1361027 100-10-14 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種線路板結構及其製作方法，且特 別是有關於一種軟硬板結構及其製作方法。 【先前技術】1361027 100-10-14 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board structure and a method of fabricating the same, and in particular to a soft and hard board structure and a method of fabricating the same. [Prior Art]
軟硬板是由軟性線路板以及硬性線路板所組合而成的 印刷線路板，其兼具有軟性線路板的可撓性以及硬性線路 板的強度。在製作方法上，軟硬板是先以具有線路的軟性 線路板為核心層並在軟性線路板上覆蓋一層保護層，之後 再以類似增層法或疊合法的線路製程來製作硬性線路板於 軟性線路板上。The soft and hard board is a printed circuit board composed of a flexible circuit board and a rigid wiring board, and has both the flexibility of the flexible wiring board and the strength of the rigid wiring board. In the manufacturing method, the soft and hard board is first made of a flexible circuit board having a line as a core layer and a soft circuit board is covered with a protective layer, and then a hard circuit board is produced by a line-forming process similar to the build-up method or the stacking method. On a flexible circuit board.
圖1A與圖1B繪示習知的軟硬板的製作方法。首先， 請參照圖1A，提供一軟性線路板11〇。然後，在軟性線路 板110的兩側112、114上全面形成保護層12㈧之後\在 軟性線路板110的兩侧112、114壓合上膠片13〇。麸後， 請參照圖1B，在保護層120、膠片13〇上形成通孔以暴 露㈣性線路板11G的線路層116及其上方的保護層12〇 及膠片13G。並且’ f知技術在形成通孔v之後通常都合 對通孔v進行-除㈣製程’以去除形成通孔v時所產二 的膠渣。之後，在膠片13〇上盥補了, & 成導電層刚。 與電鍍的方式形 ⑽圖1C，圖案化導電層140以形成線路層 110二3片130上形成開口 01>以暴露錄性線路板 的外料A。朗，__財所❹的溶液與電 5 1361027 100-10-14 鍍時所使用的電鍍液都合破掠+ 致於影響保護層的可靠CL*的保護層’以 tiff的影響是目前亟待解決的課題。 【發明内容】 本發明提出—種軟硬板的製作方法，可使保護層不受 除膠渣製程與電鍍製程的影響。 使仟隻層不又 *本發明另提出-種軟硬板結構，'其通孔與貫孔都不會 暴絡出保護層’因此其保護層不受除_製程與電鍍製程 的影響而具有較佳的可靠度。 為具體描述本發明之内容，在此提出一種軟硬板的製 作方法如下所述。首先，提供—軟性線路板。接著，於軟 性線路板上形成-保護；I。然後，圖案化保護層，以於保 護層上形成至少一第一開口以暴露出軟性線路板的一表 面。之後’於軟性線路板上形成一第一膠片以覆蓋保護層。 接著，圖案化第一膠片，以於第一膠片内形成至少一第— 通孔，第一通孔位於保護層的第一開口中且暴露出軟性線 路板的表面。之後，於第一膠片上與第一通孔内形成一第 一導電層。第一通孔接近軟性線路板的—封閉端的孔徑小 於保護層的第一開口的口徑，且第一通孔不會暴露出保護 層0 在本發明之一實施例中’軟硬板的製作方法更包括圖 案化第一導電層，以形成一第一線路層。 在本發明之一實施例中’軟硬板的製作方法更包括圖 案化第一膠片’以於第一膝片上形成一第二開口，且第二 100-10-14 開口暴露出軟性線路板的—外露部。 列製：本=月之二!施例中，軟硬板的製作方法更包括下 安化第二: 了膠片上形成—第二膠片。接著，圖 =片’以於第二膠片内形成至少—第二通孔，且 =-通孔暴露，第：線路層。然後，於第二膠片上與第二 成—第二導電層。之後，圖案化第二導電層，以 二第一線路層。然後，圖案化第一膠片與第二膠片， =於第一朦片亡形成—第二開口，並於第二膠片上形成一 -開口 ’ 1第二開Π與第三開口連通並暴露出軟性線路 板的一外露部。 在本發明之-實施例中，保護層的材質包括感光型樹 脂或非感光型樹脂。 為具體描述本發明之内容，在此提出一種軟硬板結構 包括一軟性線路板、一保護層、一第一膠片、一第一線路 層以及一第一導電材料層。保護層配置於軟性線路板上， 且保護層具有至少一第一開口以暴露出軟性線路板的一表 面。第一膠片配置於軟性線路板上並覆蓋保護層，且第一 膠片具有至少一第一通孔，且第一通孔位於保護層的第一 開口中且暴露出軟性線路板的表面。第一線路層配置於第 一膠片上與第一通孔内。第一通孔接近軟性線路板的—封 閉端的孔徑小於保護層的第一開口的口徑，且第一通孔不 會暴露出保護層。 在本發明之一實施例中，保護層的材質包括感光型樹 脂或非感光型樹脂。 1361027 伽-1〇、14 在本發明之一實施例中，第一膠片更具有一第二 口，以暴露出軟性線路板的一外露部。 岣 在本發明之一實施例中，軟硬板結構更包括一第二腺 片與一第二線路層。第二膠片配置於軟性線路板上並: 第一膠片，且第二膠片具有至少一第二通孔以暴露出苐 線路層。第二線路層配置於第二膠片上與第二通孔内。、 ，本發明之一實施例中，第一膠片更具有一第二 口 ’第二膠片更具有一第三開口，且第二開口與第三開二 連通並暴露出軟性線路板的一外露部。 承上所述，本發明的保護層具有多個第一開口，而足 第一通孔位於第一開口中。因此，第一通孔不會暴露出保 護層。如此一來，本發明之保護層將不受除膠渣製裎與督 鍍製程的影響，進而具有較佳的可靠度。 為讓本發明之上述和其他目的'特徵和優點能更明顯 易懂，下文特舉實施例，並配合所附圖式，作詳細說明如 下。 【實施方式】 圖2A〜圖2D為本發明一實施例之軟硬板的製作方法 的製程剖面圖。圖3A〜圖3B為本發明另一實施例之軟硬 板的製作方法的製程剖面圖。 首先’請參照圖2A，提供一軟性線路板210，其例如 具有一軟性基板212與至少一線路層214。軟性線路板210 可以是單層線路板或是雙層線路板，而線路層214可根據 軟性線路板210是單層或雙層線路板而選擇性地配置於軟 1361027 100-10-14 性基板212的一表面或兩表面上。於本實施例中，軟性線 路板210是以雙層線路板為例，但並办用以限定本發明。 接著，請再次請參照圖2A，於軟性線路板210上形 成保濩層220，以覆蓋線路層214並保護線路層214免於 受到氧化或是外界污染的影響。形成保護層22〇的方法例 如塗佈或是乾膜貼附。保護層220的材質可以是感光型樹 脂或是非感光型樹脂。此外，保護層22〇的材質可以是聚 醯亞胺與壓克力膠，以使保護層220具有黏性且具有可撓 曲性。 然後，請參照圖2B，圖案化保護層220，以在保護層 220上形成多個第一開口 〇ρι以暴露出軟性線路基板21〇 的表面216、218(例如線路層214的表面），並且這些第一 開口 OP1還可暴露出線路層214。值得一提的是，這些第 一開口 OP1的位置對應於預定在軟性線路板21〇上的膠片 内（未繪示）形成通孔的位置、或者是預定在軟性線路板 210與膠片内形成貫孔的位置。圖案化保護層22〇的方法 包括對感光型樹脂進行曝光顯影之製程或是對非感光型樹 脂進行雷射蝕刻之製程。 之後’請參照圖2C，在軟性線路板210上形成第一 膠片230以覆蓋保護層220。然後，圖案化第一膠片Mo， 以於其内形成至少一第一通孔¥1，而且第一通lVl位於 第一開口 OP1中並暴露出軟性線路板21〇的表面216、 218(例如線路層214的表面）。 詳細而言，於本實施例中，第一通孔V1接近軟性線 9 100-10-14 路板210的一封閉端E的孔徑小於保護層220的第一開口 OP1的口徑，因此第一通孔VI不會暴露出保護層220。換 言之，第一通孔VI位於第一開口 ορι内的部分的孔徑較 第一開口 OP1的口徑小，且第一膠片23〇完全包覆保護層 220’以避免保§蔓層220受到電解液或是除膠渣製程中所使 用的溶液的破壞。此外’圖案化第一膠片230的方法例如 以雷射直接蝕刻第一膠片230。 接著’在第一膠片上230與第一通孔vi内形成一第 一導電層240，以覆蓋第一通孔VI以及第一通孔VI所暴 露出的表面216、218(例如線路層214的表面），並與線路 層214電性連接。 然後，請參照圖2D，圖案化第一導電層240以形成 第一線路層240a，而圖案化第一導電層240的方法包括微 影蝕刻。之後，圖案化第一膠片23〇,以在第一膠片23〇 上形成一第二開口 OP2,且第二開口 0P2暴露出軟性線路 板210的外露部A。本實施例的軟硬板結構2〇〇可藉由第 —開口 OP2所暴露出的外露部a而具有可撓曲性。此外， 圖案化第一膠片230的方法包括剝除法，而剝除法例如是 以刀具來移除第一膠片230。 此外，於本實施例中，圖2D是介紹增層一次的軟硬 板結構200，而於其他實施例中，軟硬板結構也可多次增 層。舉例來說，圖3A與圖3B是繪示增層二次的軟硬板結 構3〇〇的製作方法的製程剖面圖，且軟硬板結構3〇〇的夢 作方法可接續圖2C：之後。 、 250。 100-10-14 250。 100-10-14 請參照圖3A’在第—膠片23Q上形成—第二膠片 接著’對第二膠片250進行圖案化，以形成多個第二 通孔V2 ’而且這些第二通孔V2暴露出第一線路層2伽 及第二膠片250。此外，還可在軟性線路板21〇、第一膠片 230、第一線路層240a與第二膠片25〇上形成貫孔τ，且 貫孔Τ位於第一開口 ορι中。詳細而言，貫孔τ的孔徑小 於第-開π OT1的口徑，而且貫孔τ不會暴露出保護層 220。 然後，請參照圖3Β，分別在第二膠片25〇、第二通孔 V2與貫孔Τ内形成一第二導電層26〇，以覆蓋第二通孔 V2的侧壁以及第二通孔V2所暴露出的第一線路層24〇a 上。如此一來，第二導電層260可透過第二通孔V2而與 第一線路層240a連接，並可藉由貫孔τ而與第一線路層 240a以及線路層214連接。 之後’請參照圖3C，圖案化第二導電層26〇以形成 第二線路層260a。然後，圖案化第一膠片230與第二膠片 250’以於第一膠片230上形成第二開口 〇P2，並於第^膠 片250上形成第三開口 〇P3,且第二開口 〇]?2與第三開^ OP3連通並暴露出軟性線路板210的一外露部a。此外， 圖案化第一膠片230與第二膠片250的方法例如是以剝除 法移除第一膠片230與第二膠片250。 以下將就圖2D中的軟硬板結構200的結構部分做詳 細地描述。 請參照圖2D，本實施例的軟硬板結構200包括一軟 1361027 100-10-14 性線路板210、一保護層220、一第一膠片230以及一第一 線路層240a。保護層220配置於軟性線路板21〇上，保護 層220具有多個第一開口 OP1以暴露出軟性線路板210的 表面216、218(例如線珞層214的表面），而且這些第一開 口0P1還可暴露出軟性線路板210的線路層214。 第一膠片230配置於軟性線路板210上並覆蓋保護層 220 ’且第一膠片230具有多個第一通孔VI ’且第一通孔 VI位於保護層220的第一開口 ορι中且暴露出軟性線路 板210的表面216、218(例如線路層214的表面）。此外， 於本實施例中’第一膠片230還可具有一第二開口 〇P2以 暴露出軟性線路板210的外露部A，且軟硬板結構200可 藉由外露部A而具有可撓性。第一線路層240a配置於第 一膠片230上與第一通孔VI内，並透過第一通孔vi而與 線路層214連接。 具體而言’於本實施例中，第一通孔VI接近軟性線 路板210的一封閉端e的孔徑小於保護層220的第一開口 OP1的口徑’因此第一通孔VI不會暴露出保護層220。也 就是說，第一通孔VI位於第一開口 OP1内的部分的孔徑 較第一開口 OP1的口徑小，而且第一線路層240a與保護 層220之間隔有第一膠片230。如此一來，除膠渣製程或 是形成第一線路層240a都不會影響保護層220的可靠度。 此外’於本實施例中’圖2D是介紹增層一次的軟硬 板結構200，而於其他實施例中’軟硬板結構也可為多次 增層的結構。舉例來說，圖3B是繪示增層二次的軟硬板 12 1361027 100-10-14 結構300。 請參照圖3C，本實施例之軟硬板結構300與圖2D的 軟硬板結構200相似，兩者的差異之處僅在於軟硬板結構 3〇〇還包括一第二膠片250與一第二線路層260a。第二膠 片250例如是配置於軟性線路板210上並覆蓋第一膠片 230’且第二膠片250可具有多個第二通孔V2以暴露出第 一線路層240a。第二線路層260a例如是配置於第二膠片 250上與第二通孔V2内。 此外，於本實施例令，軟硬板結構300還具有貫孔τ， 貫孔T貫通軟性線路板210、第一膠片230、第一線路層 240a、第二膠片250與第二線路層260a。而且，第二線路 層260a覆蓋貫孔τ以連接軟性線路板210的線路層214 與第一線路層240a。另外，於本實施例中，第一勝片 還可具有一第二開口 OP2，而第二膠片250還可具有一第 二開口 OP3，且第二開口 〇P2與第三開口 OP3連通並暴 露出軟性線路板210的外露部A。 綜上所述，本發明的保護層具有多個第一開口，而且 第一開口的口徑大於第一通孔接近軟性線路板的封閉端的 =徑，也大於貫孔的孔徑，因此第一通孔與貫孔都不會暴 露出保護層。換言之，保護層藉由其所具有的第_開:來 避開第一通孔與貫孔在軟性線路板上的形成位置，且保護 層與第-通孔之間、或是與貫孔之間皆隔有第—膠片。如 此來，本發明之保護層將不受除膠渣製程與電錢製程 影響，進而具有較佳的可靠度。 & 13 10〇-1〇-14 本實關揭露如上，然其_心以 明之精神和=領域中具有通常知識者，在不脫離本發 耗圍内，虽可作些許之更動與潤飾， 【圖後附之申請專利範圍所界定者為準。發 圖1Α〜圖iC繪示習知的軟硬板的製作方法。 的製=面〜圖請為本發明—實施例之軟硬板的製作方法 圖3Α〜圖3C為本發明另-實施例之軟硬板的製作方 法的製程剖面圖。 【主要元件符號說明】 110、210 :軟性線路板 112、114 :軟性線路板的一侧 116、140a、214 :線路層 120、220 :保護層 130 :膠片 140 :導電層 200、300 :軟硬板結構 212 :軟性基板 216、218 :表面 230 :第一膠片 240 :第一導電層 240a :第一線路層 250 :第二膠片 14 1361027 100-10-14 260 :第二導電層 260a :第二線路層 A : 外露部 E ： 封閉端 OP :開口 OP1 :第一開口 OP2 :第二開口 OP3 :第三開口 T : 貫孔 V ： 通孔 VI :第一通孔 V2 :第二通孔 15FIG. 1A and FIG. 1B illustrate a conventional method for fabricating a soft and hard board. First, referring to FIG. 1A, a flexible circuit board 11A is provided. Then, after the protective layer 12 (eight) is completely formed on both sides 112, 114 of the flexible wiring board 110, the film 13 is pressed on both sides 112, 114 of the flexible wiring board 110. After the bran, referring to Fig. 1B, through holes are formed in the protective layer 120 and the film 13 to expose the wiring layer 116 of the (four) wiring board 11G and the protective layer 12A and the film 13G thereabove. Further, after the formation of the via hole v, the via hole v is usually subjected to a - (four) process to remove the slag which is produced when the via hole v is formed. After that, it is filled on the film 13 ,, & into a conductive layer just. In the form of electroplating (10), FIG. 1C, the conductive layer 140 is patterned to form a wiring layer 110, and an opening 01 is formed on the chip 130 to expose the material A of the recording board. Lang, __ 财 ❹ 溶液 与 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 Question. SUMMARY OF THE INVENTION The present invention provides a method for fabricating a soft and hard board, which can protect the protective layer from the desmear process and the electroplating process. The invention only proposes a kind of soft and hard plate structure, 'the through hole and the through hole do not burst out of the protective layer', so the protective layer is not affected by the process and the plating process. Better reliability. In order to specifically describe the contents of the present invention, a method of manufacturing a soft and hard board is proposed as follows. First, provide a flexible circuit board. Next, a -protection is formed on the flexible circuit board; Then, the protective layer is patterned to form at least one first opening on the protective layer to expose a surface of the flexible wiring board. Thereafter, a first film is formed on the flexible wiring board to cover the protective layer. Next, the first film is patterned to form at least one through hole in the first film, the first through hole being located in the first opening of the protective layer and exposing the surface of the flexible circuit board. Thereafter, a first conductive layer is formed on the first film and in the first via. The first through hole is close to the flexible circuit board - the closed end has a smaller aperture than the first opening of the protective layer, and the first through hole does not expose the protective layer 0. In one embodiment of the present invention, the method of manufacturing the soft and hard board Further comprising patterning the first conductive layer to form a first circuit layer. In one embodiment of the present invention, the method for manufacturing a soft and hard board further includes patterning the first film to form a second opening on the first knee piece, and the second 100-10-14 opening exposes the flexible circuit board. - Exposed department. Column system: This is the second of the month! In the example, the method of making the soft and hard board further includes the second of the Anhua: the second film is formed on the film. Next, the pattern = sheet' is formed to form at least a second through hole in the second film, and = a through hole is exposed, a: circuit layer. Then, on the second film, the second-second conductive layer is formed. Thereafter, the second conductive layer is patterned to have two first wiring layers. Then, the first film and the second film are patterned, and the first film is formed into a second opening, and an opening is formed on the second film. The second opening is in communication with the third opening and exposes the softness. An exposed part of the circuit board. In the embodiment of the invention, the material of the protective layer comprises a photosensitive resin or a non-photosensitive resin. To specifically describe the present invention, a soft and hard board structure is provided herein comprising a flexible circuit board, a protective layer, a first film, a first wiring layer, and a first conductive material layer. The protective layer is disposed on the flexible circuit board, and the protective layer has at least one first opening to expose a surface of the flexible circuit board. The first film is disposed on the flexible circuit board and covers the protective layer, and the first film has at least one first through hole, and the first through hole is located in the first opening of the protective layer and exposes the surface of the flexible circuit board. The first circuit layer is disposed on the first film and in the first through hole. The first through hole is close to the flexible circuit board - the aperture of the closed end is smaller than the diameter of the first opening of the protective layer, and the first through hole does not expose the protective layer. In an embodiment of the invention, the material of the protective layer comprises a photosensitive resin or a non-photosensitive resin. 1361027 Gamma, 14 In one embodiment of the invention, the first film further has a second port to expose an exposed portion of the flexible circuit board. In one embodiment of the invention, the soft and hard board structure further includes a second gland and a second circuit layer. The second film is disposed on the flexible circuit board and: a first film, and the second film has at least one second through hole to expose the 线路 circuit layer. The second circuit layer is disposed on the second film and the second through hole. In one embodiment of the present invention, the first film further has a second port. The second film further has a third opening, and the second opening communicates with the third opening and exposes an exposed portion of the flexible circuit board. . As described above, the protective layer of the present invention has a plurality of first openings, and the first through holes are located in the first openings. Therefore, the first through hole does not expose the protective layer. As a result, the protective layer of the present invention is not affected by the desmear process and the plating process, and thus has better reliability. The above and other objects, features and advantages of the present invention will become more apparent from the aspects of the invention. [Embodiment] FIG. 2A to FIG. 2D are process cross-sectional views showing a method of fabricating a soft and hard board according to an embodiment of the present invention. 3A to 3B are process cross-sectional views showing a method of fabricating a flexible board according to another embodiment of the present invention. First, please refer to FIG. 2A, which provides a flexible circuit board 210 having, for example, a flexible substrate 212 and at least one wiring layer 214. The flexible circuit board 210 may be a single layer circuit board or a double layer circuit board, and the circuit layer 214 may be selectively disposed on the soft 1361027 100-10-14 substrate according to whether the flexible circuit board 210 is a single layer or a double layer circuit board. One surface or two surfaces of 212. In the present embodiment, the flexible circuit board 210 is exemplified by a two-layer circuit board, but is used to define the present invention. Next, please refer to FIG. 2A again to form a protective layer 220 on the flexible wiring board 210 to cover the wiring layer 214 and protect the wiring layer 214 from oxidation or external pollution. The method of forming the protective layer 22 is, for example, coating or dry film attachment. The material of the protective layer 220 may be a photosensitive resin or a non-photosensitive resin. Further, the material of the protective layer 22 can be made of polyimide and acrylic to make the protective layer 220 viscous and flexible. Then, referring to FIG. 2B, the protective layer 220 is patterned to form a plurality of first openings 在ρι on the protective layer 220 to expose the surfaces 216, 218 of the flexible circuit substrate 21 ( (eg, the surface of the wiring layer 214), and These first openings OP1 may also expose the wiring layer 214. It is worth mentioning that the positions of the first openings OP1 correspond to positions where the through holes are formed in the film (not shown) which is intended to be on the flexible circuit board 21, or are intended to be formed in the flexible circuit board 210 and the film. The location of the hole. The method of patterning the protective layer 22 includes a process of exposing and developing a photosensitive resin or a process of performing laser etching on a non-photosensitive resin. Thereafter, referring to Fig. 2C, a first film 230 is formed on the flexible wiring board 210 to cover the protective layer 220. Then, the first film Mo is patterned to form at least one first through hole ¥1 therein, and the first pass 1V1 is located in the first opening OP1 and exposes the surface 216, 218 of the flexible circuit board 21A (for example, the line The surface of layer 214). In detail, in the present embodiment, the first through hole V1 is close to the soft line 9 100-10-14. The closed end E of the road plate 210 has a smaller aperture than the first opening OP1 of the protective layer 220, so the first pass The hole VI does not expose the protective layer 220. In other words, the aperture of the portion of the first through hole VI located in the first opening ορι is smaller than the aperture of the first opening OP1, and the first film 23 〇 completely covers the protective layer 220 ′ to prevent the vine layer 220 from being subjected to the electrolyte or It is the destruction of the solution used in the desmear process. Further, the method of patterning the first film 230 directly etches the first film 230, for example, by laser. Then, a first conductive layer 240 is formed on the first film 230 and the first via hole vi to cover the first via hole VI and the surface 216, 218 exposed by the first via hole VI (for example, the circuit layer 214 Surface) and electrically connected to the circuit layer 214. Then, referring to FIG. 2D, the first conductive layer 240 is patterned to form a first wiring layer 240a, and the method of patterning the first conductive layer 240 includes lithography etching. Thereafter, the first film 23 is patterned to form a second opening OP2 on the first film 23A, and the second opening 0P2 exposes the exposed portion A of the flexible wiring board 210. The soft and hard plate structure 2 of the present embodiment can be made flexible by the exposed portion a exposed by the first opening OP2. Further, the method of patterning the first film 230 includes a peeling method, and the stripping method is, for example, removing the first film 230 with a cutter. Further, in the present embodiment, Fig. 2D is a soft and hard board structure 200 for introducing the primary layer, and in other embodiments, the soft and hard board structure may be layered a plurality of times. For example, FIG. 3A and FIG. 3B are process cross-sectional views showing a method of fabricating a second-layer soft and hard plate structure 3〇〇, and the dreaming method of the soft and hard plate structure can be continued. FIG. 2C: . 250. 100-10-14 250. 100-10-14 Referring to FIG. 3A', a second film is formed on the first film 23Q, and then the second film 250 is patterned to form a plurality of second through holes V2' and the second through holes V2 are exposed. The first circuit layer 2 is affixed to the second film 250. Further, a through hole τ may be formed in the flexible wiring board 21, the first film 230, the first wiring layer 240a and the second film 25A, and the through hole Τ is located in the first opening ορι. In detail, the aperture of the through hole τ is smaller than the aperture of the first opening π OT1, and the through hole τ does not expose the protective layer 220. Then, referring to FIG. 3A, a second conductive layer 26〇 is formed in the second film 25〇, the second through hole V2 and the through hole respectively to cover the sidewall of the second through hole V2 and the second through hole V2. The exposed first line layer 24〇a. In this way, the second conductive layer 260 can be connected to the first circuit layer 240a through the second via hole V2, and can be connected to the first circuit layer 240a and the circuit layer 214 through the through hole τ. Thereafter, referring to Fig. 3C, the second conductive layer 26 is patterned to form a second wiring layer 260a. Then, the first film 230 and the second film 250' are patterned to form a second opening 〇P2 on the first film 230, and a third opening 3P3 is formed on the second film 250, and the second opening 〇]?2 It communicates with the third opening OP3 and exposes an exposed portion a of the flexible wiring board 210. Further, the method of patterning the first film 230 and the second film 250 removes the first film 230 and the second film 250, for example, by stripping. The structural portion of the soft and hard board structure 200 in Fig. 2D will be described in detail below. Referring to FIG. 2D, the soft and hard board structure 200 of the present embodiment includes a soft 1361027 100-10-14 circuit board 210, a protective layer 220, a first film 230, and a first circuit layer 240a. The protective layer 220 is disposed on the flexible circuit board 21, and the protective layer 220 has a plurality of first openings OP1 to expose the surfaces 216, 218 of the flexible circuit board 210 (for example, the surface of the turns 214), and the first openings 0P1 The circuit layer 214 of the flexible circuit board 210 can also be exposed. The first film 230 is disposed on the flexible circuit board 210 and covers the protective layer 220 ′ and the first film 230 has a plurality of first through holes VI ′ and the first through holes VI are located in the first opening ορι of the protective layer 220 and exposed. The surfaces 216, 218 of the flexible circuit board 210 (e.g., the surface of the wiring layer 214). In addition, in the embodiment, the first film 230 may further have a second opening 〇P2 to expose the exposed portion A of the flexible circuit board 210, and the soft and hard board structure 200 may have flexibility by the exposed portion A. . The first circuit layer 240a is disposed on the first film 230 and the first via hole VI, and is connected to the circuit layer 214 through the first via hole vi. Specifically, in the present embodiment, the first through hole VI is close to the aperture of a closed end e of the flexible circuit board 210 and smaller than the aperture of the first opening OP1 of the protective layer 220. Therefore, the first through hole VI is not exposed to protection. Layer 220. That is, the aperture of the portion of the first through hole VI located in the first opening OP1 is smaller than the aperture of the first opening OP1, and the first wiring layer 230 is spaced apart from the protective layer 220 by the first film 230. As a result, the desmear process or the formation of the first wiring layer 240a does not affect the reliability of the protective layer 220. Further, in the present embodiment, Fig. 2D is a soft and hard board structure 200 for introducing a layer, and in other embodiments, the 'soft and hard board structure may be a structure for multiple layers. For example, FIG. 3B illustrates a build-up secondary soft and hard board 12 1361027 100-10-14 structure 300. Referring to FIG. 3C, the soft and hard board structure 300 of the present embodiment is similar to the soft and hard board structure 200 of FIG. 2D. The difference between the two is that the soft and hard board structure 3〇〇 also includes a second film 250 and a first Two circuit layers 260a. The second film 250 is disposed, for example, on the flexible wiring board 210 and covers the first film 230' and the second film 250 may have a plurality of second through holes V2 to expose the first wiring layer 240a. The second wiring layer 260a is disposed, for example, on the second film 250 and the second through hole V2. In addition, in the present embodiment, the soft and hard plate structure 300 further has a through hole τ which penetrates the flexible circuit board 210, the first film 230, the first circuit layer 240a, the second film 250, and the second circuit layer 260a. Moreover, the second wiring layer 260a covers the through holes τ to connect the wiring layer 214 of the flexible wiring board 210 with the first wiring layer 240a. In addition, in this embodiment, the first winning piece may further have a second opening OP2, and the second film 250 may further have a second opening OP3, and the second opening 〇P2 is in communication with the third opening OP3 and exposed. The exposed portion A of the flexible wiring board 210. In summary, the protective layer of the present invention has a plurality of first openings, and the diameter of the first opening is larger than the diameter of the first through hole close to the closed end of the flexible circuit board, and is larger than the diameter of the through hole, so the first through hole No protective layer is exposed with the through holes. In other words, the protective layer avoids the formation position of the first through hole and the through hole on the flexible circuit board by the first opening: and the protective layer and the first through hole or the through hole There is a first film between them. As a result, the protective layer of the present invention will not be affected by the desmear process and the money-making process, and thus has better reliability. & 13 10〇-1〇-14 This is the real disclosure of the above, but its _ heart and spirit and the general knowledge of the field, in the field of the hair, can make some changes and refinements, [The definition of the scope of the patent application attached to the figure shall prevail. 1A to 1C show a conventional method of manufacturing a soft and hard board. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3A to FIG. 3C are process cross-sectional views showing a method of fabricating a soft and hard board according to another embodiment of the present invention. [Main component symbol description] 110, 210: flexible circuit boards 112, 114: one side of the flexible circuit board 116, 140a, 214: circuit layer 120, 220: protective layer 130: film 140: conductive layer 200, 300: soft and hard Plate structure 212: flexible substrate 216, 218: surface 230: first film 240: first conductive layer 240a: first circuit layer 250: second film 14 1361027 100-10-14 260: second conductive layer 260a: second Circuit layer A: exposed portion E: closed end OP: opening OP1: first opening OP2: second opening OP3: third opening T: through hole V: through hole VI: first through hole V2: second through hole 15