JP2021136346A - 半導体記憶装置およびその製造方法 - Google Patents
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
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Abstract
【解決手段】本実施形態による半導体記憶装置は、不純物を含む第1半導体層を含む。積層体が第1半導体層の上方に、絶縁層と導電層とを交互に積層して構成される。半導体ボディは、積層体を積層体の積層方向に貫通し、第1半導体層に達し、第1半導体層側の下部領域と、下部領域の上方に位置する上部領域とを有する。電荷蓄積部は、半導体ボディと導電層との間に設けられている。半導体ボディの下部領域の不純物濃度は、該第1半導体層の不純物濃度より高い。
【選択図】図3B
Description
図1は、第1実施形態のメモリセルアレイ1の模式斜視図である。図2は、メモリセルアレイ1の模式断面図である。
図4〜図20は、第1実施形態による半導体記憶装置の製造方法の一例を示す断面図である。尚、図4〜図20では、便宜的に、1つの柱状部CL、1つの絶縁部160および1つの配線部170を並べて示す。実際には、基板10の上方から見た平面レイアウトにおいて、千鳥状に配置された複数の柱状部CLの両側に、絶縁部160または配線部170が設けられている。
Claims (8)
- 不純物を含む第1半導体層と、
前記第1半導体層の上方に、絶縁層と導電層とを交互に積層して構成された積層体と、
前記積層体を前記積層体の積層方向に貫通し、前記第1半導体層に達し、前記第1半導体層側の下部領域と、前記下部領域の上方に位置する上部領域とを有する半導体ボディと、
前記半導体ボディと前記導電層との間に設けられた電荷蓄積部とを備え、
前記半導体ボディの前記下部領域の不純物濃度は、該第1半導体層の不純物濃度より高い、半導体記憶装置。 - 前記下部領域の不純物濃度は、前記半導体ボディの前記上部領域の不純物濃度より高い、請求項1に記載の半導体記憶装置。
- 前記上部領域は、n不純物およびp型不純物の両方を含む、請求項1または請求項2に記載の半導体記憶装置。
- 前記積層方向に対して略垂直方向に前記第1半導体層と前記下部領域とを接続する接続部をさらに備えている、請求項1から請求項3のいずれか一項に記載の半導体記憶装置。
- 前記接続部の不純物濃度は、前記下部領域の不純物濃度より低く、前記第1半導体層の不純物濃度より高い、請求項4に記載の半導体記憶装置。
- 不純物を含む第1半導体層と、
前記第1半導体層の上方に、絶縁層と導電層とを交互に積層して構成された積層体と、
前記積層体を前記積層体の積層方向に貫通し、前記第1半導体層に達し、前記第1半導体層側の下部領域と、前記下部領域の上方に位置する上部領域とを有する半導体ボディと、
前記半導体ボディと前記導電層との間に設けられた電荷蓄積部とを備え、
前記半導体ボディの前記下部領域の不純物濃度は、前記上部領域の不純物濃度よりも高く、
前記下部領域は、n型不純物層であり、
前記上部領域は、n型不純物およびp型不純物の両方を含む半導体層である、半導体記憶装置。 - 基板上方に第1犠牲層を形成し、
前記第1犠牲層の上方に、絶縁層と第2犠牲層とを交互に積層して積層体を形成し、
前記第2犠牲層を前記積層体の積層方向に貫通し、前記第1犠牲層に達するホールを形成し、
前記ホールの内面に電荷蓄積層の材料を堆積し、
前記ホールの内面の前記電荷蓄積層上に半導体ボディの材料を堆積し、
前記ホールの側面よりも該ホールの底部に厚く第1不純物含有層を形成し、
前記第1不純物含有層を熱処理し、
前記第1不純物含有層を除去することを具備した半導体記憶装置の製造方法。 - 前記第1不純物含有層の形成後、
前記第1不純物とは逆導電型の第2不純物を含む第2不純物含有層を前記ホールの側面に形成し、
前記第1および第2不純物含有層の熱処理後、前記第1および第2不純物含有層を除去することをさらに具備する、請求項7に記載の方法。
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JP2020031962A JP7504622B2 (ja) | 2020-02-27 | 2020-02-27 | 半導体記憶装置およびその製造方法 |
TW109124736A TWI779322B (zh) | 2020-02-27 | 2020-07-22 | 半導體記憶裝置 |
CN202010824945.0A CN113314538B (zh) | 2020-02-27 | 2020-08-17 | 半导体存储装置及其制造方法 |
US17/019,683 US20210273055A1 (en) | 2020-02-27 | 2020-09-14 | Semiconductor storage device and manufacturing method thereof |
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JP7504622B2 (ja) | 2024-06-24 |
US20210273055A1 (en) | 2021-09-02 |
CN113314538B (zh) | 2024-07-12 |
TWI779322B (zh) | 2022-10-01 |
CN113314538A (zh) | 2021-08-27 |
TW202133406A (zh) | 2021-09-01 |
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