously perform the cleaning process of the plurality of semiconductor wafers. As a result, workability can be improved.

It should be noted that the present invention can be modified in various ways as long as it does not deviate from the spirit of the present invention, and it is natural that the present invention extends to the modified ones.

10 Spinner cleaning device 11 Device body 12 Rotating body 13 Chuck table 14 Pulley 15 Rotary joint 15a External case 16 Motor 17 Transmission belt 18A-18E Suction port 18a-18e Intake port 19 Table body 20 (20a-20e) Suction holding part 21 Port control means 22 Negative pressure generation source (vacuum source)
23 Cleaning fluid supply means 23a Nozzle 24 Drying air supply means 24a Nozzle 25 Scatter prevention cover 25a Side cover 25b Top cover 26 Orifla 27 Swirling movement locus of cleaning fluid supply means 23 Swirling movement of drying air supply means 24 Trajectory 30 Support shaft 31 Screw W Semiconductor wafer 100 Spinner cleaning device 101 Chuck table 102 Suction holding unit 103 Cleaning fluid supply means 104 Drying air supply means 105 Suction port 105a Branch suction port

Claims (6)

A spinner cleaning device that cleans semiconductor wafers.
A chuck table having a rotating table main body portion and a plurality of suction holding portions provided on a concentric circle with the table main body portion at substantially equal intervals with predetermined phase angles, each of which can individually attract and hold the semiconductor wafer. ,
Negative pressure generation source and
A plurality of suction ports provided corresponding to the suction holding portions and individually applying the negative pressure generated by the negative pressure generation source to the suction holding portions.
A cleaning fluid supply means having a nozzle for injecting a cleaning fluid toward the semiconductor wafer that is adsorbed and held on the suction holding portion, and a cleaning fluid supply means.
A spinner cleaning device characterized by being provided with. The spinner cleaning device according to claim 1, wherein a port control means for applying an independent negative pressure to each of the suction holding portions is provided between the negative pressure generation source and the plurality of suction ports. The spinner cleaning device according to claim 2, wherein the port control means can adjust the negative pressure applied to each suction holding portion and the air pressure applied to each suction holding portion at the time of release. .. 2. Spinner cleaning device. A cover for preventing scattering of the cleaning fluid ejected from the nozzle of the cleaning fluid supply means is provided.
The cover is composed of a cylindrical side cover arranged so as to cover the outer peripheral side portion of the chuck table, and an upper cover that covers the upper surface opening of the side cover so as to be openable and closable.
The spinner cleaning device according to claim 1, 2, 3 or 4. Claims 1, 2, and 3 are characterized in that the semiconductor wafer is sucked and held on the suction holding portion so that the centrifugal force generated when the chuck table rotates and the orientation flat of the semiconductor wafer do not face each other at right angles. The spinner cleaning device according to 4 or 5.

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