JP2003115216A5 - - Google Patents
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- Publication number
- JP2003115216A5 JP2003115216A5 JP2002209269A JP2002209269A JP2003115216A5 JP 2003115216 A5 JP2003115216 A5 JP 2003115216A5 JP 2002209269 A JP2002209269 A JP 2002209269A JP 2002209269 A JP2002209269 A JP 2002209269A JP 2003115216 A5 JP2003115216 A5 JP 2003115216A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- powder
- photosensitive conductive
- metal
- metal compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims description 9
- 150000002736 metal compounds Chemical class 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002209269A JP2003115216A (ja) | 2001-07-19 | 2002-07-18 | 導電ペースト |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001219296 | 2001-07-19 | ||
| JP2001-219296 | 2001-07-19 | ||
| JP2002209269A JP2003115216A (ja) | 2001-07-19 | 2002-07-18 | 導電ペースト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003115216A JP2003115216A (ja) | 2003-04-18 |
| JP2003115216A5 true JP2003115216A5 (cg-RX-API-DMAC7.html) | 2005-10-27 |
Family
ID=26618991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002209269A Pending JP2003115216A (ja) | 2001-07-19 | 2002-07-18 | 導電ペースト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003115216A (cg-RX-API-DMAC7.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7683107B2 (en) * | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
| KR101093502B1 (ko) * | 2004-03-09 | 2011-12-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 고체 전해콘덴서 및 그 용도 |
| WO2005086191A1 (en) * | 2004-03-09 | 2005-09-15 | Showa Denko K.K. | Solid electrolytic capacitor and the use thereof |
| JP5127261B2 (ja) * | 2007-02-22 | 2013-01-23 | 京セラ株式会社 | 光電変換モジュールの製造方法 |
| JP5119526B2 (ja) * | 2007-03-07 | 2013-01-16 | Ｄｏｗａエレクトロニクス株式会社 | 銀粉およびその製造方法 |
| JP5144857B2 (ja) * | 2010-03-01 | 2013-02-13 | 株式会社ノリタケカンパニーリミテド | 太陽電池用導電性ペースト組成物 |
| TWI618095B (zh) | 2012-10-19 | 2018-03-11 | 納美仕有限公司 | 導電性糊料、印刷線路板及電子裝置 |
| JP6197504B2 (ja) * | 2013-09-04 | 2017-09-20 | 旭硝子株式会社 | 導電性ペーストおよび導電膜付き基材 |
| EP3121819B1 (en) | 2014-03-20 | 2019-12-25 | Namics Corporation | Conductive paste, processes using the conductive paste and uses of the conductive paste for forming a laminated ceramic component, printed wiring board and electronic device |
| EP3419028B1 (en) | 2016-02-17 | 2021-01-06 | Namics Corporation | Conductive paste |
| CN114930467B (zh) * | 2020-01-16 | 2025-11-11 | 纳美仕有限公司 | 导电性膏、电极以及贴片电阻器 |
| WO2022191001A1 (ja) * | 2021-03-10 | 2022-09-15 | Ｄｏｗａエレクトロニクス株式会社 | 銀粉及びその製造方法 |
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2002
- 2002-07-18 JP JP2002209269A patent/JP2003115216A/ja active Pending