JP2022032960A - Die bonding device and manufacturing method of semiconductor device - Google Patents

Abstract

To provide a die bonding device capable of further reducing oscillation.SOLUTION: A die bonding device comprises a driven body and a table driving the driven body. The table comprises: base; a liner motor having a first movable element and a stator which move the driven body; a first direct-acting guide provided between the base and the stator and freely moving the stator; a second direct-acting guide provided between the base and the first movable element and freely moving the first movable element; a second movable element provided so as to be fixed to the base; and a control device that controls the first and second movable elements. The control device is constructed so as to move the stator along the first direct-acting guide by the second movable element.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus provided with a reaction absorbing mechanism.

One of the semiconductor manufacturing devices is a die bonding device such as a die bonder that bonds a semiconductor chip called a die to a substrate such as a wiring board or a lead frame. In a die bonder, the die is vacuum-sucked by a bonding head, rises at high speed, moves horizontally, and descends to be mounted on a substrate.

There is a high demand for high precision and high speed of the die bonder, and in particular, there is a high demand for high speed of the bonding head, which is the heart of bonding. Generally, when the speed of a device is increased, the vibration caused by a high-speed moving object becomes large, and it becomes difficult to obtain the accuracy desired by the device due to this vibration.

As a reaction absorbing device for reducing this vibration, for example, there is one described in Japanese Patent Application Laid-Open No. 2013-179206 (Patent Document 1). In Patent Document 1, a linear motor is used as a drive shaft of a bonding head of a die bonder, and a fixed integrated portion including a fixed magnet portion is used as a counter weight so that the fixed integrated portion can be freely moved and fixed to a movable integrated portion including the bonding head. It discloses a technique for reducing vibration by moving the integrated part in synchronization with each other.

Japanese Unexamined Patent Publication No. 2013-179206

However, in a structure in which the fixed integrated portion (stator) is freely operated by the reaction of the movable integrated portion (movable element) as in the technique disclosed in Patent Document 1, it is difficult to perform fine motion control to reduce vibration.

An object of the present disclosure is to provide a die bonding apparatus capable of further reducing vibration.

The following is a brief overview of the representative ones of this disclosure.
That is, the die bonding device includes a driven body and a table for driving the driven body. The table includes a base, a linear motor having a first mover and a stator for moving the driven body, a first linear motion guide provided between the base and the stator, and a first linear motion guide for freely moving the stator. A second linear motion guide provided between the base and the first movable element to move the first movable element freely, a second movable element fixed to the base, and a first movable element and a second movable element. It is provided with a control device for controlling the above. The control device is configured to move the stator along the first linear motion guide by the second mover.

According to the die bonding device, vibration can be further reduced.

FIG. 1 is a top view of the table in the embodiment. FIG. 2 is a front view of the table of FIG. FIG. 3 is a cross-sectional view taken along the line AA of FIG. FIG. 4 is a cross-sectional view taken along the line BB of FIG. FIG. 5 is a perspective view of the table in the embodiment. FIG. 6 is a perspective view illustrating the recoil absorption operation of the table shown in FIG. FIG. 7 is a perspective view when the stator is moved in the direction opposite to that of FIG. 5 in the table shown in FIG. FIG. 8 is a perspective view illustrating the stroke of the first mover in the table shown in FIG. 7. FIG. 9 is a perspective view of the table in the first modification. FIG. 10 is a diagram showing waveforms of the velocity and acceleration of the first mover and the acceleration of the stator. FIG. 11 is a perspective view of the table in the second modification. FIG. 12 is a perspective view of the table in the third modification. FIG. 13A is a diagram corresponding to a cross-sectional view taken along the line BB of FIG. 1 of the table in the fifth modification. FIG. 13B is a diagram corresponding to a cross-sectional view taken along the line BB of FIG. 1 of the table in another example of the fifth modification. FIG. 14 is a top view of the table in the fourth modification. FIG. 15 is a front view of the table of FIG. FIG. 16 is a cross-sectional view taken along the line CC of FIG. FIG. 17 is a cross-sectional view taken along the line DD of FIG. FIG. 18 is a perspective view illustrating the first reaction absorption operation of the table in the fourth modification. FIG. 19 is a perspective view illustrating the second reaction absorption operation of the table in the fourth modification. FIG. 20 is a perspective view showing a state in which the second movable element of the table in the fourth modification is moved to a predetermined position. FIG. 21 is a perspective view showing a state in which the stator of the table in the fourth modification is moved in the traveling direction. FIG. 22 is a perspective view showing a state in which the first movable element of the table in the fourth modification is moved in the traveling direction. FIG. 23 is a top view showing an outline of the die bonder in the first embodiment. FIG. 24 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 23. FIG. 25 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 23. FIG. 26 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 23. FIG. 27 is a top view showing an outline of the die bonder in the second embodiment. FIG. 28 is a perspective view of the table in the sixth modification. FIG. 29 is a diagram showing the relationship between the speed and time of the first mover and the stator. FIG. 30 is a top view of the table in the seventh modification. FIG. 31 is a front view of the table shown in FIG. 32 is a rear view of the table shown in FIG. FIG. 33 is a left side view of the table shown in FIG. FIG. 34 is a top view of the table in the eighth modification. FIG. 35 is a rear view of the table shown in FIG. 34.

Hereinafter, embodiments, modifications, and examples will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present disclosure is used. It is not limited.

The configuration of the table in the embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a top view of the table in the embodiment. FIG. 2 is a front view of the table of FIG. FIG. 3 is a cross-sectional view taken along the line AA of FIG. FIG. 4 is a cross-sectional view taken along the line BB of FIG. FIG. 5 is a perspective view of a die bonding apparatus having a table shown in FIG. 1 in which the first mover is in a state before movement.

A linear motor is used as a drive source for the table 100 in the embodiment. The table 100 includes a base 101, a first linear motion guide 102 installed on the base 101, a second linear motion guide 103 arranged on the base 101 in parallel with the first linear motion guide 102, and a first linear motion guide 103. A stator 104 installed on the motion guide 102 is provided. The base 101 is fixed to a frame (not shown) of the die bonding device 10. The first linear motion guide 102 and the second linear motion guide 103 extend in the Y-axis direction. The first linear motion guide 102 is longer than the second linear motion guide 103.

The stator 104 includes a magnet portion 104a in which a large number of permanent magnets of N pole and S pole are alternately arranged in the Y direction, a flat plate-shaped yoke 104b that couples magnetic fluxes of adjacent permanent magnets, and a first. A first linear motion slider 104c that moves on the linear motion guide 102 is provided. The magnet portion 104a is provided on the upper surface of the yoke 104b, and the first linear motion slider 104c is provided on the lower surface of the yoke 104b.

The table 100 further includes a first mover 105 and a second mover 106 provided above the stator 104. The first mover 105 includes a coil portion 105a, a support 105b that supports the coil portion 105a, and a second linear motion slider 105c that moves on the second linear motion guide 103. The coil portion 105a includes a coil that generates a magnetic flux by an electric current and a yoke that couples a magnetic flux adjacent to the core, and constitutes an electromagnet. The support 105b is provided on the second linear motion slider 105c. The first mover 105 can freely move on the second linear motion guide 103.

The second mover 106 includes a coil portion 106a and a support 106b that supports the coil portion 106a. The coil portion 106a has the same configuration as the coil portion 105a. The support 106b is provided on the base 101. The second mover 106 is fixed to the base 101 and is immovable.

The length of the first mover 105 (coil portion 105a) and the second mover 106 (coil portion 106a) in the Y-axis direction is shorter than the length of the stator 104 (magnet portion 104a) in the Y-axis direction. The total length of the length of the first mover 105 (coil portion 105a) in the Y-axis direction and the length of the second mover 106 (coil portion 106a) in the Y-axis direction is also the Y of the stator 104 (magnet portion 104a). Shorter than the axial length.

As shown in FIG. 5, a driven body 108 is connected to the first mover 105. The driven body 108 is, for example, a Z drive shaft or the like that drives the bonding head in the vertical direction. The driven body 108 also includes a bonding head.

Further, the table 100 includes a scale 107 provided over substantially the entire area of the base 101 in the Y-axis direction. A linear sensor is configured by a scale 107 and, for example, an optical detection sensor (not shown) provided on the driven body 108. The linear sensor detects the position of the driven body 108 in the Y-axis direction, and based on the output of the linear sensor, movement control to a target position such as position control or speed control is performed. Thereby, for example, the first mover 105 can be controlled by the control method described in Japanese Patent Application Laid-Open No. 2015-173551.

The operation of the table 100 is controlled by the control device 110. That is, the control device 110 controls the operation of the table 100 by, for example, driving an I / O or an actuator connected to the network to control the current flowing through the coils of the first mover 105 and the second mover 106. do.

The recoil absorption operation of the table in the embodiment will be described with reference to FIG. FIG. 6 is a perspective view illustrating the recoil absorption operation of the table shown in FIG.

The control device 110 virtually moves the second mover 106 in the same direction as the first mover 105 moves (Y-axis direction) in parallel with the movement of the first mover 105. Since the second mover 106 is fixed to the base 101, it cannot move. When the second mover 106 is not fixed, passing an electric current so that the second mover 106 moves is said to virtually move the second mover 106.

Here, the mass of the first mover 105 is m1, the mass of the stator 104 is m2, the acceleration of the first mover 105 is a1, the acceleration of the second mover 106 is a2, the acceleration of the stator 104 is a3, and the first. Let F1 be the thrust acting on the one mover 105, F2 be the thrust acting on the second mover 106, and F3 be the thrust acting on the stator 104. Each equation of motion is expressed by the following equation.

F1 = m1 × a1 ... (1)
F2 = m2 × a2 ・ ・ ・ (2)
F3 = m2 × a3 ・ ・ ・ (3)

The reaction absorption (counter) mechanism is effective when the equations of motion of the first mover 105 and the stator 104 are equal. That is, the following equation holds.

F1 = F3 ... (4)

Here, the thrust to the stator 104 when the first mover 105 moves is F', and the acceleration thereof is a'. The acceleration (a3) of the stator 104, which is a counterweight, is the acceleration (a'<a1) of the thrust (F') to the stator 104 when the first mover 105 moves, and the second movable, which is immovable. It is the sum of the accelerations (a2) of the child 106. That is, the following equation holds.

a3 = a'+ a2 ... (5)
F3 = F'+ F2 ... (6)

The acceleration obtained for the second mover 106 at this time is calculated from the above formula. That is, the equations (1), (3) and (5) are substituted into the equation (4).

m1 × a1 = m2 × a3
= M2 (a'+ a2)
∴ a2 = (m1 / m2) × a1-a'・ ・ ・ (7)

By setting the acceleration of the second mover 106 to a2 calculated by inputting a numerical value into the above equation (7), the effect as a counter mechanism is exhibited. However, as described above, since the second mover 106 is fixed to the base 101, the stator 104 moves in the opposite direction to the first mover 105 in place of the second mover 106. This makes it possible to suppress vibration of the table 100.

In the present embodiment, the second mover 106 fixed to the base 101 is provided, and the stator 104 is freely movable. As a result, the stator 104 can be used as a counterweight, so that the counter mechanism can be miniaturized. Further, since the acceleration of the stator 104 is controlled by the immovable second mover 106, it is possible to adjust an appropriate vibration damping movement distance for each table, and a counter mechanism according to the machine difference becomes possible. ..

Substantially, the calculation of the acceleration / deceleration of the stator 104 according to the acceleration of the first mover 105 is as described above. This will be described with reference to the vt diagram shown in FIG. FIG. 29 is a diagram showing the relationship between the speed and time of the first mover and the stator. When the acceleration time, constant speed time, and deceleration time of the first mover 105 are set to ta, tk, and td, respectively, the stator 104 operated by the second mover 106 also has the acceleration time and constant speed of the first mover 105, respectively. The counter is established by adjusting the time and deceleration time. At this time, the stator 104 moved by the second mover 106 needs to move with the same stroke as the mover. However, when the stator 104 is used, the acceleration can be changed by the weight ratio, so that the operating speed of the stator 104 can be freely adjusted. Therefore, the stroke range can be made narrower than that of the first mover 105.

Since the table in this embodiment can freely control the counter operation, when another table other than this table is mounted on the same device, the stator is moved by the second mover of this table. When operating another table, it is possible to generate vibration that cancels the vibration. As a result, it is possible to substitute the other table without adding a vibration damping mechanism, so that it is possible to prevent bloat and suppress both the space inside the device and the cost.

The stroke extension operation of the table in the embodiment will be described with reference to FIGS. 5 to 8. FIG. 7 is a perspective view when the stator is moved in the direction opposite to that of FIG. 6 in the table shown in FIG. FIG. 8 is a perspective view illustrating the stroke of the first mover in the table shown in FIG. 7.

As described above, when the counter reaction absorption operation is performed on the table 100, as shown in FIG. 6, the control device 110 virtually immobilizes the second mover 106 in the same direction as the movement direction of the first mover 105. By moving the stator 104 in the opposite direction to the first mover 105, a counter operation is performed. Here, the stroke (movable range) of the first mover 105 is L1. Further, as shown in FIG. 5, before the first mover 105 and the stator 104 move, the right end of the second mover 106 is fixed at a distance of L2 from the right end of the stator 104.

As shown in FIG. 7, when the control device 110 virtually moves the second mover 106 in the direction opposite to the moving direction (Y-axis direction) of the first mover 105, the stator 104 becomes the first mover. The 105 moves in the same direction as it moves. Since the stator 104 can move by a maximum of L2, the stroke of the first mover 105 can be extended from L1 to (L1 + L2) as shown in FIG. In this way, when the stroke is extended, the enlargement of the table can be kept to a minimum, and the cost can be suppressed by the compact design, the reduction of the assembly man-hours, and the reduction of the number of parts.

For example, when this table is provided on the bonding table of a die bonding device, a unit for replacing and cleaning consumables that handle the die, for example, a collet, is provided in the range of the extended stroke in addition to the stroke for performing die bonding. Therefore, the quality and maintainability of the product can be improved. Further, even in a long stroke drive such as a two-lane device in which two lanes for transporting a substrate are arranged in the stretching direction (Y-axis direction) of the bonding table, the stator can be miniaturized and carried out at low cost.

<Modification example>
Hereinafter, some typical modifications of the embodiment will be illustrated. In the following description of the modification, the same reference numerals as those in the above-described embodiment may be used for the portions having the same configuration and function as those described in the above-described embodiment. As for the explanation of such a portion, the explanation in the above-described embodiment can be appropriately incorporated within a technically consistent range. In addition, a part of the above-described embodiment and all or a part of the plurality of modifications can be appropriately and combinedly applied within a technically consistent range.

(First modification)
The table in the first modification will be described with reference to FIGS. 9 and 10. FIG. 9 is a perspective view of the table in the first modification. FIG. 10 is a diagram showing waveforms of the velocity and acceleration of the first mover and the acceleration of the stator.

As shown in FIG. 9, the table 100 in the first modification is the one in which the acceleration sensor 109 is provided at the tip of the driven body 108 connected to the first mover 105 of the table in the embodiment, and the other The configuration is similar to the table in the embodiment.

When the first mover 105 accelerates and decelerates as shown in FIG. 10, the stator 104 operates an acceleration time waveform (FAW) having an opposite phase to the acceleration time waveform (MAW) of the first mover 105. By doing so, the counter is established. As described above, the control device 110 in the embodiment independently controls the first mover 105 and the second mover 106, and is second movable in the same direction in parallel with the movement of the first mover 105. The child 106 is moved asynchronously to perform a counter operation. In the first modification, the waveform of the swing back generated by the acceleration is measured by the acceleration sensor 109 during the counter operation similar to the embodiment, and the second mover 106 operates the stator 104 as the standard acceleration waveform. To reflect on.

Specifically, the acceleration of the second mover 106 is obtained in real time by calculating the waveforms in opposite phase by the measurement unit and the calculation unit of the control device 110 from the waveform measured by the acceleration sensor 109, and the counter operation is performed. To be established.

The counter operation of the embodiment is performed for the optimum operation evaluated by measuring the acceleration or the like in the operation such as bonding performed in advance. For example, a standard value obtained from measurement data accumulated in advance or a value evaluated by correlating with a vibration obtained by shaking an acceleration calculated in advance is used. The kinetic energy is calculated by calculating the thrust from the acceleration of the first mover 105 and the weight of the first mover 105 obtained by calculation for the optimum motion obtained from the evaluation result. The required acceleration is calculated from the weight of the entire stator 104 so as to have the same energy as this kinetic energy. The acceleration required for the stator 104 is input to the second mover 106 at the same time as the acceleration time of the first mover 105 for implementation.

When the acceleration is measured in real time by the acceleration sensor 109 as in this modification, the control device 110 that performs the above calculation performs the calculation every time and corrects it in real time to automatically realize the counter at the appropriate acceleration. can. The acceleration of the first mover 105 of the bonding head or the like of the embodiment is automatically set from the set speed, but this modification is effective because it may change with time of the load of the linear motion guide or the like. ..

(Second modification)
The table in the second modification will be described with reference to FIG. FIG. 11 is a perspective view of the table in the second modification.

The table 100 in the second modification has the first linear motion guide 102 or the second linear motion guide 103 under the common base 101 on which the first linear motion guide 102 and the second linear motion guide 103 in the embodiment are mounted. Two or more weight sensors 201 are provided in parallel, and other configurations are the same as those of the table in the embodiment. If only the counter operation of the Y-axis operation is performed, it may be installed at both ends (two places) of the base 101 in the Y-axis direction. If the center of gravity of the X-axis is also taken into consideration, the four corners of the base 101 (as shown in FIG. 11). Install in 4 places).

In the second modification, the following control is performed in the counter operation in the embodiment. Before moving the first mover 105, for example, the weights of the two weight sensors 201 are stored, and when the first mover 105 is operated, the second moveable so as to maintain the weight balance detected by these weight sensors 201. The movement of the stator 104 is controlled and operated by the child 106. That is, the stator 104 is moved by the second mover 106 so that the combined center of gravity of the first mover 105 and the stator 104 is always the same as the center of gravity before the start of operation even when the first mover 105 moves. By applying thrust, the operation is controlled in the direction opposite to that of the first stator 105.

Perform the following manually in advance. Here, the weight balance is, for example, the ratio of the weights detected by the two weight sensors 201, not the absolute weight. Further, an example in which the driven body 108 is a bonding head will be described.

(Simple operation)
(1-1) The first mover 105 that drives the bonding head is moved to the pickup position (start position) of the die, and the weight balance at that position is measured. Here, the stator 104 remains in the starting position.
(1-2) The first mover 105 is moved to the bonding position (stop position) of the die and its weight balance is measured. Here, the stator 104 remains in the starting position without being moved.
(1-3) With the first mover 105 moved to the bonding position, the stator 104 is moved until the weight balance of the pickup position (start position) is reached, and the position is stored.
(1-4) At the same time as the (Y-axis) operation from the pickup position (start position) to the bonding position (stop position) of the first mover 105, the stator 104 is placed at the start position and (1-3). Operate between positions.

(Detailed operation)
During the acceleration operation of the bonding head operation, the operation described in the first modification is performed, and during the low speed movement, the operation is performed so as to make the above movement in consideration of the weight balance including the movement amount at the time of acceleration.

The weight sensor 201 may be installed below both ends of the first linear motion guide 102 and the second linear motion guide 103 and above the base 101.

(Third modification example)
The table in the third modification will be described with reference to FIG. FIG. 12 is a perspective view of the table in the third modification.

The table 100 in the third modification is a vibration damping damper for absorbing vibration in the Z direction on the base 101 under both ends of the first linear motion guide 102 and the second linear motion guide 103 in the embodiment. Alternatively, a vibration damping member 202 such as a balancer (pendulum counter) is provided, and other configurations are the same as those of the table in the embodiment. The vibration damping member 202 may be provided under the four corners of the base 101 and on the frame of the device.

(Fourth modification)
The configuration of the table in the fourth modification will be described with reference to FIGS. 14 to 17. FIG. 14 is a top view of the table in the fourth modification. FIG. 15 is a front view of the table of FIG. FIG. 16 is a cross-sectional view taken along the line CC of FIG. FIG. 17 is a cross-sectional view taken along the line DD of FIG.

The table 100 in the fourth modification further has an electromagnetic clutch 111 for fixing and moving the stator 104 and a fixing plate 112 for fixing the second mover 106 with respect to the table in the embodiment. Be prepared. Further, the second movable element 106 is provided on the second linear motion guide 103, similarly to the first movable element 105. Therefore, the second linear motion guide 103 is configured to extend in the Y-axis direction longer than that of the embodiment. The second mover 106 in the third modification includes a support 106b that supports the coil portion 106a, and a second linear motion slider 106c that moves on the second linear motion guide 103. The support 106b is provided on the second linear motion slider 105c, similarly to the support 105b. Other configurations of the table 100 in the third modification are the same as those of the embodiment.

The electromagnetic clutch 111 is composed of a coil, and the electromagnetic force generated by energizing the coil attracts the yoke 104b formed of the ferromagnet of the stator 104 to fix the stator 104. By cutting off the energization to the coil, the electromagnetic force disappears and the force that attracts the yoke 104b disappears, so that the stator 104 can move. The stator 104 can be fixed at an arbitrary position by the electromagnetic clutch 111.

The fixing plate 112 is made of a ferromagnet and is arranged so as to extend along the second linear motion guide 103. The support 106b includes a coil like the electromagnetic clutch 111, and the electromagnetic force generated by energizing the coil attracts the fixing plate 112 to fix the second mover 106. By cutting off the energization to the coil, the electromagnetic force disappears and the force that attracts the fixing plate 112 disappears, so that the second mover 106 can move. The electromagnetic clutch function of the support 106b and the fixing plate 112 make it possible to fix the second mover 106 at an arbitrary position.

The recoil absorption operation of the table in the fourth modification will be described with reference to FIGS. 18 and 19. FIG. 18 is a perspective view illustrating the first reaction absorption operation of the table in the fourth modification. FIG. 19 is a perspective view illustrating the second reaction absorption operation of the table in the fourth modification.

When the first mover 105 performs a large operation, as shown in FIG. 18, the second mover 106 is fixed to the fixing plate 112 by the electromagnetic clutch function of the support 106b, and the stator 104 is fixed by the electromagnetic clutch 111. Is movable, and the counter operation by the stator 104 is performed as in the embodiment.

When the first mover 105 performs a small operation, as shown in FIG. 19, the second mover 106 is made movable by the electromagnetic clutch function of the support 106b, and the stator 104 is fixed by the electromagnetic clutch 111. Then, the counter operation by the second mover 106 is performed.

The stroke extension operation of the table in the fourth modification will be described with reference to FIGS. 20 to 22. FIG. 20 is a perspective view showing a state in which the second movable element of the table in the fourth modification is moved to a predetermined position. FIG. 21 is a perspective view showing a state in which the stator of the table in the fourth modification is moved in the traveling direction. FIG. 22 is a perspective view showing a state in which the first movable element of the table in the fourth modification is moved in the traveling direction.

The stator 104 is fixed by the electromagnetic clutch 111, and the second mover 106 is made movable by the electromagnetic clutch function of the support 106b. As shown in FIG. 20, after the second mover 106 is moved by a predetermined distance in the traveling direction of the first mover 105, the second mover 106 is fixed by the electromagnetic clutch function of the support 106b. As shown in FIG. 21, when the second mover 106 is virtually moved in the direction opposite to the direction in which the first mover 105 moves, the stator 104 moves in the same direction as the direction in which the first mover 105 moves. Operate. As a result, as shown in FIG. 22, the stroke of the first mover 105 can be extended as in the embodiment.

(Fifth variant)
The configuration of the table in the fifth modification will be described with reference to FIGS. 13 (a) and 13 (b). FIG. 13A is a diagram corresponding to a cross-sectional view taken along the line BB of FIG. 1 of the table in the fifth modification. FIG. 13B is a diagram corresponding to a cross-sectional view taken along the line BB of FIG. 1 of the table in another example of the fifth modification.

The table in the fifth modification is further provided with a linear sensor that detects the position of the stator 104 with respect to the table in the embodiment.

As shown in FIG. 13A, a scale 107a installed on the side surface of the stator 104 on the second mover 106 side, and an optical detection sensor 109a provided on the support 106b of the second mover 106. Consists of a linear sensor. As a result, the stator 104 is also controlled to move to the target position, such as position control or speed control, based on the output of the linear sensor. For example, the second mover 106 can be controlled by the control method described in Japanese Patent Application Laid-Open No. 2015-173551.

As shown in FIG. 13B, the linear sensor may be configured by the optical detection sensor 109b provided on the stator 104 and the scale 107 provided on the base 101.

(Sixth modification)
The structure of the table in the sixth modification will be described with reference to FIG. 28. FIG. 28 is a perspective view of the table in the sixth modification.

In the embodiment, an example in which the arrangement of the N pole and the S pole of the permanent magnet of the magnet portion 104a of the stator 104 is uniform has been described, but as shown in FIG. 28, the first of the magnet portions 104a of the stator 104. (2) The N pole and S pole of the permanent magnet in the portion that operates facing the mover 106 may be arranged closely, or the size of the magnet may be changed to increase the thrust. That is, in the sixth modification, the N pole and the S pole of the magnet portion 104a arranged on the yoke 104b are further subdivided without changing the arrangement, so that the detailed operation of the coil portion 106a of the second mover 106 can be performed. It is possible. Usually, the weight of the stator composed of the magnet plate is heavy and the amount of movement is small. The narrower the distance between the S pole and the N pole, the smaller the stroke can be moved accurately. As a result, even if the weights of the first mover 105 and the stator 104 are significantly different, or the movement amount is different (very small) due to this, the first mover 105 and the stator 104 can be operated in synchronization with the same accuracy. For example, with a weight ratio of 5: 1, synchronization control becomes easier if the SN poles are arranged at a density five times higher.

(Seventh variant)
The configuration of the table in the seventh modification will be described with reference to FIGS. 30 to 33. FIG. 30 is a top view of the table in the seventh modification. FIG. 31 is a front view of the table shown in FIG. 32 is a rear view of the table shown in FIG. FIG. 33 is a left side view of the table shown in FIG.

In the embodiment, the scale 107 of the linear sensor for detecting the position of the first mover 105 is provided on the base 101, but in the seventh modification, the scale 213 for detecting the position of the first mover 105 is fixed. It is provided in the child 104. Further, in the seventh modification, the scale 215 for detecting the position of the stator 104 is also provided on the stator 104. Further, in the seventh modification, since the scales 213 and 215 are provided on the stator 104, the structure of the stator 104 is different from that of the embodiment. The table 100 in the seventh modification has the same configuration as that of the embodiment except for the configuration related to the linear sensor. Hereinafter, the table 100 in the seventh modification will be described focusing on the differences from the embodiments.

First, the stator 104 in the seventh modification will be described. As shown in FIG. 33, the yoke 104b is U-shaped in side view. The magnet portion 104a is provided on the lower surface of the upper horizontal portion and the upper surface of the lower horizontal portion of the yoke 104b, and the first linear motion slider 104c is provided on the lower surface of the lower horizontal portion of the yoke 104b.

Next, the first mover 105 in the seventh modification will be described. The support 105b is erected on the second linear motion slider 105c and extends above the upper surface of the upper horizontal portion of the yoke 104b. The coil portion 105a is supported by the support body 105b so as to be located between the upper horizontal portion and the lower horizontal portion of the yoke 104b in the vertical direction.

Next, the second mover 106 in the seventh modification will be described. The second mover 106 has the same structure as that of the embodiment, and the coil portion 106a is supported on the upper side of the support 106b so as to be located between the upper horizontal portion and the lower horizontal portion of the yoke 104b in the vertical direction. ing.

Next, the linear sensor in the seventh modification will be described. A scanning head 212 for the first mover 105 is connected to the upper surface of the support 105b of the first mover 105. A driven body similar to the driven body 108 shown in the embodiment is connected to the scanning head 212. The scanning head 214 for the stator 104 is supported on the upper surface of the support 216 fixed on the base 101.

Further, the table 100 has a scale 213 for the first mover 105 extending in the Y-axis direction on the upper surface of the horizontal portion on the upper side of the yoke 104b, and substantially on the side surface of the vertical portion of the yoke 104b in the Y-axis direction. A scale 215 for the stator 104, which is provided over the entire area, is provided. The scale 213 and an optical detection sensor (not shown) provided on the scanning head 212 constitute a first linear sensor. A second linear sensor is configured by the scale 215 and an optical detection sensor (not shown) provided on the scanning head 214.

The first linear sensor detects the position of the first mover 105 in the Y-axis direction with respect to the stator 104, and the second linear sensor detects the position of the stator 104 in the Y-axis direction with respect to the base 101. Based on the outputs of the first and second linear sensors, movement control to the target position such as position control or speed control is performed.

Generally, a hall sensor is used in a motor. The Hall sensor is a sensor that applies the current magnetic effect called the Hall effect. Applications are generally rotation detection, position detection, open / close detection, current detection, orientation detection and the like. Applications in linear motors are position detection in which the strength and direction of the magnetic field are converted into voltage.

In order to execute the counter mechanism using a linear motor, it is possible to accurately detect the direction in which the coil portion 105a of the first mover 105 moves when the magnet portion 104a of the stator 104 moves, and to move the specified distance. It is necessary to. If the phases of the first mover 105 and the stator 104 are different, insufficient torque or reverse operation may occur.

When the position (absolute position) of the first mover 105 with respect to the base 101 is detected by using a linear sensor, the stator 104 moves in the counter operation, so the relative position between the first mover 105 and the stator 104 I can't figure out. Therefore, the position of the first mover 105 with respect to the stator 104 is detected by using the Hall sensor provided in the coil portion 105a of the first mover 105, and the phases of the first mover 105 and the stator 104 do not differ (same). It is necessary to control so that it becomes).

In the seventh modification, the scale 215 for the first mover 105 is attached to the stator 104 side so that the relative position between the first mover 105 and the stator 104 can be grasped. As a result, the position of the scale 215 in the operation of the stator 104 can be made to follow the arrangement of the magnetic poles of the magnet portion 104a. Therefore, the relative positional relationship between the first mover 105 and the stator 104 can be grasped without control, and the current can be passed in the correct phase (θ), so that the thrust can be generated correctly by the linear motor. .. At this time, in order to move the first mover 105 to the target position, it is necessary to consider the amount of movement of the stator 104 in the counter operation control. The amount of movement of the stator 104 in the counter operation control is determined by the time-speed change of the stator 104 based on the weight ratio of the first mover 105 and the stator 104.

(Eighth variant example)
The configuration of the table in the eighth modification will be described with reference to FIGS. 34 and 35. FIG. 34 is a top view of the table in the eighth modification. FIG. 35 is a rear view of the table shown in FIG. 34.

In the seventh modification, the scale 213 for the first mover 105 and the scale 215 for the stator 104 use different scales. In the eighth modification, one scale 213 covering the entire area of the stator 104 is provided, and the first linear sensor of the first mover 105 and the second mover 106 fixed to the base 101 are provided. Each linear sensor detects another position on the same scale 213.

Hereinafter, an embodiment in which the table in the embodiment or the modified example is applied to a die bonder as an example of the die bonding apparatus will be described.

FIG. 23 is a top view showing an outline of the die bonder in the first embodiment. FIG. 24 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 23.

The die bonder 10 is roughly divided into a die supply unit 1 for supplying a die D to be mounted on the substrate S, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6, and a substrate unloading unit. It has a unit 7 and a control device 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10, and the bonding unit 4 is arranged on the back side. Here, one or a plurality of product areas (hereinafter referred to as package areas P), which is the final package, are printed on the substrate S.

First, the die supply unit 1 supplies the die D to be mounted on the package area P of the substrate S. The die supply unit 1 has a wafer holding table 12 for holding the wafer 11 and a peeling unit 13 shown by a dotted line for peeling the die D from the wafer 11. The die supply unit 1 is moved in the XY axis direction by a drive means (not shown), and the die D to be picked up is moved to the position of the peeling unit 13.

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y-axis direction, and each drive (not shown) that moves the collet 22 up / down, rotates, and moves in the X-axis direction. With a part. The pickup head 21 has a collet 22 (see also FIG. 24) that attracts and holds the peeled die D to the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has each drive unit (not shown) that raises and lowers, rotates, and moves the collet 22 in the X-axis direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the package area P of the substrate S to be conveyed, or laminates it on the die already bonded on the package area P of the substrate S. Bond in shape. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 24) that attracts and holds the die D to the tip like the pickup head 21, and a Y drive unit 43 that moves the bonding head 41 in the Y-axis direction. It has a substrate recognition camera 44 that captures a position recognition mark (not shown) of the package area P of the substrate S and recognizes the bonding position. The Y-axis drive unit 43 is composed of a table according to any one of the embodiments and the first to fourth modifications, or a combination thereof. The bonding head 41 is a driven body 108 in the embodiment. With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the image pickup data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and makes the substrate based on the image pickup data of the substrate recognition camera 44. Die D is bonded to.

The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 to which the substrate S moves. The substrate S moves by driving a nut (not shown) of the substrate transport claw 51 provided in the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With such a configuration, the substrate S moves from the substrate supply unit 6 to the bonding position along the transfer lane 52, and after bonding, moves to the substrate unloading unit 7 and passes the substrate S to the substrate unloading unit 7.

The control device 8 corresponds to the control device 110 in the embodiment, and has a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory. And.

Next, the configuration of the die supply unit 1 will be described with reference to FIG. 25. FIG. 25 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 23.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY axis direction) and a peeling unit 13 that moves in the vertical direction. The wafer holding table 12 has an expanding ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held on the wafer ring 14 and to which a plurality of dies D are adhered. The peeling unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held in the wafer ring 14 is stretched to widen the interval between the dies D, and the die D is peeled from the dicing tape 16 by the peeling unit 13 to improve the pick-up property of the die D. The adhesive for adhering the die to the substrate changes from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

Next, a method of manufacturing a semiconductor device using a die bonder in the first embodiment will be described with reference to FIG. 26. FIG. 26 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 23.

(Wafer / substrate loading process: step S11)
The wafer ring 14 holding the dicing tape 16 to which the dicing tape 16 divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control device 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate S is prepared and carried into the die bonder 10. The control device 8 attaches the substrate S to the substrate transfer claw 51 by the substrate supply unit 6.

(Pickup process: step S12)
The control device 8 peels off the die D as described above, and picks up the peeled die D from the wafer 11. In this way, the die D peeled off from the dicing tape 16 together with the die attach film 18 is adsorbed and held by the collet 22 and conveyed to the next step (step S13). Then, when the collet 22 that has conveyed the die D to the next step returns to the dicing unit 1, the next die D is peeled off from the dicing tape 16 according to the above procedure, and thereafter, the dicing tape 16 to 1 is followed by the same procedure. The die D is peeled off one by one.

(Bonding process: step S13)
The control device 8 mounts the picked-up die on the substrate S or stacks the picked-up die on the die already bonded. The control device 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds the die D to the conveyed substrate S.

(Substrate carry-out process: step S14)
The control device 8 takes out the substrate S to which the die D is bonded from the substrate transfer claw 51 at the substrate carry-out portion 7. The substrate S is carried out from the die bonder 10.

As described above, the die D is mounted on the substrate S via the die attach film 18 and carried out from the die bonder. After that, it is electrically connected to the electrode of the substrate S via the Au wire in the wire bonding step. Subsequently, the substrate S on which the die D was mounted was carried into the die bonder, and the second die D was laminated on the die D mounted on the substrate S via the die attach film 18 and carried out from the die bonder. Later, in the wire bonding step, it is electrically connected to the electrode of the substrate S via the Au wire. The second die D is peeled from the dicing tape 16 by the method described above, and then transferred to the pelleting step and laminated on the dicing D. After the above steps are repeated a predetermined number of times, the substrate S is transferred to the molding step, and the plurality of dies D and Au wires are sealed with a molding resin (not shown) to complete a laminated package.

FIG. 27 is a top view showing an outline of the die bonder in the second embodiment.

The die bonder 10 in the second embodiment is roughly divided into a wafer supply unit 301, a work supply / transfer unit 305, a preform unit 302, a die bonding unit 304, and a control device 308 that monitors and controls the operation of each unit. , Consists of.

The wafer supply unit 301 includes a wafer cassette lifter 311 and a wafer ring holder 312. The work supply / transfer unit 305 includes a frame pusher 353, a loader lifter 354, a frame feeder 355, a loader 356, and an unloader 357. The die bonding unit 304 includes a bonding head 341 and a bonding table 343. The preform unit 302 includes a preform head 321 and a preform table 323.

A wafer cassette filled with a wafer ring 14 is set in the wafer cassette lifter 311, and the wafer ring 14 is supplied to the wafer ring holder 312. In parallel with this, the work supplied from the frame pusher 353 of the loader 356 or the loader lifter 354 is applied or cleaned with the die adhesive by the preform portion 302, and is conveyed on the frame feeder 355 to the bonding point.

In the wafer ring holder 312, the dicing tape (not shown) is stretched downward (expanded) and the distance between the dies (not shown) is widened to improve the dicing pickability, as in the first embodiment. After that, the die is pushed up from below the die by the push-up portion 313 via the dicing tape, picked up by the bonding head 341, and further die-bonded to a work (not shown) such as a lead frame. The wafer ring holder 312 is arranged on the XY linear motion table, and after picking up, it linearly moves to the next die position and repeats the die bonding operation.

The bonding head 341 is installed on the bonding table 343. The bonding table 343 is one of the embodiments and any one of the first to fourth modifications, or a combination thereof. The preform table 323 for driving the preform head 321, the XY table for driving the wafer ring holder 312, and the XY table for driving the push-up portion 313 are any of the embodiments and the first to fourth modifications. It may be one or a combination thereof.

Although the disclosure made by the present disclosers has been specifically described based on the embodiments, modifications and examples, the present disclosure is not limited to the above embodiments, modifications and examples, and is various. Needless to say, it can be changed.

For example, in the embodiment, the example of the table in which the driving body is moved in the horizontal direction has been described, but it may be applied to the table in which the driving body is moved in the vertical direction.

In the embodiment, the example of the bonding head as the driven body has been described, but the optical system unit used for the die bonding mechanism such as the substrate recognition camera in the first embodiment may be used.

In the first modification, an example of measuring acceleration and suppressing vibration was described, but the vibration inside the device is suppressed by picking up and feeding back the vibration of the table or the like of another unit by the sensor that detects the vibration. May be good. That is, by using a sensor that senses vibration, it picks up the vibration when another unit is operating, converts it to the opposite phase as it is, and sends a command to the second mover 106 that moves the stator 104, which is a counter. , Suppress vibration. For example, the same structure is provided for the three axes of XYZ, and the stator of the axis that is not actually operated is operated to suppress the vibration so as to cancel the combined waveform of the acceleration calculated from the three-dimensional acceleration sensor or the linear sensor. Here, the first mover of the shaft that is not operated is operated so as to maintain the original position.

Further, the Y-axis drive unit 23 in the first embodiment may be configured by any one of the embodiments and the first to sixth modifications, or a table in which they are combined.

Further, in the first embodiment, a die bonder in which a die is picked up from a die supply unit by a pickup head and placed on an intermediate stage, and the die mounted on the intermediate stage is bonded to a substrate by a bonding head has been described. It can be applied to a flip-chip bonder that picks up a die from the supply unit, rotates the die pickup head upward, transfers the die to the transfer head or the bonding head, and bonds the die to the substrate with the bonding head.

10 ... Die bonder (die bonding device)
101 ... Base 102 ... First linear motion guide 103 ... Second linear motion guide 104 ... Stator 105 ... First mover 106 ... Second mover 108 ... Covered Drive 110: Control device

Claims (23)

Driven body and
The table that drives the driven body and
Equipped with
The table is
With the base
A linear motor including a first mover and a stator for moving the driven body, and
A first linear motion guide provided between the base and the stator to freely move the stator,
A second linear motion guide provided between the base and the first movable element to freely move the first movable element, and a second linear motion guide.
The second movable element fixed to the base and
A control device that controls the first mover and the second mover,
Equipped with
The control device is a die bonding device configured to move the stator along the first linear motion guide by the second mover. In the die bonding apparatus of claim 1,
The control device moves the first mover in the first direction along the second linear motion guide, and the second mover causes the stator in a second direction opposite to the first direction. A die bonding device configured to suppress vibration during operation of the driven body by moving the driven body along the first linear motion guide. In the die bonding apparatus of claim 1,
A first linear sensor for detecting the position of the first mover is provided.
The control device is a die bonding device configured to perform position control or speed control of the first mover or movement control to a target position based on the output of the first linear sensor. In the die bonding apparatus of claim 3,
A second linear sensor for detecting the position of the stator is provided.
The control device is a die bonding device configured to perform position control, speed control, or movement control of the stator to a target position based on the output of the second linear sensor. Driven body and
The table that drives the driven body and
Equipped with
The table is
With the base
A linear motor including a first mover and a stator for moving the driven body, and
A first linear motion guide provided between the base and the stator to move the stator,
With the second mover,
A second linear motion guide provided between the base and the first mover and the second mover to move the first mover and the second mover,
The first fixing part for fixing and releasing the stator, and
The second fixing portion for fixing and releasing the second movable element,
A control device that controls the first mover, the second mover, the first fixing portion, and the second fixing portion.
A die bonding device equipped with. In the die bonding apparatus of claim 5,
The control device is
The stator is made movable by the first fixing portion, and the second mover is fixed by the second fixing portion.
The first mover is moved in the first direction along the second linear motion guide, and the stator is moved in the second direction opposite to the first direction by the second mover. A die bonding device configured to suppress vibration during operation of the driven body by moving along a motion guide. In the die bonding apparatus of claim 5,
The control device is
The stator is fixed by the first fixing portion, and the second mover is made movable by the second fixing portion.
The first mover is moved in the first direction along the second linear motion guide, and the second mover is moved in the second direction opposite to the first direction along the second linear motion guide. A die bonding device configured to suppress vibration during operation of the driven body by moving the driven body. In the die bonding apparatus of claim 5,
The control device is
The stator is fixed by the first fixing portion, the second mover is made movable by the second fixing portion, and the second mover is predetermined along the second linear motion guide in the first direction. Move a distance,
The stator is made movable by the first fixing portion, the second mover is fixed by the second fixing portion, and the second mover is used in the second direction opposite to the first direction. A die bonding device configured to widen the movable range of the first mover in the first direction by moving the stator along the first linear motion guide. In the die bonding apparatus according to any one of claims 1 to 4,
The control device is configured to widen the movable range of the first mover in the first direction by moving the stator in the first direction along the first linear motion guide by the second mover. Die bonding equipment to be done. In the die bonding apparatus according to any one of claims 1 to 4,
The stator comprises a plurality of permanent magnets and a yoke that couples the magnetic fluxes of the adjacent permanent magnets.
The first mover is arranged above the stator and has a first coil portion that forms an electromagnet, and a support that is arranged on the second linear motion guide and supports the first coil portion. Prepare,
The second mover is a die bonding apparatus including a second coil portion arranged above the stator and forming an electromagnet, and a support arranged on the base and supporting the second coil portion. .. In the die bonding apparatus according to any one of claims 5 to 8.
The stator comprises a plurality of permanent magnets and a yoke that couples the magnetic fluxes of the adjacent permanent magnets.
The first mover and the second mover are respectively arranged above the stator and formed on the coil portion forming an electromagnet and on the second linear motion guide to support the coil portion. Support and preparation,
The first fixing portion is arranged close to the stator and is composed of an electromagnet.
The second fixing portion is a die bonding device which is an electromagnet provided on the support of the second mover. In the die bonding apparatus according to any one of claims 2, 6 and 7.
When the controller accelerates or decelerates the first mover, the stator controls the second mover based on a waveform having a phase opposite to the acceleration time waveform in the first mover, and the stator controls the stator. A die bonding device configured to move. In the die bonding apparatus of claim 12,
The control device independently controls the first mover and the second mover via a network, and moves the second mover in the same direction in parallel with the operation of the first mover. Die bonding equipment configured. In the die bonding apparatus of claim 13,
The driven body is provided with an acceleration sensor at its tip and has an acceleration sensor.
When the first mover is accelerated or decelerated, the control device measures the waveform of the swing back generated by the acceleration by the acceleration sensor, and the standard acceleration in which the stator is operated by the second mover. A die bonding device configured to reflect on the waveform. In the die bonding apparatus according to any one of claims 2, 6 and 7.
The control device sets the stator so that the position of the center of gravity of the first mover and the stator is always the same as the center of gravity before the start of operation even when the first mover moves. (Ii) A die bonding device configured to give thrust by a mover. In the die bonding apparatus of claim 15,
In addition, it is equipped with two or more weight sensors.
The weight sensor is under the base in parallel with the first linear motion guide or the second linear motion guide, or under both ends of the first linear motion guide and the second linear motion guide. Provided on the base
The control device stores the weight detected by the weight sensor before the movement of the first mover, and maintains the weight balance based on the stored weight when the first mover operates. (Ii) A die bonding device configured to move the stator by a mover. In the die bonding apparatus according to any one of claims 2, 6 and 7.
Further, it is provided with another table different from the above table and a sensor for detecting the vibration of the other table.
The control device is a die bonding device configured to move the stator by the second mover based on the detected vibration. In the die bonding apparatus according to any one of claims 1 to 8,
The stator comprises a plurality of permanent magnets and a yoke that couples the magnetic fluxes of the adjacent permanent magnets.
The portion of the stator that overlaps the second mover in top view is a die bonding device in which the arrangement of the permanent magnets is more densely configured than the other parts of the stator. In the die bonding apparatus according to any one of claims 2, 6 and 7.
A bonding device in which a balancer or damper for absorbing vertical vibration is provided under both ends of the first linear motion guide. In the die bonding apparatus according to any one of claims 1 to 8,
The driven body is a die bonding device that is a bonding head that picks up a die and bonds it to a substrate. In the die bonding apparatus according to any one of claims 1 to 8,
The driven body is a die bonding device that is a preform head that applies a die adhesive to a substrate or cleans the substrate. A linear motor including a bonding head, a table for driving the bonding head, a base, a first mover and a stator for moving the bonding head in the horizontal direction, and a base and the stator are provided between the base and the stator. The first linear motion guide for freely moving the stator, the second linear motion guide provided between the base and the first movable element, and the second linear motion guide for freely moving the first movable element, and the base. A substrate loading process for loading a substrate into a die bonding device equipped with a second mover that is fixedly provided.
The bonding process of picking up the die and bonding it to the substrate,
Equipped with
In the bonding step, the first mover is moved in the first direction along the second linear motion guide, and the stator is moved in the second direction opposite to the first direction by the second mover. A method of manufacturing a semiconductor device for moving a semiconductor device along the first linear motion guide. In the die bonding apparatus of claim 1,
A first linear sensor that detects the position of the first mover with respect to the stator, and
A second linear sensor that detects the position of the stator with respect to the base,
Equipped with
The control device is a die bonding device configured to perform position control or speed control of the first mover or movement control to a target position based on the outputs of the first linear sensor and the second linear sensor.

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