JP2021055113A5 - - Google Patents

Download PDF

Info

Publication number
JP2021055113A5
JP2021055113A5 JP2020218278A JP2020218278A JP2021055113A5 JP 2021055113 A5 JP2021055113 A5 JP 2021055113A5 JP 2020218278 A JP2020218278 A JP 2020218278A JP 2020218278 A JP2020218278 A JP 2020218278A JP 2021055113 A5 JP2021055113 A5 JP 2021055113A5
Authority
JP
Japan
Prior art keywords
resin
electronic component
electromagnetic wave
wave shielding
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020218278A
Other languages
Japanese (ja)
Other versions
JP2021055113A (en
JP7371613B2 (en
Filing date
Publication date
Priority claimed from JP2019101328A external-priority patent/JP7236326B2/en
Application filed filed Critical
Priority to JP2020218278A priority Critical patent/JP7371613B2/en
Priority claimed from JP2020218278A external-priority patent/JP7371613B2/en
Publication of JP2021055113A publication Critical patent/JP2021055113A/en
Publication of JP2021055113A5 publication Critical patent/JP2021055113A5/ja
Application granted granted Critical
Publication of JP7371613B2 publication Critical patent/JP7371613B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (6)

電子部品を有し、
前記電子部品は、樹脂と電磁波シールド性フィラーとを含むインサート成形用樹脂組成物により前記電子部品の表面上に形成された電磁波シールド層を含む樹脂成形物により封止されており、
前記電子部品の表面に垂直な方向における前記樹脂成形物の断面において、前記電子部品の表面に近い方の領域における２００μｍ四方当りの前記電磁波シールド性フィラーの個数Ａ（個／４０,０００μｍ２）は、前記樹脂成形物の表面に近い方の領域における２００μｍ四方当りの前記電磁波シールド性フィラーの個数Ｂ（個／４０,０００μｍ２）の１．０５倍以上であり、
前記電磁波シールド性フィラーの表面は、絶縁性材料で被覆処理されておらず、
前記電磁波シールド性フィラーの少なくとも一部は、前記電子部品に接触している電子部品の封止体。 Has electronic components
The electronic component is sealed with a resin molded product containing an electromagnetic wave shielding layer formed on the surface of the electronic component with a resin composition for insert molding containing a resin and an electromagnetic wave shielding filler.
In the cross section of the resin molded product in the direction perpendicular to the surface of the electronic component, the number A (piece / 40,000 μm 2 ) of the electromagnetic shielding filler per 200 μm square in the region closer to the surface of the electronic component is The number of electromagnetic shielding fillers B (pieces / 40,000 μm 2 ) per 200 μm square in the region closer to the surface of the resin molded product is 1.05 times or more .
The surface of the electromagnetic wave shielding filler is not coated with an insulating material and is not coated.
At least a part of the electromagnetic wave shielding filler is a sealant of an electronic component that is in contact with the electronic component. 前記樹脂は、熱可塑性樹脂、及び熱硬化性樹脂よりなる群から選択される少なくとも１種である請求項１に記載の電子部品の封止体。 The encapsulation body for electronic components according to claim 1, wherein the resin is at least one selected from the group consisting of a thermoplastic resin and a thermosetting resin. 前記電磁波シールド性フィラーは、導電性フィラーである請求項１または２に記載の電子部品の封止体。 The sealant for electronic components according to claim 1 or 2, wherein the electromagnetic wave shielding filler is a conductive filler. 前記電磁波シールド性フィラーは、アスペクト比が１．５以上である請求項１～３のいずれかに記載の電子部品の封止体。 The sealant for electronic components according to any one of claims 1 to 3, wherein the electromagnetic wave shielding filler has an aspect ratio of 1.5 or more. 前記熱可塑性樹脂は、ポリエステル系樹脂、ポリアミド系樹脂、ポリオレフィン系樹脂、ポリカーボネート系樹脂、及びポリウレタン系樹脂よりなる群から選択される少なくとも１種である請求項２に記載の電子部品の封止体。 The encapsulant for an electronic component according to claim 2, wherein the thermoplastic resin is at least one selected from the group consisting of polyester-based resin, polyamide-based resin, polyolefin-based resin, polycarbonate-based resin, and polyurethane-based resin. .. 前記熱硬化性樹脂は、エポキシ系樹脂、フェノール系樹脂、不飽和ポリエステル系樹脂、ジアリルフタレート系樹脂、ウレタン（メタ）アクリレート系樹脂、及びポリイミド系樹脂よりなる群から選択される少なくとも１種である請求項２に記載の電子部品の封止体。 The thermosetting resin is at least one selected from the group consisting of epoxy resins, phenol resins, unsaturated polyester resins, diallyl phthalate resins, urethane (meth) acrylate resins, and polyimide resins. The encapsulation body for electronic parts according to claim 2.
JP2020218278A 2019-05-30 2020-12-28 Encapsulated body for electronic components Active JP7371613B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020218278A JP7371613B2 (en) 2019-05-30 2020-12-28 Encapsulated body for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019101328A JP7236326B2 (en) 2019-05-30 2019-05-30 Electronic component sealing body and method for manufacturing electronic component sealing body
JP2020218278A JP7371613B2 (en) 2019-05-30 2020-12-28 Encapsulated body for electronic components

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019101328A Division JP7236326B2 (en) 2019-05-30 2019-05-30 Electronic component sealing body and method for manufacturing electronic component sealing body

Publications (3)

Publication Number Publication Date
JP2021055113A JP2021055113A (en) 2021-04-08
JP2021055113A5 true JP2021055113A5 (en) 2022-05-13
JP7371613B2 JP7371613B2 (en) 2023-10-31

Family

ID=88509956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020218278A Active JP7371613B2 (en) 2019-05-30 2020-12-28 Encapsulated body for electronic components

Country Status (1)

Country Link
JP (1) JP7371613B2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237352A (en) 2000-02-25 2001-08-31 Sony Corp Semiconductor package, heat generating part and its heat radiating structure
JP2002324877A (en) 2001-04-25 2002-11-08 Mitsui Chemicals Inc Semiconductor element
JP3916889B2 (en) 2001-06-08 2007-05-23 ソニー株式会社 Semiconductor sealing resin composition and semiconductor device using the same
JP4651004B2 (en) 2004-12-07 2011-03-16 戸田工業株式会社 Spherical sintered ferrite particles, resin composition for semiconductor encapsulation using the same, and semiconductor device obtained using the same
JP2007287937A (en) 2006-04-17 2007-11-01 Kyocera Chemical Corp Resin-sealed semiconductor device and its manufacturing method

Similar Documents

Publication Publication Date Title
US5926696A (en) Ball grid array plastic package
US10615128B2 (en) Systems and methods for electromagnetic interference shielding
JP6169914B2 (en) Anisotropic conductive film manufacturing method, anisotropic conductive film, and connection structure
US11923319B2 (en) Semiconductor package including sheilding cover that covers molded body
JP2017055044A (en) Lead frame
KR20150035251A (en) External connection terminal and Semi-conductor package having external connection terminal and Methods thereof
JP2013207115A (en) Connection structure and manufacturing method of the same, electronic component and manufacturing method of the same, connection method of electronic component
JP2008270469A (en) Power module and its manufacturing method
JP2023181334A5 (en)
JP2021055113A5 (en)
TW201306189A (en) Structure and method of electronic component embedded package
US10210988B2 (en) Coil component
TWI573502B (en) Substrate structure and manufacturing method thereof
JP2003318333A (en) Hybrid integrated circuit device
KR20200064869A (en) Semiconductor package and fabrication method thereof
JPH07321246A (en) Semiconductor device
US20230067595A1 (en) Package structure with antenna circuit
US20230080101A1 (en) Semiconductor package substrate, method of manufacturing the same, and semiconductor package
JP4483455B2 (en) Manufacturing method of circuit board for mounting semiconductor element
KR20070079656A (en) Printed circuit board having ultraviolet-curable coating layer and manufacturing method thereof
JPH0353509Y2 (en)
TWM532372U (en) Electro-magnetic interference shielding film with heat dissipation function
CN114650648A (en) Circuit board to which 3D-shaped electromagnetic shielding film is attached, 3D-shaped electromagnetic shielding film and 3D-shaped electromagnetic shielding film
JPH08306818A (en) Semiconductor device
KR980005236A (en) Film for manufacturing deflection member of cathode ray tube and deflection member laminated and molded