JP2020531298A5 - - Google Patents

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Publication number
JP2020531298A5
JP2020531298A5 JP2020511324A JP2020511324A JP2020531298A5 JP 2020531298 A5 JP2020531298 A5 JP 2020531298A5 JP 2020511324 A JP2020511324 A JP 2020511324A JP 2020511324 A JP2020511324 A JP 2020511324A JP 2020531298 A5 JP2020531298 A5 JP 2020531298A5
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JP
Japan
Prior art keywords
protrusions
main surface
article according
polishing pad
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020511324A
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English (en)
Japanese (ja)
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JP2020531298A (ja
JP7273796B2 (ja
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Publication date
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Priority claimed from PCT/IB2018/056320 external-priority patent/WO2019038675A1/en
Publication of JP2020531298A publication Critical patent/JP2020531298A/ja
Publication of JP2020531298A5 publication Critical patent/JP2020531298A5/ja
Application granted granted Critical
Publication of JP7273796B2 publication Critical patent/JP7273796B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020511324A 2017-08-25 2018-08-21 表面突起研磨パッド Active JP7273796B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762550055P 2017-08-25 2017-08-25
US62/550,055 2017-08-25
PCT/IB2018/056320 WO2019038675A1 (en) 2017-08-25 2018-08-21 SURFACE SURFACE SURFACE POLISHING PAD

Publications (3)

Publication Number Publication Date
JP2020531298A JP2020531298A (ja) 2020-11-05
JP2020531298A5 true JP2020531298A5 (https=) 2021-09-30
JP7273796B2 JP7273796B2 (ja) 2023-05-15

Family

ID=65439977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020511324A Active JP7273796B2 (ja) 2017-08-25 2018-08-21 表面突起研磨パッド

Country Status (4)

Country Link
US (1) US12048980B2 (https=)
JP (1) JP7273796B2 (https=)
CN (1) CN111032285B (https=)
WO (1) WO2019038675A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230106863A (ko) * 2022-01-07 2023-07-14 삼성전자주식회사 연마 패드, 그를 포함하는 화학적 기계적 연마 장치, 및 그를 이용하는 반도체 소자의 제조 방법
US20230219189A1 (en) * 2022-01-07 2023-07-13 Applied Materials, Inc. Apparatus and method for selective material removal during polishing

Family Cites Families (37)

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US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US6206759B1 (en) 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
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