M354298 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種立體線路板。特別是，關於一種具 有立體形狀之立體線路板。 【先前技術】 . 電路板被視為是電子裝置之核心元件。已知有多種不 ® 同形式之電路板，例如埋入式電路結構或是具有多層線路 之立體電路結構。一種已知埋入式電路結構的製作方式稱 為壓印法。 在壓印法的製作過程中，首先提供具有金屬箔覆的基 材。之後，使用圖案化壓模，在金屬箔覆的基材上壓印出 預定的線路圖案，線路圖案即埋入基材中，因此稱為埋入 | 式電路結構。另外，為了要完成線路圖案間的電絕緣，還 — 會進一步移除留在基材外表面、未隨線路圖案埋入基材中 - 的多餘金屬箔。至此，埋入式電路結構於焉成形。雖然， 此等埋入式電路結構的製璋方法簡單又快速，然而，為了 要遷就圖案化壓模，所形成的埋入式電路結構通常是平面 的。 另一方面，一般立體電路結構，其線路製作方式都是 沿著立體塑件表面製作單一層線路。利用金屬嵌入式（insert 5 M354298 molding)塑膠射出成形所製得的内埋式導線結構，也通常 都為單層簡單的導電線路。 因此，希望能提出另外一種具有立體形狀之立體線路 板。 【新型内容】 本創作於是提出一種具有立體形狀之立體線路板。本 創作之立體線路板，包含具有單層或兩層以上的導電物之 平面或立體型核心電路板、與核心電路板電連接之電子元 件、以及立體覆材’其包覆電子元件，並選擇性包覆核心 電路板而部份暴露核心電路板，以形成立體線路板。而核 心電路板、立體覆材可以是具有單面或雙面之平面線路或 立體線路。 【實施方式】 請參考第1圖，例示本創作具有立體形狀之立體線路 板。本創作之立體線路板1〇〇，包含核心電路板11()、電子 元件120、以及立體覆材13〇。核心電路板位於立體線 路板100之中，其自身具有導電物U1。導電物U1可以經 過圖案化而形成導電線路。視情況需要，核心電路板11 〇 本身可以具有多種構形，例如為平面型或是立體型。導電 物111可以為一般之導電材料，例如銅或是鋁。 6 M354298 立體線路板100之中還有電子元件120，其與核心電 路板110電連接，使得立體線路板100產生預定之功能。 電子元件120可以為主動元件，例如二極體、電晶體、積 體電路…等等，或是被動元件，例如電阻、電感、電容， 或其組合。電子元件120還可以是電源供應器，例如電池， 彼此結合之後作為數位訊號處理用途。 立體覆材130不但包覆電子元件120，還選擇性包覆 核心電路板110又同時部份暴露核心電路板110,而較佳地 暴露部份之導電物111，以形成立體線路板100。立體覆材 130通常為非導電材料，例如聚縮醛（P〇m)、聚辦笨二甲 酸丁二酯（PBT)、聚對苯二甲酸乙二酯（PET)、聚碳酸醋 (Polycarbonate，PC)、環狀烯烴共聚物（COC)、聚苯硫醚 (PPS )、聚醢胺（pa、PA6 )、耐綸、丙烯腈-丁二稀-苯乙 烯共聚物（acrylonitrile-butadiene-styrene copolymers, ABS )、熱致性液晶聚合物（HqUid crystal polyester, LCP )… 等等多種塑膠。另一方面，立體覆材130還可以含有可以 被雷射活化之金屬前驅物，例如金屬觸媒，其可為鈀錯合 物、銅、鋁或其他金屬或彼此混合之氧化物、錯合物或金 屬氮化物等等，作為額外界定線路之用。 可以使用射出成形的技術，使得立體覆材130形成同 時包覆電子元件120與核心電路板11〇之結構，以建構立 7 M354298 體線路板100。 立體覆材13G所部份暴露出之核^電路板110，可以 視情況需要，建立所欲之用途。第2圖例示本創作具有立 體升v狀之立體線路板之一較佳實施例。如第2圖所示，當 -立體線路板100具有偵測的功能時，導電物111可以為抗 化性的偵測器112，其裸露在立體覆材13〇之外，則貞測 外界環境的變化，例如溫度、溼度…等等。 且在本創作一較佳實施例中，立體線路板100還可以額 外具有-護蓋113，以保護暴露之導電物lu。例如，護蓋 113帽蓋住立體線路板100之偵測器112,以保護偵測器 112 ’如第3圖所示。 在本創作一另較佳實施例中，立體線路板100還可以 額外具有-外部元件14〇。外部元件14〇位於立體覆材削 上並與核心電路板11〇電連接，如第4圖所示。外部元件 亦可Μ為主動元件或是被動元件或是導電線路層，例 :燈#_，以辅助立體線路板⑽的功能。本創 ®穿Γ二立二覆：130上錢孔的方式’或是以金屬導 所需的電2 雷射成孔的方式’以形成外部元件140 8 M354298 以上所述僅為本創作之較佳實施例，凡依本創作申請專利範 圍所做之均等變化與修飾，皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第1圖例示本創作具有立體形狀之立體線路板。 第2-4圖例示本創作具有立體形狀之立體線路板之多 種較佳實施例。 【主要元件符號說明】 110核心電路板 112偵測器 120電子元件 140外部元件 100立體線路板 111導電物 113護蓋 130立體覆材M354298 VIII. New description: [New technical field] This creation is about a three-dimensional circuit board. In particular, it relates to a three-dimensional wiring board having a three-dimensional shape. [Prior Art] A circuit board is considered to be a core component of an electronic device. A variety of circuit boards of the same type are known, such as buried circuit structures or three-dimensional circuit structures with multiple layers. A known buried circuit structure is referred to as an imprint method. In the production process of the imprint method, a substrate having a metal foil is first provided. Thereafter, a predetermined pattern is embossed on the metal foil-coated substrate by using a patterned stamper, and the wiring pattern is buried in the substrate, which is called a buried circuit structure. In addition, in order to complete the electrical insulation between the wiring patterns, the excess metal foil remaining on the outer surface of the substrate and not embedded in the substrate with the wiring pattern is further removed. At this point, the buried circuit structure is formed in the crucible. Although the method of fabricating these buried circuit structures is simple and fast, the buried circuit structure formed is generally planar in order to accommodate the patterned stamper. On the other hand, the general three-dimensional circuit structure is formed by making a single layer line along the surface of the three-dimensional plastic part. Buried conductor structures made by insert molding using metal inserts (insert 5 M354298 molding) are also usually single-layer simple conductive lines. Therefore, it is desirable to propose another three-dimensional circuit board having a three-dimensional shape. [New content] This creation proposes a three-dimensional circuit board having a three-dimensional shape. The three-dimensional circuit board of the present invention comprises a planar or three-dimensional core circuit board having a single layer or more layers of conductive materials, an electronic component electrically connected to the core circuit board, and a three-dimensional cladding material that encapsulates electronic components and selects The core circuit board is covered and the core circuit board is partially exposed to form a three-dimensional circuit board. The core circuit board and the three-dimensional cladding material may be flat lines or three-dimensional lines having one or two sides. [Embodiment] Please refer to Fig. 1 to illustrate a three-dimensional circuit board having a three-dimensional shape. The three-dimensional circuit board of the present invention comprises a core circuit board 11 (), an electronic component 120, and a three-dimensional cladding material 13A. The core circuit board is located in the three-dimensional circuit board 100 and itself has a conductive material U1. Conductor U1 can be patterned to form a conductive trace. The core circuit board 11 本身 itself may have various configurations, such as a planar type or a stereo type, as the case requires. Conductor 111 can be a generally conductive material such as copper or aluminum. 6 M354298 The three-dimensional circuit board 100 also has electronic components 120 that are electrically coupled to the core circuit board 110 such that the three-dimensional circuit board 100 produces a predetermined function. Electronic component 120 can be an active component such as a diode, a transistor, an integrated circuit, etc., or a passive component such as a resistor, an inductor, a capacitor, or a combination thereof. The electronic component 120 can also be a power supply, such as a battery, that is combined with each other for digital signal processing purposes. The three-dimensional cladding material 130 not only covers the electronic component 120, but also selectively covers the core circuit board 110 while partially exposing the core circuit board 110, and preferably exposes a portion of the conductive material 111 to form the three-dimensional wiring board 100. The three-dimensional cladding material 130 is generally a non-conductive material such as polyacetal (P〇m), polybutylene dicarboxylate (PBT), polyethylene terephthalate (PET), polycarbonate (Polycarbonate, PC), cyclic olefin copolymer (COC), polyphenylene sulfide (PPS), polyamine (pa, PA6), nylon, acrylonitrile-butadiene-styrene copolymers , ABS), thermochromic liquid crystal polymer (HQUid crystal polyester, LCP)... and many other plastics. On the other hand, the three-dimensional cladding material 130 may also contain a metal precursor that can be activated by laser, such as a metal catalyst, which may be a palladium complex, copper, aluminum or other metal or an oxide mixed with each other, a complex. Or metal nitrides, etc., as an additional definition of the line. The technique of injection molding can be used to form the three-dimensional cladding material 130 to simultaneously cover the structure of the electronic component 120 and the core circuit board 11 to construct the 7 M354298 body circuit board 100. The core circuit board 110 partially exposed by the three-dimensional cladding material 13G can be used for the desired purpose as occasion demands. Fig. 2 illustrates a preferred embodiment of a three-dimensional circuit board having a vertical rise shape. As shown in FIG. 2, when the stereoscopic circuit board 100 has the function of detecting, the conductive material 111 may be a chemical resistance detector 112, which is exposed outside the three-dimensional cladding material 13 to detect the external environment. Changes, such as temperature, humidity, etc. In a preferred embodiment of the present invention, the three-dimensional circuit board 100 may additionally have a cover 113 to protect the exposed conductive material lu. For example, the cover 113 covers the detector 112 of the stereo circuit board 100 to protect the detector 112' as shown in FIG. In a further preferred embodiment of the present invention, the three-dimensional circuit board 100 may additionally have an external component 14A. The outer member 14 is placed on the three-dimensional cladding and electrically connected to the core circuit board 11 as shown in Fig. 4. The external components can also be referred to as active components or passive components or conductive circuit layers, such as lamp #_, to assist the function of the three-dimensional circuit board (10). The Creativity® is erected in two ways: the way of the money hole on the '130' or the way the metal guide is required to make the hole 2 to form the external component 140 8 M354298 For the best example, the equivalent changes and modifications made by the scope of the patent application of this creation should be covered by this creation. [Simple Description of the Drawing] Fig. 1 illustrates a three-dimensional circuit board having a three-dimensional shape. Figures 2-4 illustrate various preferred embodiments of a three-dimensional circuit board having a three-dimensional shape. [Main component symbol description] 110 core circuit board 112 detector 120 electronic components 140 external components 100 stereo circuit board 111 conductive 113 cover 130 three-dimensional cladding