KR20070079656A - Printed circuit board having ultraviolet-curable coating layer and manufacturing method thereof - Google Patents

Abstract

A printed circuit board having an ultraviolet-curable coating layer and a manufacturing method thereof are provided to prevent warpage of a semiconductor package, by hardening a printed circuit board before the semiconductor package is manufactured. In a method for manufacturing a printed circuit board having an ultraviolet-curable coating layer, a board body(110) with the constant thickness is prepared. A copper wire layer(120) with a board pad(123) and a port pad(125) is formed on both sides of the board body. A photo solder resist layer(140) covering both planes of the board body except the board pad and the port pad is formed. An ultraviolet-curable coating layer(150) is formed on the photo solder resist layer except the board pad and the port pad.

Description

Printed circuit board having UV-curable coating layer and manufacturing method therefor {PRINTED CIRCUIT BOARD HAVING ULTRAVIOLET-CURABLE COATING LAYER AND MANUFACTURING METHOD THEREOF}

1 is a cross-sectional view illustrating a semiconductor package using a printed circuit board according to an exemplary embodiment of the present invention.

2 to 4 are diagrams showing manufacturing steps of a printed circuit board according to an embodiment of the present invention.

2 is a cross-sectional view illustrating a step of preparing a substrate body and forming a copper wiring layer and via holes;

3 is a cross-sectional view showing a step of forming a photo solder resist layer;

4 is a cross-sectional view showing a step of forming an ultraviolet curable coating layer.

Explanation of symbols on the main parts of the drawings

110: board body

120: copper wiring layer

122: upper wiring layer

123: board pad

124: lower wiring layer

125: terminal pad

130: via hole

140: photo solder resist layer

150: ultraviolet-curable coating layer

160: printed circuit board

170: semiconductor chip

172: chip pad

181: adhesive layer

183: bonding wire

185 resin molding portion

187: solder ball

200: semiconductor package

The present invention relates to a package substrate and a manufacturing method thereof, and more particularly, to a printed circuit board having a UV curable coating layer having flexibility (flexibility) and a manufacturing method thereof.

In recent years, as the size of electronic portable devices has become smaller, semiconductor packages mounted in electronic portable devices have become increasingly smaller, thinner, and lighter. On the other hand, the capacity of the semiconductor chip mounted in the semiconductor package is increasing. Accordingly, in the past, a single chip package in which a semiconductor chip having one function is mounted has been manufactured, but recently, a multi chip package in which two or more semiconductor chips are mounted in one package; MCP) is being manufactured.

Multi-chip package technology is a semiconductor packaging technology that can be reduced in size by mounting two or more semiconductor chips on a package substrate to form a single package, and is a hybrid type in which the same type of semiconductor chips are mounted or other types of semiconductor chips are mounted. The technology is developing in various directions such as hybrid type.

In this case, a printed circuit board may be used as the package substrate. The printed circuit board is advantageous in terms of mounting density on a mother board because the printed circuit board can provide the entire surface opposite to the surface on which the semiconductor chip is bonded to the formation region of the solder balls.

Accordingly, the printed circuit board according to the prior art is highly integrated to be used in a multi-chip package in accordance with the demand for high integration and multifunction of the semiconductor package, thereby reel type (reel) to reduce the manufacturing cost of the rising printed circuit board type).

However, since a reel type printed circuit board is manufactured with flexibility, warpage is generated in a semiconductor package manufactured using the reel type printed circuit board.

Accordingly, an object of the present invention is to provide a printed circuit board having an ultraviolet curable coating layer capable of preventing warpage from occurring in a semiconductor package and a method of manufacturing the same.

In order to achieve the above object, the present invention provides a method of manufacturing a printed circuit board having an ultraviolet curable coating layer of the following configuration.

The method of manufacturing a printed circuit board according to the present invention includes the steps of (a) preparing a substrate body having a predetermined thickness, (b) forming a copper wiring layer having a substrate pad and a terminal pad on both sides of the substrate body; (c) forming a photo solder resist layer covering both sides of the substrate body except for the substrate pad and the terminal pad, and (d) forming an ultraviolet curable coating layer on the photo solder resist layer except for the substrate pad and the terminal pad. Include.

In the method of manufacturing a printed circuit board according to the present invention, step (d) includes (d1) applying a UV curable material on a photo solder resist layer including a substrate pad and a terminal pad, and (d2) an ultraviolet curable type Incompletely curing the material to form an ultraviolet curable coating layer, and (d3) exposing the substrate pad and the terminal pad from the ultraviolet curable coating layer.

The method of manufacturing a printed circuit board according to the present invention further includes forming a via hole penetrating the substrate body between the steps (b) and (c) so that the copper wiring layers on both sides of the substrate body are electrically connected.

On the other hand, the present invention provides a printed circuit board having the following configuration.

The printed circuit board according to the present invention includes a substrate body having a predetermined thickness, a copper wiring layer formed on both sides of the substrate body, and covering both surfaces of the substrate body except the substrate pad and the terminal pad. A soldering resist layer and the ultraviolet curable coating layer formed on the photo solder resist layer except a board pad and a terminal pad are included.

The printed circuit board according to the present invention further includes a via hole penetrating the substrate body such that copper wiring layers on both sides of the substrate body are electrically connected.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is a cross-sectional view illustrating a semiconductor package using a printed circuit board according to an exemplary embodiment of the present invention. 2 to 4 are diagrams illustrating manufacturing steps of a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 1, in the semiconductor package 200 using the printed circuit board 160 according to the embodiment of the present invention, at least one semiconductor chip 170 is formed on the ultraviolet curable coating layer 150 of the printed circuit board 160. It has a structure bonded to it. At this time, the printed circuit board 160, as the ultraviolet curable coating layer 150 is completely cured by ultraviolet rays, has a feature that is rigid. As described above, since the semiconductor package 200 is manufactured using the rigid printed circuit board 160, warpage may be prevented from occurring in the semiconductor package 200.

The manufacturing method of the printed circuit board 160 according to the embodiment of the present invention will be described with reference to FIGS. 2 to 4 as follows.

First, as shown in FIG. 2, the substrate body 110 is prepared and the copper wiring layer 120 and the via hole 130 are formed. The substrate body 110 is an insulating plate of a prepreg material having a predetermined thickness, and has a top surface, a bottom surface, and both side surfaces connecting the top and bottom surfaces. That is, copper foil is thermo-compressed on the upper and lower surfaces of the substrate body 110 and then the copper foil is patterned to form the copper wiring layer 120. In addition, the via hole 130 is formed by drilling a region of the substrate body 110 and then filling a metal material having good electrical conductivity.

In this case, the copper wiring layer 120 includes an upper wiring layer 122 formed on the upper surface of the substrate body 110 and a lower wiring layer 124 formed on the lower surface of the substrate body 110. The upper wiring layer 122 includes a substrate pad 123 that is formed in close proximity to a chip mounting region to be formed in a central portion of the upper surface of the substrate body 110 and electrically connected to a semiconductor chip (not shown). The lower wiring layer 124 includes a terminal pad 125 on which solder balls (not shown) are formed.

In addition, the via hole 130 is formed through the substrate body 110 to connect the upper wiring layer 122 and the lower wiring layer 124, and electrically connects the substrate pad 123 and the terminal pad 125.

Subsequently, as shown in FIG. 3, the forming of the photo solder resist layer 140 is performed. That is, a photo solder resist (PSR) is coated on the upper and lower surfaces of the substrate body 110 to a predetermined thickness so that the upper wiring layer 122 and the lower wiring layer 124 are covered. Then, the substrate pad 123 of the upper wiring layer 122 and the terminal pad 125 of the lower wiring layer 124 are patterned to expose the photo solder resist layer 140. Accordingly, the copper wiring layer 120 except for the substrate pad 123 and the terminal pad 125 is protected by the photo solder resist layer 140.

Finally, as shown in FIG. 4, the step of forming the UV curable coating layer 150 is performed.

First, the step of applying the ultraviolet curable material is carried out. That is, an ultraviolet-curable material is applied to the upper and lower surfaces of the substrate body 110 at a predetermined thickness to cover the photo solder resist layer 140 including the substrate pad 123 and the terminal pad 125. . At this time, the ultraviolet curable material may be a film type (liquid type) or liquid (liquid type), the upper and lower surfaces of the substrate body 110 to a thickness of about 5 to 50㎛ depending on the characteristics of the printed circuit board to be manufactured It can be applied to.

Subsequently, the step of forming the ultraviolet curable coating layer 150 proceeds. That is, the UV curable material applied to the upper and lower surfaces of the substrate body 110 is incompletely cured to form the ultraviolet curable coating layer 150 adhered to the upper and lower surfaces of the substrate body 110. The ultraviolet curable coating layer 150 has flexibility, but when the ultraviolet rays (ultraviolet rays) of a predetermined size or more is completely cured, the rigidity is lost and rigid.

Finally, exposing the substrate pad 123 and the terminal pad 125 is performed. That is, by patterning the UV-curable coating layer 150 to expose the substrate pad 123 and the terminal pad 125, the manufacturing process of the printed circuit board 160 according to the present embodiment is completed.

Meanwhile, in the embodiment of the present invention, only a method of manufacturing a single type printed circuit board 160 is disclosed, but a plurality of printed circuit boards 160 may be provided in a reel form manufactured by being arranged in a matrix form. have.

A method of manufacturing the semiconductor package 200 using the printed circuit board 160 having such a structure will be described with reference to FIG. 1 to completely cure the ultraviolet curable coating layer 150 of the printed circuit board 160. After stiffening 160, at least one semiconductor chip 170 is adhered to an upper surface of the printed circuit board 160. That is, the semiconductor chips 170 are adhered and stacked on the chip mounting area of the upper surface of the printed circuit board 160 via the adhesive layer 181, and the chip pads 172 and the printed circuit of each semiconductor chip 170 are bonded to each other. The substrate pad 123 of the substrate 160 is electrically connected to each other using the bonding wire 183. In addition, the upper portion of the printed circuit board 160 including the semiconductor chips 170 and the bonding wires 183 is sealed with a liquid molding resin to form a resin encapsulation portion 185, and the lower portion of the printed circuit board 160. Solder balls 187 are formed on the terminal pads 125 on the surface, respectively.

Therefore, according to the structure of the present invention, since the printed circuit board includes an ultraviolet curable coating layer, even if the printed circuit board is provided in a reel form with flexibility, as the ultraviolet curable coating layer is completely cured by ultraviolet irradiation, the printed circuit The substrate may lose its flexibility and be rigid.

Therefore, before the semiconductor package is manufactured using the flexible printed circuit board, the printed circuit board can be stiffened to prevent warpage from occurring in the completed semiconductor package.

Claims (5)

(a) preparing a substrate body having a predetermined thickness; (b) forming a copper wiring layer having substrate pads and terminal pads on both sides of the substrate body; (c) forming a photo solder resist layer covering both sides of the substrate body except for the substrate pad and the terminal pad; And (d) forming an ultraviolet curable coating layer on the photo solder resist layer except for the substrate pad and the terminal pad; and a method of manufacturing a printed circuit board having an ultraviolet curable coating layer. The method of claim 1, wherein step (d) (d1) applying an ultraviolet curable material on the photo solder resist layer including the substrate pad and the terminal pad; (d2) incompletely curing the ultraviolet curable material to form an ultraviolet curable coating layer; And (d3) exposing the substrate pad and the terminal pad from the ultraviolet curable coating layer; and a method of manufacturing a printed circuit board having an ultraviolet curable coating layer. The method of claim 1, wherein, between step (b) and step (c), And forming a via hole through the substrate body such that the copper wiring layers on both sides of the substrate body are electrically connected to each other. A substrate body having a predetermined thickness; Copper wiring layers formed on both surfaces of the substrate body and having a substrate pad and a terminal pad; A photo solder resist layer covering both sides of the substrate body except for the substrate pad and the terminal pad; And And an ultraviolet curable coating layer formed on the photo solder resist layer except for the substrate pad and the terminal pad. The printed circuit board of claim 4, further comprising a via hole penetrating through the substrate body such that the copper wiring layers on both sides of the substrate body are electrically connected to each other.

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