JP2021057525A - 基板処理方法、及び、プラズマ処理装置 - Google Patents
基板処理方法、及び、プラズマ処理装置 Download PDFInfo
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- JP2021057525A JP2021057525A JP2019181500A JP2019181500A JP2021057525A JP 2021057525 A JP2021057525 A JP 2021057525A JP 2019181500 A JP2019181500 A JP 2019181500A JP 2019181500 A JP2019181500 A JP 2019181500A JP 2021057525 A JP2021057525 A JP 2021057525A
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
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- H01J2237/334—Etching
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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Abstract
Description
この場合、方法MT1は、プラズマ処理装置1の制御部80によって実行され得る。
Claims (18)
- a)チャンバ内に基板を提供する工程と、
b)前記基板の表面に有機膜を形成する工程と、
を含み、
前記b)は、
b1)前記チャンバ内に有機化合物を含む第1のガスを供給し、前記基板に前駆体層を形成する工程と、
b2)前記チャンバ内に改質ガスを含む第2のガスを供給し、前記前駆体層及び前記第2のガスの少なくとも一方にエネルギーを供給して前記前駆体層を改質することによって、前記基板に有機膜を形成する工程と、
を含む、
基板処理方法。 - 前記b2)において、前記第2のガスのプラズマを生成することによって、前記基板に前記有機膜を形成する、
請求項1に記載の基板処理方法。 - 前記b1)と前記b2)とは、交互に繰り返される、
請求項1又は請求項2に記載の方法。 - c)前記b)の後に、処理ガスのプラズマを用いて、エッチング領域をエッチングする工程、
を更に含み、
前記基板は、前記エッチング領域、及び前記エッチング領域上に設けられたパターニングされた領域を有しており、前記エッチング領域は、前記パターニングされた領域の側面に囲まれている、
請求項1〜請求項3の何れか一項に記載の基板処理方法。 - d)前記c)の前に、前記パターニングされた領域の前記側面に沿った部分で前記有機膜が残されるように前記エッチング領域上に延在する前記有機膜をエッチングする工程、 を更に含む、
請求項4に記載の基板処理方法。 - e)前記b)の前に、処理ガスのプラズマを用いて、パターニングされた領域を介してエッチング領域を部分的にエッチングすることにより凹部を形成する工程と、
f)前記b)の後に、処理ガスのプラズマを用いて、前記凹部を更にエッチングする工程と、
を更に含み、
前記基板は、前記エッチング領域、及び前記エッチング領域上に設けられた前記パターニングされた領域を有しており、前記エッチング領域は、前記パターニングされた領域の側面に囲まれている、
請求項1〜請求項3の何れか一項に記載の基板処理方法。 - 前記b1)において前記凹部の表面全体に前記前駆体層を形成しない、および/または、前記b2)において前記凹部の表面全体で前記前駆体層を改質しない、
請求項6に記載の基板処理方法。 - 前記有機膜は、前記基板の厚さ方向に沿って異なる厚さを有する、
請求項6又は請求項7に記載の基板処理方法。 - g)前記b)の後に、前記有機膜をトリミングする工程と、
h)処理ガスのプラズマを用いて、パターニングされた領域を介してエッチング領域をエッチングする工程と、
を更に含み、
前記基板は、前記エッチング領域、及び前記エッチング領域上に設けられた前記パターニングされた領域を有しており、
前記エッチング領域は、前記パターニングされた領域の側面に囲まれており、
前記b)において、前記有機膜は、前記側面に前記基板の厚さ方向に沿って異なる厚さを有するように形成される、
請求項1〜請求項3の何れか一項に記載の基板処理方法。 - i)前記b)の前に、前記側面の全体にコンフォーマルな有機膜を形成する工程を更に含む、
請求項9に記載の基板処理方法。 - 前記第1のガスは、エポキシド、カルボン酸、カルボン酸ハロゲン化物、無水カルボン酸、イソシアネート及びフェノール類の群から選択される少なくとも一種の有機化合物を含む、
請求項1〜請求項10の何れか一項に記載の基板処理方法。 - 前記第2のガスは、NH結合を有する無機化合物ガス、不活性ガス、N2及びH2の混合ガス、H2Oガス並びにH2及びO2の混合ガスの群から選択される少なくとも一種の改質ガスを含む、
請求項1〜請求項11の何れか一項に記載の基板処理方法。 - 前記第1のガスがカルボン酸、カルボン酸ハロゲン化物及びイソシアネートの群から選択される少なくとも一種の有機化合物を含む場合、前記第2のガスは、NH結合を有する無機化合物ガス、不活性ガス、N2及びH2の混合ガス、H2Oガス並びにH2及びO2の混合ガスの群から選択される少なくとも一種の改質ガスを含む、
請求項1〜請求項12の何れか一項に記載の基板処理方法。 - 前記第1のガスがエポキシド、無水カルボン酸及びフェノール類の群から選択される少なくとも一種の有機化合物を含む場合、前記第2のガスは、NH結合を有する無機化合物ガス、不活性ガス並びにN2及びH2の混合ガスの群から選択される少なくとも一種の改質ガスを含む、
請求項1〜請求項9の何れか一項に記載の基板処理方法。 - 前記NH結合を有する無機化合物ガスは、N2H2、N2H4及びNH3の群から選択される少なくとも一種である、請求項12〜請求項14の何れか一項に記載の基板処理方法。
- 前記エッチング領域は、シリコン含有膜を含む、
請求項4〜請求項7の何れか一項に記載の基板処理方法。 - 前記有機膜を形成する前記工程及びエッチングする前記工程を、減圧雰囲気を維持して同一チャンバ内(in-situ)または同一システム内(in-system)で実行する、請求項4〜請求項15の何れか一項に記載の基板処理方法。
- チャンバと、
基板が収容される前記チャンバの内部空間に高周波を供給するように構成される高周波電源と、
前記内部空間に第1のガス及び第2のガスを供給するように構成されるガスソース群と、
前記高周波電源及び前記ガスソース群を制御するように構成される制御部と、
を備え、
前記第1のガスは、有機化合物を含み、
前記第2のガスは、改質ガスを含み、
前記制御部は、前記基板が前記内部空間に収容された状態において、
前記チャンバ内に第1のガスを供給し、前記基板に前駆体層を形成し、
前記チャンバ内に第2のガスを供給し、前記前駆体層及び前記第2のガスの少なくとも一方にエネルギーを供給して前記前駆体層を改質することによって、前記基板に有機膜を形成するように、
前記高周波電源及び前記ガスソース群を制御するように構成される、
プラズマ処理装置。
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