JP2021027126A - Drive device, die bonder, bonding method, and semiconductor element manufacturing method - Google Patents

Abstract

To provide a drive device, a die bonder, a bonding method, and a semiconductor element manufacturing method using the same that can speed up movements in three axes of X, Y, and Z.SOLUTION: A drive device M includes an X movable unit 21a that can move in an X-axis direction, a Y movable unit 22a that can move in a Y-axis direction orthogonal to the X-axis direction, an XY movable unit 24a that can move in the X-axis direction and the Y-axis direction, and a Z drive mechanism unit 23 having a Z movable unit 23a that can move in a Z-axis direction orthogonal to the X-axis direction and the Y-axis direction. The X movable unit 21a can be driven in the X-axis direction. The Y movable unit 22a or the XY movable unit 24a can be driven in the Y-axis direction. With the driving of the Y movable unit 22a or the XY movable unit 24a in the Y-axis direction, a reaction force canceling member that moves in the Y-axis direction opposite to the driving direction is provided.SELECTED DRAWING: Figure 1

Description

The present invention relates to a drive device, a die bonder, a bonding method, and a semiconductor device manufacturing method.

A die bonder, which is a device for arranging a semiconductor chip on a printed circuit board, needs to move a collet that adsorbs the semiconductor chip by using a moving mechanism. As the moving mechanism, a drive mechanism as described in Patent Document 1 or the like is used. Can be used.

As shown in FIG. 12, this drive mechanism has a ZY drive shaft 111 that moves the bonding head up and down in the Z (height) direction and moves it in the Y-axis direction, and an X drive shaft that moves it in the X-axis direction (not shown). The ZY drive shaft 111 picks up the Y drive shaft 112 that reciprocates the bonding head 110 having the collet 103 between the pickup position P and the bonding position Q, and the die (chip) 101 from the wafer 106 or the substrate. It has a Z drive shaft 113 which is moved up and down to bond to. The X drive shaft moves the entire ZY drive shaft 111 in the X axis direction.

The ZY drive shaft 111 includes a Y drive shaft 112, a Z drive shaft 113, a connecting portion 115 that connects the Y-axis movable portion 112a of the Y drive shaft 112 and the Z-axis movable portion 113a of the Z drive shaft 113, and a bonding head. It has a rotation drive unit (not shown) that rotates 110 around the Z axis, and a support 116 that supports all of them. The support 116 in this case has an upper support 116a, a side support 116b, a lower support 116c, and a Y drive shaft support 116d between the upper support 116a and the lower support 116c.

The Y-drive shaft 112 includes an inverted U-shaped Y-axis fixing portion 112b having upper and lower fixed magnet portions 118 in which a large number of permanent magnets of N pole and S pole are alternately arranged in the Y-axis direction, and a Y-axis fixing portion. It has a linear guide 120 provided between the 112b and the Y drive shaft support 116d and capable of moving the Y-axis fixing portion 112b in the Y-axis direction. Further, the Y drive shaft 112 has at least one set of N-pole and S-pole electromagnets in the arrangement direction, and is inserted into an inverted U-shaped recess and moves in the recess, and a Y-axis movable portion 112a and Y. It has a Y-axis linear guide 121 fixed to a connecting portion 115 that supports the shaft movable portion 112a and provided between the connecting portion 115 and the lower support 116c. The linear guide 120 includes a guide rail 120a on the Y-drive shaft support side and a slider 120b on the Y-axis fixing portion 112b side. Further, the linear guide 121 includes a guide rail 121a on the lower support 116c side and a slider 121b on the Y drive shaft support 116 side.

Similar to the Y drive shaft 112, the Z drive shaft 113 has an inverted U-shaped Z shaft having left and right fixed magnet portions 122 and 122 in which a large number of electromagnets of N pole and S pole are alternately arranged in the Z axis direction. A Z-axis movable portion that has at least one set of N-pole and S-pole electromagnets in the arrangement direction of the fixing portion 113b and the Z-axis fixing portion 113b, and is inserted into an inverted U-shaped recess and moves in the recess. It has a 113a and a linear guide 123 between the Z-axis movable portion 113a and the connecting portion 115. The linear guide 123 includes a guide rail 123a on the connecting portion 115 side and a slider 123b on the Z-axis movable portion 113a side.

The Z-axis movable portion 113a is connected to the Y-axis movable portion 112a via the connecting portion 115, and when the Y-axis movable portion 112a moves in the Y-axis direction, the Z-axis movable portion 113 also moves in the Y-axis direction. Then, it is necessary to enable the Z-axis movable portion 113a (bonding head) to move up and down at a predetermined position of the movement destination.

By configuring in this way, the fixed integrated portion (Y-axis fixed portion 112b, fixed magnets 118, 118, and Y-axis linear guide 120 on the Y-axis fixed portion 112b side) that moves integrally with the Y-axis fixed portion 112b ) Is used as a counter weight so that it can be moved in the Y-axis direction to cancel and suppress vibration. That is, in Patent Document 1, the Y-axis movable portion 112a of the Y-drive shaft 112 and the Z-axis movable portion 113a of the Z drive shaft 113 are connected, and the Y-axis fixing portion 112b is used as a reaction force canceling member.

Japanese Unexamined Patent Publication No. 2013-179206

Therefore, in the one described in Patent Document 1, the Z-axis fixing portion and the Y-axis fixing portion (reaction force canceling member) are mounted on the X-axis movable portion, and the mass of the movable portion increases. Therefore, when the speed of movement of the X movable portion in the X-axis direction is increased, the vibration becomes large.

Further, in order to make the device compact, it is preferable to reduce the stroke of the reaction force canceling member. In order to reduce the stroke, the mass of the reaction force canceling member is generally made several times larger than the mass of the Y movable portion.

The present invention provides a drive device capable of speeding up movement in the three axes of X, Y, and Z, a die bonder using such a drive device, a bonding method, and further, such a bonding method. Provided is a method for manufacturing a semiconductor element to be used, and a method for manufacturing an automobile on which a semiconductor element manufactured by such a method for manufacturing a semiconductor element is mounted (mounted).

The drive device of the present invention has an X movable portion that can move in the X-axis direction, a Y movable portion that can move in the Y-axis direction that is orthogonal to the X-axis direction, and a movable portion that can move in the X-axis direction and the Y-axis direction. A drive device including an XY movable portion and a Z drive mechanism portion having a Z movable portion that can be driven in the Z axis direction orthogonal to the X axis direction and the Y axis direction, and the X movable portion is an X. Along with being able to drive in the axial direction, the Y movable part or the XY movable part can be driven in the Y axis direction, and the Y movable part or the XY movable part can be driven in the Y axis direction. Along with this, the Y movable portion or the XY movable portion is provided with a reaction force canceling member that moves in the Y-axis direction opposite to the drive direction in the Y-axis direction.

According to the drive device of the present invention, as the Y movable portion or the XY movable portion is driven in the Y axis direction, the Y axis opposite to the drive direction of the Y movable portion or the XY movable portion in the Y axis direction. Since the reaction force canceling member that moves in the direction is provided, the vibration generated when the Y movable portion or the XY movable portion moves in the Y-axis direction can be suppressed.

The XY movable portions are supported by the fixed base so as to be movable in the X-axis direction and the Y-axis direction, and the X-movable portion and the Z drive mechanism portion are supported by the XY movable portions, and the XY movable portions are supported. The movable portion moves in the X-axis direction as the X movable portion is driven in the X-axis direction, and the Y movable portion moves in the Y-axis direction as the XY movable portion is driven in the Y-axis direction. It may constitute the reaction force canceling member that moves in the Y-axis direction opposite to the driving direction of the movable portion.

With this configuration, the XY movable parts move in the X-axis direction as the X-Y movable parts are driven in the X-axis direction. Therefore, the XY movable parts are moved in the X-axis direction. There is no need to provide a drive mechanism for this. Further, since the Y movable portion constitutes the reaction force canceling member, it is not necessary to separately provide the reaction force canceling member. Further, the Y movable portion moves in the Y-axis direction as the X / Y movable portion is driven in the Y-axis direction, and it is necessary to provide a drive mechanism for driving the Y movable portion in the Y-axis direction. Absent.

The Y movable portion has first Y and second Y movable portions supported on a fixed base so as to be movable in the Y axis direction, and the X movable portion and the Z drive mechanism portion are supported by the XY movable portions. The XY movable portions move in the X-axis direction as the X-movable portion is driven in the X-axis direction, and the first Y movable portion moves in the Y-axis direction as the second Y movable portion is driven. It may constitute the reaction force canceling member that moves in the Y-axis direction opposite to the moving direction of the second Y movable portion.

With this configuration, the XY movable parts move in the X-axis direction as the X-Y movable parts are driven in the X-axis direction. Therefore, the XY movable parts are moved in the X-axis direction. There is no need to provide a drive mechanism for this. The first Y movable portion moves in the Y-axis direction as the second Y movable portion is driven in the Y-axis direction, and it is necessary to provide a drive mechanism for moving the first Y movable portion in the Y-axis direction. Absent.

The X fixed portion fixed to the fixed base and the X movable portion form an X drive motor, and the X movable portion is driven in the X axis direction without contacting the X fixed portion, and the X and Y movable parts are formed. An extension portion may be provided in the portion, and the extension portion may form the X movable portion. With such a configuration, simplification of the device configuration can be achieved.

The mass of the reaction force canceling member can be made larger than the mass of the XY movable parts, and the mass of the reaction force canceling member can be made larger than the total mass of the second Y movable part and the XY movable parts. With this configuration, the stroke of the reaction force canceling member in the Y-axis direction can be reduced, and the entire device can be made compact.

The die bonder of the present invention is a die bonder provided with the driving device, and is provided with a suction collet for sucking and holding a work in the Z movable portion.

According to the die bonder of the present invention, the bonding method according to the present invention is possible. That is, the tip is picked up by the suction collet arranged in the Z movable part at the pickup position, and at least one of the X movable part, the Y movable part, and the XY movable part is moved to move the suction collet to the bonding position. The tip can be bonded by transporting it upward and lowering the suction collet by lowering the Z movable portion at this bonding position.

The semiconductor device manufacturing method of the present invention manufactures a semiconductor device by packaging a chip bonded by the bonding method.

INDUSTRIAL APPLICABILITY According to the present invention, vibration generated when the Y movable portion or the XY movable portion moves in the Y-axis direction can be suppressed, and the device can be speeded up and is excellent in productivity.

It is a simplified overall view of the 1st drive device of this invention. It is a simplified figure which shows the Z drive mechanism of the 1st drive device of this invention. It is an overall simplified block diagram of the die bonder which can use the drive device which concerns on this invention. It is a simplified diagram which shows the bonding operation. It is a simplified drawing of a wafer. It is a simplified overall view which shows the modification of the 1st drive device of this invention. It is a simplified overall view of the 2nd drive device of this invention. It is a simplified overall view which shows the modification of the 2nd drive device of this invention. It is a simplified overall view of the 3rd drive device of this invention. It is a simplified overall view which shows the modification of the 3rd drive device of this invention. It is a block diagram which shows the manufacturing process of a semiconductor element. It is sectional drawing of the main part of the conventional drive device.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 11.

FIG. 1 shows a simplified view of a drive device (conveyor device) according to the present invention, and FIG. 3 shows a die bonder (bonding device) using this transfer device. The bonding device includes the drive device M according to the present invention, the chip supply unit 70 is arranged on the upstream side thereof, and the chip supply unit 71 is arranged on the downstream side thereof.

The chip supply unit 70 has a wafer ring holding unit 73, holds the wafer ring 14 to which the wafer sheet 15 is attached, and has an extension mechanism (not shown). Here, the extension mechanism is for applying tension to the wafer sheet 15 to increase the distance between the chips 11 attached to the wafer sheet 15. The wafer 16 is adhered to a wafer sheet (adhesive sheet 15) stretched on a metal ring (wafer ring), and the wafer 16 is divided (divided) into a large number of chips 11 by a dicing process.

Although not shown, the embodiment includes a magazine that holds a plurality of stages of the wafer ring 14 to which the wafer sheet (adhesive sheet) 15 is attached. This magazine has a plurality of wafer ring storage chambers, and can be raised and lowered by an elevator mechanism (not shown) to make all the wafer ring storage chambers correspond to storage / pull-out positions. Then, the wafer ring 14 in the wafer ring storage chamber of the magazine is supplied to the wafer ring holding portion 73 by a transfer arm or the like constituting a transfer means (not shown).

Further, the chip supply portion 71 is a substrate 12 such as a REIT frame, and the chip 11 is supplied (bonded) to an island (bonding portion) of the substrate 12. The substrate 12 is arranged on, for example, a substrate transfer conveyor (not shown), and the substrate is stored in a magazine (not shown) for storing the substrate on this conveyor. It should be noted that this magazine has a plurality of board storage chambers, and can be raised and lowered by an elevator mechanism (not shown) to make all the board storage chambers correspond to storage / pull-out positions.

That is, in the wafer ring holding portion 73, the chip 11 is picked up by the suction collet 13 attached to the drive device M according to the present invention, and the picked up chip 11 is bonded to the island of the substrate 12.

As shown in FIG. 2, the drive device M is provided with a bonding head 33 having a suction collet 13 attached to the tip thereof. Then, the bonding head 33 can be moved between the pickup position P and the bonding position Q. That is, as shown in FIG. 4, the chip 11 cut out from the wafer 16 is picked up by the collet 13 at the pickup position P and transferred (mounted) to the bonding position Q of the base material 12 such as the lead frame.

The tip 11 of the collet 13 is vacuum-sucked through a suction hole opened in the lower end surface of the collet 13, and the tip 11 is sucked on the lower end surface of the collet 13. If this vacuum suction (evacuation) is released, the tip 11 will come off from the collet 13.

Then, in the drive device M according to the present invention, which is a moving mechanism, the collet 12 rises in the arrow A direction and falls in the arrow B direction on the pickup position P, and rises in the arrow C direction on the bonding position Q. And the descent in the arrow D direction and the reciprocating movement in the arrow E and F directions between the pickup position P and the bonding position Q are possible. In the stage device, the movement of the arrows A, B, C, D, E, and F is controlled by a control means (not shown). The control means is composed of, for example, a ROM (Read Only Memory) centered on a CPU (Central Processing Unit).

By the way, a confirmation camera (not shown) for observing the semiconductor chip 11 of the supply unit 10 which is the pickup position P, and a confirmation camera (not shown) for observing the island portion of the lead frame (board 12) at the bonding position. Be prepared.

Next, a die bonding method using this die bonder will be described. First, the chip 11 to be picked up is observed with a confirmation camera arranged above the supply unit 10, the collet 13 is positioned above the chip 11 to be picked up, and then the collet 13 is indicated by an arrow B. To pick up this chip 1. After that, the collet 13 is raised as shown by the arrow A.

Next, the island portion of the lead frame 12 to be bonded is observed with a confirmation camera arranged above the bonding position, and the collet 13 is moved in the direction of arrow E to be positioned above the island portion. After that, the collet 13 is moved downward as shown by the arrow D to supply the chip 11 to the island portion. After supplying the chips to the island portion, the collet 13 is raised as shown by the arrow C and then returned to the standby position above the pickup position as shown by the arrow F.

As shown in FIG. 1, the drive device M includes an X movable portion 21a that can move in the X-axis direction, a Y movable portion 22a that can move in the Y-axis direction that is orthogonal to the X-axis direction, and the X-axis direction and It includes a Z drive mechanism unit 23 having a Z movable portion 23a movable in the Z axis direction orthogonal to the Y axis direction, and an XY movable portion 24a movable in the X axis direction and the Y axis direction.

The X movable portion 21a and the X fixed portion 21b form an X drive mechanism (X drive motor) 21. That is, the X drive motor 21 is a linear motor including an X fixing portion (X motor fixing portion) 21b as a stator and an X movable portion 21a as a mover. In this case, the stator may be an MC type in which the stator is a magnet and the mover is a coil, or the stator may be an MM type in which the stator is a coil and the mover is a magnet (magnet). The X motor fixing portion 21b is fixed to the fixing base 20. In this case, the base 20 has a base body 20a and a rising wall 20b erected from the base body 20a, and the X motor fixing portion 21b is fixed to the rising wall 20b. The X movable portion 21a includes a main body portion 21a1 and a sub portion 21a2 extending from the main body portion 21a1, and the sub portion 21a2 is fitted into an X motor fixing portion 21b having a U-shaped cross section.

The X movable portion 21a is mounted on the XY movable portion 24a via the Y guide mechanism 25. The Y guide mechanism 25 has a guide rail 25a fixed to the lower surface of the main body 21a1 of the X movable portion 21a and extending in the Y-axis direction, and a slider 25b fitted to the guide rail 25a. The XY movable portion 24a is made of a square tubular body having a magnet (not shown), and the Y movable portion 22a made of a coil is loosely fitted into the XY movable portion 24a. Therefore, the XY movable portion 24a and the Y movable portion 22a form a Y drive motor for reciprocating the XY movable portion 24a in the Y-axis direction. That is, the XY movable portion 24a becomes a mover, and the Y movable portion 22a becomes a stator. In this case, the XY movable portion 24a includes an upper wall 24a1, a lower wall 24a2, and side walls 24a3 and 24a4, and a slider 25b of the guide mechanism 25 is fixed to the upper wall 24a1.

Further, the XY movable portion 24a is slidable in the X-axis direction and the Y-axis direction to the base body 20a of the base 20 via the XY slide allowable portion 26. The XY slide allowable portion 26 can be configured by a publicly known public fluid bearing 45 (for example, an air bearing) or the like. It is necessary to set the internal X-direction dimension of the XY movable portion 24a in consideration of the X stroke.

Further, the Y movable portion 22a extends along the Y-axis direction and can move along the Y-axis direction via the second Y guide mechanism 30. As shown in FIG. 1, the Y guide mechanism 30 has a guide rail 30a fixed to the rising wall 20b of the base 20 and a slider 30b fitted to the guide rail 30a. Further, the slider 30b and the Y movable portion 22a are connected via a connecting member 31.

By the way, the XY movable portion 24a and the Y movable portion 22a form a Y drive motor, and the XY movable portion 24a can be driven in the Y-axis direction. Then, as the XY movable portion 24a is driven in the Y-axis direction, the Y movable portion 22a moves in the Y-axis direction opposite to the Y-axis direction of the XY movable portion 24a. Therefore, the Y movable portion 22a constitutes a reaction force canceling member.

A Z drive motor (Z drive mechanism unit) 23 composed of a linear motor including a Z motor fixing portion 23b as a stator and a Z movable portion 23a as a mover is attached to the XY movable portions 24a. ing. In this case, the stator may be an MC type in which the stator is a magnet and the mover is a coil, or the stator may be an MM type in which the stator is a coil and the mover is a magnet (magnet). Then, as shown in FIG. 2, the Z motor fixing portion 23b is attached (fixed) to one side wall 24a3 of the XY movable portion 24a, and the Z table 34 is continuously provided to the Z movable portion 24a. In this case, the Z table 34 is attached to the XY movable portions 24a via a guide mechanism 32 having a guide rail 32a extending in the Z-axis direction on the side wall 24a3 and a slider 32b fitted to the guide rail 32a. There is. A bonding head 33 having a suction collet 13 attached to the tip thereof is connected to the Z table 34.

In the drive device M configured as described above, the X movable portion 21a is driven in the X axis direction by the drive of the X drive motor, and the XY movable portions 24a move in the X axis direction with this drive. As a result, the collet 13 can reciprocate in the X-axis direction. Further, the collet 13 can reciprocate in the Y-axis direction by driving the XY movable portions 24a in the Y-axis direction. Further, the suction collet 13 can be reciprocated in the Z-axis direction by driving the Z drive motor 29. Therefore, the collet 13 rises in the arrow A direction and descends in the arrow B direction on the pickup position P, rises in the arrow C direction and descends in the arrow D direction on the bonding position Q, and bonds with the pickup position P. Reciprocating movement in the directions of arrows E and F with the position Q is possible.

According to the drive device M of the present invention, as the XY movable portions 24a are driven in the Y-axis direction, the Y movable portion 22a moves in the Y-axis direction opposite to the moving direction. Therefore, the Y movable portion 22a constitutes a reaction force canceling member in the Y-axis direction, and vibration generated when the Y movable portion 22a or the XY movable portion 24a moves in the Y-axis direction is suppressed. Can be done.

It is possible to suppress the vibration generated when the Y movable portion 22a or the XY movable portion 24a moves in the Y-axis direction, and the device can be speeded up and has excellent productivity.

Further, in the drive device M shown in FIG. 1, since the XY movable portion 24a moves in the X-axis direction as the X-Y movable portion 24a is driven in the X-axis direction, the XY movable portion 24a is moved. It is not necessary to provide a drive mechanism for moving in the X-axis direction. Further, since the Y movable portion 22a constitutes the reaction force canceling member, it is not necessary to separately provide the reaction force canceling member. Further, the Y movable portion 22a moves in the Y-axis direction as the XY movable portions 24a are driven in the Y-axis direction, and a drive mechanism for moving the Y movable portion 22a in the Y-axis direction is provided. There is no need to provide it.

In this case, it is preferable to increase the mass of the reaction force canceling member composed of the Y movable portion 22a by increasing the mass of the XY movable portion 24a. With this configuration, the stroke of the reaction force canceling member in the Y-axis direction can be reduced, and the entire device can be made compact.

In the one shown in FIG. 6, an extension portion 35 is provided on the upper wall 24a1 of the XY movable portion 24a, and the extension portion 35 constitutes the X movable portion 21a. That is, the Y guide mechanism 25 and the main body portion 21a1 of the X movable portion 21a in FIG. 1 are omitted, and the sub portion 21a2 of the X movable portion 21a is directly connected to the XY movable portion 24a. The configuration shown in FIG. 6 is the same as that of the drive device M shown in FIG. 1, and the same members are designated by the same reference numerals as those shown in FIG. 1 and the description thereof will be omitted. Therefore, even the drive device M shown in FIG. 6 has the same effect as that of the drive device M shown in FIG.

FIG. 7 shows a second drive device M. In this drive device M, the first and second Y movable portions 41 and 42 that can reciprocate in the Y-axis direction with respect to the fixed base 50 formed of the rising wall 50b, and X. It includes an XY movable portion 43 that can move in the X-axis direction as the movable portion 21a is driven in the X-axis direction.

The second Y movable portion 42 is composed of a square tubular body having an upper wall 42a, a lower wall 42b, a side wall 42c, and a side wall 42d, and is a magnet (not shown) like the XY movable portion 24a shown in FIG. Has. Further, a first Y movable portion 41 made of a coil is fitted into the second Y movable portion 42. Similar to the Y movable portion 22a shown in FIG. 1, the first Y movable portion 41 can move along the Y axis direction via the guide mechanism 30. The guide mechanism 30 has a guide rail 30a fixed to the fixed base 50 and extending in the Y-axis direction, and a slider 30b fitted to the guide rail 30a. Then, the slider 30b of the guide mechanism 30 and the Y movable portion 22a are connected via the connecting member 31.

Further, the second Y movable portion 42 can reciprocate in the Y-axis direction along the fixed base 50 via the guide mechanisms 51 and 51. That is, the guide mechanism 51 has a guide rail 51a extending along the Y-axis direction on the side surface of the fixed base 50 and a slider 51b fitted to the guide rail 51a, and the slider 51b is attached to the second Y movable portion 42. It is attached to a series of attachment pieces 52.

The XY movable portion 43 is composed of a member having a U-shaped cross section having an upper wall 43a, a lower wall 43b, and a side wall 43c, and does not have a magnet. Then, the second Y movable portion 42 is fitted into the XY movable portion 43 via the upper and lower guide mechanisms 54 and 55.

The upper guide mechanism 54 has a guide rail 54a arranged on the upper surface of the upper wall 42a of the second Y movable portion 42 and extending in the X-axis direction, and sliders 54b and 54b fitted to the guide rail 54a. 54b and 54b are attached to the lower surface of the upper wall 43a of the XY movable portion 43. Further, the lower guide mechanism 55 has a guide rail 55a arranged on the lower surface of the lower wall 42b of the second Y movable portion 42 and extending in the X-axis direction, and sliders 55b and 55b fitted to the guide rail 55a. , Sliders 55b and 55b are attached to the upper surface of the lower wall 43b of the XY movable portion 43.

The X movable portion 21a is attached to the XY movable portion 42 via the Y guide mechanism 25. In this case, the slider 25b of the Y guide mechanism 25 is attached to the upper surface of the upper wall 43a of the XY movable portion 43. The X movable portion 21a is composed of a main body portion 21a1 and a sub portion 21a2, and a guide rail 25a of the guide mechanism 25 is attached to the main body portion 21a1. Further, a Z drive motor (Z drive mechanism portion) 23 is attached to the side wall 43c of the XY movable portion 43.

Since the other configurations of the drive device shown in FIG. 7 are the same as those of the drive device M shown in FIG. 1, the same members are designated by the same reference numerals and the description thereof will be omitted.

In the drive device M shown in FIG. 7, the X movable portion 21a is driven along the X axis direction by the drive of the X drive motor, and the XY movable portions 43 move in the X axis direction with this drive. The collet 13 can reciprocate in the X-axis direction. Further, by driving the second Y movable portion 42 in the Y-axis direction, the XY movable portions 43 move in the Y-axis direction, and the collet 13 can reciprocate in the Y-axis direction, and is attracted by the drive of the Z drive motor 29. The collet 13 can reciprocate in the Z-axis direction. Therefore, the collet 13 rises in the arrow A direction and descends in the arrow B direction on the pickup position P, rises in the arrow C direction and descends in the arrow D direction on the bonding position Q, and bonds with the pickup position P. Reciprocating movement in the directions of arrows E and F with the position Q is possible.

Further, the first Y movable portion 41 moves in the Y-axis direction opposite to the Y-axis direction of the second movable portion 42 by driving the second Y movable portion 42 in the Y-axis direction. Therefore, in this drive device M as well, the first Y movable portion 41 constitutes a reaction force canceling member. Therefore, it is possible to suppress the vibration generated when the first Y movable portion 41 or the XY movable portion 43 moves in the Y-axis direction, and the speed of the device is increased and the productivity is excellent.

Further, with this configuration, the XY movable portion 43 moves in the X-axis direction as the X-Y movable portion 21a is driven in the X-axis direction, so that the XY movable portion 43 is X. It is not necessary to provide a drive mechanism for moving in the axial direction. Further, since the Y movable portion 41 constitutes the reaction force canceling member, it is not necessary to separately provide the reaction force canceling member. Further, the Y movable portion 41 moves in the Y axis direction as the Y movable portion 42 moves in the Y axis direction, and it is necessary to provide a drive mechanism for moving the Y movable portion 41 in the Y axis direction. There is no.

Further, it is preferable that the mass of the reaction force canceling member composed of the first Y movable portion 41 is larger than the total mass of the second Y movable portion 42 and the XY movable portions 43. With this configuration, the stroke of the reaction force canceling member in the Y-axis direction can be reduced, and the entire device can be made compact.

Next, in the device shown in FIG. 8, in the drive device M shown in FIG. 7, an extension portion 57 is provided on the upper wall 43a of the XY movable portion 43, and the extension portion 57 constitutes the X movable portion 21a. .. That is, the Y guide mechanism 25 in FIG. 8 is omitted, and the upper wall 43a is continuously provided with the extension portion 57. The extension portion 57 has a rising piece 57a erected from the upper wall 43a and a horizontal piece 57b extending from the rising piece 57a toward the fixed base 50 side, and the horizontal piece 57b is loosely fitted into the X fixing portion. It is fitted in a shape. Other configurations of the drive device M shown in FIG. 8 are the same as those of the drive device M shown in FIG. 7, and the same members are designated by the same reference numerals as those shown in FIG. 7, and the description thereof will be omitted. Therefore, the drive device M shown in FIG. 8 also has the same effect as that of the drive device M shown in FIG. 7.

In the drive device M shown in FIG. 9, in the drive device M shown in FIG. 7, the mounting piece 52 and the guide mechanism 51 are omitted, and another guide mechanism 60 is provided in the second Y movable portion 42. That is, the guide mechanism 60 is interposed between the side wall 42c of the second Y movable portion 42 and the first Y movable portion 41, and is a guide extending in the Y-axis direction on the side wall 42c corresponding surface of the first movable portion 41. It has a rail 60a and a slider 60b that fits into the guide rail 60a. The slider 60b is attached to the inner surface of the side wall 42c of the second movable portion 42. Other configurations of the drive device M shown in FIG. 9 are the same as those of the drive device M shown in FIG. 7, and the same members are designated by the same reference numerals as those shown in FIG. 7, and the description thereof will be omitted.

Therefore, also in the drive device M shown in FIG. 9, the X movable portion 21a is driven along the X axis direction by the drive of the X drive motor, and the XY movable portions 43 are driven in the X axis direction along with this drive. By moving, the collet 13 can reciprocate in the X-axis direction. Further, by driving the second Y movable portion 42 in the Y-axis direction, the XY movable portions 43 move in the Y-axis direction, and the collet 13 can reciprocate in the Y-axis direction, and is attracted by the drive of the Z drive motor 29. The collet 13 can reciprocate in the Z-axis direction.

Further, the first Y movable portion 41 moves in the Y-axis direction opposite to the Y-axis direction of the second movable portion 42 by driving the second Y movable portion 42 in the Y-axis direction. Therefore, in this drive device M as well, the first Y movable portion 41 constitutes a reaction force canceling member.

Therefore, the drive device M shown in FIG. 9 also has the same effect as that of the drive device M shown in FIG. 7.

In FIG. 9, the drive device M shown in FIG. 10 is provided with an extension portion 57 on the upper wall 43a of the XY movable portion 43, and the extension portion 57 constitutes the X movable portion 21a. Other configurations of the drive device M shown in FIG. 10 are the same as those of the drive device M shown in FIG. 9, and the same members are designated by the same reference numerals as those shown in FIG. 9 and the description thereof will be omitted. Therefore, the drive device M shown in FIG. 10 also has the same effect as that of the drive device M shown in FIG.

In this way, by using each drive device M, the chip 11 is picked up by the suction collet 13 arranged in the Z movable portion 23a at the pickup position P, and the X movable portion 21a and the Y movable portion 22a (41, 42) are picked up. ) And at least one of the XY movable parts 24a (43), the suction collet 13 is conveyed onto the bonding position Q, and the suction collet is lowered by 13 by lowering the Z movable part 23a at this bonding position Q. The chip 11 can be bonded.

In addition, the chip 11 bonded by the bonding method performed using each drive device M is packaged to form a semiconductor element (electronic component (memory, LED, FET, etc.) made by utilizing the electrical characteristics of the semiconductor). Can be manufactured. By the way, as shown in FIG. 11, the semiconductor element manufacturing process includes a wafer making process S1, a circuit forming process S2, a dicing process S3, a bonding process S4, a molding process S5, and the like.

In the wafer making step S1, the silicon ingot is sliced on a disk to make a wafer. In the circuit forming step S2, a semiconductor layer is formed on the wafer, and a plurality of electronic circuits are formed by combining the semiconductor layers. In the dicing step S3, the wafer on which the plurality of electronic circuits are formed is cut into a plurality of semiconductor chips. A wafer 16 in which a large number of elements are collectively built is diced and separated into individual semiconductor chips 11. In the bonding step S4, the semiconductor chip is bonded to the bonding position. Then, the die bonder (bonding device) according to the present invention is used for this chip bonding. In the molding step S5, the chip is packaged to manufacture a semiconductor element.

Further, the semiconductor element manufactured by this semiconductor device manufacturing method can be mounted on an automobile. In other words, the digitization of automobiles is advancing in every part, and in in-vehicle information systems such as car audio and navigation systems, vehicle body control systems such as dashboards and electric mirrors, and control fields related to driving such as engines and brakes. Various semiconductor elements are used. In addition, hybrid vehicles and electric vehicles use electricity as energy and an electric motor as a power source. For this reason, various semiconductor elements are used for controlling and monitoring motors and batteries, which are indispensable for hybrid vehicles and electric vehicles. Therefore, as the semiconductor element mounted on the automobile in this way, the semiconductor element manufactured by the semiconductor element manufacturing method according to the present invention can be used.

The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, the present invention can be used for various devices such as an assembly device, an inspection device, and a processing device other than a bonding device. Further, the drive device M is an X / Y / Z table in the embodiment, but may be an X / Y / Z / θ table.

11 Semiconductor chip 13 Collet 20 Fixed base 20a Base body 21a X Movable part 22a Y Movable part 23a Z Movable part 23 Z Drive mechanism part 24a XY Movable part 41 1st Y Movable part 42 2nd Y Movable part 43 XY Movable part 50 Fixed base P pickup position (pickup position)
Q Bonding position (bonding position)

Claims (9)

An X movable part that can move in the X-axis direction, a Y movable part that can move in the Y-axis direction that is orthogonal to the X-axis direction, and an XY movable part that can move in the X-axis direction and the Y-axis direction. A drive device including a Z drive mechanism unit having a Z movable unit that can be driven in the Z axis direction orthogonal to the X-axis direction and the Y-axis direction.
The X movable portion can be driven in the X axis direction, and the Y movable portion or the XY movable portion can be driven in the Y axis direction, and the Y movable portion or the XY movable portion can be driven. It is characterized by including a reaction force canceling member that moves in the Y-axis direction opposite to the drive direction of the Y movable portion or the XY movable portion in the Y-axis direction as the portion is driven in the Y-axis direction. Drive device. The XY movable portions are supported by the fixed base so as to be movable in the X-axis direction and the Y-axis direction, and the X-movable portion and the Z drive mechanism portion are supported by the XY movable portions. The Y movable portion moves in the X-axis direction as the X movable portion is driven in the X-axis direction, and the Y movable portion moves in the Y-axis direction as the X / Y movable portion is driven in the Y-axis direction. The driving device according to claim 1, further comprising the reaction force canceling member that moves in the Y-axis direction opposite to the moving direction of the Y movable portion. The Y movable portion has first Y and second Y movable portions supported on the fixed base so as to be movable in the Y axis direction, and the X movable portion and the Z drive mechanism portion are attached to the XY movable portions. The X / Y movable portion is supported and moves in the X-axis direction as the X-movable portion is driven in the X-axis direction, and the first Y movable portion is driven in the Y-axis direction of the second Y movable portion. The driving device according to claim 1, wherein the reaction force canceling member that moves in the Y-axis direction opposite to the moving direction of the second Y movable portion is configured. The X fixed portion fixed to the fixed base and the X movable portion form an X drive motor, and the X movable portion is driven in the X axis direction without contacting the X fixed portion, and the X. The drive device according to any one of claims 1 to 3, wherein an extension portion is provided in the Y movable portion, and the X movable portion is formed by the extension portion. The driving device according to claim 1 or 2, wherein the mass of the reaction force canceling member is made larger than the mass of the XY movable portion. The driving device according to claim 3, wherein the mass of the reaction force canceling member is made larger than the total mass of the second Y movable portion and the XY movable portions. A die bonder including the drive device according to any one of claims 1 to 6.
A die bonder characterized in that a suction collet for sucking and holding the chip as a work is arranged on the Z movable portion. The bonding method using the drive device according to any one of claims 1 to 7.
The chip is picked up by the suction collet disposed on the Z movable portion at the pickup position, and at least one of the X movable portion, the Y movable portion, and the XY movable portion is moved to obtain the said. A bonding method comprising transporting a suction collet onto a bonding position and lowering the suction collet by lowering the Z movable portion at the bonding position to bond the chips. A semiconductor device manufacturing method for manufacturing a semiconductor device by packaging a chip bonded by the bonding method according to claim 8.

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