JP2021138082A - 3次元プリンタ及びこれを用いた造形方法 - Google Patents
3次元プリンタ及びこれを用いた造形方法 Download PDFInfo
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- JP2021138082A JP2021138082A JP2020038836A JP2020038836A JP2021138082A JP 2021138082 A JP2021138082 A JP 2021138082A JP 2020038836 A JP2020038836 A JP 2020038836A JP 2020038836 A JP2020038836 A JP 2020038836A JP 2021138082 A JP2021138082 A JP 2021138082A
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- voltage
- heating plate
- dimensional printer
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- temperature
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- 238000007493 shaping process Methods 0.000 title abstract 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000155 melt Substances 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000020169 heat generation Effects 0.000 claims description 7
- 230000008018 melting Effects 0.000 description 34
- 238000002844 melting Methods 0.000 description 34
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 5
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
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- 229920002530 polyetherether ketone Polymers 0.000 description 5
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- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
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- 238000009434 installation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
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- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
Description
2 通路
10 ホットエンド
11 供給部
111 供給口
12 断熱部
121 開口部
13 融解部
131 開口部
14 吐出部
141 吐出口
15 加熱板
150 リード
151 絶縁基板
152 発熱抵抗体(発熱抵抗体層)
153 電極
153c 中間端子
154 シール材(保護層)
155 絶縁保護板
16 温度調整部
21 電源
22 シャント抵抗
C 変換装置
C1 AC/DCコンバータ
C2 平滑コンデンサ
C3 DC/ACインバータ
Claims (4)
- 絶縁基板及び該絶縁基板上に形成された発熱抵抗体層を有する加熱板により造形材料を加熱し融解して吐出するホットエンドと、
前記加熱板を発熱するために電圧を印加する電圧印加手段と、を備えた3次元プリンタであって、
前記電圧印加手段は、前記発熱抵抗体層に極性交番電圧を印加することを特徴とする3次元プリンタ。 - 前記加熱板は、前記発熱抵抗体層を覆う絶縁保護板を有することを特徴とする請求項1に記載の3次元プリンタ。
- 前記電圧印加手段は、前記極性交番電圧を印加することで前記加熱板を400℃以上に発熱できることを特徴とする請求項1又は2に記載の3次元プリンタ。
- 請求項1〜3のいずれかに記載の3次元プリンタを用い、前記造形材料として400℃以上に加熱融解される材料を用いて立体造形物を造形することを特徴とする造形方法。
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JP2020038836A JP6937051B2 (ja) | 2020-03-06 | 2020-03-06 | 3次元プリンタ及びこれを用いた造形方法 |
JP2021135633A JP2021185037A (ja) | 2020-03-06 | 2021-08-23 | 加熱板 |
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JP2020038836A JP6937051B2 (ja) | 2020-03-06 | 2020-03-06 | 3次元プリンタ及びこれを用いた造形方法 |
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JP2021135633A Division JP2021185037A (ja) | 2020-03-06 | 2021-08-23 | 加熱板 |
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JP2021138082A true JP2021138082A (ja) | 2021-09-16 |
JP6937051B2 JP6937051B2 (ja) | 2021-09-22 |
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JP2020038836A Active JP6937051B2 (ja) | 2020-03-06 | 2020-03-06 | 3次元プリンタ及びこれを用いた造形方法 |
JP2021135633A Pending JP2021185037A (ja) | 2020-03-06 | 2021-08-23 | 加熱板 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150136763A (ko) * | 2014-05-28 | 2015-12-08 | 국립대학법인 울산과학기술대학교 산학협력단 | 전기수력학적현상을 이용하는 3d 프린팅 장치 및 그를 이용한 프린팅 방법 |
JP2019014269A (ja) * | 2015-05-19 | 2019-01-31 | 谷口 秀夫 | 造形材料吐出ヘッド、造形材料吐出ヘッドを備えた3次元プリンタ、造形材料吐出ヘッドの流路構造体、および造形材料吐出ヘッドの流路の形成方法 |
JP2019123241A (ja) * | 2013-07-17 | 2019-07-25 | マークフォージド インコーポレイテッド | 繊維強化による積層造形用装置 |
JP2020023146A (ja) * | 2018-07-27 | 2020-02-13 | 谷口 秀夫 | 3次元造形装置用の造形材料のホットエンド |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57210588A (en) * | 1982-04-23 | 1982-12-24 | Kyocera Corp | Heating element |
JPS6391194U (ja) * | 1986-12-03 | 1988-06-13 | ||
JP2586180B2 (ja) * | 1990-05-10 | 1997-02-26 | 東芝機器株式会社 | 面状発熱体 |
JPH10238795A (ja) * | 1997-02-21 | 1998-09-08 | Daiken Trade & Ind Co Ltd | 暖房床用ヒータ埋設パネルの製造方法 |
US6519835B1 (en) * | 2000-08-18 | 2003-02-18 | Watlow Polymer Technologies | Method of formable thermoplastic laminate heated element assembly |
JP2004022486A (ja) * | 2002-06-20 | 2004-01-22 | Canon Inc | 加熱体、加熱装置および画像形成装置 |
JP2009245729A (ja) * | 2008-03-31 | 2009-10-22 | Konica Minolta Business Technologies Inc | 面状ヒータ並びにそれを用いた定着装置、静電潜像担持体及び画像形成装置 |
JP5430997B2 (ja) * | 2009-03-30 | 2014-03-05 | 太平洋セメント株式会社 | セラミックヒータ |
JP2012045716A (ja) * | 2010-08-24 | 2012-03-08 | Seiko Epson Corp | 液体噴射ヘッド |
US10703044B2 (en) * | 2017-07-27 | 2020-07-07 | Robert Bosch Tool Corporation | Removable build plate with evenly heated build surface of 3D printer |
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2020
- 2020-03-06 JP JP2020038836A patent/JP6937051B2/ja active Active
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019123241A (ja) * | 2013-07-17 | 2019-07-25 | マークフォージド インコーポレイテッド | 繊維強化による積層造形用装置 |
KR20150136763A (ko) * | 2014-05-28 | 2015-12-08 | 국립대학법인 울산과학기술대학교 산학협력단 | 전기수력학적현상을 이용하는 3d 프린팅 장치 및 그를 이용한 프린팅 방법 |
JP2019014269A (ja) * | 2015-05-19 | 2019-01-31 | 谷口 秀夫 | 造形材料吐出ヘッド、造形材料吐出ヘッドを備えた3次元プリンタ、造形材料吐出ヘッドの流路構造体、および造形材料吐出ヘッドの流路の形成方法 |
JP2020023146A (ja) * | 2018-07-27 | 2020-02-13 | 谷口 秀夫 | 3次元造形装置用の造形材料のホットエンド |
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JP6937051B2 (ja) | 2021-09-22 |
JP2021185037A (ja) | 2021-12-09 |
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