JP7288286B1 - Electronic device manufacturing method - Google Patents

Abstract

Provided are an electronic device capable of fixing a sensor region and a light emitting region by one-time molding, and a manufacturing method thereof. A light emitting element that is electrically connected to a first conductive pattern arranged on one surface of a deformable base material and emits light, and a second conductive pattern arranged on one surface of the folded base material and electrically connected A bonded sensor, an external connection terminal electrically connected to the first conductive pattern and the second conductive pattern and electrically connected to an external element provided outside, and the first conductive pattern are arranged. a light-transmissive resin layer that separates and fixes the one surface of the substrate with the second conductive pattern arranged and the one surface of the folded substrate, and the light-emitting element that is separated from the light-emitting element to restrict light leakage. and a light guide body having a wall surface that guides light from the light emitting element toward the sensor.

Description

The present invention relates to a method of manufacturing an electronic device.

A flexible circuit board in which a switch is formed by folding back a film substrate on which a circuit pattern and contacts are formed, and interposing spacers punched out in the portions corresponding to the contacts between them, wherein the film substrate is formed of a flame-retardant resin film. Then, a conductive circuit pattern, a plurality of electrodes and contacts are formed on the film substrate, the circuit pattern, electrodes and contacts are covered with a conductive protective film, and the protective film is formed between the electrodes. A plurality of independent resistors are provided parallel to each other with paint, and each of these resistors is trimmed to a resistance value by a laser beam. A flexible circuit board is known in which a flexible film is laminated on one half via an adhesive layer, and the other half of the film substrate is folded back and adhered to the other surface of the flexible film via an adhesive layer (Patent Reference 1).

An illumination display panel that has a display portion capable of illumination display and constitutes a part of a housing, comprising: a first molding portion existing excluding the display portion; A second molding portion having a convex portion fitted to a first molding portion is provided in a portion where the first molding portion does not exist. A resin panel whose first molded part is made of an opaque resin whose light transmittance is lower than that of the second molded part, a light source arranged on the back side of the resin panel and guided to the display area, and a film substrate on which the light source is mounted. and a light source mounting substrate, and at least the light source of the light source mounting substrate is sealed with a second molded portion (Patent Document 2).

JP-A-6-29015 JP 2021-67816 A

The present invention provides a method of manufacturing an electronic device that can fix the sensor region and the light emitting region by one molding.

The invention according to claim 2 is the method for manufacturing an electronic device according to claim 1,
The area of the base material where the sensor is arranged is folded back with one end side of the area where the light emitting element is arranged as a starting point, and the pair of the light emitting element and the sensor face each other.
It is characterized by

The invention according to claim 3 is the method for manufacturing an electronic device according to claim 1,
The second conductive pattern is formed in a meandering shape so that the elongation rate becomes small when the base material is deformed in the thickness direction in the region where the base material is folded back,
It is characterized by

According to the invention of claim 4 , in the method of manufacturing an electronic device according to claim 3 ,
The second conductive pattern is a metal plating layer made of at least one metal selected from Cu, Ni, Ag, and Au, or PEDOT/PSS, CNT, graphene, polyacetylene, polythiophene, polypyrrole, poly An organic electrode pattern containing at least one of paraphenylene, polyaniline, and polysulfur nitride,
It is characterized by

In order to solve the above problems, the method for manufacturing an electronic device according to claim 1 comprises:
a light emitting element electrically connected to a first conductive pattern disposed on one surface of a deformable base material and emitting light; and a second conductive pattern disposed on one surface of the folded base material and electrically connected to the an external connection terminal for electrically connecting to an external element electrically connected to the first conductive pattern and the second conductive pattern and provided outside; the first conductive a light-transmitting resin layer for separating and fixing one surface of the substrate on which the conductive pattern is arranged and one surface of the substrate on which the second conductive pattern is arranged and folded back; and separating the light emitting element. A method of manufacturing an electronic device comprising: a light guide body having a wall surface that surrounds and regulates leakage of the light, and guides the light from the light emitting element toward the sensor,
preparing the substrate;
disposing the first conductive pattern, the second conductive pattern and the sensor on the substrate;
forming a through-hole in the base material;
electrically joining the first conductive pattern and the light emitting element with a joining means;
a step of placing the base material having the through-hole formed in a mold and shaping the base material into a folded shape;
A step of placing the shaped base material in a mold and molding the resin layer;
disposing the light guide body on the resin layer;
including,
It is characterized by

According to the first aspect of the invention, the sensor region and the light emitting region can be fixed by one molding.

According to the second aspect of the invention, the sensor area and the light emitting area can be formed integrally by folding back the deformable base material.

According to the third aspect of the invention, disconnection due to bending deformation of the conductive pattern can be suppressed.

According to the fourth aspect of the invention, it is possible to obtain a three-dimensional electronic device by suppressing disconnection due to bending deformation of the conductive pattern.

FIG. 1A is a schematic plan view showing an example of the electronic device according to the present embodiment with the sensor and the display body omitted, and FIG. 1B is a schematic cross-sectional view showing the example of the electronic device according to the present embodiment. FIG. 2A is a schematic plan view showing a substrate on which a circuit is formed, and FIG. 2B is a schematic cross-sectional view showing the substrate on which a circuit is formed. 3A is a schematic partial plan view for explaining a light guide body in an electronic device, and FIG. 3B is a schematic partial cross-sectional view for explaining a light guide body in an electronic device. FIG. 4A is a partial schematic plan view illustrating a light guide according to Modification 1 in an electronic device, and FIG. 4B is a partial cross-sectional schematic diagram illustrating a light guide according to Modification 1 in an electronic device. FIG. 5A is a schematic partial plan view illustrating a light guide body according to Modification Example 2 in an electronic device, and FIG. 5B is a schematic partial cross-sectional view illustrating a light guide body according to Modification Example 2 in an electronic device. It is a flowchart figure which shows an example of the procedure of the outline of the manufacturing method of an electronic device. It is a partial cross-sectional schematic diagram for demonstrating the manufacturing process of an electronic device. It is a figure explaining the shaping process in the manufacturing process of an electronic device.

Next, specific examples of embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.
It should be noted that in the following description using the drawings, the drawings are schematic, and the ratio of each dimension is different from the actual one. Illustrations other than members are omitted as appropriate.

(1) Overall Configuration of Electronic Device FIG. 1A is a schematic plan view showing an example of the electronic device 1 according to the present embodiment with the sensor 5 and the display 9 omitted, and FIG. 1B is an example of the electronic device 1 according to the present embodiment. 2A is a schematic plan view showing the substrate 2 on which the circuit is formed, FIG. 2B is a schematic cross-sectional view showing the substrate 2 on which the circuit is formed, FIG. 3A is a light guide body in the electronic device 1 8, and FIG. 3B is a partial cross-sectional schematic diagram for explaining the light guide body 8 in the electronic device 1. As shown in FIG.
Hereinafter, the configuration of the electronic device 1 according to this embodiment will be described with reference to the drawings.

As shown in FIG. 1, the electronic device 1 includes a light emitting element 4 that is electrically connected to a first conductive pattern 3A arranged on one surface 2a of a deformable base material 2 and emits light, and a folded base material. A sensor 5 electrically connected to a second conductive pattern 3B arranged on one surface 2a of the material 2, an external connection terminal 6 for electrically connecting to an external element, and a first conductive pattern 3A are arranged. A resin layer 7 that separates and fixes one surface 2a of the base material 2 that has been formed and the one surface 2a of the base material 2 that has the second conductive pattern 3B arranged and folded back from each other, and the light from the light emitting element 4 to the sensor 5. and a light guide body 8 for guiding toward.

(Base material)
Although the deformable base material 2 used in the present embodiment is not particularly limited to a film-like base material, a film-like base material will be described below. Here, a "deformable substrate" is a substantially flat two-dimensional shape that can be deformed after placement of the first conductive pattern 3A and the second conductive pattern 3B, i.e., by thermoforming, vacuum forming or pressure forming. means a substrate that can be formed into a substantially three-dimensional shape from

Examples of materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides such as nylon 6-10 and nylon 46, polyetheretherketone (PEEK), ABS, PMMA, Thermoplastic resins such as polyvinyl chloride may be mentioned.
In particular, polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.

One surface 2a of the substrate 2 is preferably surface-treated in order to evenly apply catalyst ink such as metal nanoparticles. As the surface treatment, for example, corona treatment, plasma treatment, solvent treatment, and primer treatment can be used.

A through hole 2c is formed through the base material 2 in the thickness direction. The through hole 2c is a hole for forming a space portion 71 into which a light guide body 8, which will be described later, is inserted in the resin layer 7. A mold pin for forming the space portion 71 is inserted through the through hole 2c when the resin layer 7 is formed. (see Figure 7E). The shape, size, and number of the through holes 2c are appropriately set according to the shape and size of the light guide body 8 to be formed.

The film-like base material 2 made of such a deformable thermoplastic resin can be bent from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming, or air pressure forming in a state where it is bent 180 degrees and folded back. Although shaped into a dimensional shape, the area where the light emitting element 4 and the sensor 5 are arranged is a flat or developable surface.

(Conductive pattern)
When arranging the first conductive pattern 3A and the second conductive pattern 3B on the one surface 2a of the substrate 2, first, a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers growth of the metal plating is formed. It is formed in a predetermined pattern. Here, the predetermined pattern includes a meandering shape. The base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 21, followed by drying and baking.

The thickness (μm) of the underlayer is preferably 0.1 to 20 μm, more preferably 0.2 to 5 μm, most preferably 0.5 to 2 μm. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.

Gold, silver, copper, palladium, nickel, and the like are used as the material of the catalyst. Gold, silver, and copper are preferable from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferable.

The particle size (nm) of the catalyst is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.

The first conductive pattern 3A and the second conductive pattern 3B are formed on the underlying layer by electrolytic plating or electroless plating. As the plating metal, copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.

The thickness (μm) of the plating layer is preferably 0.03 to 100 μm, more preferably 1 to 35 μm, most preferably 3 to 18 μm. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plated layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.

The second conductive pattern 3B is formed in a meandering shape when the thickness of the resin layer 7 is particularly thin and when the base 2 is deformed in the thickness direction in the region where the base 2 is folded back, the elongation rate increases. (not shown). The meandering conductive pattern is formed so as to meander repeatedly in a direction intersecting with the extending direction of the linear conductive pattern 3B, and the wiring length is increased. The meander-shaped conductive pattern has a longer wiring length than the straight-line shape, so that when the base material 2 is folded back and deformed in the thickness direction, the conductive pattern is easily stretched and the second conductive pattern 3B is formed. disconnection can be suppressed.

The second conductive pattern 3B, except for the connector connection pads 3b, which will be described later, is formed by using an organic conductive material in ink or paste form by screen printing, transfer printing, offset printing, flexographic printing, ink-jet printing, or the like. It may be formed by coating and firing. Organic conductive materials include PEDOT (polyethylenedioxythiophene)/PSS, carbon, polyacetylene, polythiophene (PT), polypyrrole, polyparaphenylene, polyaniline, and polysulfur nitride.

A plurality of connector connection pads 3a and 3b are formed at one end of the first conductive pattern 3A and the second conductive pattern 3B, and as shown in FIG. An external connection terminal 6 is electrically connected for the purpose of connection.
The external connection terminal 6 includes, for example, a terminal portion 6a serving as a connector terminal and an anchor portion 6b. The anchor portion 6b is electrically joined to the connector connection pads 3a and 3b with a joining material. The terminal portion 6a and the anchor portion 6b are formed in a quadrangular prism shape using a copper alloy or the like, and the surface thereof is plated with nickel. plating may be applied. The pitch of the external connection terminals 6 corresponds to the standard of the connector to which they are connected.

(light emitting element)
The light emitting element 4 is, for example, a semiconductor light emitting element such as an LED.
The light emitting element 4 preferably has a lens (not shown). As such an LED, for example, commercially available semiconductor light-emitting elements such as products of Nichia Corporation, Cree Corporation, Osram Corporation, Toyoda Gosei Co., etc. can be used. Although these semiconductor light emitting elements differ in form, size, and mounting method, they are electrically bonded to one end of the first conductive pattern 3A formed on the base material 2 with a bonding material. It emits light when it is fed with power from the outside through an external connection terminal 6 electrically connected to the .

(sensor)
The sensor 5 is a touch sensor and is formed as a transparent electrode electrically connected to the second conductive pattern 3B. A transparent electrode includes a material having conductivity and transparency. Here, the conductive and transparent materials include ITO (indium tin oxide), IZO (indium zinc oxide), PEDOT (polyethylenedioxythiophene)/PSS, and CNT (carbon). ITO and IZO, in particular, are widely used as materials for forming transparent electrodes.
The sensor 5 may be a conductive pattern made of ITO, IZO, PEDOT/PSS, CNT, or the like. The shape of the conductive pattern is not particularly limited, and examples thereof include stripes, squares, lattices, and the like.

1 and 2, the first conductive pattern 3A and the second conductive pattern 3B show an example of electrically connecting the external connection terminal 6 with the light emitting element 4 and the sensor 5. A plurality of electronic components other than the light emitting element 4 and the sensor 5 may be attached to the first conductive pattern 3A and the second conductive pattern 3B. Electronic parts include control circuits, sound generators such as microphones and speakers, device operation parts such as memory chips, programmable logic chips and CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, etc. are mentioned.

(resin layer)
As shown in FIG. 1B, the resin layer 7 is formed by connecting the one surface 2a of the substrate 2 on which the first conductive pattern 3A is arranged and the one surface 2a of the substrate 2 on which the second conductive pattern 3B is arranged and folded back. They are formed via an adhesive layer AD so as to be separated and fixed. The adhesive layer AD is preferably optically colorless and transparent after forming the adhesive layer.
As shown in FIG. 3, the resin layer 7 is formed with a space 71 extending through the substrate 2 on which the light emitting element 4 is mounted and extending toward the folded substrate 2 on which the sensor 5 is arranged. there is A light guide body 8 that guides the light from the light emitting element 4 toward the sensor 5 is inserted into the space 71 .

The resin layer 7 is a thermoplastic resin made of a translucent thermoplastic resin material. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), which are commonly used as light guide materials. It can be made of a material that

(Light guide body)
As shown in FIG. 3, the light guide body 8 is inserted into the space 71 formed in the resin layer 7 from the other surface 2b opposite to the surface 2a of the substrate 2 on which the light emitting element 4 is mounted. It protrudes toward the sensor 5 and guides the light emitted from the light emitting element 4 toward the outside. Specifically, the light guide body 8 inserted into the space 71 surrounds the light emitting element 4 from all sides, and the wall surface 8a that regulates the leakage of the light emitted from the light emitting element 4 protrudes toward the sensor 5. It is formed as a plate-like body extending so as to

As described above, the light guide body 8 is inserted into the space 71 of the resin layer 7 made of a light-transmitting material, and restricts the leakage of the light emitted from the light-emitting element 4. It is preferably formed of a light-shielding material so as to Specifically, by making it black, leakage of light propagated to the light guide body 8 can be suppressed, and light emitted from the light emitting element 4 can be guided toward the sensor 5 . This makes it possible to clearly distinguish between the light-emitting region and the non-light-emitting region by irradiating the translucent portion 9a of the display body 9, which will be described later, from the inner surface.

"Modification 1"
4A is a schematic partial plan view for explaining a light guide body 8A according to Modification 1 of the electronic device 1, and FIG. 4B is a partial schematic cross-sectional view for explaining the light guide body 8A according to Modification 1 of the electronic device 1. FIG.
The light guide body 8A according to the modification is a filling body that fills the space 71 formed in the resin layer 7 from the other side 2b opposite to the side 2a on which the light emitting element 4 of the base material 2 is mounted. good too.
Specifically, the light guide body 8A filling the space 71 is formed by potting a curable resin material containing a black pigment or dye as a light shielding material.

The method for curing the uncured light guide body 8A formed by potting is not particularly limited as long as the curable resin material can be cured, and can be appropriately selected according to the type of resin to be used. In the present embodiment, by using a two-component curable resin material, a photocurable resin material, or a moisture-curable resin material that does not require heating for curing as the curable resin material, the resin layer 7 is melted. It is possible to suppress the deformation and deformation.
The light guide body 8A can suppress leakage of light and guide the light emitted from the light emitting element 4 toward the sensor 5. As shown in FIG. This makes it possible to clearly distinguish between the light-emitting region and the non-light-emitting region by irradiating the translucent portion 9a of the display body 9, which will be described later, from the inner surface.

"Modification 2"
FIG. 5A is a partial schematic plan view explaining a light guide body 8B according to Modification 2 of the electronic device 1, and FIG. 5B is a partial cross-sectional schematic diagram explaining the light guide body 8B according to Modification 2 of the electronic device 1. FIG.
The light guide body 8B according to the modification is printed or pasted on the wall surface 71a of the space 71 formed in the resin layer 7 from the other surface 2b opposite to the surface 2a of the base material 2 on which the light emitting element 4 is mounted. Laminated or coated opaque material.
Specifically, a paint containing a black pigment or dye as an opaque material, or a paint containing a white pigment or dye that reflects light without transmitting light is applied to the wall surface 71a of the space 71. A light guide body 8B is formed. Also, a resin material made of an opaque material may be attached.

Part of the light emitted from the light emitting element 4 is reflected multiple times by the light guide body 8B formed on the wall surface 71a of the space 71, and part of the light is absorbed each time it is reflected, thereby preventing light leakage. It is possible to suppress and guide the light emitted from the light emitting element 4 toward the sensor 5 . This makes it possible to clearly distinguish between the light-emitting region and the non-light-emitting region by irradiating the translucent portion 9a of the display body 9, which will be described later, from the inner surface.

(Display body)
A display member 9 having a light-transmitting portion 9a that transmits light may be attached to the surface of the sensor 5 . As the display body 9, the entire film base material is colored opaque to suppress the diffusion of light to the outside, and a light-transmitting part 9a having, for example, pores formed in a part thereof is provided to form a light guide body. A decorative film that transmits part of the light guided by 8 can be mentioned.
Further, as the display body 9, a resin molded body having a light-transmitting portion 9a may be attached.

In this way, the light-transmitting resin layer 7 is formed to separate and fix the one surface 2a of the substrate 2 on which the light emitting element 4 is arranged and the one surface 2a of the substrate 2 on which the sensor 5 is arranged and folded back. By doing so, the fixing of the sensor region and the light emitting region can be performed by one molding. Further, by forming a space 71 in the resin layer 7 and arranging the light guide body 8 for guiding the light from the light emitting element 4 toward the sensor 5 in the space 71, the light emitted from the light emitting element 4 can be It is possible to suppress the leakage and clarify the distinction between the light-emitting region and the non-light-emitting region.

(2) Electronic device manufacturing method FIG. 6 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1, FIG. 7 is a schematic partial cross-sectional view for explaining the manufacturing process of the electronic device 1, 4A and 4B are diagrams for explaining a shaping step S15 in the manufacturing process of the electronic device 1; FIG. Hereinafter, a method for manufacturing the electronic device 1 will be described with reference to the drawings.

The electronic device 1, as shown in FIG. , a through hole forming step S13 for forming the through hole 2c in the base material 2, a joining step S14 for electrically joining the light emitting element 4 and the external connection terminal 6 to the circuit, and the light emitting element 4 and the external connection terminal 6 to the circuit. A shaping step S15 in which the base material 2 electrically joined and having the through holes 2c formed therein is placed in a mold and the base material 2 is shaped into a three-dimensional shape. A resin filling step S<b>16 for forming the resin layer 7 by pressing and a light guide member placement step S<b>17 for placing the light guide member 8 on the resin layer 7 are performed.

(Base material preparation step S11)
In the base material preparation step S11, first, the first conductive pattern 3A, the second conductive pattern 3B, and the sensor 5 are formed on the substantially flat film-like base material 2 having a predetermined shape and size. In order to dispose a transparent electrode as an example, a base layer made of catalyst particles such as metal nanoparticles is formed in a predetermined pattern on the substrate 2 . In order to evenly apply the catalyst ink composed of catalyst particles such as metal nanoparticles, the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment.

Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.

Specifically, after applying a low-viscosity catalyst ink of 1000 cps or less, for example, 2 cps to 30 cps by an inkjet printing method, the solvent is removed (drying), and the metal nanoparticles are sintered (baking). The firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the metal nanoparticles will not be sufficiently sintered, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.

(Circuit forming step S12)
The base layer formed on the base material 2 is subjected to electroplating or electroless plating using copper, nickel, tin, silver, gold, or the like, thereby depositing plating metal on the surface and inside of the base layer. A first conductive pattern 3A and a second conductive pattern 3B are arranged (see FIG. 7A). The plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.
The first conductive pattern 3A and the second conductive pattern 3B are made of PEDOT (polyethylenedioxythiophene)/PSS, carbon, polyacetylene, polythiophene (PT), polypyrrole, polyparaphenylene, polyaniline, polysulfur nitride, or the like. It may be formed by coating an organic conductive material in the form of ink or paste by screen printing, transfer printing, offset printing, flexographic printing, ink jet method, or the like, followed by baking.

A transparent electrode as a sensor 5 is formed at the tip of the second conductive pattern 3B arranged on the base material 2 . In order to dispose the transparent electrode on the base material 2, it is preferable to subject the base material 2 to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment. An electrode material ink containing ITO or IZO as an electrode material is applied onto the surface-treated substrate 2 . Methods for applying the electrode material ink include silk screen printing, gravure printing, offset printing, flexo printing, inkjet printing, roller coater, brush coating, spray, knife jet coater, and pad printing. , a gravure offset printing method, a die coater method, a bar coater method, a spin coater method, a comma coater method, an impregnation coater method, a dispenser method, and a metal mask method, but in this embodiment, a silk screen printing method is used. .

(Through hole forming step S13)
In the through-hole forming step S13, through-holes 2c penetrating in the thickness direction of the substrate 2 are formed in the substrate 2 on which the first conductive pattern 3A and the second conductive pattern 3B are arranged (see FIG. 7B). . The through hole 2c is a hole for forming a space 71 in the resin layer 7 in which the light guide body 8 is arranged. And the shape, size, and number are appropriately set according to the size. In this embodiment, they are formed at four locations in the vicinity of the light emitting element 4 so as to surround one light emitting element 4 so as to be separated from all four sides. Also, two holes are formed in the vicinity of the region where the external connection terminals 6 are mounted so as to fix the external connection terminals 6 .

(Joining step S14)
In the joining step S14 of the light emitting element 4 and the external connection terminal 6, the light emitting element 4 and the external connection terminal 6 are joined onto the first conductive pattern 3A and the second conductive pattern 3B arranged on the base material 2 by soldering. To do so, first, a solder resist is applied to the one surface 2a side of the base material 2 by, for example, screen printing.
Next, solder paste is applied to the first conductive pattern 3A, the second conductive pattern 3B, the terminal portion of the light emitting element 4, and the anchor portion 6b of the external connection terminal 6. Next, as shown in FIG. Application of the solder paste can be performed using a known device such as a stencil printer, a screen printer, or a dispenser. In this embodiment, a dispenser device is used to apply the solder paste.

After applying the solder paste, the solder is melted and solidified to electrically join the light emitting element 4 onto the first conductive pattern 3A through the solder (see FIG. 7C). Also, the external connection terminals 6 are electrically joined to the ends of the first conductive pattern 3A and the second conductive pattern 3B (see FIG. 7C).

For soldering, laser soldering or photo-sintering soldering may be used. Laser soldering has the advantage that the light-emitting element 4 can be mounted in a minute portion of the circuit in a short time by irradiating a laser beam from the soldering head of the soldering device. In addition, since it is possible to selectively irradiate a laser beam to a portion to be electrically bonded, it is possible to perform bonding without applying heat to the entire light emitting element 4 as compared with the flow method or the reflow method. Become. Also, instead of soldering, electrical bonding may be performed using a conductive adhesive made of a resin containing a conductive filler that easily relaxes stress.
In particular, a conductive adhesive is used to join the first conductive pattern 3A and the light emitting element 4, and the ends of the first conductive pattern 3A and the second conductive pattern 3B and the anchor portions 6b of the external connection terminals 6 are attached. It is also possible to selectively use soldering for joining with.

(Shaping step S15)
In the shaping step S15, the base material 2 in which the light emitting elements 4 and the external connection terminals 6 are joined to the first conductive pattern 3A and the second conductive pattern 3B and the through holes 2c are formed is subjected to hot press molding and vacuum molding. The area where the second conductive pattern 3B and the sensor 5 are arranged is bent 180 degrees and formed into a three-dimensional shape by forming means such as air pressure forming, vacuum pressure forming, etc. (see FIG. 7D).
As shown in FIG. 8, the mold used for shaping is the shape of the cavity CA of the mold K used for molding in the resin filling step S16, which will be described later, so that the surfaces 2a of the base material 2 that have been shaped are facing each other. formed along the

First, as shown in FIG. 8A, the substrate 2 is placed between the cradle 11 and the male mold 12 . At this time, the cradle 11 and the male mold 12 are heated to a predetermined temperature at which the substrate 2 can be softened. Then, as shown in FIG. 8B, when the region where the second conductive pattern 3B and the sensor 5 of the base material 2 are arranged is bent 180 degrees and the female mold 13 is clamped with a predetermined pressure, the base material 2 becomes the male mold. It is sandwiched between the core portion 12a of the mold 12 and the cavity portion 13a (not shown) of the female mold 13 and shaped.

Then, the female mold 13 is opened and cooled. As a result, the one surface 2a of the substrate 2 on which the second conductive pattern 3B and the sensor 5 are arranged and the one surface 2a of the substrate 2 on which the first conductive pattern 3A to which the light emitting element 4 is bonded are separated from each other. Then, the base material 2 shaped so as to face each other is obtained. Then, the substrate 2 is taken out from the female mold 13 and the male mold 12, and the unnecessary portion is trimmed to obtain the substrate 2 before the resin layer 7 is formed.

(Resin filling step S16)
In the resin filling step S16, first, a binder ink is applied to the surface 2a of the substrate 2, which has been shaped into a three-dimensional shape in the shaping step S15, on which the first conductive pattern 3A and the second conductive pattern 3B are arranged. It is applied to form an adhesive layer AD. The binder ink contains an adhesive resin and improves the adhesiveness between the substrate 2 and the molded resin layer 7 .

Next, in a state in which the substrate 2 having the adhesive layer AD formed thereon is positioned and set in the mold K (see FIG. 7E), the mold K is closed and the cavity CA is filled with resin. The resin is filled by injection molding, and the molten resin is filled while compressing the cavity CA in order to reduce the resin pressure on the light emitting element 4 bonded to the base material 2 and the sensor 5 formed on the base material 2. Low pressure molding may be used.
The one surface 2a of the substrate 2 on which the first conductive pattern 3A is arranged and the one surface 2a of the substrate 2 on which the second conductive pattern 3B is arranged and folded are separated from each other by the resin filled in the cavity CA. A fixing resin layer 7 is formed. At the same time, a space portion 71 is formed in the resin layer 7 .

(Light guide member placement step S17)
In the light guide body placement step S17, first, the light guide body 8 to be inserted into the space 71 formed in the resin layer 7 is prepared. The light guide body 8 surrounds the light emitting element 4 from all four sides, and the wall surface 8a for restricting the leakage of the light emitted from the light emitting element 4 extends toward the sensor 5. formed by injection molding using a thermoplastic resin material containing

By inserting the light guide body 8 thus formed into the space 71 from the through hole 2c formed in the base material 2 and bonding it, one surface 2a of the base material 2 on which the light emitting element 4 is arranged and the sensor A light guide body 8 that guides the light from the light emitting element 4 toward the sensor 5 is arranged on the resin layer 7 that separates and fixes the one surface 2 a of the base material 2 on which the light emitting elements 5 are arranged. Then, the electronic device 1 is obtained by attaching the display member 9 to the surface of the substrate 2 on which the sensor 5 is arranged (see FIG. 7F).

In the light guide body placement step S17, a curable resin material containing a black pigment or dye is potted (resin-filled) in the space 71 formed in the resin layer 7, and the light guide body 8A filling the space 71 is placed. You may
Further, the wall surface 71a of the space 71 is coated with a paint containing a black pigment or dye, or a paint containing a white pigment or dye that reflects without transmitting light, and the light guide body 8B is arranged in the space 71. good too.

According to the method for manufacturing the electronic device 1 according to the present embodiment, the one surface 2a of the substrate 2 on which the light emitting element 4 is arranged and the one surface 2a of the substrate 2 on which the sensor 5 is arranged and folded are separated from each other. By forming the light-transmitting resin layer 7 to be fixed, the fixing of the sensor region and the light emitting region can be performed by one-time molding, and the number of processes for manufacturing the electronic device 1 can be reduced. In addition, by forming the resin layer 7 by separating the folded base material 2 from each other, even if there is a difference in the shrinkage rate as the material of the base material 2 and the resin layer 7, the resin layer 7 The base material 2 connected on both sides is pulled together, and warp and deformation of the resin layer 7 are suppressed.

DESCRIPTION OF SYMBOLS 1... Electronic device 2... Base material 3A... 1st conductive pattern, 3B... 2nd conductive pattern 4... Light emitting element 5... Sensor 6... External connection terminal 7 Resin layer 71 Spatial portion 71a Wall portion 8, 8A, 8B Light guide body 9 Display body 9a Translucent portion

Claims (4)

a light emitting element electrically connected to a first conductive pattern disposed on one surface of a deformable base material and emitting light; and a second conductive pattern disposed on one surface of the folded base material and electrically connected to the an external connection terminal for electrically connecting to an external element electrically connected to the first conductive pattern and the second conductive pattern and provided outside; the first conductive a light-transmissive resin layer for separating and fixing one surface of the substrate on which the conductive pattern is arranged and one surface of the substrate on which the second conductive pattern is arranged and folded back; A method of manufacturing an electronic device, comprising: a light guide body having a wall surface that surrounds and restricts leakage of the light, and guides the light from the light emitting element toward the sensor,
preparing the substrate;
disposing the first conductive pattern, the second conductive pattern and the sensor on the substrate;
forming a through-hole in the base material;
electrically joining the first conductive pattern and the light emitting element with a joining means;
a step of placing the base material having the through-hole formed in a mold and shaping the base material into a folded shape;
A step of placing the shaped base material in a mold and molding the resin layer;
disposing the light guide body on the resin layer;
including,
A method of manufacturing an electronic device, characterized by: The area of the base material where the sensor is arranged is folded back with one end side of the area where the light emitting element is arranged as a starting point, and the pair of the light emitting element and the sensor face each other.
2. The method of manufacturing an electronic device according to claim 1, wherein: The second conductive pattern is formed in a meandering shape so that the elongation rate becomes small when the base material is deformed in the thickness direction in the region where the base material is folded back,
2. The method of manufacturing an electronic device according to claim 1, wherein: The second conductive pattern is a metal plating layer made of at least one metal selected from Cu, Ni, Ag, and Au, or PEDOT/PSS, CNT, graphene, polyacetylene, polythiophene, polypyrrole, poly An organic electrode pattern containing at least one of paraphenylene, polyaniline, and polysulfur nitride,
4. The method of manufacturing an electronic device according to claim 3 , wherein:

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