WO2023145028A1 - Electronic device and method for manufacturing same - Google Patents

Electronic device and method for manufacturing same Download PDF

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Publication number
WO2023145028A1
WO2023145028A1 PCT/JP2022/003453 JP2022003453W WO2023145028A1 WO 2023145028 A1 WO2023145028 A1 WO 2023145028A1 JP 2022003453 W JP2022003453 W JP 2022003453W WO 2023145028 A1 WO2023145028 A1 WO 2023145028A1
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WO
WIPO (PCT)
Prior art keywords
base material
resin layer
electronic device
substrate
conductive pattern
Prior art date
Application number
PCT/JP2022/003453
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French (fr)
Japanese (ja)
Inventor
崇 中島
稔 飯塚
慎吾 北山
英明 横山
雄一 老田
清 藤巻
Original Assignee
エレファンテック株式会社
タカハタプレシジョン株式会社
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Publication date
Application filed by エレファンテック株式会社, タカハタプレシジョン株式会社 filed Critical エレファンテック株式会社
Priority to PCT/JP2022/003453 priority Critical patent/WO2023145028A1/en
Priority to JP2022535972A priority patent/JP7178682B1/en
Publication of WO2023145028A1 publication Critical patent/WO2023145028A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to an electronic device and its manufacturing method.
  • a mounting board comprising: an electronic component; a circuit board electrically connected to the electronic component; and a molded body integrated with the mounting board so as to partially cover the mounting board.
  • a molded article is known which has a coating layer at the interface with the molded article so that the mounting substrate and the molded article can be separated (Patent Document 1).
  • a semiconductor device in which a film is divided and arranged is also known (Patent Document 2).
  • the present invention suppresses warpage when a resin layer is formed on one surface of a film substrate in which a conductive pattern is formed on a deformable base material, and facilitates separation of the base material and the resin layer to improve recyclability.
  • the electronic device comprises: a film substrate having a conductive pattern formed on the first surface of the substrate; a resin layer covering a second surface of the substrate opposite to the first surface; a fixing body that fixes the second surface of the base material and the resin layer so that they are in contact with each other on the first surface side of the base material; It is characterized by
  • the invention according to claim 2 is the electronic device according to claim 1,
  • the fixed body has a planar body portion having at least one surface along the first surface of the base material, and the one surface of the planar body portion is in surface contact with the second surface of the base material to form the base material. and fixing the resin layer, It is characterized by
  • the invention according to claim 3 is the electronic device according to claim 1 or 2,
  • the planar body portion is formed integrally with the resin layer so as to penetrate the base material in the thickness direction and protrude toward the first surface, It is characterized by
  • the invention according to claim 4 is the electronic device according to any one of claims 1 to 3,
  • the fixed body is provided at a plurality of locations except for the conductive pattern and the mounted product mounted on the film substrate, It is characterized by
  • the invention according to claim 5 is the electronic device according to any one of claims 1 to 4, An adhesive layer is not provided between the second surface of the base material and the resin layer, It is characterized by
  • the invention according to claim 6 is the electronic device according to any one of claims 1 to 4, A non-adhesive layer containing an inorganic or organic substance that inhibits adhesion between the base material and the resin layer is provided between the second surface of the base material and the resin layer. It is characterized by
  • the invention according to claim 7 is the electronic device according to any one of claims 1 to 6,
  • the region with which one surface of the planar body part abuts has an entry restricting body that restricts entry of the resin layer between the second surface of the base material and the resin layer, It is characterized by
  • the invention according to claim 8 is the electronic device according to any one of claims 1 to 7, wherein the substrate is a deformable film made of a synthetic resin material; It is characterized by
  • the electronic device includes: A film substrate having a conductive pattern formed on a first surface of a base material, a resin layer covering a second side opposite to the first surface of the base material, and the base material on the first surface side of the base material
  • a fixed body fixed so that the second surface of and the resin layer are in contact with each other is an electronic device integrally molded by insert molding, During the insert molding, the fixed body penetrates the base material in the thickness direction and protrudes toward the first surface to form a planar body part having at least one surface along the first surface of the base material, and the surface The one surface of the body portion is formed integrally with the resin layer so as to be in contact with the second surface of the base material to fix the base material and the resin layer, It is characterized by
  • the method for manufacturing an electronic device comprises: A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; A method for manufacturing an electronic device, comprising: a fixing body for fixing such that the second surface of the material and the resin layer are in contact with each other, preparing the substrate; disposing the conductive pattern on the substrate; forming a through-hole in the base material; placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body; It is characterized by
  • the method for manufacturing an electronic device comprises: A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; a fixing body for fixing such that the second surface of the substrate and the resin layer are in contact with each other;
  • a method for manufacturing an electronic device comprising: an entry restrictor for restricting entry of preparing the substrate; disposing the conductive pattern on the substrate; forming a through-hole in the base material; a step of adhering the entry suppressing body to a second surface of the base material in a region covered by the fixed body of the base material; placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body; It is characterized by
  • the first aspect of the invention when a resin layer is formed on one surface of a film substrate having a conductive pattern formed on a deformable base material, warping is suppressed and separation between the base material and the resin layer is prevented. This makes it easier to improve recyclability.
  • the fixed body can be formed simultaneously with the molding of the resin layer.
  • the fifth aspect of the invention it is possible to suppress warping and facilitate separation of the base material and the resin layer.
  • deformation of the base material can be suppressed.
  • the electronic device can be given a three-dimensional shape.
  • the fixed body can be formed simultaneously with the molding of the resin layer.
  • FIG. 1 is a perspective view showing an example of an electronic device according to an embodiment
  • FIG. FIG. 2A is a schematic plan view showing an example of the electronic device according to this embodiment
  • FIG. 2B is a schematic cross-sectional view taken along line AA shown in FIG. 2A
  • FIG. 3A is a schematic plan view showing an example of a film substrate having through-holes formed therein
  • FIG. 3B is a schematic cross-sectional view explaining the flow of resin in an injection mold for integrally molding a resin layer and a fixed body
  • 4A is a schematic plan view showing an example of a film substrate to which an intrusion restrictor is adhered
  • FIG. 4B is a schematic cross-sectional view of an electronic device according to a modification taken along line AA shown in FIG.
  • FIG. 10 is a flow chart diagram showing an example of a schematic procedure of a method for manufacturing an electronic device according to a modification; It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of the electronic device which concerns on a modification.
  • FIG. 1 is a perspective view showing an example of an electronic device 1 according to the present embodiment
  • FIG. 2A is a schematic plan view showing an example of the electronic device 1 according to the present embodiment
  • FIG. 2B is FIG. 2A
  • FIG. 3A is a schematic plan view showing an example of a film substrate 4 having through holes 2c formed therein
  • FIG. 3B is an injection molding for integrally molding the resin layer 5 and the fixed body 6.
  • 4 is a schematic cross-sectional view for explaining the flow of resin in the mold K; FIG.
  • the configuration of the electronic device 1 according to this embodiment will be described with reference to the drawings.
  • the electronic device 1 includes a film substrate 4 having a conductive pattern 3 formed on a first surface 2a of a substrate 2 and a A resin layer 5 that covers the second surface 2b, and a fixing body 6 that fixes the second surface 2b of the base material 2 and the resin layer 5 so as to abut on the first surface 2a side of the base material 2. It is
  • the base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material.
  • a "deformable substrate” is one that can be deformed after placement of the conductive pattern 3, i.e. from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or air pressure forming. It means a substrate that can be deformed into a shape.
  • Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyether ether ketone (PEEK), acrylic butadiene styrene ( ABS), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC) and other thermoplastic resins.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamides
  • PEEK polyether ether ketone
  • ABS acrylic butadiene styrene
  • PMMA polymethyl methacrylate
  • PVC polyvinyl chloride
  • polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.
  • the resin layer 5 is insert-molded onto the base material 2 on which the conductive pattern 3 is arranged without an adhesive layer intervening. Therefore, it is not necessary to consider the adhesiveness between the substrate 2 and the resin layer 5, and the material of the substrate 2 can be not only thermoplastic resin but also thermosetting resin.
  • Thermosetting resin materials include phenol resins, epoxy resins, polyimide resins, unsaturated polyester resins, polyurethane resins, silicone resins, oxetane resins, etc.
  • polyimide resins (PI) are particularly preferred. .
  • the first surface 2a of the substrate 2 is preferably surface-treated in order to evenly apply catalyst ink such as metal nanoparticles.
  • catalyst ink such as metal nanoparticles.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, primer treatment, etc. can be used.
  • a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers the growth of the metal plating is formed in a predetermined pattern.
  • the base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 2, followed by drying and baking.
  • the thickness ( ⁇ m) of the underlayer is preferably 0.1 to 20 ⁇ m, more preferably 0.2 to 5 ⁇ m, most preferably 0.5 to 2 ⁇ m. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  • gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferred.
  • the particle size (nm) of the catalyst is preferably 1-500 nm, more preferably 10-100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.
  • the conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating.
  • the plating metal copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.
  • the thickness ( ⁇ m) of the plating layer is preferably 0.03-100 ⁇ m, more preferably 1-35 ⁇ m, and most preferably 3-18 ⁇ m. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plated layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.
  • the electronic components 3B include control circuits, strain, resistance, capacitance, contact sensing such as TIR, and photodetection components, tactile components such as piezoelectric actuators or vibration motors or vibration components, light emitting components such as LEDs, microphones and Producing or receiving sounds such as speakers, device operating components such as memory chips, programmable logic chips and CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.
  • DSP digital signal processors
  • the conductive pattern 3 has a plurality of connector connection pads 3a formed at one end thereof for electrical connection with an external device provided outside the electronic device 1.
  • a connector 3C is electrically connected.
  • the connector 3C includes terminals 3Ca electrically connected to the conductive pattern 3 and electrically connected to an external device, and a housing 3Cb that holds the terminals 3Ca.
  • the housing 3Cb is integrated with the resin layer 5 described later. is formed by
  • the resin layer 5 covers the second surface 2b of the substrate 2 on the side opposite to the first surface 2a of the substrate 2 on which the conductive pattern 3 is arranged without an adhesive layer interposed therebetween. is formed in As will be described later, the resin layer 5 is formed by insert-molding a molten resin while positioning and setting the base material 2 on which the conductive pattern 3 is arranged in the injection mold K. As shown in FIG. At this time, in order to improve the adhesiveness between the resin layer 5 and the substrate 2, a binder ink that forms an adhesive layer is usually applied according to the combination of resin materials. , the resin layer 5 is insert-molded without an adhesive layer. The base material 2 and the resin layer 5 are fixed by a fixing body 6 to be described later so that the base material 2 and the resin layer 5 are in contact with each other. This facilitates the separation of the base material 2 and the resin layer 5, thereby improving the recyclability.
  • the resin layer 5 contains an inorganic substance or an organic substance that inhibits adhesion between the base material 2 and the resin layer 5 with respect to the second surface 2b opposite to the first surface 2a of the base material 2 on which the conductive pattern 3 is arranged. It may be formed so as to cover the second surface 2b of the substrate 2 via a compounded non-adhesive layer 5A (not shown).
  • a compounded non-adhesive layer 5A As the material for the non-adhesive layer 5A, silicone compounds, silicone resins, fluorine compounds, fluorine resins, waxes, and the like can be used alone or in combination of two or more. This makes it easier to separate the base material 2 and the resin layer 5, thereby improving recyclability.
  • the resin layer 5 is a thermoplastic resin made of a thermoplastic resin material that can be injection molded. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof.
  • a plastic resin can be used.
  • the fixed body 6 has a planar body portion 61 having at least one surface 61 a along the first surface 2 a of the base material 2 , and one surface 61 a of the planar body portion 61 is the first surface of the base material 2 .
  • the substrate 2 and the resin layer 5 are fixed by making surface contact with the first surface 2a.
  • the planar body portion 61 is formed integrally with the resin layer 5 so as to penetrate the base material 2 in the thickness direction and protrude toward the first surface 2a.
  • the planar body portion 61 has the conductive pattern 3 arranged on the first surface 2a of the base material 2, and the through hole 2c for forming the fixed body 6 is provided.
  • the resin layer 5 With the film substrate 4 (see FIG. 3A) placed and fixed on the injection molding die K (see FIG. 3B), the resin layer 5 is insert-molded so that the molten resin filling the cavity CA1 is It is formed integrally with the resin layer 5 so as to flow from the through hole 2c to the cavity CA2 (see the arrow in FIG. 3B), penetrate the base material 2 in the thickness direction, and protrude toward the first surface 2a.
  • the fixed body 6 that fixes the base material 2 and the resin layer 5 by making surface contact with the first surface 2a of the base material 2 in this manner includes the conductive pattern 3 and the electronic component 3B mounted on the film substrate 4 ( not shown).
  • the formation position and the number of fixed bodies 6 on the first surface 2a of the base material 2 are set according to the size (area) of the film substrate 4 and the arrangement of the conductive patterns 3 and electronic components 3B (not shown). As a result, warping of the electronic device 1 can be suppressed and the separation of the base material 2 and the resin layer 5 can be facilitated, thereby improving the recyclability of the electronic device 1 .
  • FIG. 4A is a schematic plan view showing an example of a film substrate 4 to which an intrusion restrictor 7 is adhered
  • FIG. 4B is a schematic cross-sectional view of an electronic device 1A according to a modification taken along line AA shown in FIG. 2A.
  • the one surface 61 a of the planar body portion 61 abuts, it is preferable to provide an entry restricting body 7 for restricting entry of the resin layer 5 between the second surface 2 b of the base material 2 and the resin layer 5 .
  • FIG. 1 is a schematic plan view showing an example of a film substrate 4 to which an intrusion restrictor 7 is adhered
  • FIG. 4B is a schematic cross-sectional view of an electronic device 1A according to a modification taken along line AA shown in FIG. 2A.
  • the entry restricting body 7 is arranged around the through hole 2 c formed in the base material 2 so as to be in close contact with the second surface 2 b of the base material 2 so as to match the planar shape of the planar body portion 61 . , is fixed by gluing. Examples of the bonding method include fixing with an adhesive, pasting with double-sided tape, etc. so that the entry restricting body 7 is not displaced by the resin pressure of the molten resin.
  • the material of the entry restricting body 7 is not particularly limited, it is preferably made of the same thermoplastic resin material as the material of the resin layer 5 .
  • the intrusion restricting body 7 prevents the resin from flowing into the second surface 2b of the base material 2 covered with the planar body portion 61 of the fixed body 6 integrally formed with the resin layer 5 when the resin layer 5 is formed by injection molding. By restricting the entry of the layer 5, deformation of the substrate 2 due to resin pressure during injection molding of the resin layer 5 is suppressed.
  • FIG. 5 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1, and FIG. is.
  • the electronic device 1 includes a substrate 2 preparation step S11, a wiring plating step S12 for forming a conductive pattern 3 on the substrate 2, and a substrate on which the conductive pattern 3 is arranged.
  • Base material preparation step S11 Metal plating is first performed on the base material 2 in order to dispose the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size.
  • a base layer made of catalyst particles such as metal nanoparticles that trigger growth is formed in a predetermined pattern.
  • the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment.
  • Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method.
  • Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method.
  • an inkjet printing method is used.
  • the solvent is volatilized to leave only the metal nanoparticles.
  • the solvent is then removed (drying) and the metal nanoparticles are sintered (firing).
  • the firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the metal nanoparticles will not be sufficiently sintered, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.
  • Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit a plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 6A).
  • the plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.
  • a through-hole 2c is formed through the substrate 2 on which the conductive pattern 3 is arranged (see FIG. 6B).
  • the through hole 2c is a hole that communicates with the cavity CA1 forming the resin layer 5 and the cavity CA2 forming the fixed body 6.
  • the through hole 2c is adapted to the size of the planar body portion 61 of the fixed body 6 and allows the molten resin to pass therethrough. It is formed in multiple sizes.
  • a through hole 2d is also formed for integrally forming the housing 3Cb of the connector 3C with the resin layer 5 (see FIG. 6B).
  • the injection molding die K is placed in a state in which the base material 2 having the through holes 2c and the conductive pattern 3 arranged thereon is positioned and set in the injection molding die K (see FIG. 6C). Close to fill cavity CA1 with resin. A resin layer 5 covering the second surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. Then, the cavity CA2 formed on the side of the first surface 2a of the substrate 2 on which the conductive pattern 3 is arranged is filled with the resin that fills the cavity CA1 through the through hole 2c formed in the substrate 2. FIG. The resin filled in the cavity CA2 forms the planar body portion 61 of the fixed body 6 that is fixed so that the second surface 2b of the base material 2 and the resin layer 5 are in contact with each other (see FIG. 6D).
  • the substrate 2 and the resin layer 5 are bonded to the second surface 2b opposite to the first surface 2a on which the conductive pattern 3 of the substrate 2 having the through holes 2c formed in the through hole forming step S13.
  • a resin composition that inhibits adhesion may be applied.
  • the fixed body 6 is formed simultaneously with the molding of the resin layer 5 on the film substrate 4 having the conductive pattern 3 formed on the base material 2. can be done.
  • the second surface 2b of the base material 2 is not coated with a binder ink that serves as an adhesive layer, warping of the electronic device 1 due to the difference in shrinkage between the base material 2 and the resin layer 5 during injection molding can be suppressed. can be done.
  • FIG. 7 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1A according to the modification
  • FIG. 8 is a schematic partial cross-sectional view of the electronic device 1A for explaining the manufacturing process of the electronic device 1A according to the modification. is.
  • the electronic device 1A includes a preparation step S21 for the base material 2, a wiring plating step S22 for forming the conductive pattern 3 on the base material 2, and the conductive pattern 3. a through-hole forming step S23 of forming a through-hole 2c in the base material 2, and bonding the entry restricting body 7 to a region where the planar body portion 61 of the fixed body 6 is formed on the second surface 2b side of the base material 2.
  • the substrate 2 is positioned in the injection mold K so that the second surface 2b of the substrate 2 and the resin layer 5 are in contact with each other on the side of the first surface 2a of the substrate 2. and a resin filling step S25 in which the fixed body 6 to be fixed is integrally insert-molded.
  • Preparing step S21 of substrate 2, wiring plating step S22 (see FIG. 8A), through-hole forming step S23 (see FIG. 8B), and resin filling step S25 (see FIG. 8E) in the manufacturing process of the electronic device 1A according to the modification. ) is the same as the manufacturing process of the electronic device 1 described above, the description thereof will be omitted, and the following will be described from the entry restricting body bonding step S24 onward.
  • FIG. 1 The planar body portion 61 of the fixed body 6 that is fixed so that the second surface 2b of the base material 2 and the resin layer 5 are in contact with each other is formed by the resin filled in the cavity CA2. It should be noted that the base material 2 and the resin layer 5 are bonded to the second surface 2b opposite to the first surface 2a on which the conductive pattern 3 of the base material 2 in which the through holes 2c are formed in the through hole forming step S23. A resin composition that inhibits adhesion may be applied.
  • the fixed body 6 is formed on the film substrate 4 having the conductive pattern 3 formed on the base material 2 at the same time as the resin layer 5 is formed. can be formed.
  • an entry restricting body 7 for restricting the entrance of the resin layer 5 is provided between the second surface 2b of the base material 2 and the resin layer 5 by bonding. Intrusion of the resin layer 5 into the second surface 2b of the base material 2 covered with the planar body portion 61 is restricted to suppress deformation of the base material 2 due to resin pressure.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention suppresses warping when a resin layer is molded on one surface of a film substrate having a conductive pattern formed on a deformable base material, and easily separates the resin layer from the base material and improves recycling performance. The present invention comprises: a film substrate having a conductive pattern formed on a first surface of a base material; a resin layer that covers a second surface on the side opposite the first surface of the base material; and a fixing body that fixes the second surface of the base material and the resin layer so that the second surface and the resin layer are in contact on the first surface side of the base material, wherein the fixing body has a planar body part that has at least one surface that follows the first surface of the base material, and the one surface of the planar body part is in surface contact with the second surface of the base material and fixes the resin layer and the base material.

Description

電子装置及びその製造方法Electronic device and its manufacturing method
　本発明は、電子装置及びその製造方法に関する。 The present invention relates to an electronic device and its manufacturing method.
　電子部品と、電子部品と電気的に接続された回路基板とを備えた実装基板と、実装基板の一部を覆うようにして、実装基板と一体化された成形体とを備え、実装基板と成形体との界面に、実装基板と成形体とを分離可能に構成された被覆層を有する、成形品が知られている（特許文献１）。 A mounting board comprising: an electronic component; a circuit board electrically connected to the electronic component; and a molded body integrated with the mounting board so as to partially cover the mounting board. A molded article is known which has a coating layer at the interface with the molded article so that the mounting substrate and the molded article can be separated (Patent Document 1).
　可撓性フィルムからなるベース基板の一表面に配線導体が配置され、可撓性フィルムの表面上に接着材を介在して半導体チップが塔載される半導体装置であって、配線導体上に絶縁膜を分割して配置した半導体装置も知られている（特許文献２）。 A semiconductor device in which a wiring conductor is arranged on one surface of a base substrate made of a flexible film, and a semiconductor chip is mounted on the surface of the flexible film with an adhesive interposed therebetween, wherein the wiring conductor is insulated. A semiconductor device in which a film is divided and arranged is also known (Patent Document 2).
特開２０２１－１２６８２８号公報Japanese Patent Application Laid-Open No. 2021-126828 特開平１１－５４６５８号公報JP-A-11-54658
　本発明は、変形可能な基材上に導電性パターンが形成されたフィルム基板の一面に樹脂層を成形した場合の反りを抑制するとともに基材と樹脂層の分離を容易にしてリサイクル性を向上させる。 The present invention suppresses warpage when a resin layer is formed on one surface of a film substrate in which a conductive pattern is formed on a deformable base material, and facilitates separation of the base material and the resin layer to improve recyclability. Let
　前記課題を解決するために、請求項１に記載の電子装置は、
　基材の第１面に導電性パターンが形成されたフィルム基板と、
　前記基材の第１面とは反対側の第２面を覆う樹脂層と、
　前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、を備えた、
　ことを特徴とする。 In order to solve the above problems, the electronic device according to claim 1 comprises:
a film substrate having a conductive pattern formed on the first surface of the substrate;
a resin layer covering a second surface of the substrate opposite to the first surface;
a fixing body that fixes the second surface of the base material and the resin layer so that they are in contact with each other on the first surface side of the base material;
It is characterized by
　請求項２に記載の発明は、請求項１に記載の電子装置において、
　前記固定体は、前記基材の第１面に沿う少なくとも一面を有する面状体部を有し、前記面状体部の前記一面が前記基材の第２面と面接触して前記基材と前記樹脂層を固定している、
　ことを特徴とする。 The invention according to claim 2 is the electronic device according to claim 1,
The fixed body has a planar body portion having at least one surface along the first surface of the base material, and the one surface of the planar body portion is in surface contact with the second surface of the base material to form the base material. and fixing the resin layer,
It is characterized by
　請求項３に記載の発明は、請求項１又は２に記載の電子装置において、
　前記面状体部は、前記基材を厚み方向に貫通して前記第１面側に突出するように前記樹脂層と一体に形成されている、
　ことを特徴とする。 The invention according to claim 3 is the electronic device according to claim 1 or 2,
The planar body portion is formed integrally with the resin layer so as to penetrate the base material in the thickness direction and protrude toward the first surface,
It is characterized by
　請求項４に記載の発明は、請求項１ないし３のいずれか１項に記載の電子装置において、
　前記固定体は、前記導電性パターン及び前記フィルム基板上に実装された実装品を除いて複数箇所に設けられている、
　ことを特徴とする。 The invention according to claim 4 is the electronic device according to any one of claims 1 to 3,
The fixed body is provided at a plurality of locations except for the conductive pattern and the mounted product mounted on the film substrate,
It is characterized by
　請求項５に記載の発明は、請求項１ないし４のいずれか１項に記載の電子装置において、
　前記基材の第２面と前記樹脂層との間に接着層が設けられていない、
　ことを特徴とする。 The invention according to claim 5 is the electronic device according to any one of claims 1 to 4,
An adhesive layer is not provided between the second surface of the base material and the resin layer,
It is characterized by
　請求項６に記載の発明は、請求項１ないし４のいずれか１項に記載の電子装置において、
　前記基材の第２面と前記樹脂層との間に、前記基材と前記樹脂層との接着を阻害する無機物又は有機物を配合した非接着層が設けられている、
　ことを特徴とする。 The invention according to claim 6 is the electronic device according to any one of claims 1 to 4,
A non-adhesive layer containing an inorganic or organic substance that inhibits adhesion between the base material and the resin layer is provided between the second surface of the base material and the resin layer.
It is characterized by
　請求項７に記載の発明は、請求項１ないし６のいずれか１項に記載の電子装置において、
　前記面状体部の一面が当接する領域は、前記基材の第２面と前記樹脂層の間に前記樹脂層の進入を規制する進入規制体を有する、
　ことを特徴とする。 The invention according to claim 7 is the electronic device according to any one of claims 1 to 6,
The region with which one surface of the planar body part abuts has an entry restricting body that restricts entry of the resin layer between the second surface of the base material and the resin layer,
It is characterized by
　請求項８に記載の発明は、請求項１ないし７のいずれか１項に記載の電子装置において、
　前記基材が合成樹脂材料からなる変形可能なフィルムである、
　ことを特徴とする。 The invention according to claim 8 is the electronic device according to any one of claims 1 to 7,
wherein the substrate is a deformable film made of a synthetic resin material;
It is characterized by
　前記課題を解決するために、請求項９に記載の電子装置は、
　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、がインサート成形によって一体成形された電子装置であって、
  前記インサート成形時に、前記固定体が前記基材を厚み方向に貫通して前記第１面側に突出して前記基材の第１面に沿う少なくとも一面を有する面状体部が形成され、前記面状体部の前記一面が前記基材の第２面と接触して前記基材と前記樹脂層を固定するように前記樹脂層と一体に形成されている、
　ことを特徴とする。 In order to solve the above problems, the electronic device according to claim 9 includes:
A film substrate having a conductive pattern formed on a first surface of a base material, a resin layer covering a second side opposite to the first surface of the base material, and the base material on the first surface side of the base material A fixed body fixed so that the second surface of and the resin layer are in contact with each other is an electronic device integrally molded by insert molding,
During the insert molding, the fixed body penetrates the base material in the thickness direction and protrudes toward the first surface to form a planar body part having at least one surface along the first surface of the base material, and the surface The one surface of the body portion is formed integrally with the resin layer so as to be in contact with the second surface of the base material to fix the base material and the resin layer,
It is characterized by
　前記課題を解決するために、請求項１０に記載の電子装置の製造方法は、
　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２面を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、を備えた電子装置の製造方法であって、
　前記基材を準備する工程と、
　前記基材上に前記導電性パターンを配置する工程と、
　前記基材に貫通孔を形成する工程と、
　前記貫通孔が形成された前記基材を金型に載置して前記樹脂層と前記固定体を射出成形する工程と、を含む、
　ことを特徴とする。 In order to solve the above problems, the method for manufacturing an electronic device according to claim 10 comprises:
A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; A method for manufacturing an electronic device, comprising: a fixing body for fixing such that the second surface of the material and the resin layer are in contact with each other,
preparing the substrate;
disposing the conductive pattern on the substrate;
forming a through-hole in the base material;
placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body;
It is characterized by
　前記課題を解決するために、請求項１１に記載の電子装置の製造方法は、
　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２面を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、前記面状体部の一面が当接する領域の前記基材の第２面と前記樹脂層の間に前記樹脂層の進入を規制する進入規制体と、を備えた電子装置の製造方法であって、
　前記基材を準備する工程と、
　前記基材上に前記導電性パターンを配置する工程と、
　前記基材に貫通孔を形成する工程と、
　前記基材の前記固定体に覆われる領域の前記基材の第２面に前記進入抑制体を張り合わせる工程と、
　前記貫通孔が形成された前記基材を金型に載置して前記樹脂層と前記固定体を射出成形する工程と、を含む、
　ことを特徴とする。 In order to solve the above problems, the method for manufacturing an electronic device according to claim 11 comprises:
A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; a fixing body for fixing such that the second surface of the substrate and the resin layer are in contact with each other; A method for manufacturing an electronic device comprising: an entry restrictor for restricting entry of
preparing the substrate;
disposing the conductive pattern on the substrate;
forming a through-hole in the base material;
a step of adhering the entry suppressing body to a second surface of the base material in a region covered by the fixed body of the base material;
placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body;
It is characterized by
　請求項１に記載の発明によれば、変形可能な基材上に導電性パターンが形成されたフィルム基板の一面に樹脂層を成形した場合の反りを抑制するとともに基材と樹脂層の分離を容易にしてリサイクル性を向上させることができる。 According to the first aspect of the invention, when a resin layer is formed on one surface of a film substrate having a conductive pattern formed on a deformable base material, warping is suppressed and separation between the base material and the resin layer is prevented. This makes it easier to improve recyclability.
　請求項２に記載の発明によれば、基材と樹脂層の収縮差による反り、捻じれを抑制することができる。 According to the invention of claim 2, it is possible to suppress warping and twisting due to the difference in contraction between the base material and the resin layer.
　請求項３に記載の発明によれば、樹脂層の成形と同時に固定体を形成することができる。 According to the third aspect of the invention, the fixed body can be formed simultaneously with the molding of the resin layer.
　請求項４に記載の発明によれば、反りを抑制するとともに基材と樹脂層の分離を容易にすることができる。 According to the fourth aspect of the invention, it is possible to suppress warping and facilitate separation of the base material and the resin layer.
　請求項５に記載の発明によれば、反りを抑制するとともに基材と樹脂層の分離を容易にすることができる。 According to the fifth aspect of the invention, it is possible to suppress warping and facilitate separation of the base material and the resin layer.
　請求項６に記載の発明によれば、反りを抑制するとともに基材と樹脂層の分離を容易にすることができる。 According to the sixth aspect of the invention, it is possible to suppress warping and facilitate separation of the base material and the resin layer.
　請求項７に記載の発明によれば、基材の変形を抑制することができる。 According to the seventh aspect of the invention, deformation of the base material can be suppressed.
　請求項８に記載の発明によれば、電子装置に３次元形状を付与することができる。 According to the eighth aspect of the invention, the electronic device can be given a three-dimensional shape.
　請求項９に記載の発明によれば、樹脂層の成形と同時に固定体を形成することができる。 According to the ninth aspect of the invention, the fixed body can be formed simultaneously with the molding of the resin layer.
　請求項１０に記載の発明によれば、変形可能な基材上に導電性パターンが形成されたフィルム基板の一面に樹脂層を成形した場合の反りを抑制するとともに基材と樹脂層の分離を容易にしてリサイクル性を向上させることができる。 According to the tenth aspect of the invention, when a resin layer is molded on one surface of a film substrate having a conductive pattern formed on a deformable base material, warping is suppressed and separation between the base material and the resin layer is prevented. This makes it easy to improve recyclability.
　請求項１１に記載の発明によれば、射出成形による基材の変形を抑制しながら、変形可能な基材上に導電性パターンが形成されたフィルム基板の一面に樹脂層を成形した場合の反りを抑制するとともに基材と樹脂層の分離を容易にしてリサイクル性を向上させることができる。 According to the invention of claim 11, while suppressing deformation of the base material due to injection molding, warping when a resin layer is formed on one surface of a film substrate in which a conductive pattern is formed on a deformable base material can be suppressed and the separation of the base material and the resin layer can be facilitated to improve recyclability.
本実施形態に係る電子装置の一例を示す斜視図である。1 is a perspective view showing an example of an electronic device according to an embodiment; FIG. 図２Ａは本実施形態に係る電子装置の一例を示す平面模式図、図２Ｂは図２Ａに示すＡ－Ａ線に沿った断面模式図である。FIG. 2A is a schematic plan view showing an example of the electronic device according to this embodiment, and FIG. 2B is a schematic cross-sectional view taken along line AA shown in FIG. 2A. 図３Ａは貫通孔が形成されたフィルム基板の一例を示す平面模式図、図３Ｂは樹脂層と固定体を一体成形する射出成形用金型における樹脂の流動を説明する断面模式図である。FIG. 3A is a schematic plan view showing an example of a film substrate having through-holes formed therein, and FIG. 3B is a schematic cross-sectional view explaining the flow of resin in an injection mold for integrally molding a resin layer and a fixed body. 図４Ａは侵入規制体を接着したフィルム基板の一例を示す平面模式図、図４Ｂは変形例に係る電子装置の図２Ａに示すＡ－Ａ線に沿った断面模式図である。4A is a schematic plan view showing an example of a film substrate to which an intrusion restrictor is adhered, and FIG. 4B is a schematic cross-sectional view of an electronic device according to a modification taken along line AA shown in FIG. 2A. 電子装置の製造方法の概略の手順の一例を示すフローチャート図である。It is a flowchart figure which shows an example of the procedure of the outline of the manufacturing method of an electronic device. 電子装置の製造過程を説明するための電子装置の部分断面模式図である。It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of an electronic device. 変形例に係る電子装置の製造方法の概略の手順の一例を示すフローチャート図である。FIG. 10 is a flow chart diagram showing an example of a schematic procedure of a method for manufacturing an electronic device according to a modification; 変形例に係る電子装置の製造過程を説明するための電子装置の部分断面模式図である。It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of the electronic device which concerns on a modification.
　次に図面を参照しながら、本発明の実施形態の具体例を説明するが、本発明は以下の実施形態に限定されるものではない。
　尚、以下の図面を使用した説明において、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることに留意すべきであり、理解の容易のために説明に必要な部材以外の図示は適宜省略されている。 Next, specific examples of embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.
It should be noted that in the following description using the drawings, the drawings are schematic, and the ratio of each dimension is different from the actual one. Illustrations other than members are omitted as appropriate.
　（１）電子装置の全体構成
　図１は本実施形態に係る電子装置１の一例を示す斜視図、図２Ａは本実施形態に係る電子装置１の一例を示す平面模式図、図２Ｂは図２ＡにおけるＡ－Ａ線に沿った断面模式図、図３Ａは貫通孔２ｃが形成されたフィルム基板４の一例を示す平面模式図、図３Ｂは樹脂層５と固定体６を一体成形する射出成形用金型Ｋにおける樹脂の流動を説明する断面模式図である。
　以下、図面を参照しながら、本実施形態に係る電子装置１の構成について説明する。 (1) Overall Configuration of Electronic Device FIG. 1 is a perspective view showing an example of an electronic device 1 according to the present embodiment, FIG. 2A is a schematic plan view showing an example of the electronic device 1 according to the present embodiment, and FIG. 2B is FIG. 2A. FIG. 3A is a schematic plan view showing an example of a film substrate 4 having through holes 2c formed therein, and FIG. 3B is an injection molding for integrally molding the resin layer 5 and the fixed body 6. 4 is a schematic cross-sectional view for explaining the flow of resin in the mold K; FIG.
Hereinafter, the configuration of the electronic device 1 according to this embodiment will be described with reference to the drawings.
　電子装置１は、図１及び図２に示すように、基材２の第１面２ａに導電性パターン３が形成されたフィルム基板４と、基材２の第１面２ａとは反対側の第２面２ｂを覆う樹脂層５と、基材２の第１面２ａ側で基材２の第２面２ｂと樹脂層５とが当接するように固定する固定体６と、を備えて構成されている。 As shown in FIGS. 1 and 2, the electronic device 1 includes a film substrate 4 having a conductive pattern 3 formed on a first surface 2a of a substrate 2 and a A resin layer 5 that covers the second surface 2b, and a fixing body 6 that fixes the second surface 2b of the base material 2 and the resin layer 5 so as to abut on the first surface 2a side of the base material 2. It is
　（基材）
  本実施形態における基材２は、合成樹脂材料からなり変形可能な絶縁性のフィルム状の基材である。ここで、「変形可能な基材」は、導電性パターン３を配置後に変形できる、すなわち、熱成形、真空成形または圧空成形によって実質的に平坦な２次元形状から実質的に立体的な３次元形状に変形することができる基材を意味する。 (Base material)
The base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material. Here, a "deformable substrate" is one that can be deformed after placement of the conductive pattern 3, i.e. from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or air pressure forming. It means a substrate that can be deformed into a shape.
  基材２の材質としては、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）などのポリエステル、ナイロン６－１０、ナイロン４６などのポリアミド（ＰＡ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、アクリルブタジエンスチレン（ＡＢＳ）、ポリメチルメタクリレート（ＰＭＭＡ）、ポリ塩化ビニル（ＰＶＣ）などの熱可塑性樹脂が挙げられる。特にポリエステルがより好ましく、さらにその中でもポリエチレンテレフタレート（ＰＥＴ）が経済性、電気絶縁性、耐薬品性等のバランスが良く最も好ましい。 Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyether ether ketone (PEEK), acrylic butadiene styrene ( ABS), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC) and other thermoplastic resins. In particular, polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.
　また、本実施形態においては、後述するように、導電性パターン３が配置された基材２に対して、接着層を介することなく樹脂層５をインサート成形する。そのために、基材２と樹脂層５の接着性を考慮する必要がなく、基材２の材質としては、熱可塑性樹脂のみならず、熱硬化性樹脂も用いることができる。熱硬化性樹脂材料としては、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、不飽和ポリエステル樹脂、ポリウレタン樹脂、シリコーン樹脂、オキセタン樹脂などが挙げられ、これらの中では、特にポリイミド樹脂（ＰＩ）が好適である。 Further, in this embodiment, as will be described later, the resin layer 5 is insert-molded onto the base material 2 on which the conductive pattern 3 is arranged without an adhesive layer intervening. Therefore, it is not necessary to consider the adhesiveness between the substrate 2 and the resin layer 5, and the material of the substrate 2 can be not only thermoplastic resin but also thermosetting resin. Thermosetting resin materials include phenol resins, epoxy resins, polyimide resins, unsaturated polyester resins, polyurethane resins, silicone resins, oxetane resins, etc. Among these, polyimide resins (PI) are particularly preferred. .
　基材２の第１面２ａには、金属ナノ粒子等の触媒インクを均一に塗布するために、表面処理を施すことが好ましい。表面処理としては、例えば、コロナ処理、プラズマ処理、溶剤処理、プライマー処理等を用いることができる。 The first surface 2a of the substrate 2 is preferably surface-treated in order to evenly apply catalyst ink such as metal nanoparticles. As the surface treatment, for example, corona treatment, plasma treatment, solvent treatment, primer treatment, etc. can be used.
　（導電性パターン）
　基材２の第１面２ａに導電性パターン３を配置する場合、さきに、金属めっき成長のきっかけとなる金属ナノ粒子等の触媒からなる下地層（不図示）を所定のパターン状に形成する。下地層は、基材２上に金属ナノ粒子等の触媒インクを塗布したあと、乾燥および焼成を行うことにより形成する。 (Conductive pattern)
When the conductive pattern 3 is arranged on the first surface 2a of the base material 2, first, a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers the growth of the metal plating is formed in a predetermined pattern. . The base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 2, followed by drying and baking.
  下地層の厚み（μｍ）は、０．１～２０μｍが好ましく、０．２～５μｍがさらに好ましく、０．５～２μｍが最も好ましい。下地層が薄すぎると、下地層の強度が低下するおそれがある。また、下地層が厚すぎると、金属ナノ粒子は通常の金属よりも高価であるため、製造コストが増大する虞がある。 The thickness (μm) of the underlayer is preferably 0.1 to 20 μm, more preferably 0.2 to 5 μm, most preferably 0.5 to 2 μm. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  触媒の材料としては、金、銀、銅、パラジウム、ニッケルなどが用いられ、導電性の観点から金、銀、銅が好ましく、金、銀に比べて安価な銅が最も好ましい。 As materials for the catalyst, gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferred.
 　触媒の粒子径（ｎｍ）は１～５００ｎｍが好ましく、１０～１００ｎｍがより好ましい。粒子径が小さすぎる場合、粒子の反応性が高くなりインクの保存性・安定性に悪影響を与える虞がある。粒子径が大きすぎる場合、薄膜の均一形成が困難になるとともに、インクの粒子の沈殿が起こりやすくなる虞がある。 The particle size (nm) of the catalyst is preferably 1-500 nm, more preferably 10-100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.
  導電性パターン３は、下地層の上に電解めっきまたは無電解めっきにより形成される。めっき金属としては、銅、ニッケル、錫、銀、金などを用いることができるが、伸長性、導電性および価格の観点から銅を用いることが最も好ましい。   The conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating. As the plating metal, copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.
  めっき層の厚さ（μｍ）は、０．０３～１００μｍが好ましく、１～３５μｍがより好ましく、３～１８μｍが最も好ましい。めっき層が薄すぎると、機械的強度が不足するとともに、導電性が実用上十分に得られない虞がある。めっき層が厚すぎると、めっきに必要な時間が長くなり、製造コストが増大する虞がある。 The thickness (μm) of the plating layer is preferably 0.03-100 μm, more preferably 1-35 μm, and most preferably 3-18 μm. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plated layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.
　（電子部品）
　導電性パターン３は、図１においては、タッチセンサ３Ａとして配置されている例を示しているが、導電性パターン３には、複数の電子部品３Ｂ（不図示）が取り付けられてもよい。電子部品３Ｂとしては、制御回路、歪み、抵抗、静電容量、ＴＩＲなどの接触感知、および光検出部品、圧電アクチュエータまたは振動モータなどの触知部品または振動部品、ＬＥＤなどの発光部品、マイクおよびスピーカーなどの発音または受音、メモリチップ、プログラマブルロジックチップおよびＣＰＵなどのデバイス操作部品、デジタル信号プロセッサ（ＤＳＰ）、ＡＬＳデバイス、ＰＳデバイス、処理デバイス、ＭＥＭＳ等が挙げられる。 (Electronic parts)
Although the conductive pattern 3 is arranged as a touch sensor 3A in FIG. 1, a plurality of electronic components 3B (not shown) may be attached to the conductive pattern 3. FIG. The electronic components 3B include control circuits, strain, resistance, capacitance, contact sensing such as TIR, and photodetection components, tactile components such as piezoelectric actuators or vibration motors or vibration components, light emitting components such as LEDs, microphones and Producing or receiving sounds such as speakers, device operating components such as memory chips, programmable logic chips and CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.
　また、図１、図２に示すように、導電性パターン３には、一端に複数のコネクタ接続パッド３ａが形成され、電子装置１の外部に設けられた外部装置と電気的に接続するためのコネクタ３Ｃが電気的に接続されている。
　コネクタ３Ｃは、導電性パターン３と電気的に接続され外部装置と電気的に接続するための端子３Ｃａと、端子３Ｃａを保持するハウジング３Ｃｂと、を備え、ハウジング３Ｃｂは後述する樹脂層５と一体で形成されている。 As shown in FIGS. 1 and 2, the conductive pattern 3 has a plurality of connector connection pads 3a formed at one end thereof for electrical connection with an external device provided outside the electronic device 1. A connector 3C is electrically connected.
The connector 3C includes terminals 3Ca electrically connected to the conductive pattern 3 and electrically connected to an external device, and a housing 3Cb that holds the terminals 3Ca. The housing 3Cb is integrated with the resin layer 5 described later. is formed by
　（樹脂層）
　樹脂層５は、基材２の導電性パターン３が配置された第１面２ａとは反対側の第２面２ｂに対して接着層を介することなく基材２の第２面２ｂを覆うように形成されている。樹脂層５は、後述するように、導電性パターン３が配置された基材２を射出成形用金型Ｋに位置決めしてセットした状態で溶融樹脂をインサート成形することで形成される。
　このとき、通常は、樹脂層５と基材２の接着性を向上させるために、樹脂素材の組み合わせに応じて接着層を形成するバインダーインクを塗布することが行われるが、本実施形態においては、接着層を介することなく、樹脂層５をインサート成形する。基材２と樹脂層５は、後述する固定体６によって基材２と樹脂層５を当接するように固定している。これにより、基材２と樹脂層５の分離を容易にしてリサイクル性を向上させている。 (resin layer)
The resin layer 5 covers the second surface 2b of the substrate 2 on the side opposite to the first surface 2a of the substrate 2 on which the conductive pattern 3 is arranged without an adhesive layer interposed therebetween. is formed in As will be described later, the resin layer 5 is formed by insert-molding a molten resin while positioning and setting the base material 2 on which the conductive pattern 3 is arranged in the injection mold K. As shown in FIG.
At this time, in order to improve the adhesiveness between the resin layer 5 and the substrate 2, a binder ink that forms an adhesive layer is usually applied according to the combination of resin materials. , the resin layer 5 is insert-molded without an adhesive layer. The base material 2 and the resin layer 5 are fixed by a fixing body 6 to be described later so that the base material 2 and the resin layer 5 are in contact with each other. This facilitates the separation of the base material 2 and the resin layer 5, thereby improving the recyclability.
　「変形例」
　樹脂層５は、基材２の導電性パターン３が配置された第１面２ａとは反対側の第２面２ｂに対して基材２と樹脂層５との接着を阻害する無機物又は有機物を配合した非接着層５Ａ（不図示）を介して基材２の第２面２ｂを覆うように形成されてもよい。非接着層５Ａの材料としては、シリコーン系化合物、シリコーン系樹脂、フッ素系化合物、フッ素系樹脂、ワックス等を単独でまたは２種以上併用して使用することができる。これにより、基材２と樹脂層５の分離をより容易にしてリサイクル性を向上させることができる。 "Variation"
The resin layer 5 contains an inorganic substance or an organic substance that inhibits adhesion between the base material 2 and the resin layer 5 with respect to the second surface 2b opposite to the first surface 2a of the base material 2 on which the conductive pattern 3 is arranged. It may be formed so as to cover the second surface 2b of the substrate 2 via a compounded non-adhesive layer 5A (not shown). As the material for the non-adhesive layer 5A, silicone compounds, silicone resins, fluorine compounds, fluorine resins, waxes, and the like can be used alone or in combination of two or more. This makes it easier to separate the base material 2 and the resin layer 5, thereby improving recyclability.
　樹脂層５は、射出成形可能な熱可塑性樹脂材料からなる熱可塑性樹脂である。具体的には、ポリカーボネート（ＰＣ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリメチルメタクリレート（ＰＭＭＡ）、ポリアミド（ＰＡ）、アクリルブタジエンスチレン（ＡＢＳ）、ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、変性ポリフェニレンエーテル（ｍ－ＰＰＥ）、変性ポリフェニレンオキサイト（ｍ－ＰＰＯ）、シクロオレフィンコポリマー（ＣＯＣ）、シクロオレフィンポリマー（ＣＯＰ）、ポリテトラフルオロエチレン（ＰＴＦＥ）、ポリ塩化ビニル（ＰＶＣ）、またはこれらの混合物を含む熱可塑性樹脂を用いることができる。 The resin layer 5 is a thermoplastic resin made of a thermoplastic resin material that can be injection molded. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof. A plastic resin can be used.
　（固定体）
　固定体６は、図２Ｂに示すように、基材２の第１面２ａに沿う少なくとも一面６１ａを有する面状体部６１を有し、面状体部６１の一面６１ａが基材２の第１面２ａと面接触して基材２と樹脂層５を固定している。
　面状体部６１は、基材２を厚み方向に貫通して第１面２ａ側に突出するように樹脂層５と一体に形成されている。 (fixed body)
As shown in FIG. 2B , the fixed body 6 has a planar body portion 61 having at least one surface 61 a along the first surface 2 a of the base material 2 , and one surface 61 a of the planar body portion 61 is the first surface of the base material 2 . The substrate 2 and the resin layer 5 are fixed by making surface contact with the first surface 2a.
The planar body portion 61 is formed integrally with the resin layer 5 so as to penetrate the base material 2 in the thickness direction and protrude toward the first surface 2a.
　具体的には、面状体部６１は、図３に示すように、基材２の第１面２ａに導電性パターン３が配置され、固定体６を形成するための貫通孔２ｃが設けられたフィルム基板４（図３Ａ　参照）を射出成形用金型Ｋに載置して固定した状態（図３Ｂ　参照）で、樹脂層５をインサート成形することで、キャビティＣＡ１に充填される溶融樹脂が貫通孔２ｃからキャビティＣＡ２へ流動して（図３Ｂ中　矢印参照）、基材２を厚み方向に貫通して第１面２ａ側に突出するように樹脂層５と一体として形成される。 Specifically, as shown in FIG. 3, the planar body portion 61 has the conductive pattern 3 arranged on the first surface 2a of the base material 2, and the through hole 2c for forming the fixed body 6 is provided. With the film substrate 4 (see FIG. 3A) placed and fixed on the injection molding die K (see FIG. 3B), the resin layer 5 is insert-molded so that the molten resin filling the cavity CA1 is It is formed integrally with the resin layer 5 so as to flow from the through hole 2c to the cavity CA2 (see the arrow in FIG. 3B), penetrate the base material 2 in the thickness direction, and protrude toward the first surface 2a.
　このように基材２の第１面２ａと面接触して基材２と樹脂層５を固定している固定体６は、導電性パターン３及びフィルム基板４上に実装された電子部品３Ｂ（不図示）を除いて複数箇所に設けられている。固定体６の基材２の第１面２ａにおける形成位置及び個数は、フィルム基板４の大きさ（面積）、導電性パターン３及び電子部品３Ｂ（不図示）の配置に応じて設定される。
　これにより、電子装置１の反りを抑制するとともに基材２と樹脂層５の分離を容易にして電子装置１のリサイクル性を向上させることができる。 The fixed body 6 that fixes the base material 2 and the resin layer 5 by making surface contact with the first surface 2a of the base material 2 in this manner includes the conductive pattern 3 and the electronic component 3B mounted on the film substrate 4 ( not shown). The formation position and the number of fixed bodies 6 on the first surface 2a of the base material 2 are set according to the size (area) of the film substrate 4 and the arrangement of the conductive patterns 3 and electronic components 3B (not shown).
As a result, warping of the electronic device 1 can be suppressed and the separation of the base material 2 and the resin layer 5 can be facilitated, thereby improving the recyclability of the electronic device 1 .
　「変形例」
　図４Ａは侵入規制体７を接着したフィルム基板４の一例を示す平面模式図、図４Ｂは変形例に係る電子装置１Ａの図２Ａに示すＡ－Ａ線に沿った断面模式図である。
　面状体部６１の一面６１ａが当接する領域は、基材２の第２面２ｂと樹脂層５の間に樹脂層５の進入を規制する進入規制体７を設けることが好ましい。図４に示すように、進入規制体７は、面状体部６１の平面形状に合わせて基材２に形成された貫通孔２ｃの周囲に基材２の第２面２ｂに密着するように、接着により固定される。接着の方法としては、溶融樹脂の樹脂圧により進入規制体７がずれないように、接着剤で固定する、両面テープで張り合わせる等が挙げられる。
　進入規制体７の材料は特に限定されないが、樹脂層５の材料と同じ熱可塑性樹脂材料で形成されているのが好ましい。 "Variation"
FIG. 4A is a schematic plan view showing an example of a film substrate 4 to which an intrusion restrictor 7 is adhered, and FIG. 4B is a schematic cross-sectional view of an electronic device 1A according to a modification taken along line AA shown in FIG. 2A.
In the area where the one surface 61 a of the planar body portion 61 abuts, it is preferable to provide an entry restricting body 7 for restricting entry of the resin layer 5 between the second surface 2 b of the base material 2 and the resin layer 5 . As shown in FIG. 4 , the entry restricting body 7 is arranged around the through hole 2 c formed in the base material 2 so as to be in close contact with the second surface 2 b of the base material 2 so as to match the planar shape of the planar body portion 61 . , is fixed by gluing. Examples of the bonding method include fixing with an adhesive, pasting with double-sided tape, etc. so that the entry restricting body 7 is not displaced by the resin pressure of the molten resin.
Although the material of the entry restricting body 7 is not particularly limited, it is preferably made of the same thermoplastic resin material as the material of the resin layer 5 .
　進入規制体７は、樹脂層５を射出成形で形成する際に、樹脂層５と一体として形成される固定体６の面状体部６１で覆われる基材２の第２面２ｂへの樹脂層５の進入を規制して樹脂層５を射出成形する際の樹脂圧による基材２の変形を抑制している。 The intrusion restricting body 7 prevents the resin from flowing into the second surface 2b of the base material 2 covered with the planar body portion 61 of the fixed body 6 integrally formed with the resin layer 5 when the resin layer 5 is formed by injection molding. By restricting the entry of the layer 5, deformation of the substrate 2 due to resin pressure during injection molding of the resin layer 5 is suppressed.
　（２）電子装置の製造方法
　図５は電子装置１の製造方法の概略の手順の一例を示すフローチャート図、図６は電子装置１の製造過程を説明するための電子装置１の部分断面模式図である。 (2) Manufacturing method of electronic device FIG. 5 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1, and FIG. is.
　電子装置１は、図５に示すように、基材２の準備工程Ｓ１１と、基材２上に導電性パターン３を形成する配線用めっき工程Ｓ１２と、導電性パターン３が配置された基材２に貫通孔２ｃを設ける貫通孔形成工程Ｓ１３と、基材２を射出成形用金型Ｋに位置決めして、基材２の第１面２ａ側で基材２の第２面２ｂと樹脂層５とが当接するように固定する固定体６とを一体としてインサート成形する樹脂充填工程Ｓ１４と、を経て製造される。 As shown in FIG. 5, the electronic device 1 includes a substrate 2 preparation step S11, a wiring plating step S12 for forming a conductive pattern 3 on the substrate 2, and a substrate on which the conductive pattern 3 is arranged. A through-hole forming step S13 in which a through-hole 2c is provided in the base material 2, and the base material 2 is positioned in the injection mold K, and the second surface 2b of the base material 2 and the resin layer are formed on the side of the first surface 2a of the base material 2. and a resin filling step S14 of integrally insert-molding the fixed body 6 fixed so that the fixed body 5 is in contact with the fixed body 5 .
　（基材の準備工程Ｓ１１）
　基材の準備工程Ｓ１１においては、まず、所定の形状及び大きさに形成された実質的に平坦なフィルム状の基材２に導電性パターン３を配置するために、基材２上に金属めっき成長のきっかけとなる金属ナノ粒子等の触媒粒子からなる下地層を所定のパターン状に形成する。尚、基材２には、金属ナノ粒子等の触媒粒子からなる触媒インクを均一に塗布するために、例えば、コロナ処理、プラズマ処理、溶剤処理、プライマー処理等の表面処理を施すことが好ましい。 (Base material preparation step S11)
In the base material preparation step S11, metal plating is first performed on the base material 2 in order to dispose the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size. A base layer made of catalyst particles such as metal nanoparticles that trigger growth is formed in a predetermined pattern. In order to uniformly apply catalyst ink composed of catalyst particles such as metal nanoparticles, the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment.
　基材２上に金属ナノ粒子等の触媒粒子からなる触媒インクを塗布する方法としては、インクジェット印刷方式、シルクスクリーン印刷方式、グラビア印刷方式、オフセット印刷方式、フレキソ印刷方式、ローラーコーター方式、刷毛塗り方式、スプレー方式、ナイフジェットコーター方式、パッド印刷方式、グラビアオフセット印刷方式、ダイコーター方式、バーコーター方式、スピンコーター方式、コンマコーター方式、含浸コーター方式、ディスペンサー方式、メタルマスク方式が挙げられるが、本実施形態においてはインクジェット印刷方式を用いている。 Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.
　具体的には、１０００ｃｐｓ以下、例えば、２ｃｐｓから３０ｃｐｓの低粘度の触媒インクをインクジェット印刷方式で塗布した後、溶媒を揮発させ金属ナノ粒子のみを残す。その後、溶媒を除去し（乾燥）、金属ナノ粒子を焼結させる（焼成）。
　焼成温度は、１００°Ｃ～３００°Ｃが好ましく、１５０°Ｃ～２００°Ｃがより好ましい。焼成温度が低すぎると、金属ナノ粒子同士の焼結が不十分となるとともに、金属ナノ粒子以外の成分が残ることで、密着性が得られない虞がある。また、焼成温度が高すぎると、基材２の劣化や歪みが発生する虞がある。 Specifically, after applying a low-viscosity catalyst ink of 1000 cps or less, for example, 2 cps to 30 cps, by an inkjet printing method, the solvent is volatilized to leave only the metal nanoparticles. The solvent is then removed (drying) and the metal nanoparticles are sintered (firing).
The firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the metal nanoparticles will not be sufficiently sintered, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.
　（配線用めっき工程Ｓ１２）
　基材２上に形成された下地層に対し、電解めっきまたは無電解めっきを行うことにより、下地層の表面および内部にめっき金属を析出させ導電性パターン３を配置する（図６Ａ　参照）。めっき方法は公知のめっき液およびめっき処理と同様であり、具体的に無電解銅めっき、電解銅めっきが挙げられる。 (Wiring plating step S12)
Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit a plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 6A). The plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.
　（貫通孔形成工程Ｓ１３）
　導電性パターン３が配置された基材２に、基材２の厚み方向に貫通する貫通孔２ｃを形成する（図６Ｂ　参照）。貫通孔２ｃは、樹脂層５を形成するキャビティＣＡ１と固定体６を形成するキャビティＣＡ２とを連通する孔であり、固定体６の面状体部６１の大きさに合わせて、溶融樹脂が通過できる大きさで複数形成される。また、コネクタ３Ｃのハウジング３Ｃｂを樹脂層５と一体に形成するための貫通孔２ｄも形成する（図６Ｂ　参照）。 (Through hole forming step S13)
A through-hole 2c is formed through the substrate 2 on which the conductive pattern 3 is arranged (see FIG. 6B). The through hole 2c is a hole that communicates with the cavity CA1 forming the resin layer 5 and the cavity CA2 forming the fixed body 6. The through hole 2c is adapted to the size of the planar body portion 61 of the fixed body 6 and allows the molten resin to pass therethrough. It is formed in multiple sizes. A through hole 2d is also formed for integrally forming the housing 3Cb of the connector 3C with the resin layer 5 (see FIG. 6B).
　（樹脂充填工程Ｓ１４）
　樹脂充填工程Ｓ１４では、貫通孔２ｃが形成され導電性パターン３が配置された基材２を射出成形用金型Ｋに位置決めしてセットした状態（図６Ｃ　参照）で射出成形用金型Ｋを閉じて樹脂をキャビティＣＡ１に充填する。キャビティＣＡ１に充填された樹脂により、基材２の第２面２ｂを覆う樹脂層５が形成される。そして、キャビティＣＡ１に充填される樹脂は、基材２に形成された貫通孔２ｃから基材２の導電性パターン３が配置された第１面２ａ側に形成されたキャビティＣＡ２に充填される。キャビティＣＡ２に充填された樹脂により、基材２の第２面２ｂと樹脂層５とが当接するように固定する固定体６の面状体部６１が形成される（図６Ｄ　参照）。 (Resin filling step S14)
In the resin filling step S14, the injection molding die K is placed in a state in which the base material 2 having the through holes 2c and the conductive pattern 3 arranged thereon is positioned and set in the injection molding die K (see FIG. 6C). Close to fill cavity CA1 with resin. A resin layer 5 covering the second surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. Then, the cavity CA2 formed on the side of the first surface 2a of the substrate 2 on which the conductive pattern 3 is arranged is filled with the resin that fills the cavity CA1 through the through hole 2c formed in the substrate 2. FIG. The resin filled in the cavity CA2 forms the planar body portion 61 of the fixed body 6 that is fixed so that the second surface 2b of the base material 2 and the resin layer 5 are in contact with each other (see FIG. 6D).
　尚、貫通孔形成工程Ｓ１３で貫通孔２ｃが形成された基材２の導電性パターン３が配置された第１面２ａとは反対側の第２面２ｂに基材２と樹脂層５との接着を阻害する樹脂組成物を塗布してもよい。 In addition, the substrate 2 and the resin layer 5 are bonded to the second surface 2b opposite to the first surface 2a on which the conductive pattern 3 of the substrate 2 having the through holes 2c formed in the through hole forming step S13. A resin composition that inhibits adhesion may be applied.
　このように、本実施形態の電子装置１の製造方法によれば、基材２上に形成された導電性パターン３を有するフィルム基板４に樹脂層５の成形と同時に固定体６を形成することができる。また、基材２の第２面２ｂに接着層となるバインダーインクを塗布していないために、射出成形での基材２と樹脂層５の収縮差による電子装置１としての反りを抑制することができる。 As described above, according to the method for manufacturing the electronic device 1 of the present embodiment, the fixed body 6 is formed simultaneously with the molding of the resin layer 5 on the film substrate 4 having the conductive pattern 3 formed on the base material 2. can be done. In addition, since the second surface 2b of the base material 2 is not coated with a binder ink that serves as an adhesive layer, warping of the electronic device 1 due to the difference in shrinkage between the base material 2 and the resin layer 5 during injection molding can be suppressed. can be done.
　「変形例」
　図７は変形例に係る電子装置１Ａの製造方法の概略の手順の一例を示すフローチャート図、図８は変形例に係る電子装置１Ａの製造過程を説明するための電子装置１Ａの部分断面模式図である。 "Variation"
FIG. 7 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1A according to the modification, and FIG. 8 is a schematic partial cross-sectional view of the electronic device 1A for explaining the manufacturing process of the electronic device 1A according to the modification. is.
　変形例に係る電子装置１Ａは、図８に示すように、基材２の準備工程Ｓ２１と、基材２上に導電性パターン３を形成する配線用めっき工程Ｓ２２と、導電性パターン３が配置された基材２に貫通孔２ｃを設ける貫通孔形成工程Ｓ２３と、基材２の第２面２ｂ側で固定体６の面状体部６１が形成される領域に進入規制体７を接着する進入規制体接着工程Ｓ２４、基材２を射出成形用金型Ｋに位置決めして、基材２の第１面２ａ側で基材２の第２面２ｂと樹脂層５とが当接するように固定する固定体６とを一体としてインサート成形する樹脂充填工程Ｓ２５と、を経て製造される。 As shown in FIG. 8, the electronic device 1A according to the modification includes a preparation step S21 for the base material 2, a wiring plating step S22 for forming the conductive pattern 3 on the base material 2, and the conductive pattern 3. a through-hole forming step S23 of forming a through-hole 2c in the base material 2, and bonding the entry restricting body 7 to a region where the planar body portion 61 of the fixed body 6 is formed on the second surface 2b side of the base material 2. In the step S24 of adhering the restrictor, the substrate 2 is positioned in the injection mold K so that the second surface 2b of the substrate 2 and the resin layer 5 are in contact with each other on the side of the first surface 2a of the substrate 2. and a resin filling step S25 in which the fixed body 6 to be fixed is integrally insert-molded.
　変形例に係る電子装置１Ａの製造工程における、基材２の準備工程Ｓ２１、配線用めっき工程Ｓ２２（図８Ａ　参照）、貫通孔形成工程Ｓ２３（図８Ｂ　参照）、樹脂充填工程Ｓ２５（図８Ｅ　参照）は、上述した電子装置１の製造過程と同一であるために、その説明は省略して、進入規制体接着工程Ｓ２４以降について説明する。 Preparing step S21 of substrate 2, wiring plating step S22 (see FIG. 8A), through-hole forming step S23 (see FIG. 8B), and resin filling step S25 (see FIG. 8E) in the manufacturing process of the electronic device 1A according to the modification. ) is the same as the manufacturing process of the electronic device 1 described above, the description thereof will be omitted, and the following will be described from the entry restricting body bonding step S24 onward.
　（進入規制体接着工程Ｓ２４）
　基材２の準備工程Ｓ２１、配線用めっき工程Ｓ２２、貫通孔形成工程Ｓ２３を経て、基材２の固定体６の面状体部６１が形成される領域の基材２の第２面２ｂに進入規制体７を接着により取り付ける（図８Ｃ　参照）。 (Entrance regulator bonding step S24)
After the substrate 2 preparing step S21, the wiring plating step S22, and the through-hole forming step S23, a Attach the entry restrictor 7 by gluing (see FIG. 8C).
　（樹脂充填工程Ｓ２５）
　樹脂充填工程Ｓ２５では、基材２に貫通孔２ｃが形成され進入規制体７が接着されたフィルム基板４を射出成形用金型Ｋに位置決めしてセットした状態で射出成形用金型Ｋを閉じて（図８Ｄ　参照）樹脂をキャビティＣＡ１に充填する。キャビティＣＡ１に充填された樹脂により、基材２の第２面２ｂを覆う樹脂層５が形成される。このとき、進入規制体７が接着されている領域の基材２の第２面２ｂには、溶融樹脂は進入することができず、溶融樹脂の樹脂圧による基材２の変形が抑制される。 (Resin filling step S25)
In the resin filling step S25, the film substrate 4 having the through hole 2c formed in the base material 2 and the entry restricting member 7 adhered thereto is positioned and set in the injection molding die K, and the injection molding die K is closed. (see FIG. 8D) to fill the cavity CA1 with resin. A resin layer 5 covering the second surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. At this time, the molten resin cannot enter the second surface 2b of the base material 2 in the region where the entry restricting body 7 is adhered, and the deformation of the base material 2 due to the resin pressure of the molten resin is suppressed. .
　そして、キャビティＣＡ１に充填される樹脂は、基材２に形成された貫通孔２ｃから基材２の導電性パターン３が配置された第１面２ａ側に形成されたキャビティＣＡ２に充填される。キャビティＣＡ２に充填された樹脂により、基材２の第２面２ｂと樹脂層５とが当接するように固定する固定体６の面状体部６１が形成される。
　尚、貫通孔形成工程Ｓ２３で貫通孔２ｃが形成された基材２の導電性パターン３が配置された第１面２ａとは反対側の第２面２ｂに基材２と樹脂層５との接着を阻害する樹脂組成物を塗布してもよい。 Then, the cavity CA2 formed on the side of the first surface 2a of the substrate 2 on which the conductive pattern 3 is arranged is filled with the resin that fills the cavity CA1 through the through hole 2c formed in the substrate 2. FIG. The planar body portion 61 of the fixed body 6 that is fixed so that the second surface 2b of the base material 2 and the resin layer 5 are in contact with each other is formed by the resin filled in the cavity CA2.
It should be noted that the base material 2 and the resin layer 5 are bonded to the second surface 2b opposite to the first surface 2a on which the conductive pattern 3 of the base material 2 in which the through holes 2c are formed in the through hole forming step S23. A resin composition that inhibits adhesion may be applied.
　このように、本実施形態の変形例に係る電子装置１Ａの製造方法によれば、基材２上に形成された導電性パターン３を有するフィルム基板４に樹脂層５の成形と同時に固定体６を形成することができる。また、面状体部６１の一面６１ａが当接する領域は、基材２の第２面２ｂと樹脂層５の間に樹脂層５の進入を規制する進入規制体７を接着により設けることで、面状体部６１で覆われる基材２の第２面２ｂへの樹脂層５の進入を規制して樹脂圧による基材２の変形を抑制している。 As described above, according to the method of manufacturing the electronic device 1A according to the modification of the present embodiment, the fixed body 6 is formed on the film substrate 4 having the conductive pattern 3 formed on the base material 2 at the same time as the resin layer 5 is formed. can be formed. In addition, in the region where the one surface 61a of the planar body portion 61 abuts, an entry restricting body 7 for restricting the entrance of the resin layer 5 is provided between the second surface 2b of the base material 2 and the resin layer 5 by bonding. Intrusion of the resin layer 5 into the second surface 2b of the base material 2 covered with the planar body portion 61 is restricted to suppress deformation of the base material 2 due to resin pressure.
１、１Ａ・・・電子装置
　２・・・基材
　　２ａ・・・第１面（導電性パターン３側）、２ｂ・・・第２面
　　２ｃ、２ｄ・・・貫通孔
　３・・・導電性パターン
　３Ａ・・・タッチセンサ、３Ｂ・・・電子部品、３Ｃ・・・コネクタ
　４・・・フィルム基板
　５・・・樹脂層
　６・・・固定体、６１・・・面状体部、
　７・・・進入規制体
Ｋ・・・射出成形用金型
ＣＡ１、ＣＡ２・・・キャビティ DESCRIPTION OF SYMBOLS 1, 1A... Electronic device 2... Base material 2a... 1st surface (conductive pattern 3 side), 2b... 2nd surface 2c, 2d... Through-hole 3... Conductivity Pattern 3A... Touch sensor, 3B... Electronic component, 3C... Connector 4... Film substrate 5... Resin layer 6... Fixed body, 61... Planar body part,
7 Entry control body K Molds for injection molding CA1, CA2 Cavity

Claims (11)

  1. 　基材の第１面に導電性パターンが形成されたフィルム基板と、
    　前記基材の第１面とは反対側の第２面を覆う樹脂層と、
    　前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、を備えた、
    　ことを特徴とする電子装置。     a film substrate having a conductive pattern formed on the first surface of the substrate;
    a resin layer covering a second surface of the substrate opposite to the first surface;
    a fixing body that fixes the second surface of the base material and the resin layer so that they are in contact with each other on the first surface side of the base material;
    An electronic device characterized by:
  2. 　前記固定体は、前記基材の第１面に沿う少なくとも一面を有する面状体部を有し、前記面状体部の前記一面が前記基材の第２面と面接触して前記基材と前記樹脂層を固定している、
    　ことを特徴とする請求項１に記載の電子装置。     The fixed body has a planar body portion having at least one surface along the first surface of the base material, and the one surface of the planar body portion is in surface contact with the second surface of the base material to form the base material. and fixing the resin layer,
    The electronic device according to claim 1, characterized in that:
  3. 　前記面状体部は、前記基材を厚み方向に貫通して前記第１面側に突出するように前記樹脂層と一体に形成されている、
    　ことを特徴とする請求項１又は２に記載の電子装置。     The planar body portion is formed integrally with the resin layer so as to penetrate the base material in the thickness direction and protrude toward the first surface,
    3. The electronic device according to claim 1, wherein:
  4. 　前記固定体は、前記導電性パターン及び前記フィルム基板上に実装された実装品を除いて複数箇所に設けられている、
    　ことを特徴とする請求項１ないし３のいずれか１項に記載の電子装置。     The fixed body is provided at a plurality of locations except for the conductive pattern and the mounted product mounted on the film substrate,
    The electronic device according to any one of claims 1 to 3, characterized in that:
  5. 　前記基材の第２面と前記樹脂層との間に接着層が設けられていない、
    　ことを特徴とする請求項１ないし４のいずれか１項に記載の電子装置。     An adhesive layer is not provided between the second surface of the base material and the resin layer,
    The electronic device according to any one of claims 1 to 4, characterized in that:
  6. 　前記基材の第２面と前記樹脂層との間に、前記基材と前記樹脂層との接着を阻害する無機物又は有機物を配合した非接着層が設けられている、
    　ことを特徴とする請求項１ないし４のいずれか１項に記載の電子装置。     A non-adhesive layer containing an inorganic or organic substance that inhibits adhesion between the base material and the resin layer is provided between the second surface of the base material and the resin layer.
    The electronic device according to any one of claims 1 to 4, characterized in that:
  7. 　前記面状体部の一面が当接する領域は、前記基材の第２面と前記樹脂層の間に前記樹脂層の進入を規制する進入規制体を有する、
    　ことを特徴とする請求項１ないし６のいずれか１項に記載の電子装置。     The region with which one surface of the planar body part abuts has an entry restricting body that restricts entry of the resin layer between the second surface of the base material and the resin layer,
    The electronic device according to any one of claims 1 to 6, characterized in that:
  8. 　前記基材が合成樹脂材料からなる変形可能なフィルムである、
    　ことを特徴とする請求項１ないし７のいずれか１項に記載の電子装置。     wherein the substrate is a deformable film made of a synthetic resin material;
    The electronic device according to any one of claims 1 to 7, characterized in that:
  9. 　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、がインサート成形によって一体成形された電子装置であって、
      前記インサート成形時に、前記固定体が前記基材を厚み方向に貫通して前記第１面側に突出して前記基材の第１面に沿う少なくとも一面を有する面状体部が形成され、前記面状体部の前記一面が前記基材の第２面と接触して前記基材と前記樹脂層を固定するように前記樹脂層と一体に形成されている、
    　ことを特徴とする電子装置。     A film substrate having a conductive pattern formed on a first surface of a base material, a resin layer covering a second side opposite to the first surface of the base material, and the base material on the first surface side of the base material A fixed body fixed so that the second surface of and the resin layer are in contact with each other is an electronic device integrally molded by insert molding,
    During the insert molding, the fixed body penetrates the base material in the thickness direction and protrudes toward the first surface to form a planar body part having at least one surface along the first surface of the base material, and the surface The one surface of the body portion is formed integrally with the resin layer so as to be in contact with the second surface of the base material and fix the base material and the resin layer,
    An electronic device characterized by:
  10. 　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２面を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、を備えた電子装置の製造方法であって、
    　前記基材を準備する工程と、
    　前記基材上に前記導電性パターンを配置する工程と、
    　前記基材に貫通孔を形成する工程と、
    　前記貫通孔が形成された前記基材を金型に載置して前記樹脂層と前記固定体を射出成形する工程と、を含む、
    　ことを特徴とする電子装置の製造方法。     A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; A method for manufacturing an electronic device, comprising: a fixing body for fixing such that the second surface of the material and the resin layer are in contact with each other,
    preparing the substrate;
    disposing the conductive pattern on the substrate;
    forming a through-hole in the base material;
    placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body;
    A method of manufacturing an electronic device, characterized by:
  11. 　基材の第１面に導電性パターンが形成されたフィルム基板と、前記基材の第１面とは反対側の第２面を覆う樹脂層と、前記基材の第１面側で前記基材の第２面と前記樹脂層とが当接するように固定する固定体と、前記面状体部の一面が当接する領域の前記基材の第２面と前記樹脂層の間に前記樹脂層の進入を規制する進入規制体と、を備えた電子装置の製造方法であって、
    　前記基材を準備する工程と、
    　前記基材上に前記導電性パターンを配置する工程と、
    　前記基材に貫通孔を形成する工程と、
    　前記基材の前記固定体に覆われる領域の前記基材の第２面に前記進入抑制体を張り合わせる工程と、
    　前記貫通孔が形成された前記基材を金型に載置して前記樹脂層と前記固定体を射出成形する工程と、を含む、
    　ことを特徴とする電子装置の製造方法。     A film substrate having a conductive pattern formed on a first surface of a substrate; a resin layer covering a second surface of the substrate opposite to the first surface; a fixing body for fixing such that the second surface of the substrate and the resin layer are in contact with each other; A method for manufacturing an electronic device comprising: an entry restrictor for restricting entry of
    preparing the substrate;
    disposing the conductive pattern on the substrate;
    forming a through-hole in the base material;
    a step of adhering the entry suppressing body to a second surface of the base material in a region covered by the fixed body of the base material;
    placing the base material having the through-holes in a mold and injection-molding the resin layer and the fixed body;
    A method of manufacturing an electronic device, characterized by:
PCT/JP2022/003453 2022-01-28 2022-01-28 Electronic device and method for manufacturing same WO2023145028A1 (en)

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JP2003007379A (en) * 2001-06-25 2003-01-10 Sumitomo Wiring Syst Ltd Mechanism and method for flat wire connection
JP2006210788A (en) * 2005-01-31 2006-08-10 Fujikura Ltd Flexible printed wiring board and its manufacturing method
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JP2013172068A (en) * 2012-02-22 2013-09-02 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board

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Publication number Priority date Publication date Assignee Title
JPH10242659A (en) * 1997-02-26 1998-09-11 Nec Shizuoka Ltd Coupling structure of metal component to resin component
JP2003007379A (en) * 2001-06-25 2003-01-10 Sumitomo Wiring Syst Ltd Mechanism and method for flat wire connection
JP2006210788A (en) * 2005-01-31 2006-08-10 Fujikura Ltd Flexible printed wiring board and its manufacturing method
JP2008103619A (en) * 2006-10-20 2008-05-01 Nec Corp Printed circuit board flexure prevention apparatus, its manufacturing method, and printed circuit board flexure prevention method
JP2013172068A (en) * 2012-02-22 2013-09-02 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board

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