JP2020526429A - 導電性コイルを有する3d物品を製造する方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
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- B29C64/336—Feeding of two or more materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
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- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3468—Batteries, accumulators or fuel cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3487—Resistors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Engineering & Computer Science (AREA)
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- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
Description
Claims (11)
- 熱溶解積層法3Dプリンタを使用して3D物品を製造する方法であって、前記3D物品が、導電性ワイヤの少なくとも一部の導電性コイルを含み、前記方法が、
印刷段階中に、前記導電性コイルを含む前記3D物品を供給するよう、3D印刷可能材料を印刷するステップを含み、
前記3D印刷可能材料が、前記導電性ワイヤ、及び前記導電性ワイヤと導電接触する電子部品を含む方法。 - 前記熱溶解積層法3Dプリンタが、プリンタノズルを備えるプリンタヘッドを有し、前記方法が、
前記プリンタヘッドにおいて、フィラメントと、前記電子部品を含む前記導電性ワイヤとを組み合わせることによって、前記3D印刷可能材料を供給するステップを更に含む請求項1に記載の方法。 - 前記熱溶解積層法3Dプリンタが、プリンタノズルを備えるプリンタヘッドを有し、前記方法が、
フィラメントと、前記電子部品を含む前記導電性ワイヤとを別々の経路を介して前記ノズルに供給するステップ、及び
前記プリンタノズルの下流で、前記フィラメントと、前記電子部品を含む前記導電性ワイヤとを組み合わせることによって、前記3D印刷可能材料を供給するステップを更に含む請求項1に記載の方法。 - 前記電子部品が、熱電対、サーモパイル、抵抗器、トランジスタ、ダイオード、バッテリ、コンデンサ、スーパーキャパシタ、加熱抵抗器、ホールセンサ、太陽電池、有機半導体、加速度計、電子コンパス、ジャイロスコープ、及び電子回路のうちの1つ以上を備える請求項1乃至3のいずれか一項に記載の方法。
- 前記電子部品が、又は前記電子部品及び前記導電性ワイヤが共に、少なくとも前記熱溶解積層法3Dプリンタのプリンタヘッドの長さの長さを有する請求項1乃至4のいずれか一項に記載の方法。
- 電気回路生成段階を更に含み、前記電気回路生成段階が、電子部品を含む電気回路を供給するよう、前記導電性ワイヤのワイヤ部分を別の導電性部分と関連付けることを含む請求項1乃至5のいずれか一項に記載の方法。
- 前記電気回路生成段階が、前記ワイヤ部をリードフレームに関連付けることを含み、前記電子部品が、リードフレームと機能的に結合され、前記電気回路生成段階が、前記ワイヤ部の少なくとも一部を前記リードフレームの受容部内に含む3D印刷可能材料のフィラメントを前記3Dプリンタのプリンタノズルで押圧することを含む請求項6に記載の方法。
- 前記印刷段階中に、3D印刷材料をコイル構成で供給し、それによって、前記導電性コイルを供給するよう、前記導電性ワイヤを含む前記3D印刷可能材料の印刷を制御することを含む請求項1乃至7のいずれか一項に記載の方法。
- 前記3D印刷可能材料が前記導電性コイルを含む請求項1乃至7のいずれか一項に記載の方法。
- 前記導電性ワイヤの少なくとも一部が、前記3D印刷可能材料がフィラメント伸長段階において伸ばされるときに前記導電性ワイヤの伸長を可能にする圧縮状態にある請求項1乃至9のいずれか一項に記載の方法。
- 前記導電性ワイヤが、前記3Dプリンタのプリンタノズルの下流でフィラメントの前記3D印刷可能材料に埋め込まれた前記導電性ワイヤを維持するための安定要素を含む請求項1乃至10のいずれか一項に記載の方法。
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EP17185829 | 2017-08-11 | ||
EP17185829.3 | 2017-08-11 | ||
PCT/EP2018/069889 WO2019029979A1 (en) | 2017-08-11 | 2018-07-23 | METHOD FOR MANUFACTURING A 3D ARTICLE HAVING AN ELECTROCONDUCTIVE COIL |
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EP (1) | EP3664989B1 (ja) |
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US10894365B2 (en) | 2018-08-22 | 2021-01-19 | Nxp B.V. | Method for embedding an integrated circuit into a 3D-printed object |
US11358330B2 (en) * | 2019-03-15 | 2022-06-14 | GM Global Technology Operations LLC | Filament deposition head and method of depositing filament material for joining workpieces |
US20240009926A1 (en) * | 2020-11-13 | 2024-01-11 | Signify Holding B.V. | Fdm manufactured light reflective surfaces |
EP4295167A1 (en) * | 2021-02-19 | 2023-12-27 | Katholieke Universiteit Leuven | 3d printed mri coil, phantom and shimming element |
GB2610794A (en) * | 2021-05-02 | 2023-03-22 | Zephlinear Ltd | Method of manufacturing hybrid additive fabric, the fabric, and tools for manufacturing fabric |
EP4108984A1 (en) | 2021-06-24 | 2022-12-28 | Abb Schweiz Ag | Electronic cover |
EP4116063A1 (en) * | 2021-07-07 | 2023-01-11 | ACMIT Gmbh | Method for the additive manufacturing of a shaped body |
CN115351291A (zh) * | 2022-09-02 | 2022-11-18 | 西安交通大学 | 一种基于金属丝连续纤维3d打印工艺的电子元件制备方法 |
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JP2016531770A (ja) * | 2013-06-24 | 2016-10-13 | プレジデント アンド フェローズ オブ ハーバード カレッジ | 印刷3次元(3d)機能部品および製造方法 |
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CN111032317B (zh) | 2022-04-26 |
CN111032317A (zh) | 2020-04-17 |
US20200361138A1 (en) | 2020-11-19 |
JP6806954B2 (ja) | 2021-01-06 |
US11376785B2 (en) | 2022-07-05 |
EP3664989A1 (en) | 2020-06-17 |
WO2019029979A1 (en) | 2019-02-14 |
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