JP2021097065A5 - - Google Patents
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- Publication number
- JP2021097065A5 JP2021097065A5 JP2019225271A JP2019225271A JP2021097065A5 JP 2021097065 A5 JP2021097065 A5 JP 2021097065A5 JP 2019225271 A JP2019225271 A JP 2019225271A JP 2019225271 A JP2019225271 A JP 2019225271A JP 2021097065 A5 JP2021097065 A5 JP 2021097065A5
- Authority
- JP
- Japan
- Prior art keywords
- ring assembly
- assembly according
- ring
- annular member
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 9
- 230000002093 peripheral effect Effects 0.000 claims 6
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019225271A JP7471810B2 (ja) | 2019-12-13 | 2019-12-13 | リングアセンブリ、基板支持体及び基板処理装置 |
| KR1020200168167A KR20210075855A (ko) | 2019-12-13 | 2020-12-04 | 링 어셈블리, 기판 지지체 어셈블리 및 기판 처리 장치 |
| US17/117,177 US20210183629A1 (en) | 2019-12-13 | 2020-12-10 | Ring assembly, substrate support assembly and substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019225271A JP7471810B2 (ja) | 2019-12-13 | 2019-12-13 | リングアセンブリ、基板支持体及び基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021097065A JP2021097065A (ja) | 2021-06-24 |
| JP2021097065A5 true JP2021097065A5 (enExample) | 2022-09-27 |
| JP7471810B2 JP7471810B2 (ja) | 2024-04-22 |
Family
ID=76320649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019225271A Active JP7471810B2 (ja) | 2019-12-13 | 2019-12-13 | リングアセンブリ、基板支持体及び基板処理装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20210183629A1 (enExample) |
| JP (1) | JP7471810B2 (enExample) |
| KR (1) | KR20210075855A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230016132A1 (en) * | 2021-07-15 | 2023-01-19 | Kingtek Electronics Technology Corp. | Pre-jig wafer carrier disc installation/uninstallation device and method thereof |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3121524B2 (ja) * | 1995-06-07 | 2001-01-09 | 東京エレクトロン株式会社 | エッチング装置 |
| JPH08339895A (ja) * | 1995-06-12 | 1996-12-24 | Tokyo Electron Ltd | プラズマ処理装置 |
| US6554954B2 (en) | 2001-04-03 | 2003-04-29 | Applied Materials Inc. | Conductive collar surrounding semiconductor workpiece in plasma chamber |
| JP4640922B2 (ja) | 2003-09-05 | 2011-03-02 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US7244336B2 (en) | 2003-12-17 | 2007-07-17 | Lam Research Corporation | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
| JP5255936B2 (ja) | 2008-07-18 | 2013-08-07 | 東京エレクトロン株式会社 | フォーカスリング及び基板載置台、並びにそれらを備えたプラズマ処理装置 |
| JP5602282B2 (ja) | 2013-06-06 | 2014-10-08 | 東京エレクトロン株式会社 | プラズマ処理装置およびフォーカスリングとフォーカスリング部品 |
| US20180061696A1 (en) | 2016-08-23 | 2018-03-01 | Applied Materials, Inc. | Edge ring or process kit for semiconductor process module |
| JP2018129386A (ja) | 2017-02-08 | 2018-08-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP6932070B2 (ja) | 2017-11-29 | 2021-09-08 | 東京エレクトロン株式会社 | フォーカスリング及び半導体製造装置 |
-
2019
- 2019-12-13 JP JP2019225271A patent/JP7471810B2/ja active Active
-
2020
- 2020-12-04 KR KR1020200168167A patent/KR20210075855A/ko active Pending
- 2020-12-10 US US17/117,177 patent/US20210183629A1/en not_active Abandoned
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