JP2021012359A - 可捩発光ダイオードディスプレイモジュール - Google Patents
可捩発光ダイオードディスプレイモジュール Download PDFInfo
- Publication number
- JP2021012359A JP2021012359A JP2020100988A JP2020100988A JP2021012359A JP 2021012359 A JP2021012359 A JP 2021012359A JP 2020100988 A JP2020100988 A JP 2020100988A JP 2020100988 A JP2020100988 A JP 2020100988A JP 2021012359 A JP2021012359 A JP 2021012359A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- twistable
- display module
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Abstract
Description
100 可捩基板
102 電極パターン層
102a、102b 電極
104 絶縁層
104a 開口
106 回路層
108、200 発光ダイオード装置
110 導電接着層
112、114 保護層
116、202 コントローラ
118 接続装置
Claims (15)
- 可捩基板と、
前記可捩基板上に配置される電極パターン層と、
前記電極パターン層上に配置される絶縁層であって、前記絶縁層の縁部に開口が設けられ、前記開口は、前記可捩基板の縁部に位置し、前記電極パターン層の一部を露出させる、絶縁層と、
前記絶縁層上及び前記開口の側壁上に配置され、前記電極パターン層に接続される回路層と、
前記回路層上に配置され、それぞれ、前記回路層に電気的に接続される複数の発光ダイオード装置であって、各前記発光ダイオード装置は、駆動回路を備える、複数の発光ダイオード装置と、
を備える可捩発光ダイオードディスプレイモジュール。 - 前記回路層上の前記複数の発光ダイオード装置のそれぞれの投影面積は、50mm×50mm以下である、請求項1の可捩発光ダイオードディスプレイモジュール。
- 前記発光ダイオード装置のそれぞれは、マイクロコントローラ(MCU)をさらに備える、請求項1の可捩発光ダイオードディスプレイモジュール。
- コントローラと、
前記コントローラを前記電極パターン層の露出部分に接続する接続装置と、
をさらに備える、請求項1の可捩発光ダイオードディスプレイモジュール。 - 前記接続装置は、ワイヤ、導電繊維、導電織物、低温はんだ、導電金属接着剤、液体金属パッケージ、又はその組み合わせを含む、請求項4の可捩発光ダイオードディスプレイモジュール。
- 前記複数の発光ダイオード装置のそれぞれ及び前記回路層上に配置される保護層をさらに備える、請求項1の可捩発光ダイオードディスプレイモジュール。
- 導電接着層が、前記発光ダイオード装置のそれぞれと前記回路層との間に配置される、請求項1の可捩発光ダイオードディスプレイモジュール。
- 前記導電接着層は、異方性導電フィルム、導電接着剤、低温はんだ、液体金属パッケージ、又はその組み合わせを含む、請求項7の可捩発光ダイオードディスプレイモジュール。
- 可捩基板と、
前記可捩基板上に配置される回路層と、
前記回路層上に配置され、それぞれ、前記回路層に電気的に接続される複数の発光ダイオード装置であって、前記複数の発光ダイオード装置のそれぞれは、無線通信ネットワークに使用されるトランシーバ、及び駆動回路を備える、
可捩発光ダイオードディスプレイモジュール。 - 前記回路層上の前記複数の発光ダイオード装置のそれぞれの投影面積は、50mm×50mm以下である、請求項9の可捩発光ダイオードディスプレイモジュール。
- 各トランシーバに無線接続されるコントローラをさらに備える、請求項9の可捩発光ダイオードディスプレイモジュール。
- 前記複数の発光ダイオード装置のそれぞれ及び前記回路層上に配置される保護層をさらに備える、請求項9の可捩発光ダイオードディスプレイモジュール。
- 前記発光ダイオード装置のそれぞれと前記回路層との間に配置される導電接着層をさらに備える、請求項9の可捩発光ダイオードディスプレイモジュール。
- 前記導電接着層は、異方性導電フィルム、導電接着剤、低温はんだ、液体金属パッケージ、又はその組み合わせを含む、請求項13の可捩発光ダイオードディスプレイモジュール。
- 前記無線通信ネットワークは、Bluetooth通信ネットワーク又は5Gネットワークを含む、請求項13の可捩発光ダイオードディスプレイモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108123545A TWI682532B (zh) | 2019-07-04 | 2019-07-04 | 可扭曲發光二極體顯示模組 |
TW108123545 | 2019-07-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021012359A true JP2021012359A (ja) | 2021-02-04 |
Family
ID=69942469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020100988A Pending JP2021012359A (ja) | 2019-07-04 | 2020-06-10 | 可捩発光ダイオードディスプレイモジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US11205642B2 (ja) |
JP (1) | JP2021012359A (ja) |
TW (1) | TWI682532B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI767728B (zh) | 2021-06-01 | 2022-06-11 | 國立臺北科技大學 | 可扭曲電子元件模組 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003150074A (ja) * | 2001-11-13 | 2003-05-21 | Koha Co Ltd | Ledモジュールおよびled表示装置 |
JP2008096464A (ja) * | 2006-10-05 | 2008-04-24 | Fujitsu Ltd | 表示装置および表示装置ユニット並びに表示書き換え方法 |
JP2008166139A (ja) * | 2006-12-28 | 2008-07-17 | Tokyo Metropolitan Industrial Technology Research Institute | Led制御回路、led制御方法、led選別装置、led選別方法及びled制御回路を内蔵する電子機器。 |
JP2012032471A (ja) * | 2010-07-29 | 2012-02-16 | Dainippon Printing Co Ltd | パッシブマトリクス駆動型の表示素子パネル、その製造方法及び表示装置 |
JP2016033635A (ja) * | 2014-07-31 | 2016-03-10 | 有限会社ファイトロニクス | 表示器 |
JP2016038579A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP2019028423A (ja) * | 2017-07-27 | 2019-02-21 | ギュ キム、ソン | 無線制御型透明電光装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI270331B (en) | 2004-05-24 | 2007-01-01 | Phoenix Prec Technology Corp | Circuit board with multi circuit layers and method for fabricating the same |
US7980863B1 (en) * | 2008-02-14 | 2011-07-19 | Metrospec Technology, Llc | Printed circuit board flexible interconnect design |
TWI361027B (en) | 2008-07-08 | 2012-03-21 | Unimicron Technology Corp | Rigid-flex wiring board structure and fabrication |
US20110073353A1 (en) | 2009-09-29 | 2011-03-31 | Tex-Ray Industrial Co., Ltd. | Conductive fabric and method for forming the same |
US8828245B2 (en) | 2011-03-22 | 2014-09-09 | Industrial Technology Research Institute | Fabricating method of flexible circuit board |
TWI474763B (zh) | 2013-02-01 | 2015-02-21 | Career Technology Mfg Co Ltd | 多層線路板以及其製造方法 |
US8941129B1 (en) * | 2013-07-19 | 2015-01-27 | Bridgelux, Inc. | Using an LED die to measure temperature inside silicone that encapsulates an LED array |
TWI519225B (zh) | 2014-06-13 | 2016-01-21 | 欣興電子股份有限公司 | 多層軟性線路結構的製作方法 |
US20160105950A1 (en) * | 2014-10-10 | 2016-04-14 | Apple Inc. | Electronic Device Having Structured Flexible Substrates With Bends |
US10082284B2 (en) * | 2015-03-31 | 2018-09-25 | Frank Shum | LED light re-direction accessory |
TWI574595B (zh) | 2015-10-28 | 2017-03-11 | 財團法人工業技術研究院 | 多層線路的製作方法與多層線路結構 |
TWI595129B (zh) | 2015-12-22 | 2017-08-11 | 財團法人紡織產業綜合研究所 | 導電織物模組與具有導電織物模組的智慧型服飾 |
TWI590806B (zh) | 2016-01-22 | 2017-07-11 | Far Eastern New Century Corp | Wearable motion sensing device |
-
2019
- 2019-07-04 TW TW108123545A patent/TWI682532B/zh active
-
2020
- 2020-03-09 US US16/812,393 patent/US11205642B2/en active Active
- 2020-06-10 JP JP2020100988A patent/JP2021012359A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003150074A (ja) * | 2001-11-13 | 2003-05-21 | Koha Co Ltd | Ledモジュールおよびled表示装置 |
JP2008096464A (ja) * | 2006-10-05 | 2008-04-24 | Fujitsu Ltd | 表示装置および表示装置ユニット並びに表示書き換え方法 |
JP2008166139A (ja) * | 2006-12-28 | 2008-07-17 | Tokyo Metropolitan Industrial Technology Research Institute | Led制御回路、led制御方法、led選別装置、led選別方法及びled制御回路を内蔵する電子機器。 |
JP2012032471A (ja) * | 2010-07-29 | 2012-02-16 | Dainippon Printing Co Ltd | パッシブマトリクス駆動型の表示素子パネル、その製造方法及び表示装置 |
JP2016033635A (ja) * | 2014-07-31 | 2016-03-10 | 有限会社ファイトロニクス | 表示器 |
JP2016038579A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP2019028423A (ja) * | 2017-07-27 | 2019-02-21 | ギュ キム、ソン | 無線制御型透明電光装置 |
Also Published As
Publication number | Publication date |
---|---|
US11205642B2 (en) | 2021-12-21 |
TW202103315A (zh) | 2021-01-16 |
TWI682532B (zh) | 2020-01-11 |
US20210005581A1 (en) | 2021-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100885894B1 (ko) | Led 발광 장치의 플래인 구조체 | |
KR101943257B1 (ko) | 유연한 입출력 컴포넌트를 구비한 전자 디바이스 | |
KR101784406B1 (ko) | 투명 전광 장치 | |
JP4960783B2 (ja) | 直下方式バックライト装置 | |
KR102035005B1 (ko) | 터치 표시장치 | |
CN108241456B (zh) | 触控感测模组及其制作方法以及应用其的触控显示面板 | |
CN109859648A (zh) | 一种显示面板及显示装置 | |
CN109658831A (zh) | 一种显示面板及显示装置 | |
CN105824460B (zh) | Oled显示面板及制作方法 | |
CN102860128A (zh) | 有机el照明装置 | |
JP6833722B2 (ja) | 発光モジュール | |
KR102588760B1 (ko) | 표시 장치 | |
CN109164660A (zh) | 电致变色器件、壳体、电子设备 | |
CN114038330B (zh) | 一种可折叠显示模组和可折叠显示装置 | |
CN105518885A (zh) | 发光装置 | |
WO2021013148A1 (zh) | 触控结构、触控显示面板及触控显示装置 | |
EP3226321B1 (en) | Organic electroluminescence device and manufacturing method thereof, and display device | |
JP2021012359A (ja) | 可捩発光ダイオードディスプレイモジュール | |
CN204741065U (zh) | 一种带天线的显示面板和电子设备 | |
CN102983282B (zh) | 有机发光二极管模块 | |
KR100779950B1 (ko) | 투명전광판 및 이에 사용되는 라인형성칩 | |
CN105611714B (zh) | 柔性印刷电路板及显示装置 | |
US20210408454A1 (en) | Light-emitting panel and display device | |
CN114265516A (zh) | 一种触控显示面板及显示装置 | |
CN113589893A (zh) | 覆晶薄膜以及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200610 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210309 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210609 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210803 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211102 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20220208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220524 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20220524 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20220525 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20220613 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20220614 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20220715 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20220726 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20221101 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20230404 |