TWI767728B - 可扭曲電子元件模組 - Google Patents
可扭曲電子元件模組 Download PDFInfo
- Publication number
- TWI767728B TWI767728B TW110119902A TW110119902A TWI767728B TW I767728 B TWI767728 B TW I767728B TW 110119902 A TW110119902 A TW 110119902A TW 110119902 A TW110119902 A TW 110119902A TW I767728 B TWI767728 B TW I767728B
- Authority
- TW
- Taiwan
- Prior art keywords
- twistable
- electronic component
- layer
- circuit
- circuit board
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09281—Layout details of a single conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the PCB or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
一種可扭曲電子元件模組,其包括可扭曲基板、電極圖案層、絕緣層、線路層、多個線路板以及多個電子元件。電極圖案層設置於可扭曲基板上。絕緣層設置於電極圖案層上。絕緣層的邊緣具有開口,而開口位於可扭曲基板的邊緣且暴露電極圖案層的一部分。線路層設置於絕緣層上以及開口的側壁上,且與電極圖案連接。所述多個線路板設置於線路層上,且各自與線路層電性連接。所述多個電子元件設置於所述多個線路板上,且各自與所述多個線路板中的對應者電性連接。
Description
本發明是有關於一種電子元件模組,且特別是有關於一種可扭曲電子元件模組。
近年來,智慧布料的技術在工業、民生、休閒、醫療上已能協助紡織業成衣商、衣服品牌商提供解決方案,因此符合未來的穿戴式電子裝置的趨勢。
對於一般的穿戴式電子裝置來說,多個電子元件設置在基板上且與驅動這些電子元件的線路層電性連接。為了驅動這些電子元件,電子裝置中必須設置多層線路層,且必須在這些線路層之間設置導通孔(conductive via)。如此一來,導致線路設計困難,且電子裝置容易因彎折而斷裂。
本發明提供一種可扭曲電子元件模組,其包括電子元件以及設置於電子元件與線路層之間的線路板。
本發明的可扭曲電子元件模組包括可扭曲基板、電極圖案層、絕緣層、線路層、多個線路板以及多個電子元件。電極圖案層設置於可扭曲基板上。絕緣層設置於電極圖案層上。絕緣層的邊緣具有開口,而開口位於可扭曲基板的邊緣且暴露電極圖案層的一部分。線路層設置於絕緣層上以及開口的側壁上,且與電極圖案連接。所述多個線路板設置於線路層上,且各自與線路層電性連接。所述多個電子元件設置於所述多個線路板上,且各自與所述多個線路板中的對應者電性連接。
在本發明的可扭曲電子元件模組的一實施例中,線路板的厚度介於35 μm至180 μm之間。
在本發明的可扭曲電子元件模組的一實施例中,設置於線路板上的電子元件的邊緣與線路板的邊緣之間的距離不超過線路板的寬度的20%。
在本發明的可扭曲電子元件模組的一實施例中,設置於線路板上的電子元件的邊緣與線路板的邊緣對齊。
在本發明的可扭曲電子元件模組的一實施例中,設置於線路板上的電子元件的邊緣不超出線路板的邊緣。
在本發明的可扭曲電子元件模組的一實施例中,電子元件包括具有主動元件、被動元件或其組合的晶片。
在本發明的可扭曲電子元件模組的一實施例中,更包括控制器以及連接控制器與電極圖案層的暴露部分的連接裝置。
在本發明的可扭曲電子元件模組的一實施例中,連接裝置包括導線、導電纖維、導電布、低溫焊錫、導電金屬膠、液態金屬封裝體或其組合。
在本發明的可扭曲電子元件模組的一實施例中,更包括覆蓋連接裝置與電極圖案層的界面處的保護層。
在本發明的可扭曲電子元件模組的一實施例中,更包括設置於絕緣層上且覆蓋線路層、所述多個線路板以及所述多個電子元件的保護層,且保護層並暴露出開口中的電極圖案層。
基於上述,在本發明的可扭曲電子元件模組中,線路板設置於電子元件與線路層之間,因此可有效地避免用以連接電子元件與線路層的凸塊或類似物對線路層造成損傷。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
下文列舉實施例並配合附圖來進行詳細地說明,但所提供的實施例並非用以限制本發明所涵蓋的範圍。此外,圖式僅以說明為目的,並未依照原尺寸作圖。為了方便理解,在下述說明中相同的元件將以相同的符號標示來說明。
關於文中所使用「包含」、「包括」、「具有」等等用語,均為開放性的用語,也就是指「包含但不限於」。
此外,文中所提到的方向性用語,例如「上」、「下」等,僅是用以參考圖式的方向,並非用來限制本發明。因此,應理解,「上」可與「下」互換使用,且當層或膜等元件放置於另一元件「上」時,所述元件可直接放置於所述另一元件上,或者可存在中間元件。另一方面,當稱元件「直接」放置於另一元件「上」時,則兩者之間不存在中間元件。
在以下實施例中,所提及的數量與形狀僅用以具體地說明本發明以便於了解其內容,而非用以限定本發明。
圖1A為依照本發明的第一實施例的可扭曲電子元件模組的剖面示意圖。圖1B為依照本發明的第一實施例的可扭曲電子元件模組中的電極圖案層的上視示意圖。圖1C為依照本發明的第一實施例的可扭曲電子元件模組的上視示意圖。圖1A為沿圖1C中的I-I’剖線所繪示,且為了清楚表示,在圖1C中省略了保護層、控制器以及連接裝置。
請同時參照圖1A、圖1B與圖1C,本實施例的可扭曲的電子元件模組10包括可扭曲基板100、電極圖案層102、絕緣層104、線路層106、多個線路板108以及多個電子元件110。可扭曲基板100具有可彎曲、可扭轉、可摺疊等特性。在本實施例中,可扭曲基板100可以是聚胺酯(polyurethane,PU)基板、矽膠基板、橡膠基板或其他合適的基板。
電極圖案層102設置於可扭曲基板100上。在本實施例中,電極圖案層102構成指狀電極,其包括電極102a與電極102b,如圖1B所示。電極102a與電極102b可分別作為正極與負極。電極102a與電極102b各自具有主體部分以及自主體部分延伸的指狀部分,且電極102a的指狀部分與電極102b的指狀部分交替排列。然而,本發明不限於此。在其他實施例中,電極圖案層102可視實際需求而構成各種圖案。電極圖案層102的材料可為任何合適的導電材料,且可經由任何合適的方式(例如噴塗、網版印刷、連續滾壓(roll-to-roll)印刷、3D列印、電鍍、濺鍍等)來形成於可扭曲基板100上。
絕緣層104設置於電極圖案層102上。絕緣層104的邊緣具有開口104a。開口104a位於可扭曲基板100的邊緣,並暴露電極圖案層102的一部分。在本實施例中,絕緣層104的角落處(圖1C中的左下角處)具有開口104a,且開口104a位於可扭曲基板100的角落處(圖1C中的左下角處),並暴露電極102a的一部分與電極102b的一部分。電極102a的暴露部分與電極102b的暴露部分可作為連接至外部裝置的接點。在其他實施例中,開口104a也可以不位於角落處,只要可暴露出所需的接點位置且易於連接即可。絕緣層104的材料可為任何合適的絕緣材料,且可經由任何合適的方式(例如噴塗、網版印刷、連續滾壓印刷、3D列印等)來形成於可扭曲基板100上以覆蓋電極圖案層102。
線路層106設置於絕緣層104上。此外,線路層106設置於開口104a的側壁上,以沿著開口104a的側壁延伸至開口104a的底部而與電極圖案102連接。如此一來,當開口104a所暴露的接點與外部裝置連接時,藉由外部裝置提供電壓即可啟動與線路層106電性連接的電子元件。此外,線路層106可用以將與其電性連接的多個電子元件彼此電性連接。線路層106的佈局並不限於圖1C中所示,在其他實施例中可視實際需求來調整線路層106的佈局。線路層106的材料可為任何合適的導電材料,且可經由任何合適的方式(例如噴塗、網版印刷、連續滾壓印刷、3D列印等)來形成於絕緣層104上。
電子元件110設置於線路層106上,且各自與線路層106電性連接。電子元件110可以是具有主動元件或被動元件晶片,主動元件或被動元件例如是電晶體、記憶體、二極體、電阻器、電容器、電感器、微控制器(microcontroller unit,MCU)、感測器等。此外,電子元件110與線路層106之間設置有線路板108。在本實施例中,一個線路板108設置於一個電子元件110與線路層106之間,但本發明不限於此。在其他實施例中,可視實際情況而將多個電子元件110設置於一個線路板108上。
在本實施例中,電子元件110設置於線路板108的中央區域中,且電子元件110的邊緣與線路板108的邊緣之間的距離D不超過線路板108的寬度的20%。在另一實施例中,電子元件110的邊緣與線路板108的邊緣可對齊,亦即距離D為0。也就是說,電子元件110的邊緣與線路板108的邊緣之間的距離D不超過線路板108的寬度的20%,且電子元件110的邊緣不超出線路板108的邊緣。特別是,在多個電子元件110設置於一個線路板108上的情況下,當每一個電子元件110的邊緣與線路板108的邊緣之間的距離D超過線路板108的寬度的20%時,會造成這些電子元件110之間的距離過近而產生短路的問題。此外,當電子元件110的邊緣超出線路板108的邊緣時,在電子元件模組10彎折的情況下,電子元件110的超出線路板108的邊緣的部分會造成下方膜層(例如線路層106)受損甚至斷裂,產生斷路的問題。
此外,在本實施例中,線路板108設置於電子元件110與線路層106之間,可有效地避免用以連接電子元件110與線路層106的凸塊或類似物對線路層106造成損傷。一般來說,電子元件110的表面上具有多個用以電性連接至外部裝置的接墊,且這些接墊通常密集設置而使得凸塊或類似物必須具有較小的尺寸。當這些凸塊或類似物直接與線路層106接觸時,容易刮傷線路層106而對線路層106的電性造成影響。因此,在本實施例中,將電子元件110通過凸塊112或類似物而電性連接至線路板108,且將線路板108通過凸塊114或類似物而電性連接至線路層106。由於線路板108與線路層106之間可具有相對少的接墊且因此凸塊114或類似物可具有較大的尺寸與較少的數量,因此可有效地避免線路層106受到損傷。
另外,在本實施例中,線路板108的厚度例如介於35 μm至180 μm之間。當線路板108的厚度大於180 μm時,線路板108的硬度過大而造成無法扭曲的問題。當線路板108的厚度小於35 μm時,線路板108的厚度過薄而容易在扭曲時破裂。當線路板108的厚度介於35 μm至180 μm之間時,折彎角度可達到150°以上,使得本實施例的可扭曲電子元件模組10具有良好的扭曲度。
在本實施例中,電子元件模組10還可包括設置於絕緣層104上的保護層115。保護層115覆蓋線路層106、線路板108以及電子元件110,並暴露出開口104中的電極圖案層102。保護層115的材料例如是具有防水、導熱、不透濕等特性的材料,且可經由任何合適的方式(例如點膠、噴塗、網版印刷、連續滾壓印刷、3D列印等)來形成於絕緣層104上。
在本實施例中,電子元件模組10還可包括控制器116以及連接控制器116與電極圖案層102的暴露部分(即接點)的連接裝置118。控制器116可視實際需求而包括各種電子元件(例如電池、無線接收器、無線保真(wireless fidelity,WIFI)接收器、藍芽接收器、紅外線接收器、顯示面板等),本發明不對此進行限定。如上文所述,控制器116可提供電壓,以對電子元件110進行控制。連接裝置118可以為任何形式的連接裝置,只要可將控制器116與電極圖案層102的暴露部分電性連接即可。舉例來說,連接裝置118可以是導線(例如銅導線、金導線等)、導電纖維、導電布、低溫焊錫、導電金屬膠、液態金屬封裝體或其組合。
在本實施例中,絕緣層104僅需具有一個開口104a即可暴露出連接至外部裝置的接點。因此,設置於可扭曲基板100上的電極圖案層102可被絕緣層104有效地保護而不易受到損壞。此外,由於開口104a位於絕緣層104的邊緣處,且暴露出位於可扭曲基板100的邊緣處的接點,使得外部裝置可容易地與接點連接。此外,在其他實施例中,絕緣層104的邊緣可具有其他開口,以暴露出用於與另一個電子元件模組連接的接點。如此一來,可藉由電性連接多個電子元件模組來達成大面積應用。
圖2為依照本發明的第二實施例的可扭曲電子元件模組的剖面示意圖。在本實施例中,與第一實施例相同的元件將以相同的元件符號表示,且不再對其進行說明。
請參照圖2,在電子元件模組20中,連接裝置118可為與電極圖案層102的暴露部分(即接點)連接的公頭連接裝置,且連接裝置118可經由具有母頭的導線120而與控制器116電性連接。在其他實施例中,連接裝置118可為母頭連接裝置,且連接裝置118可經由具有公頭的導線120而與控制器116電性連接。此外,保護層122可覆蓋接裝置118與電極圖案層102之間的界面處,以確保連接裝置118與電極圖案層102之間的電性連接。保護層122的材料例如是具有防水、導熱、不透濕等特性的材料,且可經由任何合適的方式(例如點膠、噴塗等)來形成。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
10、20:電子元件模組
100:可扭曲基板
102:電極圖案層
102a、102b:電極
104:絕緣層
104a:開口
106:線路層
108:線路板
110:電子元件
112、114:凸塊
115、122:保護層
116:控制器
118:連接裝置
120:導線
D:距離
圖1A為依照本發明的第一實施例的可扭曲電子元件模組的剖面示意圖。
圖1B為依照本發明的第一實施例的可扭曲電子元件模組中的電極圖案層的上視示意圖。
圖1C為依照本發明的第一實施例的可扭曲電子元件模組的上視示意圖。
圖2為依照本發明的第二實施例的可扭曲電子元件模組的剖面示意圖。
10:電子元件模組
100:可扭曲基板
102a:電極
104:絕緣層
104a:開口
106:線路層
108:線路板
110:電子元件
112、114:凸塊
115:保護層
116:控制器
118:連接裝置
D:距離
Claims (10)
- 一種可扭曲電子元件模組,包括:可扭曲基板;電極圖案層,設置於所述可扭曲基板上;絕緣層,設置於所述電極圖案層上,其中所述絕緣層的邊緣具有開口,所述開口位於所述可扭曲基板的邊緣且暴露所述電極圖案層的一部分;線路層,設置於所述絕緣層上以及所述開口的側壁上,且與所述電極圖案連接;多個線路板,堆疊於所述可扭曲基板上且設置於所述線路層上,且各自與所述線路層電性連接;以及多個電子元件,設置於所述多個線路板上,且各自與所述多個線路板中的對應者電性連接。
- 如請求項1所述的可扭曲電子元件模組,其中所述線路板的厚度介於35μm至180μm之間。
- 如請求項1所述的可扭曲電子元件模組,其中設置於所述線路板上的所述電子元件的邊緣與所述線路板的邊緣之間的距離不超過所述線路板的寬度的20%。
- 如請求項3所述的可扭曲電子元件模組,其中設置於所述線路板上的所述電子元件的邊緣與所述線路板的邊緣對齊。
- 如請求項1所述的可扭曲電子元件模組,其中設置於所述線路板上的所述電子元件的邊緣不超出所述線路板的邊緣。
- 如請求項1所述的可扭曲電子元件模組,其中所述電子元件包括具有主動元件、被動元件或其組合的晶片。
- 如請求項1所述的可扭曲電子元件模組,更包括:控制器;以及連接裝置,連接所述控制器與所述電極圖案層的暴露部分。
- 如請求項7所述的可扭曲電子元件模組,其中所述連接裝置包括導線、導電纖維、導電布、低溫焊錫、導電金屬膠、液態金屬封裝體或其組合。
- 如請求項7所述的可扭曲電子元件模組,更包括保護層,包覆所述連接裝置與所述電極圖案層的連接區域。
- 如請求項1所述的可扭曲電子元件模組,更包括保護層,設置於所述絕緣層上且覆蓋所述線路層、所述多個線路板以及所述多個電子元件,並暴露出所述開口。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110119902A TWI767728B (zh) | 2021-06-01 | 2021-06-01 | 可扭曲電子元件模組 |
US17/377,398 US11546997B2 (en) | 2021-06-01 | 2021-07-16 | Twistable electronic device module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110119902A TWI767728B (zh) | 2021-06-01 | 2021-06-01 | 可扭曲電子元件模組 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI767728B true TWI767728B (zh) | 2022-06-11 |
TW202249554A TW202249554A (zh) | 2022-12-16 |
Family
ID=83103887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110119902A TWI767728B (zh) | 2021-06-01 | 2021-06-01 | 可扭曲電子元件模組 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11546997B2 (zh) |
TW (1) | TWI767728B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106879190A (zh) * | 2012-12-17 | 2017-06-20 | 纬创资通股份有限公司 | 电路板及电路板的制造方法 |
TW202107951A (zh) * | 2019-08-13 | 2021-02-16 | 欣興電子股份有限公司 | 電路板及組裝結構及組裝結構的製造方法 |
US20210067669A1 (en) * | 2016-04-29 | 2021-03-04 | Lg Innotek Co., Ltd. | Camera module having a slim overall structure and portable device comprising same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7980863B1 (en) * | 2008-02-14 | 2011-07-19 | Metrospec Technology, Llc | Printed circuit board flexible interconnect design |
US8941129B1 (en) | 2013-07-19 | 2015-01-27 | Bridgelux, Inc. | Using an LED die to measure temperature inside silicone that encapsulates an LED array |
US20160105950A1 (en) * | 2014-10-10 | 2016-04-14 | Apple Inc. | Electronic Device Having Structured Flexible Substrates With Bends |
TWI682532B (zh) | 2019-07-04 | 2020-01-11 | 國立臺北科技大學 | 可扭曲發光二極體顯示模組 |
-
2021
- 2021-06-01 TW TW110119902A patent/TWI767728B/zh active
- 2021-07-16 US US17/377,398 patent/US11546997B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106879190A (zh) * | 2012-12-17 | 2017-06-20 | 纬创资通股份有限公司 | 电路板及电路板的制造方法 |
US20210067669A1 (en) * | 2016-04-29 | 2021-03-04 | Lg Innotek Co., Ltd. | Camera module having a slim overall structure and portable device comprising same |
TW202107951A (zh) * | 2019-08-13 | 2021-02-16 | 欣興電子股份有限公司 | 電路板及組裝結構及組裝結構的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202249554A (zh) | 2022-12-16 |
US11546997B2 (en) | 2023-01-03 |
US20220386469A1 (en) | 2022-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10510821B2 (en) | Display device | |
US10985194B2 (en) | Display panel and display device | |
WO2017045358A1 (zh) | 柔性基板和显示装置 | |
WO2020156595A9 (zh) | 柔性电路板及制作方法、显示装置、电路板结构及其显示面板 | |
US20190378451A1 (en) | Display device | |
US9972568B2 (en) | Stretchable semiconductor packages and semiconductor devices including the same | |
WO2024120485A1 (zh) | 可挠性线路板、薄膜覆晶封装结构及显示装置 | |
TWI767728B (zh) | 可扭曲電子元件模組 | |
US9129972B2 (en) | Semiconductor package | |
TW201916268A (zh) | 可撓性晶片封裝 | |
US20070252263A1 (en) | Memory package structure | |
CN112241223B (zh) | 显示屏及电子设备 | |
KR20170140764A (ko) | 디스플레이 장치 | |
TWI682532B (zh) | 可扭曲發光二極體顯示模組 | |
TWI676977B (zh) | 可撓式畫素陣列基板及應用其之可撓式顯示面板 | |
US20240098893A1 (en) | Embedded smart module | |
TWI751554B (zh) | 影像顯示器及其拼接式電路承載與控制模組 | |
TWI766275B (zh) | 影像顯示器及其電路承載與控制模組 | |
US20150279775A1 (en) | Screen control module of a mobile electronic device and controller thereof | |
US20170148725A1 (en) | Package of a controller and screen control module with the same | |
CN221264064U (zh) | 可挠性线路板、薄膜覆晶封装结构 | |
EP4095920A1 (en) | Display panel and display apparatus | |
TW201238052A (en) | Active device array substrate | |
JP2009038279A5 (zh) | ||
US20090072335A1 (en) | Image sensor package |