JP2020527461A5 - - Google Patents
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- Publication number
- JP2020527461A5 JP2020527461A5 JP2019567274A JP2019567274A JP2020527461A5 JP 2020527461 A5 JP2020527461 A5 JP 2020527461A5 JP 2019567274 A JP2019567274 A JP 2019567274A JP 2019567274 A JP2019567274 A JP 2019567274A JP 2020527461 A5 JP2020527461 A5 JP 2020527461A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- soldering material
- copper
- soldering
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims 19
- 238000005476 soldering Methods 0.000 claims 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 10
- 229910052802 copper Inorganic materials 0.000 claims 10
- 239000010949 copper Substances 0.000 claims 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 7
- 239000010936 titanium Substances 0.000 claims 7
- 229910052719 titanium Inorganic materials 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052738 indium Inorganic materials 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000011572 manganese Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 229910052706 scandium Inorganic materials 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017114893.0A DE102017114893B4 (de) | 2017-07-04 | 2017-07-04 | Lötmaterial zum Aktivlöten und Verfahren zum Aktivlöten |
| DE102017114893.0 | 2017-07-04 | ||
| PCT/EP2018/068020 WO2019008003A1 (de) | 2017-07-04 | 2018-07-04 | Lötmaterial zum aktivlöten und verfahren zum aktivlöten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020527461A JP2020527461A (ja) | 2020-09-10 |
| JP2020527461A5 true JP2020527461A5 (cg-RX-API-DMAC7.html) | 2020-11-26 |
| JP7093796B2 JP7093796B2 (ja) | 2022-06-30 |
Family
ID=62816572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019567274A Active JP7093796B2 (ja) | 2017-07-04 | 2018-07-04 | 活性ハンダ付けのためのハンダ付け材料、及び活性ハンダ付け方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11338397B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3609647B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7093796B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20200027529A (cg-RX-API-DMAC7.html) |
| CN (1) | CN110891733B (cg-RX-API-DMAC7.html) |
| DE (1) | DE102017114893B4 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2019008003A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020111698A1 (de) | 2020-04-29 | 2021-11-04 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren |
| DE102020120188B4 (de) | 2020-07-30 | 2024-08-01 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Trägersubstrats und ein Trägersubstrat hergestellt mit einem solchen Verfahren |
| CN112059470A (zh) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | 钛酸盐微波介质陶瓷与金属钎焊用活性钎料及其制备方法 |
| CN112427759B (zh) * | 2020-10-27 | 2022-08-26 | 哈尔滨工业大学 | 一种ZrC-SiC陶瓷与TC4钛合金钎焊方法 |
| EP4032870A1 (de) | 2021-01-22 | 2022-07-27 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur strukturierung von metall-keramik-substraten und strukturiertes metall-keramik-substrat |
| JP7596515B2 (ja) * | 2021-03-30 | 2024-12-09 | 株式会社東芝 | セラミックス回路基板の製造方法 |
| JP7707671B2 (ja) * | 2021-06-10 | 2025-07-15 | 三菱マテリアル株式会社 | 銅合金粉末、および、積層造形物 |
| EP4112587A1 (de) | 2021-06-29 | 2023-01-04 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats mittels schnellem heizen |
| EP4112586A1 (de) | 2021-06-29 | 2023-01-04 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats mittels einem durchlaufofen |
| WO2023074470A1 (ja) * | 2021-10-25 | 2023-05-04 | 株式会社 東芝 | セラミックス銅回路基板およびそれを用いた半導体装置 |
| EP4186880A1 (de) | 2021-11-26 | 2023-05-31 | Heraeus Deutschland GmbH & Co. KG | Metall-keramik-substrat, verfahren zu dessen herstellung und modul |
| CN114952077B (zh) * | 2022-04-14 | 2024-06-21 | 天诺光电材料股份有限公司 | 一种复合钎焊膏及其制备方法和应用 |
| EP4311819A1 (de) | 2022-07-29 | 2024-01-31 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4311818A1 (de) | 2022-07-29 | 2024-01-31 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4332267B1 (de) | 2022-09-05 | 2025-05-14 | Heraeus Electronics GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats |
| EP4421054A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| EP4421055A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| DE102023104436A1 (de) | 2023-02-23 | 2024-08-29 | Heraeus Deutschland GmbH & Co. KG | Metall-Keramik-Substrat mit sinterbarer Oberseite |
| EP4421056A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit sinterbarer oberseite |
| EP4593075A1 (de) | 2024-01-24 | 2025-07-30 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4593076A1 (de) | 2024-01-24 | 2025-07-30 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| TWI863823B (zh) * | 2024-02-06 | 2024-11-21 | 同欣電子工業股份有限公司 | 活性金屬陶瓷基板的製造方法 |
| TWI876868B (zh) * | 2024-02-06 | 2025-03-11 | 同欣電子工業股份有限公司 | 金屬陶瓷基板及其製造方法 |
| KR20250155381A (ko) * | 2024-04-23 | 2025-10-30 | 주식회사 케이씨씨 | 금속 페이스트 조성물 및 이를 포함하는 금속-세라믹 복합 기판 |
| EP4663620A1 (de) | 2024-06-11 | 2025-12-17 | Heraeus Electronics GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats und metall-keramik-substrat |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2457198C2 (de) * | 1974-12-04 | 1983-10-20 | Institut problem materialovedenija Akademii Nauk Ukrainskoj SSR, Kiev | Legierung zum Metallisieren und Löten von überharten Werkstoffen |
| FR2298609A1 (fr) * | 1975-01-22 | 1976-08-20 | Inst Materialovedeni | Alliage pour la metallisation et le brasage des materiaux abrasifs |
| US4603990A (en) | 1982-09-10 | 1986-08-05 | Kotobuki & Co., Ltd. | Mechanical pencil with refill cartridge |
| US4426033A (en) * | 1982-09-20 | 1984-01-17 | Gte Products Corporation | Ductile titanium-copper brazing alloy |
| US4661416A (en) | 1984-04-05 | 1987-04-28 | Gte Products Corporation | Ductile reactive metal-indium-copper brazing alloy article |
| US4603090A (en) * | 1984-04-05 | 1986-07-29 | Gte Products Corporation | Ductile titanium-indium-copper brazing alloy |
| EP0185954B1 (de) | 1984-12-22 | 1990-03-14 | Vacuumschmelze GmbH | Rasch abgeschreckte duktile Lötfolie |
| DE3608559A1 (de) * | 1986-03-14 | 1987-09-17 | Kernforschungsanlage Juelich | Verfahren zum verbinden von formteilen aus sic mit keramik oder metall und zur oberflaechenbehandlung von sisic sowie eine zum verbinden brauchbare legierung |
| US5013612A (en) * | 1989-11-13 | 1991-05-07 | Ford Motor Company | Braze material for joining ceramic to metal and ceramic to ceramic surfaces and joined ceramic to metal and ceramic to ceramic article |
| US5102621A (en) | 1990-12-21 | 1992-04-07 | Ucar Carbon Technology Corporation | Ternary brazing alloy for carbon or graphite |
| JPH04238877A (ja) | 1991-01-08 | 1992-08-26 | Sumitomo Metal Ind Ltd | ＡｌＮ部材とＣｕ部材の接合体とその製造方法 |
| JP3095187B2 (ja) | 1991-07-30 | 2000-10-03 | 同和鉱業株式会社 | 金属・セラミックス接合用ろう材 |
| CN1027797C (zh) | 1992-03-25 | 1995-03-08 | 中国科学院金属研究所 | 可焊接陶瓷的耐氧化型活性金属钎料 |
| JP3790000B2 (ja) * | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
| DE19729545A1 (de) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Lotlegierung |
| US5832360A (en) * | 1997-08-28 | 1998-11-03 | Norton Company | Bond for abrasive tool |
| US6187071B1 (en) * | 1999-01-14 | 2001-02-13 | Norton Company | Bond for abrasive tool |
| JP2003283064A (ja) | 2002-03-26 | 2003-10-03 | Ngk Spark Plug Co Ltd | セラミック回路基板及びその製造方法 |
| JP2003305588A (ja) | 2002-04-11 | 2003-10-28 | Fujitsu Ltd | 接合材料 |
| EP2055725A1 (en) | 2007-11-05 | 2009-05-06 | Total Petrochemicals Research Feluy | Reduced blockage when transferring polymer product from one reactor to another |
| EP2727898B1 (en) | 2011-06-30 | 2017-02-01 | Hitachi Metals, Ltd. | Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, and ceramic master circuit substrate |
| CN102554385B (zh) * | 2011-12-13 | 2013-09-04 | 河南科技大学 | 一种金属陶瓷复合衬板的钎焊铸接工艺 |
| CN104718615B (zh) * | 2012-10-04 | 2018-01-02 | 株式会社东芝 | 半导体电路板及其制造方法和使用其的半导体装置 |
| DE102012110322B4 (de) | 2012-10-29 | 2014-09-11 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP6127833B2 (ja) * | 2013-08-26 | 2017-05-17 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
| CN105980334B (zh) * | 2014-02-12 | 2017-10-31 | 三菱综合材料株式会社 | 铜‑陶瓷接合体及功率模块用基板 |
| KR102300413B1 (ko) * | 2014-03-20 | 2021-09-08 | 미쓰비시 마테리알 가부시키가이샤 | 접합체, 파워 모듈용 기판, 파워 모듈 및 접합체의 제조 방법 |
| DE102015108668B4 (de) * | 2015-06-02 | 2018-07-26 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Verbundmaterials |
-
2017
- 2017-07-04 DE DE102017114893.0A patent/DE102017114893B4/de active Active
-
2018
- 2018-07-04 US US16/628,554 patent/US11338397B2/en active Active
- 2018-07-04 KR KR1020207003138A patent/KR20200027529A/ko not_active Ceased
- 2018-07-04 JP JP2019567274A patent/JP7093796B2/ja active Active
- 2018-07-04 EP EP18737251.1A patent/EP3609647B1/de active Active
- 2018-07-04 WO PCT/EP2018/068020 patent/WO2019008003A1/de not_active Ceased
- 2018-07-04 CN CN201880044903.6A patent/CN110891733B/zh active Active
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