JP7117706B1 - Display device and manufacturing method thereof - Google Patents

Abstract

Provided are a display device capable of suppressing leakage of light and clearly distinguishing between a light-emitting region and a non-light-emitting region, and a method of manufacturing the same. a light emitting element that is electrically connected to a conductive pattern arranged on one surface of a deformable base material and emits light; and a resin layer that covers the other surface opposite to the one surface of the base material and supports the base material. A part of the resin layer penetrates the base material in the thickness direction and protrudes above the base material in a cylindrical shape, and has a wall surface that separates the light emitting element and controls the leakage of light. and a light-shielding molding that guides light to the outside.

Description

The present invention relates to a display device and its manufacturing method.

An operation device provided in a device for operating the device, comprising: an operation key to be pressed to generate an operation signal indicating operation content of the device; a first substrate holding the operation key in a depressible manner; and a light guide member for guiding light to the outside, and the first substrate has an opening for positioning the light guide member (Patent Document 1).

a light guide member that converts a light beam incident from the first surface into diffused light and emits the light from a second surface opposite to the first surface; and a plurality of point light sources arranged, the light guide member partitioning the first surface into a plurality of light emitting regions corresponding to the one or more point light sources directly below, and controlling the transmission of light rays to the adjacent light emitting regions. A light-emitting display device having a light shielding structure that reduces light is also known (Patent Document 2).

JP 2019-10798 A JP 2019-168571 A

SUMMARY OF THE INVENTION The present invention provides a display device capable of suppressing leakage of light and clearly distinguishing between a light-emitting region and a non-light-emitting region, and a manufacturing method thereof.

In order to solve the above problems, the display device according to claim 1,
a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
a light-shielding molded body that has a wall surface that encloses the light-emitting element at a distance and restricts leakage of the light, and guides the light toward the outside;
It is characterized by

The invention according to claim 2 is the display device according to claim 1,
The light-shielding molded body is formed such that part of the resin layer penetrates the base material in the thickness direction and protrudes in a cylindrical shape above the base material.
It is characterized by

The invention according to claim 3 is the display device according to claim 2,
The light-shielding molded body protrudes above the base material so as to cover a part of the conductive pattern to which the light-emitting element is joined,
It is characterized by

The invention according to claim 4 is the display device according to any one of claims 1 to 3,
Further comprising an entry restricting body that is fixed in close contact with the other surface of the base material on which the resin layer is formed in the area where the conductive pattern is covered with the light shielding molded body and restricts the entry of the resin layer,
It is characterized by

The invention according to claim 5 is the display device according to claim 1,
The light-shielding molded body has a light guide part inside the wall surface, one end of which faces the light emitting part of the light emitting element and guides the light from the light emitting element to the outside.
It is characterized by

The invention according to claim 6 is the display device according to claim 5,
The light-shielding molded body is formed in a block shape by dividing a plurality of the light-emitting elements by the wall surface and connecting the light-emitting elements so as to restrict leakage of light to the adjacent light guide section side.
6. The display device according to claim 5, wherein:

The invention according to claim 7 is the display device according to claim 5 or 6,
The light-emitting element is arranged in a region where the base material is bent in the thickness direction and protrudes upward in the light emitting direction, and the light-shielding molded body fills the concave portion between the convex shapes. formed,
A display device characterized by:

The invention according to claim 8 is the display device according to claim 1,
A display body having a light-transmitting portion that transmits the light on the surface of the light-shielding molded body,
It is characterized by

In order to solve the above problems, the display device manufacturing method according to claim 9 includes:
a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
A method of manufacturing a display device, comprising: a light-shielding molded body having a wall surface that separates and surrounds the light-emitting element and restricts leakage of the light, and guides the light from the light-emitting element to the outside,
providing the substrate;
disposing the conductive pattern on the substrate;
electrically bonding the light emitting element to the conductive pattern;
forming a through-hole in the base material;
a step of adhering an entry restricting body for restricting entry of the resin layer to the other surface of the base material in a region of the conductive pattern covered with the light shielding molded body;
a step of placing the base material having the through holes formed therein in a mold to form the resin layer and the light-shielding molded body;
including,
It is characterized by

In order to solve the above problems, the display device manufacturing method according to claim 10 comprises:
a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
A light-shielding molded body having a light guide part whose one end faces the light emitting part of the light emitting element and guides the light from the light emitting element to the outside inside the wall wall that surrounds the light emitting element and restricts the leakage of light. and a method of manufacturing a display device,
providing the substrate;
disposing the conductive pattern on the substrate;
electrically bonding the light emitting element to the conductive pattern;

A shaping step of placing the base material in a mold and shaping the base material into a three-dimensional shape;
placing the shaped base material in a mold to form the resin layer and the light-shielding molded body;
It is characterized by

According to the first aspect of the present invention, it is possible to suppress light leakage and clarify the distinction between the light-emitting region and the light-extinguishing region.

According to the second aspect of the invention, it is possible to reduce the number of processes for manufacturing the display device by integrating the light-shielding molded body and the resin layer.

According to the third aspect of the invention, the light-shielding molding can be formed on the conductive pattern to which the light-emitting element is joined.

According to the fourth aspect of the invention, deformation of the base material due to resin pressure during injection molding can be suppressed.

According to the fifth aspect of the invention, the light from the light-emitting element can be guided to the outside by the light-shielding molding.

According to the sixth aspect of the invention, it is possible to regulate the leakage of light to the adjacent light emitting region and to support the light guide section.

According to the seventh aspect of the invention, a three-dimensional display device can be obtained.

According to the eighth aspect of the present invention, it is possible to suppress the diffusion of the light propagated from the light guide section to the outside and to arrange the display body capable of transmitting the light on the surface of the display device.

According to the ninth aspect of the present invention, it is possible to suppress light leakage and clarify the distinction between the light-emitting region and the light-extinguishing region.

According to the tenth aspect of the present invention, it is possible to suppress light leakage and clarify the distinction between the light-emitting region and the light-extinguishing region.

FIG. 1A is a schematic plan view showing an example of the display device according to the present embodiment with the display body omitted, and FIG. 1B is a schematic cross-sectional view showing the example of the display device according to the present embodiment. FIG. 2A is a schematic plan view showing an example of a substrate having through holes formed therein, and FIG. 2B is a schematic cross-sectional view showing an example of a substrate having through holes formed therein. FIG. 3A is a schematic plan view showing the configuration of the light-shielding molded body, and FIG. 3B is a schematic cross-sectional view showing the configuration of the light-shielding molded body. It is a cross-sectional schematic diagram explaining the flow of resin in the metal mold|die which forms a light-shielding molded object. FIG. 5A is a schematic plan view showing an example of a display device according to a modification with the display body omitted, and FIG. 5B is a schematic cross-sectional view showing an example of the display device according to the modification. It is a flowchart figure which shows an example of the procedure of the outline of the manufacturing method of a display apparatus. It is a partial cross-sectional schematic diagram for demonstrating the manufacturing process of a display apparatus. FIG. 11 is a flow chart diagram showing an example of a schematic procedure of a manufacturing method of a display device according to a modification; It is a figure for demonstrating a part of manufacturing process of the display apparatus which concerns on a modification.

Next, specific examples of embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.
It should be noted that in the following description using the drawings, the drawings are schematic, and the ratio of each dimension is different from the actual one. Illustrations other than members are omitted as appropriate.

(1) Overall configuration of display device FIG. 1A is a schematic plan view showing an example of the display device 1 according to the present embodiment with the display body 9 omitted, and FIG. 1B is a cross section showing an example of the display device 1 according to the present embodiment. Schematic diagrams, FIG. 2A is a schematic plan view showing an example of the base material 2 in which the through holes 2c are formed, FIG. 2B is a cross-sectional schematic diagram showing an example of the base material 2 in which the through holes 2c are formed, and FIG. 3A is a light-shielding molding. FIG. 3B is a schematic plan view showing the structure of the body 6, FIG. 3B is a schematic cross-sectional view showing the structure of the light-shielding molded body 6, and FIG. be.
Hereinafter, the configuration of the display device 1 according to this embodiment will be described with reference to the drawings.

The display device 1, as shown in FIG. It comprises a resin layer 5 covering the other surface 2b on the opposite side and supporting the substrate 2, and a light shielding molding 6 guiding the light from the light emitting element 4 to the outside.

(Base material)
Although the deformable base material 2 used in the present embodiment is not particularly limited to a film-like base material, a film-like base material will be described below. Here, a "deformable substrate" is capable of being deformed after placement of the conductive pattern 3, i.e. formed from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or pressure forming. means a substrate that can be

Examples of materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides such as nylon 6-10 and nylon 46, polyetheretherketone (PEEK), ABS, PMMA, Thermoplastic resins such as polyvinyl chloride may be mentioned.
In particular, polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.

One surface 2a of the substrate 2 is preferably surface-treated in order to evenly apply catalyst ink such as metal nanoparticles. As the surface treatment, for example, corona treatment, plasma treatment, solvent treatment, and primer treatment can be used.

Further, as shown in FIG. 2, through holes 2c are formed in the base material 2 so as to extend through the base material 2 in the thickness direction. The through hole 2c is a hole that communicates the cavity CA1 that forms the resin layer 5 and the cavity CA2 that forms the light shielding molded body 6 when the light shielding molded body 6, which will be described later, is formed by injection molding. It becomes a flow path for molten resin (see Fig. 4). The shape, size, and number of the through holes 2c are appropriately set according to the shape and size of the light-shielding molding 6 to be formed.

The film-like base material 2 made of such a deformable thermoplastic resin is shaped from a substantially flat two-dimensional shape to a substantially three-dimensional shape according to the required mode of use of the display device 1. .

(Conductive pattern)
When the conductive pattern 3 is arranged on the one surface 2a of the base material 2, first, a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers growth of the metal plating is formed in a predetermined pattern. The base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 21, followed by drying and baking.

The thickness (μm) of the underlayer is preferably 0.1 to 20 μm, more preferably 0.2 to 5 μm, most preferably 0.5 to 2 μm. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.

Gold, silver, copper, palladium, nickel, and the like are used as the material of the catalyst. Gold, silver, and copper are preferable from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferable.

The particle size (nm) of the catalyst is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.

The conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating. As the plating metal, copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.

The thickness (μm) of the plating layer is preferably 0.03 to 100 μm, more preferably 1 to 35 μm, most preferably 3 to 18 μm. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plating layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.

Further, the conductive pattern 3 may be formed by applying an organic conductive material in ink or paste form by screen printing, transfer printing, offset printing, flexo printing, ink jet method, etc., and baking it. . Examples of organic conductive materials include PEDOT (polyethylenedioxythiophene)/PSS, carbon, polyacetylene, polythiophene (PT), polypyrrole, polyparaphenylene, polyaniline, and polysulfur nitride.

A plurality of connector connection pads 3a are formed at one end of the conductive pattern 3, and as shown in FIG. electrically connected.
The external connection terminal 7 includes, for example, a terminal portion 7a serving as a connector terminal and an anchor portion 7b, and the anchor portion 7b is electrically joined to the connector connection pad 3a with a joining material. The terminal portion 7a and the anchor portion 7b are formed in a quadrangular prism shape using a copper alloy or the like, and the surface thereof is plated with nickel. plating may be applied. The pitch of the external connection terminals 7 corresponds to the standard of the connector to which they are connected.

1 and 2 show an example in which the conductive pattern 3 electrically connects the external connection terminal 7 and the light emitting element 4, the conductive pattern 3 may include other Multiple electronic components may be attached. Electronic components include control circuits, strain, resistance, capacitance, touch sensing such as TIR, light detection components, tactile components such as piezoelectric actuators, sound generation or reception such as microphones and speakers, memory chips, and programmable logic. Device operating components such as chips and CPUs, digital signal processors (DSPs), ALS devices, PS devices, processing devices, MEMS, and the like.

(light emitting element)
The light emitting element 4 is, for example, a semiconductor light emitting element such as an LED. As shown in FIGS. 1 and 2, the light emitting element 4 is electrically bonded to the conductive pattern 3 with a bonding material such as solder. The light emitting element 4 preferably has a lens (not shown). As such an LED, for example, commercially available semiconductor light-emitting elements such as products of Nichia Corporation, Cree Corporation, Osram Corporation, Toyoda Gosei Co., etc. can be used. These semiconductor light-emitting elements differ in form, size, and mounting method, but are electrically bonded to the conductive pattern 3 formed on the substrate 2 with a bonding material such as solder. Electric power is supplied from the outside through external connection terminals 7 that are physically joined to emit light.

(resin layer)
As shown in FIG. 1B, the resin layer 5 is attached to the other surface 2b of the base material 2 opposite to the one surface 2a of the base material 2 on which the conductive pattern 3 is arranged, via the adhesive layer AD. is formed to cover and support the The adhesive layer AD may be toned to hide the conductive pattern 3 invisibly from the outside. In addition, by using an opaque resin material for the resin layer 5, the light-shielding molding 6 integrally formed with the resin layer 5 restricts the leakage of the light emitted from the light-emitting element 4, thereby Light can be guided towards the outside.

The resin layer 5 is a thermoplastic resin made of an injection-moldable thermoplastic resin material. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof. A plastic resin can be used.

(Light shielding molding)
As shown in FIG. 3, the light-shielding molded body 6 is formed as a cylinder having a wall surface 6a that encloses the light emitting element 4 on the one surface 2a of the base material 2 with a space therebetween and restricts the leakage of the light emitted from the light emitting element 4. and guides the light emitted from the light emitting element 4 toward the outside.

Such a light-shielding molded body 6 is formed such that a part of the resin layer 5 penetrates the base material 2 in the thickness direction and protrudes in a cylindrical shape toward the one surface 2a of the base material 2 . Specifically, as shown in FIG. 3, the light-shielding molded body 6 is a part of the conductive pattern 3 (3b indicated by the dashed line in FIG. 3A) arranged on the one surface 2a of the base material 2 and to which the light emitting element 4 is joined. , and protrudes on one surface 2a of the base material 2. That is, the thermoplastic resin forming the resin layer 5 flows from the through holes 2c provided in the base material 2 onto the one surface 2a of the base material 2 on which the conductive pattern 3 is arranged (indicated by arrows in FIG. 4). By straddling and covering a part of the conductive pattern 3, the light-shielding molding 6 encloses the light-emitting element 4 with a continuous cylindrical body over the entire circumference, and restricts the leakage of light emitted from the light-emitting element 4. there is

Since the light-shielding molded body 6 is formed integrally with the resin layer 5 covering and supporting the other surface 2b of the base material 2 in this way, it is made of the same injection-moldable thermoplastic resin material as the resin layer 5, It is possible to reduce the manufacturing steps of the display device 1 .

(Intrusion regulator)
As shown in FIGS. 3B and 4, the resin layer 5 is formed on the base material 2 in the region where the conductive pattern 3 is covered with the light shielding molded body 6, and is fixed in close contact with the other surface 2b. is provided with an entry restricting body 8 that restricts the
Prior to the formation of the resin layer 5 , the entry restricting body 8 is fixed by adhesion so as to be in close contact with the other surface 2 b of the base material 2 in the area of the conductive pattern 3 covered with the light shielding molded body 6 . As a method of adhesion, fixing with an adhesive, pasting with a double-sided tape, etc. can be mentioned so that the entry restricting body 8 is not displaced by the resin pressure of the molten resin.
Although the material of the entry restricting body 8 is not particularly limited, it is preferably made of the same thermoplastic resin material as the material of the resin layer 5 .

The entry restricting body 8 is formed on the other surface of the base material 2 in the area where the conductive pattern 3 is formed and which is covered with the light shielding molded body 6 integrally formed with the resin layer 5 when the resin layer 5 is formed by injection molding. The deformation of the base material 2 due to the resin pressure when the resin layer 5 is injection-molded is suppressed by restricting the entry of the resin layer 5 into 2b.

(Display body)
A display body 9 having a light-transmitting portion 9a may be attached to the surface of the molded body 6 . As the display 9, for example, a film base on which a touch sensor is patterned or a film base on which button switches are surface-mounted is colored opaque to suppress the diffusion of light to the outside. The visibility of the light-transmitting portion 9a can be improved by providing the light-transmitting portion 9a in which, for example, a hole is formed in a part thereof and allowing a part of the light guided by the light-shielding molded body 6 to pass therethrough.
Further, as the display body 9, a decorative film having a light-transmitting portion 9a may be attached, or a resin molding having a light-transmitting portion 9a may be attached. good.

In this way, the light-shielding molded body 6 is based on the light-shielding molded body 6 which separates the light-emitting element 4 and has the wall surface 6a which restricts the leakage of the light emitted from the light-emitting element 4, and which guides the light emitted from the light-emitting element 4 to the outside. By protruding from the surface 2a of the material 2, it is possible to suppress leakage of light and clarify the distinction between the light-emitting region and the non-light-emitting region.

"Variation"
FIG. 5A is a schematic plan view showing an example of the display device 1A according to the modification, with the display body 9 omitted, and FIG. 5B is a schematic cross-sectional view showing the example of the display device 1A according to the modification.
In the display device 1A according to the modification, the light-emitting element 4 is arranged in a region in which the base material 2A is bent in the thickness direction and protrudes upward in the light emitting direction, and the light-shielding molded body 6A is located on the wall surface 6Aa. Inside, there is a light guide part 61 whose one end faces the light emitting part 4a of the light emitting element 4 and guides the light from the light emitting element 4 to the outside. They are connected and formed in a block shape so as to restrict the leakage of light to the light section 61 side.

The conductive pattern 3 is arranged on one surface 2a of the base material 2, and as shown in FIG. protrudes to After electrically bonding the light emitting element 4 to the conductive pattern 3 arranged on the base material 2, the deformable base material 2 is subjected to forming means such as hot press forming, vacuum forming, air pressure forming, and vacuum pressure forming. is shaped into a three-dimensional shape. The base material 2 shaped to protrude in a convex shape is integrated with the resin layer 5 .

As shown in FIG. 5B, the light shielding molded body 6A has a light guiding portion 61 inside the wall surface 6Aa, one end of which faces the light emitting portion 4a of the light emitting element 4 and guides the light from the light emitting element 4 to the outside. there is The light guide part 61 is formed of a light-transmitting resin material so as to guide the light emitted from the light emitting element 4 to the upper part of the display device 1A. It is
Specific examples of light-transmitting resin materials include polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), and polypropylene. (PP), modified polyphenylene ether (m-PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), It can be made of materials commonly used as light guides.

A light-shielding molded body 6A having a light guide portion 61 has a cavity portion 62 in which each of the light emitting elements 4 arranged in a convexly protruding region of the base material 2A is surrounded by a wall surface 6Aa. are formed in a block shape connected to each other so as to regulate the leakage of light. As shown in FIG. 5A, the light guide portion 61 is positioned in the central portion of the hollow portion 62 supported by a rib body 63 extending from the wall surface 6Aa into the hollow portion 62 .

A display member 9 having a light-transmitting portion 9a that transmits light is attached to the surface of the light-shielding molded member 6A.
As described above, the light-shielding molded body 6A has columnar light guide portions 61 extending upward with one end facing the light emitting portion 4a of the light emitting element 4 inside the wall surface 6Aa. They are partitioned by the hollow portion 62 and connected in block form so as to restrict the leakage of light to the adjacent light guide portion 61 side. As a result, it is possible to suppress the leakage of light to the adjacent light-emitting regions, and to guide the light emitted from the light-emitting element 4 to the light-transmitting portion 9a by the light guide portion 61, thereby making it possible to clearly distinguish between the light-emitting region and the extinguished region. It becomes possible.
(2) Method for Manufacturing Display Device FIG. 6 is a flow chart showing an example of a schematic procedure of a method for manufacturing the display device 1, and FIGS.
The display device 1, as shown in FIG. a joining step S13 of electrically joining with solder; a through-hole forming step S14 of forming a through-hole 2c in the base material 2; 8, and a resin filling step S16 in which the base material 2 is positioned in the mold K to form the resin layer 5 and the light shielding molding 6. As shown in FIG.

(Base material preparation step S11)
In the base material preparation step S11, metal plating is first performed on the base material 2 in order to dispose the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size. A base layer made of catalyst particles such as metal nanoparticles that trigger growth is formed in a predetermined pattern. In order to uniformly apply catalyst ink composed of catalyst particles such as metal nanoparticles, the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment.

Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.

Specifically, after applying a low-viscosity catalyst ink of 1000 cps or less, for example, 2 cps to 30 cps, by an inkjet printing method, the solvent is volatilized to leave only the metal nanoparticles. After that, the solvent is removed (drying) and the metal nanoparticles are sintered (firing).
The firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the sintering of the metal nanoparticles will be insufficient, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.

(Wiring plating step S12)
Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 7A). The plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.

(Joining step S13)
In the bonding step 13 of the light emitting element 4, in order to solder the light emitting element 4 and the external connection terminals 7 onto the conductive pattern 3 arranged on the base material 2, first, the conductive pattern 3 of the base material 2 is attached. A solder resist is applied, for example, by screen printing to the side of the one surface 2a on which is arranged.
Next, solder paste is applied to the conductive pattern 3 , the light emitting element 4 and the terminal portions of the external connection terminals 7 . Application of the solder paste can be performed using a known device such as a stencil printer, a screen printer, or a dispenser. In this embodiment, a dispenser device is used to apply the solder paste.

After applying the solder paste, the solder is melted and solidified to electrically connect the light emitting element 4 and the external connection terminal 7 to the conductive pattern 3 via the solder (see FIG. 7B).
In addition, laser soldering or photobaking soldering may be used for soldering. Laser soldering has the advantage that the light-emitting element 4 can be mounted in a minute portion of the display device 1 in a short time by irradiating a laser beam from a soldering head of a soldering device. In addition, since it is possible to selectively irradiate a laser beam to a portion to be electrically joined, the entire light-emitting element 4 is not heated when joining the light-emitting element 4, as compared with the flow type or the reflow type. It becomes possible to join.

(Through hole forming step S14)
A through-hole 2c is formed in the substrate 2 in which the light-emitting element 4 is bonded to the conductive pattern 3 (see FIG. 7C). The through-hole 2c is a hole that communicates the cavity CA1 forming the resin layer 5 and the cavity CA2 forming the light-shielding molded body 6. formed by In this embodiment, they are provided at two locations in the vicinity of the light emitting element 4 with the conductive pattern 3 interposed therebetween.

(Entrance regulator bonding step S15)
Through the preparation step S11 of the substrate 2, the wiring plating step S12, the bonding step S13 of the light emitting element 4, and the through hole forming step S14, the conductive pattern 3 is arranged and the conductivity of the substrate 2 in which the through hole 2c is formed is improved. An entry restricting body 8 is attached by adhesion to the other surface 2b of the base material 2 in the region where the light shielding molded body 6 covers the light shielding pattern 3 (see FIG. 7D).

(Resin filling step S16)
In the resin filling step S16, first, the through hole 2c is formed in the through hole forming step S14, and the one surface 2a of the substrate 2 on which the conductive pattern 3 is arranged, to which the entry restricting body 8 is adhered in the entering restricting body adhering step S15. Binder ink is applied according to the combination of the resin material of the base material 2 and the resin layer 5 to the other surface 2 b on the opposite side and the one surface 2 a on which the light shielding molded body 6 is formed and which is in contact with the light shielding molded body 6 to form the adhesive layer AD. (see FIG. 1B AD). Further, it is preferable to apply a binder ink (not shown) also to the conductive pattern 3 in the region where the light shielding molded body 6 is formed. The binder ink contains an adhesive resin and is applied by screen printing, inkjet printing, spray coating, brush coating, or the like, and adheres the resin layer 5 injection-molded to the base material 2, the conductive pattern 3, and the light-shielding molding 6. improve sex.

Next, in a state in which the base material 2 having the through hole 2c formed therein and the entry restricting body 8 adhered thereto is positioned and set in the mold K (see FIG. 7E), the mold K is closed and the cavity CA1 is filled with resin. . A resin layer 5 covering the other surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. At this time, the molten resin cannot enter the other surface 2b of the base material 2 in the region where the entry restricting body 8 is adhered, and the deformation of the base material 2 due to the resin pressure of the molten resin is suppressed.
Then, the resin filling the cavity CA1 is filled into the cavity CA2 formed on the one surface 2a side of the base material 2 where the conductive pattern 3 is arranged from the through hole 2c formed in the base material 2. FIG. A light-shielding molding 6 is formed by the resin filled in the cavity CA2.

According to the method of manufacturing the display device 1 according to the present embodiment, the thermoplastic resin forming the resin layer 5 extends from the through hole 2c provided in the base material 2 to the one surface 2a of the base material 2 on which the conductive pattern 3 is arranged. The display device 1 is manufactured by forming the light-shielding molded body 6 which restricts the leakage of light emitted from the light-emitting element 4 by flowing upward and covering a part of the conductive pattern 3 so as to be integrated with the resin layer 5 . process can be reduced.

"Variation"
FIG. 8 is a flow chart showing an example of a schematic procedure of a manufacturing method of the display device 1A according to the modification, and FIG. 9 is a diagram for explaining part of the manufacturing process of the display device 1A according to the modification.

As shown in FIG. 8, the display device 1A according to the modification includes a preparation step S21 of the substrate 2, a wiring plating step S22 of forming the conductive pattern 3 on the substrate 2, the conductive pattern 3 and the light emitting device. A bonding step S23 of electrically bonding the light emitting element 4 to the element 4 by soldering; A shaping step S24 for shaping, positioning the base material 2 in the mold K, and having the resin layer 5 covering the other surface 2b of the base material 2 and the light guide part 61 protruding toward the one surface 2a side of the base material 2. and a resin filling step S25 for forming the light shielding molded body 6A.

The preparation step S21 of the base material 2, the wiring plating step S22, and the bonding step S23 of electrically bonding the conductive pattern 3 and the light emitting element 4 by soldering in the manufacturing process of the display device 1A according to the modification are described above. Since the manufacturing process is the same as the manufacturing process of the display device 1, the description thereof will be omitted, and the shaping process S24 and subsequent steps will be described.

(Shaping step S24)
In the shaping step S24, the base material 2 on which the conductive pattern 3 is arranged and the light emitting elements 4 and the external connection terminals 7 are bonded is formed by a forming means such as heat press forming, vacuum forming, pressure forming, vacuum pressure forming. , into a three-dimensional shape.
The mold used for shaping is formed such that the shaped outer surface of the base material 2 conforms to the shape of the cavity CA of the mold K used for injection molding in the resin filling step S25 described later.

First, the substrate 2 is placed between the female mold 11 and the male mold 12 as shown in FIG. 9A. At this time, the female mold 11 and the male mold 12 are heated to a predetermined temperature capable of softening the base material 2 . Then, as shown in FIG. 9B, when the female mold 11 and the male mold 12 are clamped with a predetermined pressure, the base material 2 is sandwiched between the core portion 12a of the male mold 12 and the cavity portion 11a of the female mold 11. and shaped.

Then, the female mold 11 and the male mold 12 are opened and cooled to obtain the base material 2 shaped into a predetermined three-dimensional shape before trimming. Then, the base material 2 is taken out from the female mold 11 and the male mold 12, and the unnecessary portions are trimmed to obtain the base material 2 before the resin layer 5 and the light shielding molding 6A are formed.

The base material 2 shaped in this manner is subjected to injection molding in the resin filling step S25, and integrated with the resin layer 5 and the light shielding molded body 6A to form the display device 1A.

(Resin filling step S25)
In the resin filling step S25, first, the other surface 2b opposite to the one surface 2a on which the conductive pattern 3 of the base material 2 which has been shaped into a three-dimensional shape in the shaping step S24 is arranged, and the light shielding molding 6A. Binder ink is applied to the one surface 2a on which is formed according to the combination of the base material 2 and the resin material of the resin layer 5. FIG.

Next, the base material 2 that has been shaped into a three-dimensional shape is positioned in the mold K and set. When the base material 2 is set in the cavity CA of the mold K, the base material 2, which has been shaped into a three-dimensional shape, is self-sucked on the surface of the cavity CA so as not to be misaligned. It may be attached to the surface of the cavity CA with a double-sided tape, vacuum-sucked, or may be fixed by providing a projection (not shown) on the cavity CA and fitting it into the projection.

Then, as shown in FIG. 9C, the mold is closed with the substrate 2 positioned and set in the mold K, and the cavity CA is filled with resin. The resin filled in the cavity CA forms the resin layer 5 covering the other surface 2b of the base material 2 and the light-shielding molded body 6A having the light guide portion 61 projecting toward the one surface 2a side of the base material 2 .

As described above, according to the manufacturing method of the display device 1A according to the modification of the present embodiment, the light emitted from the light-emitting elements 4 arranged in the region where the base material 2A is bent in the thickness direction and protrudes in a convex shape is emitted to the outside. A light-shielding molded body 6A having a guiding light guide portion 61 and restricting light leakage to the adjacent light guide portion 61 side can be formed in a block shape.

DESCRIPTION OF SYMBOLS 1, 1A... Display device 2... Base material 2c... Through-hole 3... Conductive pattern 4... Light emitting element 5... Resin layer 6, 6A... Light shielding molding 6a, 6Aa... wall surface, 61... light guide part, 62... cavity part 7... external connection terminal 8... entrance regulator 9... display body 9a... translucent part CA, CA1 , CA2... cavity K... mold

Claims (10)

a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
a light-shielding molding that has a wall surface that encloses the light-emitting element and regulates leakage of the light, and guides the light toward the outside;
A display device characterized by: The light-shielding molded body is formed such that part of the resin layer penetrates the base material in the thickness direction and protrudes in a cylindrical shape above the base material.
2. The display device according to claim 1, wherein: The light-shielding molded body protrudes above the base material so as to cover a part of the conductive pattern to which the light-emitting element is joined,
3. The display device according to claim 2, wherein: Further comprising an entry restricting body that is fixed in close contact with the other surface of the base material on which the resin layer is formed in the area where the conductive pattern is covered with the light shielding molded body and restricts the entry of the resin layer,
4. The display device according to any one of claims 1 to 3, characterized in that: The light-shielding molded body has a light guide part inside the wall surface, one end of which faces the light emitting part of the light emitting element and guides the light from the light emitting element to the outside.
2. The display device according to claim 1, wherein: The light-shielding molded body is formed in a block shape by dividing a plurality of the light-emitting elements by the wall surface and connecting the light-emitting elements so as to restrict leakage of light to the adjacent light guide section side.
6. The display device according to claim 5, wherein: The light-emitting element is arranged in a region where the base material is bent in the thickness direction and protrudes upward in the light emitting direction, and the light-shielding molded body fills the concave portion between the convex shapes. formed,
7. The display device according to claim 5 or 6, characterized in that: A display body having a light-transmitting portion that transmits the light on the surface of the light-shielding molded body,
2. The display device according to claim 1, wherein: a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
A method of manufacturing a display device, comprising: a light-shielding molded body having a wall surface that separates and surrounds the light-emitting element and restricts leakage of the light, and guides the light from the light-emitting element to the outside,
providing the substrate;
disposing the conductive pattern on the substrate;
electrically bonding the light emitting element to the conductive pattern;
forming a through-hole in the base material;
a step of adhering an entry restricting body for restricting entry of the resin layer to the other surface of the base material in a region of the conductive pattern covered with the light shielding molded body;
a step of placing the base material having the through holes formed therein in a mold to form the resin layer and the light-shielding molded body;
including,
A method of manufacturing a display device, characterized by: a light emitting element that is electrically connected to a conductive pattern disposed on one surface of a deformable base material and emits light;
a resin layer covering the other surface opposite to the one surface of the base material and supporting the base material;
A light-shielding molded body having a light guide part whose one end faces the light emitting part of the light emitting element and guides the light from the light emitting element to the outside inside the wall wall that surrounds the light emitting element and restricts the leakage of light. and a method of manufacturing a display device,
providing the substrate;
disposing the conductive pattern on the substrate;
electrically bonding the light emitting element to the conductive pattern;
A shaping step of placing the base material in which the light emitting element is joined to the conductive pattern in a mold and shaping the base material into a three-dimensional shape;
placing the shaped base material in a mold to form the resin layer and the light-shielding molded body;
A method of manufacturing a display device, characterized by:

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