JP2020535666A5 - - Google Patents
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- Publication number
- JP2020535666A5 JP2020535666A5 JP2020538754A JP2020538754A JP2020535666A5 JP 2020535666 A5 JP2020535666 A5 JP 2020535666A5 JP 2020538754 A JP2020538754 A JP 2020538754A JP 2020538754 A JP2020538754 A JP 2020538754A JP 2020535666 A5 JP2020535666 A5 JP 2020535666A5
- Authority
- JP
- Japan
- Prior art keywords
- processing system
- substrate processing
- injector assemblies
- valve
- pulse width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 33
- 230000000712 assembly Effects 0.000 claims 23
- 238000000429 assembly Methods 0.000 claims 23
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024002916A JP7754960B2 (ja) | 2017-09-26 | 2024-01-12 | パルス幅変調されたドーズ制御のためのシステムおよび方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762563129P | 2017-09-26 | 2017-09-26 | |
| US62/563,129 | 2017-09-26 | ||
| US201762590815P | 2017-11-27 | 2017-11-27 | |
| US62/590,815 | 2017-11-27 | ||
| PCT/US2018/052246 WO2019067323A1 (en) | 2017-09-26 | 2018-09-21 | DOSE CONTROL SYSTEMS AND METHODS MODULATED BY TIME PULSES |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024002916A Division JP7754960B2 (ja) | 2017-09-26 | 2024-01-12 | パルス幅変調されたドーズ制御のためのシステムおよび方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020535666A JP2020535666A (ja) | 2020-12-03 |
| JP2020535666A5 true JP2020535666A5 (enExample) | 2021-11-04 |
| JP7421482B2 JP7421482B2 (ja) | 2024-01-24 |
Family
ID=65903780
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020538754A Active JP7421482B2 (ja) | 2017-09-26 | 2018-09-21 | パルス幅変調されたドーズ制御のためのシステムおよび方法 |
| JP2024002916A Active JP7754960B2 (ja) | 2017-09-26 | 2024-01-12 | パルス幅変調されたドーズ制御のためのシステムおよび方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024002916A Active JP7754960B2 (ja) | 2017-09-26 | 2024-01-12 | パルス幅変調されたドーズ制御のためのシステムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US11542598B2 (enExample) |
| EP (3) | EP4235743B1 (enExample) |
| JP (2) | JP7421482B2 (enExample) |
| KR (3) | KR102654894B1 (enExample) |
| CN (2) | CN120854322A (enExample) |
| SG (1) | SG11202002686YA (enExample) |
| TW (3) | TWI829651B (enExample) |
| WO (1) | WO2019067323A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019067323A1 (en) | 2017-09-26 | 2019-04-04 | Lam Research Corporation | DOSE CONTROL SYSTEMS AND METHODS MODULATED BY TIME PULSES |
| EP4367713A4 (en) * | 2021-07-07 | 2026-02-18 | Inficon Inc | UPSTREAM PROCESSING MONITORING FOR DEPOSIT AND ENGRAVING ROOMS |
| US20240203695A1 (en) * | 2022-12-16 | 2024-06-20 | Applied Materials, Inc. | Fast gas switching |
| KR20250148210A (ko) | 2024-04-05 | 2025-10-14 | 주식회사 엘지에너지솔루션 | 배터리 팩 및 이를 포함하는 자동차 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4761269A (en) * | 1986-06-12 | 1988-08-02 | Crystal Specialties, Inc. | Apparatus for depositing material on a substrate |
| US6197123B1 (en) * | 1997-12-18 | 2001-03-06 | Texas Instruments Incorporated | Method for cleaning a process chamber used for manufacturing substrates during nonproduction intervals |
| JP3830670B2 (ja) * | 1998-09-03 | 2006-10-04 | 三菱電機株式会社 | 半導体製造装置 |
| US6348098B1 (en) * | 1999-01-20 | 2002-02-19 | Mykrolis Corporation | Flow controller |
| US6143080A (en) * | 1999-02-02 | 2000-11-07 | Silicon Valley Group Thermal Systems Llc | Wafer processing reactor having a gas flow control system and method |
| US6706541B1 (en) | 1999-10-20 | 2004-03-16 | Advanced Micro Devices, Inc. | Method and apparatus for controlling wafer uniformity using spatially resolved sensors |
| US20040224504A1 (en) * | 2000-06-23 | 2004-11-11 | Gadgil Prasad N. | Apparatus and method for plasma enhanced monolayer processing |
| US6333272B1 (en) | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US20030116089A1 (en) | 2001-12-04 | 2003-06-26 | Walther Steven R. | Plasma implantation system and method with target movement |
| US20030101935A1 (en) * | 2001-12-04 | 2003-06-05 | Walther Steven R. | Dose uniformity control for plasma doping systems |
| US20040040502A1 (en) * | 2002-08-29 | 2004-03-04 | Micron Technology, Inc. | Micromachines for delivering precursors and gases for film deposition |
| US20040040503A1 (en) * | 2002-08-29 | 2004-03-04 | Micron Technology, Inc. | Micromachines for delivering precursors and gases for film deposition |
| US20040050325A1 (en) * | 2002-09-12 | 2004-03-18 | Samoilov Arkadii V. | Apparatus and method for delivering process gas to a substrate processing system |
| US7628860B2 (en) * | 2004-04-12 | 2009-12-08 | Mks Instruments, Inc. | Pulsed mass flow delivery system and method |
| JP4502189B2 (ja) | 2004-06-02 | 2010-07-14 | ルネサスエレクトロニクス株式会社 | 薄膜の形成方法および半導体装置の製造方法 |
| US7228645B2 (en) * | 2005-01-11 | 2007-06-12 | Xuyen Ngoc Pham | Multi-zone shower head for drying single semiconductor substrate |
| US8088223B2 (en) | 2005-03-10 | 2012-01-03 | Asm America, Inc. | System for control of gas injectors |
| US7846497B2 (en) | 2007-02-26 | 2010-12-07 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a processing chamber |
| US8486191B2 (en) * | 2009-04-07 | 2013-07-16 | Asm America, Inc. | Substrate reactor with adjustable injectors for mixing gases within reaction chamber |
| US9303319B2 (en) * | 2010-12-17 | 2016-04-05 | Veeco Instruments Inc. | Gas injection system for chemical vapor deposition using sequenced valves |
| US9840778B2 (en) * | 2012-06-01 | 2017-12-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma chamber having an upper electrode having controllable valves and a method of using the same |
| US9488315B2 (en) * | 2013-03-15 | 2016-11-08 | Applied Materials, Inc. | Gas distribution apparatus for directional and proportional delivery of process gas to a process chamber |
| US9624805B2 (en) * | 2014-08-26 | 2017-04-18 | Caterpillar Inc. | Aftertreatment system having dynamic independent injector control |
| JP6502779B2 (ja) | 2015-07-29 | 2019-04-17 | 東京エレクトロン株式会社 | ガス供給系のバルブのリークを検査する方法 |
| US20170092470A1 (en) | 2015-09-28 | 2017-03-30 | Applied Materials, Inc. | Plasma reactor for processing a workpiece with an array of plasma point sources |
| US10256075B2 (en) * | 2016-01-22 | 2019-04-09 | Applied Materials, Inc. | Gas splitting by time average injection into different zones by fast gas valves |
| US10453721B2 (en) * | 2016-03-15 | 2019-10-22 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10403476B2 (en) | 2016-11-09 | 2019-09-03 | Lam Research Corporation | Active showerhead |
| WO2019067323A1 (en) | 2017-09-26 | 2019-04-04 | Lam Research Corporation | DOSE CONTROL SYSTEMS AND METHODS MODULATED BY TIME PULSES |
-
2018
- 2018-09-21 WO PCT/US2018/052246 patent/WO2019067323A1/en not_active Ceased
- 2018-09-21 EP EP23173746.1A patent/EP4235743B1/en active Active
- 2018-09-21 EP EP24174495.2A patent/EP4391011A3/en not_active Withdrawn
- 2018-09-21 SG SG11202002686YA patent/SG11202002686YA/en unknown
- 2018-09-21 KR KR1020207012048A patent/KR102654894B1/ko active Active
- 2018-09-21 JP JP2020538754A patent/JP7421482B2/ja active Active
- 2018-09-21 CN CN202510700386.5A patent/CN120854322A/zh active Pending
- 2018-09-21 US US16/650,328 patent/US11542598B2/en active Active
- 2018-09-21 EP EP18860772.5A patent/EP3688794B1/en active Active
- 2018-09-21 KR KR1020257030846A patent/KR102994497B1/ko active Active
- 2018-09-21 KR KR1020247010982A patent/KR102861934B1/ko active Active
- 2018-09-21 CN CN201880062506.1A patent/CN111164743B/zh active Active
- 2018-09-25 TW TW107133589A patent/TWI829651B/zh active
- 2018-09-25 TW TW112149941A patent/TWI869129B/zh active
- 2018-09-25 TW TW113145967A patent/TWI907178B/zh active
-
2023
- 2023-01-02 US US18/092,413 patent/US11834736B2/en active Active
- 2023-12-01 US US18/526,411 patent/US12215421B2/en active Active
-
2024
- 2024-01-12 JP JP2024002916A patent/JP7754960B2/ja active Active
-
2025
- 2025-01-31 US US19/042,959 patent/US20250179634A1/en active Pending
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