JP2003115216A5 - - Google Patents
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- Publication number
- JP2003115216A5 JP2003115216A5 JP2002209269A JP2002209269A JP2003115216A5 JP 2003115216 A5 JP2003115216 A5 JP 2003115216A5 JP 2002209269 A JP2002209269 A JP 2002209269A JP 2002209269 A JP2002209269 A JP 2002209269A JP 2003115216 A5 JP2003115216 A5 JP 2003115216A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- powder
- photosensitive conductive
- metal
- metal compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
【０００８】
【課題を解決するための手段】上記課題を解決するため、本発明は以下の構成からなる。すなわち本発明は、バインダー樹脂、Ａｇ粉末、およびＴｉ、Ｎｉ、Ｉｎ、Ｓｎ、Ｓｂの群から選ばれる少なくとも１種の金属または金属の化合物を含有することを特徴とする感光性導電ペーストである。
0008
Means for Solving the Problems In order to solve the above problems, the present invention has the following configuration. That is, the present invention is a photosensitive conductive paste containing a binder resin, Ag powder, and at least one metal or metal compound selected from the group Ti, Ni, In, Sn, Sb.
実施例２〜２０および実施例２２〜２７は、表１に示す項目について、実施例１の条件を変更して行ったほかは実施例１と同様にして行った。 Examples 2 to 2 0 and Example 2 2 to 27, for the items shown in Table 1, except that was performed by changing the conditions of Example 1 were carried out in the same manner as in Example 1.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002209269A JP2003115216A (en) | 2001-07-19 | 2002-07-18 | Conductive paste |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-219296 | 2001-07-19 | ||
| JP2001219296 | 2001-07-19 | ||
| JP2002209269A JP2003115216A (en) | 2001-07-19 | 2002-07-18 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003115216A JP2003115216A (en) | 2003-04-18 |
| JP2003115216A5 true JP2003115216A5 (en) | 2005-10-27 |
Family
ID=26618991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002209269A Pending JP2003115216A (en) | 2001-07-19 | 2002-07-18 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003115216A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7683107B2 (en) * | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
| JP4655689B2 (en) * | 2004-03-09 | 2011-03-23 | 株式会社村田製作所 | Solid electrolytic capacitor and its use |
| WO2005086191A1 (en) * | 2004-03-09 | 2005-09-15 | Showa Denko K.K. | Solid electrolytic capacitor and the use thereof |
| JP5127261B2 (en) * | 2007-02-22 | 2013-01-23 | 京セラ株式会社 | Manufacturing method of photoelectric conversion module |
| JP5119526B2 (en) * | 2007-03-07 | 2013-01-16 | Ｄｏｗａエレクトロニクス株式会社 | Silver powder and method for producing the same |
| JP5144857B2 (en) * | 2010-03-01 | 2013-02-13 | 株式会社ノリタケカンパニーリミテド | Conductive paste composition for solar cell |
| CN104737238A (en) | 2012-10-19 | 2015-06-24 | 纳美仕有限公司 | Electroconductive paste |
| JP6197504B2 (en) * | 2013-09-04 | 2017-09-20 | 旭硝子株式会社 | Conductive paste and substrate with conductive film |
| CN106104702B (en) | 2014-03-20 | 2021-03-30 | 纳美仕有限公司 | Conductive paste, laminated ceramic component, printed wiring board, and electronic device |
| CN108604475B (en) | 2016-02-17 | 2020-09-25 | 纳美仕有限公司 | Conductive paste |
| JPWO2021145269A1 (en) * | 2020-01-16 | 2021-07-22 | ||
| EP4306239A1 (en) | 2021-03-10 | 2024-01-17 | DOWA Electronics Materials Co., Ltd. | Silver powder and production method therefor |
-
2002
- 2002-07-18 JP JP2002209269A patent/JP2003115216A/en active Pending
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