TWI735166B - Electronic module, electronic device, and manufacturing method thereof - Google Patents

Abstract

The electronic module (10) of the present invention includes a resin molded body (12), a wiring circuit (30) formed on the upper surface (121) of the resin molded body (12), and a wiring circuit (30) for connecting the wiring circuit (30) to the outside The circuit is electrically connected to the connecting pin (20). The connecting pin (20) includes a rod-shaped portion (21) and a convex structure portion (22) protruding from the peripheral surface of the rod-shaped portion (21). The connecting pin (20) is embedded in such that a part of the rod-shaped portion (21) protrudes from the resin molded body (12), and the upper surface (23) as the surface of the convex structure portion (22) is exposed on the upper surface (121). Resin molded body (12). The wiring circuit (30) is also formed on the upper surface (23) of the convex structure portion (22). Thereby, an electronic module with high connection reliability between the connection pin and the wiring circuit can be provided.

Description

Electronic module, electronic device and manufacturing method thereof

This technology relates to an electronic module, an electronic device, and manufacturing methods for these.

In recent years, electronic devices such as sensors composed of electronic circuits including active components (such as semiconductor components) and passive components (such as capacitors, resistors, etc.), Internet of Things (IoT) terminals equipped with wireless functions, The demand for ultra-miniaturization of wearable devices and the like is increasing. In order to meet this requirement, the integration and three-dimensionalization (three-dimensionalization) of electronic circuits are being actively promoted.

For example, Japanese Patent Laid-Open No. 2009-267050 (Patent Document 1) discloses a functional module connected to an electronic circuit board provided with a socket portion. The functional module includes a plurality of electronic components, a build-up wiring board that supports the plurality of electronic components and connects them to each other, and a connection pin that is connected to the electronic circuit board as a part of the build-up wiring board. The connection pin includes an anchor portion embedded in the build-up wiring board, and a rod portion formed integrally with the anchor portion and protruding to the outside from an opening provided in the build-up wiring board. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-267050

[The problem to be solved by the invention] In the functional module disclosed in Patent Document 1, the electrical connection between the connection pin and the wiring circuit formed on the wiring substrate is performed by mechanical contact with the metal plating layer formed on the surface of the opening of the wiring substrate. Therefore, the connection reliability between the connection pin and the wiring circuit is low.

In addition, the functional module disclosed in Patent Document 1 is manufactured by a step of embedding connection pins in a build-up wiring board. In this embedding step, it is necessary to laminate a plurality of wiring substrates while aligning the openings of the wiring substrates formed in each layer and the connection pins. Therefore, the embedding step becomes very complicated, and the manufacturing cost increases.

The present disclosure focuses on the above-mentioned problems, and its purpose is to provide an electronic module and an electronic device with high connection reliability between the connecting pin and the wiring circuit. In addition, an object of the present disclosure is to provide a method of manufacturing an electronic module and an electronic device that can suppress an increase in manufacturing cost and has high connection reliability between the connection pin and the wiring circuit. [Means to solve the problem]

In an example of the present disclosure, the electronic module includes a first resin molded body, a first wiring circuit formed on the first surface of the first resin molded body, and a circuit for electrically connecting the first wiring circuit with an external circuit The connecting pin. The connecting pin includes a rod-shaped part and a convex structure part protruding from the peripheral surface of the rod-shaped part. The connecting pin is embedded in the first resin molded body so that a part of the rod-shaped portion protrudes from the first resin molded body, and the second surface of the convex structure portion is exposed on the first surface. The first wiring circuit is also formed on the second surface.

According to the disclosure, the first wiring circuit is formed on the second surface of the convex structure portion. Therefore, the reliability of the connection between the first wiring circuit and the connection pin can be improved.

In the above disclosure, the convex structure portion is a circular plate with the longitudinal direction of the rod-shaped portion as the central axis. The second surface is a plane orthogonal to the longitudinal direction of the rod-shaped portion.

According to the above disclosure, the degree of freedom in selecting the connection position of the first wiring circuit and the convex structure portion is improved. As a result, the degree of freedom in designing the shape of the first wiring circuit is improved.

In the above disclosure, a part of the rod-shaped portion protrudes from the first surface of the first resin molded body.

According to the disclosure, the electronic module can be electrically connected to other circuits arranged above the first surface on which the first wiring circuit is formed through the connecting pins. As a result, an electronic circuit with a three-dimensional structure can be constructed.

In the above disclosure, a part of the rod-shaped portion protrudes from the third surface of the first resin molded body that is different from the first surface.

According to the disclosure, the electronic module can be electrically connected to other circuits disposed on a third surface different from the first surface on which the first wiring circuit is formed through the connecting pins.

In the above disclosure, the convex structure portion has a rectangular plate shape in plan view orthogonal to the longitudinal direction of the rod-shaped portion. The second surface is an end surface of the convex structure part parallel to the longitudinal direction of the rod-shaped part.

According to the disclosure, the contact area between the first wiring circuit and the second surface can be enlarged, and the connection reliability between the first wiring circuit and the connecting pin can be further improved.

In the above disclosure, the first resin molded body has a plate shape. The first surface is orthogonal to the thickness direction of the first resin molded body. The end surface of the rod-shaped portion opposite to the part is exposed on the fourth surface on the back side of the first surface of the first resin molded body. The electronic module further includes a second wiring circuit formed on the fourth surface and the end surface.

According to the above disclosure, the first wiring circuit and the second wiring circuit respectively provided on the first surface and the fourth surface of the first resin molded body can be electrically connected by the connecting pin. Thereby, the degree of freedom of design of the electronic circuit can be improved.

In the above disclosure, the electronic module further includes electronic components embedded in the first resin molded body in such a way that the electrodes are exposed from the first surface. The first wiring circuit is also formed on the electrode of the electronic component.

According to the above disclosure, it is possible to construct an electronic circuit with a three-dimensional structure regardless of the influence of the thickness of the electronic component. In addition, compared with the case where electronic components are mounted on the surface of the first resin molded body, the electronic module can be miniaturized.

In an example of the present disclosure, the electronic device includes a first electronic module and a second electronic module. The first electronic module includes the electronic module. The second electronic module includes a second resin molded body, a third wiring circuit formed on the surface of the second resin molded body, and a connection socket embedded in the second resin molded body and connected to the third wiring circuit. The connecting pin of the first electronic module is fitted into the connecting socket of the second electronic module.

According to the disclosure, the first wiring circuit is also formed on the second surface of the convex structure portion. Therefore, the reliability of the connection between the first wiring circuit and the connection pin can be improved.

In addition, the electrical connection between the first wiring circuit formed on the first resin molded body and the third wiring circuit formed on the second resin molded body is through the connection pins embedded in the first resin molded body and the embedding It is obtained by mechanically fitting the connection socket of the second resin molded body. Therefore, the connection between the first wiring circuit and the third wiring circuit does not require a thermal hardening step of bonding materials such as solder. As a result, the manufacturing cost of the electronic device can be reduced.

In an example of the present disclosure, the method of manufacturing an electronic module includes a step of molding a resin molded body by embedding connecting pins. The connecting pin includes a rod-shaped part and a convex structure part protruding from the peripheral surface of the rod-shaped part. The step of molding a resin molded body includes a step of protruding a part of the rod-shaped portion from the resin molded body and a step of exposing a part of the surface of the convex structure portion from the resin molded body. The manufacturing method of the electronic module further includes a step of forming a wiring circuit on the surface of the resin molded body and the surface of the part of the convex structure portion.

According to the above disclosure, the wiring circuit can be formed by a simple method such as a printing method such as spraying nano ink on the surface of the resin molded body and on the surface of the convex structure exposed from the resin molded body. In addition, there is no step of aligning the opening formed in the substrate with the connection pin as in Patent Document 1. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic module. In addition, the wiring circuit is formed on the surface of a part of the convex structure portion. Therefore, the reliability of the connection between the wiring circuit and the connection pin can be improved.

In the above disclosure, the step of forming the resin molded body further includes a step of injecting resin to a mold by an injection molding method, or a step of laminating resin on a template by a layered molding method. The protruding step includes a step of inserting a part of the rod-shaped portion into a hole formed in a forming die or a template. The exposing step includes the step of bringing the surface of the part of the convex structure part into contact with the surface of the forming mold or the template.

According to the above disclosure, a part of the rod-shaped portion of the insertion hole can be easily protruded from the resin molded body, and the surface of the convex structure portion in contact with the surface of the mold or template can be easily exposed from the resin molded body. In addition, by inserting a part of the rod-shaped portion into the hole and the convex structure portion is in contact with the surface of the mold or template, the connecting pin is prevented from falling when the resin molded body is molded. As a result, it is possible to suppress the occurrence of inclination defects of the connecting pin.

In the above disclosure, the step of molding the resin molded body further includes a step of embedding electronic components in the resin molded body so that electrodes are exposed from the resin molded body. The step of forming the wiring circuit includes the step of forming a wiring circuit on the electrode.

According to the above disclosure, the electronic component can be electrically connected to the connection pin. In addition, since the electronic component is embedded in the resin molded body, it does not become an obstacle when the connecting pin is connected to another circuit.

In an example of the present disclosure, the method of manufacturing an electronic device includes a step of forming a first resin molded body by embedding connection pins. The connecting pin includes a rod-shaped part and a convex structure part protruding from the peripheral surface of the rod-shaped part. The step of molding the first resin molded body includes a step of protruding a part of the rod-shaped portion from the first resin molded body and a step of exposing a part of the surface of the convex structure portion from the first resin molded body. The method of manufacturing an electronic device further includes a step of forming a first wiring circuit on the surface of the first resin molded body and the surface of the portion of the convex structure portion, a step of molding the second resin molded body by embedding the connection socket, A step of forming a second wiring circuit electrically connected to the connection socket on the surface of the second resin molded body, and fitting the rod-shaped portion protruding from the first resin molded body into the connection socket embedded in the second resin molded body A step of.

According to the above disclosure, the wiring circuit can also be formed using a simple method such as a printing method. In addition, there is no step of aligning the opening formed in the substrate with the connection pin as in Patent Document 1. Therefore, it is possible to suppress an increase in the manufacturing cost of the electronic device.

In addition, the electrical connection between the first wiring circuit and the second wiring circuit is obtained by mechanical fitting of the connection pin embedded in the first resin molded body and the connection socket embedded in the second resin molded body. Therefore, the connection between the first wiring circuit and the second wiring circuit does not require a thermal hardening step of joining materials such as solder. As a result, the manufacturing cost of the electronic device can be reduced. In addition, the wiring circuit is formed on the surface of a part of the convex structure portion. Therefore, the reliability of the connection between the wiring circuit and the connection pin can be improved. [Effects of the invention]

According to the present disclosure, it is possible to provide an electronic module and electronic device with high connection reliability between the connection pin and the wiring circuit. In addition, according to the present disclosure, it is possible to provide a method of manufacturing an electronic module and an electronic device that can suppress an increase in manufacturing cost and has high connection reliability between the connection pin and the wiring circuit.

Hereinafter, an embodiment of one aspect of the present invention will be described based on the drawings (hereinafter also referred to as "this embodiment"). Furthermore, the same or equivalent parts in the drawings are marked with the same symbols, and the description is not repeated.

＜A. Application example＞ An example of a case where the present invention is applied will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view schematically showing an example of the electronic module of this embodiment. Fig. 2 is an arrow sectional view taken along the line A-A of Fig. 1. Fig. 3 is an external perspective view showing a connecting pin included in the electronic module shown in Fig. 1.

As shown in FIGS. 1 and 2, the electronic module 10 of this embodiment includes a resin molded body 12, a wiring circuit 30 formed on the upper surface 121 of the resin molded body 12, and a lower surface 122 of the resin molded body 12. The wiring circuit 33 and the connecting pin 20. In the example shown in FIGS. 1 and 2, the resin molded body 12 has a plate shape. The upper surface 121 is one of two planes orthogonal to the thickness direction of the resin molded body 12.

The connection pin 20 is a member for electrically connecting the wiring circuit 30 and the wiring circuit 33 to an external circuit, and includes, for example, metal such as brass. As shown in FIG. 3, the connecting pin 20 includes a rod-shaped portion 21 and a convex structure portion 22 protruding from the peripheral surface of the rod-shaped portion 21. The rod-shaped portion 21 and the convex structure portion 22 are formed integrally. In the example shown in FIG. 3, the convex structure part 22 is a disk shape with the longitudinal direction of the rod-shaped part 21 as a center axis.

The connecting pin 20 is embedded in the resin molded body 12 such that a part of the rod-shaped portion 21 protrudes from the resin molded body 12 and a part of the surface of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. In the example shown in FIG. 2, the rod-shaped portion 21 protrudes from the upper surface 121 of the resin molded body 12, and the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. The upper surface 23 of the convex structure part 22 is a plane orthogonal to the longitudinal direction of the rod-shaped part 21.

The wiring circuit 30 is also formed on the upper surface 23 of the convex structure portion 22 exposed on the upper surface 121 of the resin molded body 12. In this way, the wiring circuit 30 can be electrically connected to an external circuit via the connection pin 20. As a result, three-dimensional electronic circuits can be realized. In addition, the reliability of the connection between the wiring circuit 30 and the connection pin 20 can be improved.

The wiring circuit 30 can be formed using a simple method such as a printing method such as spraying nano ink. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic module 10.

As shown in FIG. 2, the end surface 24 of the rod-shaped portion 21 of the connecting pin 20 on the side opposite to the part protruding from the resin molded body 12 may be exposed on the lower surface 122 of the resin molded body 12. In this case, the wiring circuit 33 formed on the lower surface 122 of the resin molded body 12 may also be formed on the end surface 24 of the rod-shaped portion 21. In this way, the wiring circuit 33 can be electrically connected to an external circuit via the connection pin 20. As a result, the electronic circuit can be further three-dimensionalized.

＜B. Specific examples＞ (B-1. Structure of electronic device) Hereinafter, a specific example of an electronic device incorporating the electronic module 10 of this embodiment will be described. FIG. 4 is a cross-sectional view schematically showing an example of the electronic device of this embodiment. As shown in FIG. 4, the electronic device 1 includes an electronic module 10, an electronic module 50, and an adhesive layer 40.

Each electronic module 10 and electronic module 50 includes an electronic circuit formed by wiring one or more electronic components using a wiring circuit. The electronic circuit included in the electronic module 10 and the electronic circuit included in the electronic module 50 are connected by the fitting of the connecting pins included in the electronic module 10 and the connecting socket included in the electronic module 50. connect.

The electronic module 10 includes a resin molded body 12, an electronic part 14a, an electronic part 14b, an electronic part 16a, an electronic part 16b, two connecting pins 20 (connecting pins 20a and 20b), a wiring circuit 30a, a wiring circuit 30b, and wiring The circuit 31, the wiring circuit 33, the wiring circuit 34, and the protective film 32 and the protective film 35.

The electronic module 50 includes a resin molded body 52, an electronic component 54a, an electronic component 54b, an electronic component 56a, an electronic component 56b, a connection socket 60a, a connection socket 60b, a wiring circuit 70a, a wiring circuit 70b, a wiring circuit 71, a wiring circuit 73, The wiring circuit 74, the protective film 72, and the protective film 75.

Each of the resin molded body 12 and the resin molded body 52 has a plate shape, for example, and contains resins such as acrylonitrile butadiene styrene (Acrylonitrile Butadiene Styrene, ABS). However, the materials of the resin molded body 12 and the resin molded body 52 are not particularly limited. The thickness of the resin molded body 12 and the resin molded body 52 is not specifically limited.

Electronic parts 14a, electronic parts 14b, electronic parts 16a, electronic parts 16b, electronic parts 54a, electronic parts 54b, electronic parts 56a, and electronic parts 56b are self-passive parts (resistors, capacitors, etc.), active parts (large-scale integrated circuits) (Large-Scale Integration, LSI), Integrated Circuit (IC), etc.), power supply device (battery, etc.), display device (Light Emitting Diode (LED), etc.), sensors, switches The selected parts in etc. In the example shown in FIG. 4, the electronic component 14a, the electronic component 16a, the electronic component 54a, and the electronic component 56a are chip-type capacitors, inductors or resistors, and the electronic component 14b, the electronic component 16b, the electronic component 54b, and the electronic component 56b For IC. Furthermore, there is no limitation on the types of electronic components.

Electronic component 14a, electronic component 14b, electronic component 16a, electronic component 16b, electronic component 54a, electronic component 54b, electronic component 56a, and electronic component 56b have electrodes 15a, 15b, 17a, 17b, 55a, 55b, respectively , Electrode 57a, electrode 57b.

The electronic component 14a and the electronic component 14b are embedded in the resin molded body 12 so that the electrode 15a and the electrode 15b are exposed from the upper surface 121 of the resin molded body 12, respectively. The surfaces of the electrodes 15 a and 15 b are continuous with the upper surface 121 of the resin molded body 12. Here, the "continuous" of the two surfaces means that the level difference between the two surfaces is so small that the wiring formed thereon is not cut. Specifically, the surfaces of the electrodes 15 a and 15 b are on the same plane as the upper surface 121 of the resin molded body 12.

The electronic component 16a and the electronic component 16b are embedded in the resin molded body 12 so that the electrode 17a and the electrode 17b may be exposed from the lower surface 122 of the resin molded body 12, respectively. The surfaces of the electrodes 17 a and 17 b are continuous with the lower surface 122 of the resin molded body 12. Specifically, the surfaces of the electrodes 17a and 17b and the lower surface 122 of the resin molded body 12 are on the same plane.

The electronic component 54a and the electronic component 54b are embedded in the resin molded body 52 so that the electrode 55a and the electrode 55b are exposed from the lower surface 521 of the resin molded body 52, respectively. The surfaces of the electrodes 55 a and 55 b are continuous with the lower surface 521 of the resin molded body 52. Specifically, the surfaces of the electrodes 55a and 55b and the lower surface 521 of the resin molded body 52 are on the same plane.

The electronic component 56a and the electronic component 56b are embedded in the resin molded body 52 so that the electrode 57a and the electrode 57b are exposed from the upper surface 522 of the resin molded body 52, respectively. The surfaces of the electrodes 57 a and 57 b are continuous with the upper surface 522 of the resin molded body 52. Specifically, the surfaces of the electrodes 57a and 57b and the upper surface 522 of the resin molded body 52 are on the same plane.

The connecting pin 20a includes a rod-shaped portion 21a and a convex structure portion 22a protruding from the peripheral surface of the rod-shaped portion 21a. The connecting pin 20b includes a rod-shaped portion 21b and a convex structure portion 22b protruding from the peripheral surface of the rod-shaped portion 21b. The convex structure part 22a and the convex structure part 22b are disk-shaped with the longitudinal direction of the rod-shaped part 21a and the rod-shaped part 21b as a central axis, respectively.

The connecting pin 20 a is embedded in the resin molded body 12 such that the upper portion of the rod-shaped portion 21 a protrudes from the upper surface 121 of the resin molded body 12 and the upper surface 23 a of the convex structure portion 22 a is exposed from the upper surface 121 of the resin molded body 12. The upper surface 23a is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21a. The upper surface 23 a of the convex structure portion 22 a is continuous with the upper surface 121 of the resin molded body 12. Specifically, the upper surface 23a of the convex structure portion 22a and the upper surface 121 of the resin molded body 12 are on the same plane. The length of the rod-shaped portion 21 a from the upper surface 23 a to the lower portion of the convex structure portion 22 a is the same as the thickness of the resin molded body 12. Therefore, the lower end surface 24a of the rod-shaped portion 21a is exposed on the lower surface 122 of the resin molded body 12. The end surface 24 a of the rod-shaped portion 21 a is continuous with the lower surface 122 of the resin molded body 12. Specifically, the end surface 24a of the rod-shaped portion 21a and the lower surface 122 of the resin molded body 12 are on the same plane.

The connecting pin 20b is embedded in the resin molded body 12 such that the upper portion of the rod-shaped portion 21b protrudes from the upper surface 121 of the resin molded body 12 and the upper surface 23b of the convex structure portion 22b is exposed from the upper surface 121 of the resin molded body 12. The upper surface 23b is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21b. The upper surface 23b of the convex structure portion 22b is continuous with the upper surface 121 of the resin molded body 12. Specifically, the upper surface 23b of the convex structure portion 22b and the upper surface 121 of the resin molded body 12 are on the same plane.

The connection socket 60a and the connection socket 60b respectively have a hole 61a and a hole 61b that can be fitted with the connection pin 20a and the connection pin 20b. The connection socket 60a and the connection socket 60b include metal such as brass.

The connection socket 60a has a bottomed cylindrical shape, and is embedded in the resin molded body 52 so that the end surface 62a on the opening side of the hole 61a is exposed on the lower surface 521 of the resin molded body 52. The end surface 62 a of the connection socket 60 a is continuous with the lower surface 521 of the resin molded body 52. Specifically, the end surface 62a of the connection socket 60a and the lower surface 521 of the resin molded body 52 are on the same plane.

The connection socket 60 b is cylindrical, and is embedded in the resin molded body 52 such that one end surface 62 b is exposed on the lower surface 521 of the resin molded body 52, and the other end surface 63 b is exposed on the upper surface 522 of the resin molded body 52. The end surface 62b of the connection socket 60b is continuous with the lower surface 521 of the resin molded body 52. Specifically, the end surface 62b of the connection socket 60b and the lower surface 521 of the resin molded body 52 are on the same plane. In addition, the end surface 63 b of the connection socket 60 b is continuous with the upper surface 522 of the resin molded body 52. Specifically, the end surface 63b of the connection socket 60b and the upper surface 522 of the resin molded body 52 are on the same plane.

The wiring circuit 30 a, the wiring circuit 30 b, and the wiring circuit 31 are formed on the upper surface 121 of the resin molded body 12. The wiring circuit 30a is also formed on the electrode 15a of the electronic component 14a and the upper surface 23a of the convex structure portion 22a. Therefore, the electronic component 14a and the connection pin 20a are electrically connected via the wiring circuit 30a. The wiring circuit 30b is also formed on the electrode 15b of the electronic component 14b and the upper surface 23b of the convex structure portion 22b. Therefore, the electronic component 14b and the connection pin 20b are electrically connected via the wiring circuit 30b. The wiring circuit 31 is also formed on the electrode 15a of the electronic component 14a and the electrode 15b of the electronic component 14b. Therefore, the electronic component 14 a and the electronic component 14 b are electrically connected via the wiring circuit 31.

In this way, since the wiring circuit 30a and the wiring circuit 30b are formed on the upper surface 23a and the upper surface 23b of the convex structure portion 22a and the convex structure portion 22b, respectively, each wiring circuit 30a, wiring circuit 30b and connecting pin 20a and connecting pin can be improved. 20b connection reliability. In addition, since the upper surface 23a and the upper surface 23b are continuous with the upper surface 121 of the resin molded body 12, the wiring circuit 30a and the wiring circuit 30b can be prevented from being disconnected at the boundary, and the connection between the wiring circuits 30a and 30b can be further improved. The connection reliability of the pin 20a and the connecting pin 20b.

The wiring circuit 33 and the wiring circuit 34 are formed on the lower surface 122 of the resin molded body 12. The wiring circuit 33 is also formed on the electrode 17a of the electronic component 16a and the end surface 24a of the rod-shaped portion 21a. Therefore, the electronic component 16a and the connection pin 20a are electrically connected via the wiring circuit 33. The wiring circuit 34 is also formed on the electrode 17a of the electronic component 16a and the electrode 17b of the electronic component 16b. Therefore, the electronic component 16a and the electronic component 16b are electrically connected via the wiring circuit 34.

In this way, since the wiring circuit 33 is formed on the end surface 24a of the rod-shaped portion 21a, the reliability of the connection between the wiring circuit 33 and the connection pin 20a can be improved. In addition, since the end surface 24a is continuous with the lower surface 122 of the resin molded body 12, the wiring circuit 33 can be prevented from breaking at the boundary, and the connection reliability of the wiring circuit 33 and the connection pin 20a can be further improved.

The wiring circuit 70 a, the wiring circuit 70 b, and the wiring circuit 71 are formed on the lower surface 521 of the resin molded body 52. The wiring circuit 70a is also formed on the electrode 55a of the electronic component 54a and the end surface 62a of the connection socket 60a. Therefore, the electronic component 54a and the connection socket 60a are electrically connected via the wiring circuit 70a. The wiring circuit 70b is also formed on the electrode 55b of the electronic component 54b and the end surface 62b of the connection socket 60b. Therefore, the electronic component 54b and the connection socket 60b are electrically connected via the wiring circuit 70b. The wiring circuit 71 is also formed on the electrode 55a of the electronic component 54a and the electrode 55b of the electronic component 54b. Therefore, the electronic component 54a and the electronic component 54b are electrically connected via the wiring circuit 71.

In this way, since the wiring circuit 70a and the wiring circuit 70b are formed on the end surface 62a and the end surface 62b of the connection socket 60a and the connection socket 60b, respectively, the connection reliability of each wiring circuit 70a, the wiring circuit 70b and the connection socket 60a and the connection socket 60b can be improved. sex. In addition, since the end surface 62a and the end surface 62b are continuous with the lower surface 521 of the resin molded body 52, the wiring circuit 70a and the wiring circuit 70b can be prevented from being disconnected at the boundary, and the wiring circuit 70a, the wiring circuit 70b and the connection socket 60a can be further improved. , The connection reliability of the connection socket 60b.

The wiring circuit 73 and the wiring circuit 74 are formed on the upper surface 522 of the resin molded body 52. The wiring circuit 73 is also formed on the electrode 57a of the electronic component 56a and the end surface 63b of the connection socket 60b. Therefore, the electronic component 56a and the connection socket 60b are electrically connected via the wiring circuit 73. The wiring circuit 74 is also formed on the electrode 57a of the electronic component 56a and the electrode 57b of the electronic component 56b. Therefore, the electronic component 56a and the electronic component 56b are electrically connected via the wiring circuit 74.

In this way, since the wiring circuit 73 is formed on the end surface 63b of the connection socket 60b, the reliability of the connection between the wiring circuit 73 and the connection socket 60b can be improved. In addition, since the end surface 63b is continuous with the upper surface 522 of the resin molded body 52, the wiring circuit 73 can be prevented from breaking at the boundary, and the connection reliability of the wiring circuit 73 and the connection socket 60b can be further improved.

The wiring circuit 30a, the wiring circuit 30b, the wiring circuit 31, the wiring circuit 33, the wiring circuit 34, the wiring circuit 70a, the wiring circuit 70b, the wiring circuit 71, the wiring circuit 73, and the wiring circuit 74 can be used, for example, by inkjet printing. A conductive ink (for example, silver (Ag) nano ink) is applied to the target surface of the resin molded body to be easily formed. The inkjet printing method is a printing method in which liquid ink is ejected from a nozzle and the ink is deposited on the ejection target surface. The wiring circuit 30a, the wiring circuit 30b, the wiring circuit 31, the wiring circuit 33, the wiring circuit 34, the wiring circuit 70a, the wiring circuit 70b, the wiring circuit 71, the wiring circuit 73, and the wiring circuit 74 may include materials other than Ag, or may be made of It is formed by other methods, and the width, thickness, etc. are not particularly limited.

The protective film 32 is formed on the upper surface 121 of the resin molded body 12 so as to cover the wiring circuit 30 a, the wiring circuit 30 b, and the wiring circuit 31. The protective film 35 is formed on the lower surface 122 of the resin molded body 12 so as to cover the wiring circuit 33 and the wiring circuit 34. The protective film 72 is formed on the lower surface 521 of the resin molded body 52 so as to cover the wiring circuit 70 a, the wiring circuit 70 b, and the wiring circuit 71. The protective film 75 is formed on the upper surface 522 of the resin molded body 52 so as to cover the wiring circuit 73 and the wiring circuit 74. The protective film 32, the protective film 35, the protective film 72, and the protective film 75 contain insulating materials, and impart moisture resistance and insulation to the wiring circuit. The protective film 32, the protective film 35, the protective film 72, and the protective film 75 are formed by, for example, an inkjet printing method or the like.

The electronic module 50 is stacked on the electronic module 10 in such a manner that the connecting pin 20a and the connecting pin 20b are respectively fitted into the connecting socket 60a and the connecting socket 60b. The bonding layer 40 is interposed between the electronic module 10 and the electronic module 50 and connects the electronic module 10 and the electronic module 50. The adhesive layer 40 contains a well-known adhesive. Thereby, the electronic module 50 is fixed to the electronic module 10.

According to the example shown in FIG. 4, an electronic circuit including an electronic component 14 a, an electronic component 14 b, a wiring circuit 30 a, a wiring circuit 30 b, and a wiring circuit 31 is formed on the upper surface of the electronic module 10. On the lower surface of the electronic module 10, an electronic circuit including an electronic component 16a, an electronic component 16b, a wiring circuit 33, and a wiring circuit 34 is formed. On the lower surface of the electronic module 50, an electronic circuit including an electronic component 54a, an electronic component 54b, a wiring circuit 70a, a wiring circuit 70b, and a wiring circuit 71 is formed. On the upper surface of the electronic module 50, an electronic circuit including an electronic component 56a, an electronic component 56b, a wiring circuit 73, and a wiring circuit 74 is formed. The plurality of electronic circuits respectively formed on the plurality of surfaces are electrically connected to each other in a direction orthogonal to the plurality of surfaces via the connecting pin 20a, the connecting pin 20b, the connecting socket 60a, and the connecting socket 60b. As a result, the electronic circuit can be integrated and three-dimensional, and a compact electronic device 1 can be realized.

(B-2. Manufacturing method of electronic device) Next, a method of manufacturing the electronic device 1 will be described with reference to FIGS. 5( a) to 7. FIGS. 5( a) to 5 (e) are diagrams illustrating the manufacturing process of the electronic module 10 included in the electronic device of the present embodiment. FIGS. 6( a) to 6 (e) are diagrams illustrating the manufacturing process of the electronic module 50 included in the electronic device of the present embodiment. FIG. 7 is a diagram illustrating the steps of assembling the electronic module 10 and the electronic module 50. Hereinafter, the respective electronic components 14a and 14b are referred to as "electronic components 14". The electronic components 16a and 16b are referred to as "electronic components 16". The electronic components 54a and 54b are referred to as "electronic components 54". The electronic components 56a and 56b are referred to as "electronic components 56". The connecting pins 20a and 20b are referred to as "connecting pins 20". Each connection socket 60a and connection socket 60b are referred to as "connection socket 60". The respective wiring circuits 30a and 30b are referred to as "wiring circuits 30". The respective wiring circuits 70a and 70b are referred to as "wiring circuits 70".

(B-2-1. Manufacturing steps of electronic module 10) [B-2-1-1. Forming steps] As shown in FIG. 5( a ), the electronic component 14 is adhered to the temporary fixing sheet 80 using an adhesive (not shown). At this time, the electronic component 14 is stuck to the temporary fixing sheet 80 such that the electrode 15 is in contact with the temporary fixing sheet 80. Similarly, the electronic component 16 is adhered to the temporary fixing sheet 81 using an adhesive (not shown) so that the electrode 17 is in contact with the temporary fixing sheet 81.

As the material of the temporary fixing sheet 80 and the temporary fixing sheet 81, for example, polyethylene terephthalate (PET) or the like can be used. The temporary fixing sheet 80 and the temporary fixing sheet 81 preferably include a material that transmits ultraviolet rays.

The adhesion of the electronic component 14 to the temporary fixing sheet 80 can be performed using, for example, an ultraviolet curable adhesive applied to the temporary fixing sheet 80. For example, one surface of a temporary fixing sheet 80 made of transparent PET with a thickness of 50 μm is coated with an ultraviolet curable adhesive in a thickness of 2 μm to 3 μm. This coating is performed using methods, such as an inkjet printing method, for example. After that, the electronic component 14 is placed in a predetermined position. By irradiating the other surface of the temporary fixing sheet 80 (that is, the surface opposite to the surface on which the electronic component 14 is placed) ^{with ultraviolet rays having an intensity of, for example, 3000 mJ/cm 2} , the adhesive is cured, and the electronic component 14 is adhered to the temporary fixing片80. The electronic component 16 can also be pasted to the temporary fixing sheet 81 in the same way.

Next, as shown in FIG. 5( b ), the temporary fixing piece 80 and the temporary fixing piece 81 are arranged in the forming mold 82. The forming mold 82 includes an upper mold 83 and a lower mold 84, and a space is formed between the upper mold 83 and the lower mold 84. The temporary fixing sheet 80 is arranged in the forming mold 82 such that the surface on the side where the electronic component 14 is not attached is in contact with the flat inner surface of the upper mold 83. The temporary fixing piece 81 is arranged in the forming mold 82 such that the surface on the side where the electronic component 16 is not attached is in contact with the flat inner surface of the lower mold 84. Thereby, a space is formed between the surface of the temporary fixing sheet 80 on which the electronic component 14 is attached and the surface of the temporary fixing sheet 81 on which the electronic component 16 is attached.

In addition, a connecting pin 20 is also arranged in the forming mold 82. A hole 85 is formed in the upper mold 83. The rod-shaped portion 21 of the connecting pin 20 is inserted into the hole 85 until the upper surface 23 of the convex structure portion 22 of the connecting pin 20 is in contact with the inner surface of the upper mold 83.

In addition, in the rod-shaped portion 21 of the connecting pin 20, the end surface 24 on the side not inserted into the hole 85 may also be in contact with the temporary fixing piece 81 arranged on the inner surface of the lower mold 84. That is, the length H1 of the portion of the rod-shaped portion 21 of the connecting pin 20 that is not inserted into the hole 85 is designed to be a length slightly shorter than the distance between the inner surface of the upper mold 83 and the inner surface of the lower mold 84.

The molten resin is injected into the space in the molding die 82 by the injection molding method. The resin is filled so as to surround the electronic component 14, the electronic component 16, and the connecting pin 20. The conditions for performing injection molding are appropriately selected according to the material of the resin. For example, in the case of acrylonitrile-butadiene-styrene (ABS), injection molding is performed at an injection resin temperature of 210°C to 240°C and an injection pressure of 100 MPa. Thereby, the resin molded body 12 in which the electronic component 14, the electronic component 16, and the connection pin 20 are embedded is shape|molded (refer FIG.5(c)). The resin molded body 12 is taken out from the molding die 82.

The temporary fixing piece 80 and the temporary fixing piece 81 are deformed by the temperature of the resin during injection molding, and peel off from the resin molded body 12. The thickness of the temporary fixing piece 80 and the temporary fixing piece 81 is slightly thinner than the thickness of the resin molded body 12. Therefore, in the resin molded body 12, the step difference between the surface contacting the temporary fixing piece 80 and the temporary fixing piece 81 and the surface not contacting the temporary fixing piece 80 and the temporary fixing piece 81 is negligibly small.

When the temporary fixing sheet 80 is peeled from the resin molded body 12, the upper surface 121 of the resin molded body 12 is exposed to the part of the temporary fixing sheet 80. As shown in FIG. 5( a ), the electronic component 14 is stuck to the temporary fixing sheet 80 such that the electrode 15 is in contact with the temporary fixing sheet 80. Therefore, the electrode 15 of the electronic component 14 is exposed on the upper surface 121 of the resin molded body 12. The surface of the electrode 15 and the upper surface 121 of the resin molded body 12 around the electrode 15 are in contact with the temporary fixing piece 80, so the surface of the electrode 15 is continuous with the upper surface 121 of the resin molded body 12 and is on the same plane as the upper surface 121.

In addition, the connecting pin 20 is arranged in the forming mold 82 such that the upper surface 23 of the convex structure portion 22 is in contact with the inner surface of the upper mold 83. Therefore, the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. The upper surface 23 of the convex structure portion 22 and the upper surface 121 of the resin molded body 12 around the upper surface 23 are in contact with the inner surface of the upper mold 83, so the upper surface 23 of the convex structure portion 22 is continuous with the upper surface 121 of the resin molded body 12 , And is on the same plane as the upper surface 121.

The hole 85 of the upper mold 83 is closed by the convex structure portion 22 of the connecting pin 20. Therefore, the molten resin does not intrude into the hole 85. Therefore, the portion inserted into the hole 85 in the rod-shaped portion 21 protrudes from the upper surface 121 of the resin molded body 12.

When the temporary fixing sheet 81 is peeled from the resin molded body 12, the part of the lower surface 122 of the resin molded body 12 that is in contact with the temporary fixing sheet 81 is exposed. As shown in FIG. 5( a ), the electronic component 16 is stuck to the temporary fixing sheet 81 such that the electrode 17 is in contact with the temporary fixing sheet 81. Therefore, the electrode 17 of the electronic component 16 is exposed on the lower surface 122 of the resin molded body 12. The surface of the electrode 17 and the lower surface 122 of the resin molded body 12 are in contact with the temporary fixing piece 81, so the surface of the electrode 17 is continuous with the lower surface 122 of the resin molded body 12 and is on the same plane as the lower surface 122.

In addition, as described above, the end surface 24 of the rod-shaped portion 21 of the connecting pin 20 may also be in contact with the temporary fixing piece 81. Therefore, the end surface 24 in contact with the temporary fixing piece 81 is exposed on the lower surface 122 of the resin molded body 12. The end surface 24 in contact with the temporary fixing piece 81 is continuous with the lower surface 122 of the resin molded body 12 and is on the same plane as the lower surface 122.

In the above manner, the step of molding the resin molded body 12 in which the electronic component 14, the electronic component 16, and the connecting pin 20 are embedded is implemented (see FIGS. 5( a) to 5 (c )). The step of molding the resin molded body 12 includes inserting the rod-shaped portion 21 into the hole 85 of the upper mold 83 (see FIG. 5( b )) as a step for making a part of the rod-shaped portion 21 protrude from the resin molded body 12. In addition, the step of molding the resin molded body 12 includes a step of bringing the upper surface 23 of the convex structure portion 22 into contact with the inner surface of the upper mold 83 and placing it in the molding die 82 (see FIG. 5(b)), as a step for making A step in which the upper surface 23 of the convex structure portion 22 is exposed from the resin molded body 12.

[B-2-1-2. Steps to form wiring circuit] Next, as shown in FIG. 5( d ), the wiring circuit 30 and the wiring circuit 31 are formed on the upper surface 121 of the resin molded body 12, and the wiring circuit 33 and the wiring circuit 34 are formed on the lower surface 122 of the resin molded body 12.

The wiring circuit 30, the wiring circuit 31, the wiring circuit 33, and the wiring circuit 34 are formed by, for example, a printing method. Specifically, what is necessary is just to use the method of printing by jetting a conductive material (for example, silver ink etc.) by an inkjet printer etc., the method of using aerosol, the method of printing silver paste by a dispenser etc., etc.

Furthermore, in the case of using an inkjet printer, the height H2 of the connecting pin 20 protruding from the resin molded body 12 is preferably a height that does not interfere with the print head (for example, 1.5 mm or less).

The wiring circuit 30 is also formed on the electrode 15 of the electronic component 14 and on the upper surface 23 of the convex structure portion 22. Thereby, the electronic component 14 and the connection pin 20 are connected to each other.

In the case where the convex structure portion 22 is in the shape of a circular plate with the longitudinal direction of the rod-shaped portion 21 as the central axis, as shown in FIG. Any position in the circumferential direction. Therefore, the degree of freedom in designing the shape of the wiring circuit 30 can be improved.

The wiring circuit 31 is also formed on the electrodes 15 of the plurality of electronic components 14. Thereby, a plurality of electronic components 14 are connected to each other. The wiring circuit 33 is also formed on the electrode 17 of the electronic component 16 and on the end surface 24 of the rod-shaped portion 21. Thereby, the electronic component 16 and the connection pin 20 are connected to each other. The wiring circuit 34 is also formed on the electrodes 17 of the plurality of electronic components 16. Thereby, a plurality of electronic components 16 are connected to each other.

In the case of using the printing method as described above, the wiring circuit 30, the wiring circuit 31, the wiring circuit 33, and the wiring circuit 34 are formed by sintering printed conductive materials. Due to the intermetallic diffusion bonding caused by the sintering, the reliability of the connection of the wiring circuit 30, the wiring circuit 31, the wiring circuit 33, and the wiring circuit 34 to the electrode of the electronic component or the connection pin 20 is improved.

[B-2-1-3. Formation steps of protective film] As shown in FIG. 5(e), a protective film 32 is formed on the upper surface 121 of the resin molded body 12 to cover the wiring circuit 30 and the wiring circuit 31, and the resin is applied to cover the wiring circuit 33 and the wiring circuit 34. A protective film 35 is formed on the lower surface 122 of the molded body 12. Thereby, the wiring circuit 30, the wiring circuit 31, the wiring circuit 33, and the wiring circuit 34 are protected from the influence of external air and external force.

The formation of the protective film 32 and the protective film 35 is performed using a well-known technique, such as a method of printing an ultraviolet curable protective material by an inkjet printer or the like, and irradiating ultraviolet light to cure it.

(B-2-2. Manufacturing of electronic module 50) [B-2-2-1. Forming steps] As shown in (a) of FIG. 6, the electronic component 54 is adhered to the temporary fixing sheet 90 using an adhesive (not shown). At this time, the electronic component 54 is stuck to the temporary fixing sheet 90 such that the electrode 55 is in contact with the temporary fixing sheet 90. Similarly, the electronic component 56 is adhered to the temporary fixing sheet 91 using an adhesive (not shown) so that the electrode 57 is in contact with the temporary fixing sheet 91. The materials of the temporary fixing piece 90 and the temporary fixing piece 91 are the same as the materials of the temporary fixing piece 80 and the temporary fixing piece 81. In addition, the method of pasting the electronic component to the temporary fixing sheet 90 and the temporary fixing sheet 91 is the same as the method of pasting the electronic component to the temporary fixing sheet 80 and the temporary fixing sheet 81.

A connection socket 60 is also pasted on the temporary fixing piece 90. At this time, one end surface 62 of the connection socket 60 is stuck to the temporary fixing piece 90. The other end surface 63 of the connection socket 60 can also be pasted to the temporary fixing piece 91. The connection socket 60 attached only to the temporary fixing piece 90 (that is, the connection socket 60 having a height shorter than the distance between the temporary fixing piece 90 and the temporary fixing piece 91) has a bottomed cylindrical shape in order to prevent resin from flowing into the hole 61.

Next, as shown in FIG. 6( b ), the temporary fixing piece 90 and the temporary fixing piece 91 are arranged in the forming mold 92. The forming mold 92 includes an upper mold 93 and a lower mold 94, and a space is formed between the upper mold 93 and the lower mold 94. The temporary fixing piece 90 is arranged in the forming mold 92 such that the surface on the side where the electronic component 54 is not attached is in contact with the flat inner surface of the lower mold 94. The temporary fixing piece 91 is arranged in the forming mold 92 such that the surface on the side where the electronic component 56 is not attached is in contact with the flat inner surface of the upper mold 93. Therefore, a space is formed between the surface of the temporary fixing sheet 90 on which the electronic component 54 is attached and the surface of the temporary fixing sheet 91 on which the electronic component 56 is attached.

The molten resin is injected into the space in the molding die 92 by the injection molding method. The resin is filled in such a way as to surround the electronic component 54, the electronic component 56 and the connection socket 60. The conditions for performing the injection molding of the resin are appropriately selected according to the material of the resin, and are the same conditions as the resin molded body 12. Thereby, the resin molded body 52 in which the electronic component 54, the electronic component 56, and the connection socket 60 are embedded, is shape|molded (refer FIG.6(c)). The resin molded body 52 is taken out from the molding die 92.

The temporary fixing piece 90 and the temporary fixing piece 91 are deformed by the temperature of the resin during injection molding, and peel off from the resin molded body 52. When the temporary fixing sheet 90 is peeled from the resin molded body 52, the lower surface 521 of the resin molded body 52 in contact with the temporary fixing sheet 90 is exposed. As shown in FIG. 6( a ), the electronic component 54 is stuck to the temporary fixing sheet 90 such that the electrode 55 is in contact with the temporary fixing sheet 90. Therefore, the electrode 55 of the electronic component 54 is exposed on the lower surface 521 of the resin molded body 52. The surface of the electrode 55 and the lower surface 521 of the resin molded body 52 are in contact with the temporary fixing piece 90, so the surface of the electrode 55 is continuous with the lower surface 521 of the resin molded body 52 and is on the same plane as the lower surface 521.

In addition, one end surface 62 of the connection socket 60 is adhered to the temporary fixing piece 90. Therefore, the end surface 62 of the connection socket 60 is exposed on the lower surface 521 of the resin molded body 52. The end surface 62 of the connection socket 60 and the lower surface 521 of the resin molded body 52 are in contact with the temporary fixing piece 90, so the end surface 62 of the connection socket 60 is continuous with the lower surface 521 of the resin molded body 52 and is on the same plane as the lower surface 521.

When the temporary fixing sheet 91 is peeled from the resin molded body 52, the upper surface 522 of the resin molded body 52 in contact with the temporary fixing sheet 91 is exposed. As shown in FIG. 6( a ), the electronic component 56 is stuck to the temporary fixing sheet 91 such that the electrode 57 is in contact with the temporary fixing sheet 91. Therefore, the electrode 57 of the electronic component 56 is exposed on the upper surface 522 of the resin molded body 52. The surface of the electrode 57 and the upper surface 522 of the resin molded body 52 are in contact with the temporary fixing piece 91, so the surface of the electrode 57 is continuous with the upper surface 522 of the resin molded body 52 and is on the same plane as the upper surface 522.

In addition, the other end surface 63 of the connection socket 60 can also be pasted to the temporary fixing piece 91. In this case, the end surface 63 pasted to the temporary fixing piece 91 is exposed on the upper surface 522 of the resin molded body 52. The end surface 63 adhered to the temporary fixing piece 81 is continuous with the upper surface 522 of the resin molded body 52 and is on the same plane as the upper surface 522.

[B-2-2-2. Steps to form wiring circuit] Next, as shown in FIG. 6( d ), the wiring circuit 70 and the wiring circuit 71 are formed on the lower surface 521 of the resin molded body 52, and the wiring circuit 73 and the wiring circuit 74 are formed on the upper surface 522 of the resin molded body 52. The formation of wiring circuit 70, wiring circuit 71, wiring circuit 73, and wiring circuit 74 is performed using the same method as wiring circuit 30, wiring circuit 31, wiring circuit 33, and wiring circuit 34.

The wiring circuit 70 is also formed on the electrode 15 of the electronic component 54 and on the end surface 62 of the connection socket 60. Thereby, the electronic component 54 is wired to the connection socket 60. The wiring circuit 71 is also formed on the electrodes 15 of the plurality of electronic components 54. Thereby, a plurality of electronic components 54 are connected to each other. The wiring circuit 73 is also formed on the electrode 57 of the electronic component 56 and on the end surface 63 of the connection socket 60. In this way, the electronic component 56 is connected to the connection socket 60. The wiring circuit 74 is also formed on the electrodes 57 of the plurality of electronic components 56. Thereby, a plurality of electronic components 56 are connected to each other.

[B-2-2-3. Formation steps of protective film] Next, as shown in FIG. 6(e), a protective film 72 is formed on the lower surface 521 of the resin molded body 52 to cover the wiring circuit 70 and the wiring circuit 71, and to cover the wiring circuit 73 and the wiring circuit 74. A protective film 75 is formed on the upper surface 522 of the resin molded body 52. Thereby, the wiring circuit 70, the wiring circuit 71, the wiring circuit 73, and the wiring circuit 74 are protected from external air and external force. The formation of the protective film 72 and the protective film 75 is performed using the same method as the protective film 32 and the protective film 35.

(B-2-3. Assembling steps of electronic module 10 and electronic module 50) As shown in FIG. 7, the electronic module 50 is stacked on the electronic module 10 in a manner that the connecting pin 20 is fitted into the connecting socket 60. At this time, at least one of the electronic module 50 and the electronic module 10 is coated with an adhesive layer 40.

On the lower surface of the electronic module 50, the unevenness and the step difference caused by the electronic component 54 and the connection socket 60 are small to a negligible degree. Similarly, on the upper surface of the electronic module 10, except for the protruding connecting pin 20, the unevenness and the step difference caused by the electronic component 14 are small to a negligible degree. Therefore, a firm fixation between the resin molded body 12 and the resin molded body 52 can be obtained only by coating the adhesive layer 40.

In addition, as described above, the height H2 of the connecting pin 20 protruding from the resin molded body 12 is set to a height (for example, 1.5 mm or less) that does not interfere with the print head (see FIG. 5(d)). The upper surface 121 of the resin molded body 12 on which the connecting pin 20 protrudes is a flat surface without unevenness caused by the electronic component 14 or the like. Therefore, even if the height H2 of the connection pin 20 protruding from the resin molded body 12 is set to, for example, about 1.5 mm, the connection pin 20 can be reliably fitted into the connection socket 60. As a result, the reliability of the connection between the connection pin 20 and the connection socket 60 can be ensured.

The electronic device 1 manufactured by the above manufacturing method may have a circuit of a three-dimensional structure in which a plurality of electronic circuits respectively formed on a plurality of surfaces are stacked in a direction orthogonal to the plurality of surfaces.

(B-3. Advantages) As described above, the electronic module 10 of this embodiment includes the resin molded body 12, the wiring circuit 30 formed on the upper surface 121 of the resin molded body 12, and the connection for electrically connecting the wiring circuit 30 with an external circuit. Pin 20. The connecting pin 20 includes a rod-shaped portion 21 and a convex structure portion 22 protruding from the peripheral surface of the rod-shaped portion 21. The connecting pin 20 is embedded in the resin molded body 12 such that a part of the rod-shaped portion 21 protrudes from the resin molded body 12 and the upper surface 23 that is the surface of the convex structure portion 22 is exposed on the upper surface 121. The wiring circuit 30 is also formed on the upper surface 23 of the convex structure portion 22.

In addition, the electronic device 1 of this embodiment includes an electronic module 10 and an electronic module 50. The electronic module 50 includes a resin molded body 52, a wiring circuit 70 formed on the surface of the resin molded body 52, a wiring circuit 73, and a connection socket 60 embedded in the resin molded body 52 and connected to the wiring circuit 70 or the wiring circuit 73. The connecting pin 20 of the electronic module 10 is fitted into the connecting socket 60 of the electronic module 50.

According to the above configuration, the wiring circuit 30 is formed on the upper surface 23 of the convex structure portion 22. Therefore, the reliability of the connection between the wiring circuit 30 and the connection pin 20 can be improved.

By embedding the convex structure part 22 in the resin molded body 12, the convex structure part 22 functions as an anchor, and the mechanical stress resistance of the connection pin 20 (for example, resistance to pullout, falling, etc.) can be improved.

Since the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12, the wiring circuit 30 can be formed by a simple method such as a printing method using a spray such as nano ink.

In addition, the wiring circuit 30 formed on the upper surface 23 of the convex structure portion 22 and the upper surface 121 of the resin molded body 12 may have a flat shape without a large step. Therefore, when the electronic module 50 is stacked on the electronic module 10, the wiring circuit 30 will not become an obstacle.

The convex structure part 22 has a disk shape with the longitudinal direction of the rod-shaped part 21 as a central axis. The upper surface 23 of the convex structure part 22 is a plane orthogonal to the longitudinal direction of the rod-shaped part 21. As a result, as shown in FIG. 1, the degree of freedom in selecting the connection position of the wiring circuit 30 and the convex structure portion 22 is improved. As a result, the degree of freedom in designing the shape of the wiring circuit 30 is improved.

A part of the rod-shaped portion 21 protrudes from the upper surface 121 of the resin molded body 12. Thereby, the electronic module 10 can be electrically connected to another electronic module 50 disposed above the upper surface 121 on which the wiring circuit 30 is formed through the connecting pin 20. As a result, an electronic circuit with a three-dimensional structure can be constructed.

The resin molded body 12 has a plate shape. The upper surface 121 is orthogonal to the thickness direction of the resin molded body 12. The end surface 24 of the rod-shaped portion 21 on the side opposite to the part protruding from the resin molded body 12 may be exposed on the lower surface 122 on the back side of the upper surface 121 of the resin molded body 12. The electronic module 10 further includes a wiring circuit 33 formed on the lower surface 122 and the end surface 24.

Such a configuration is realized by designing the length of the portion of the connecting pin 20 embedded in the resin molded body 12 (the length H1 of FIG. 5( b )) to be the same as the thickness of the resin molded body 12. With this configuration, the wiring circuit 30 and the wiring circuit 33 provided on the upper surface 121 and the lower surface 122 of the resin molded body 12 can be electrically connected by the connecting pin 20. Thereby, the degree of freedom of design of the electronic circuit can be improved.

In addition, the electronic module 10 further includes an electronic component 14 embedded in the resin molded body 12 such that the electrode 15 is exposed from the upper surface 121. The wiring circuit 30 is also formed on the electrode 15 of the electronic component 14.

Thereby, it is possible to construct an electronic circuit having a three-dimensional structure without considering the influence of the thickness of the electronic component 14 other than the thickness of the resin molded body 12. In addition, compared with the case where the electronic component 14 is mounted on the upper surface 121 of the resin molded body 12, the thickness of the electronic device 1 in which the electronic module 10 and the electronic module 50 are stacked can be reduced.

In the case of mounting the electronic component 14 on the upper surface 121 of the resin molded body 12, the thickness of the electronic component 14 must be considered, and the height H2 of the portion of the connecting pin 20 protruding from the upper surface 121 of the resin molded body 12 must be increased (refer to FIG. 5(d)). However, since the electronic component 14 is embedded in the resin molded body 12, the height H2 can be reduced. Thereby, the mechanical strength of the connecting pin 20 can be improved.

In addition, since the electronic component 14 is embedded in the resin molded body 12, the upper surface 121 of the resin molded body 12 can be made flat. Similarly, in the electronic module 50, by embedding the electronic components 54 in the resin molded body 52, the lower surface 521 of the resin molded body 52 can also be made flat. Therefore, when the electronic module 50 is stacked on the electronic module 10 such that the upper surface 121 of the resin molded body 12 and the lower surface 521 of the resin molded body 52 face each other, the electronic module 50 can be brought into close contact with the electronic module 10 . As a result, since one of the electronic module 10 and the electronic module 50 plays a role of preventing the other from tilting, etc., the stress applied to the bending or the like of the connecting pin 20 is reduced.

In addition, by fixing the interface between the electronic module 10 and the electronic module 50 by using the adhesive layer 40 and the like, it is possible to prevent the application due to the deviation of the other of the electronic module 10 and the electronic module 50 from one of them. The shear stress to the connecting pin 20 is generated.

The manufacturing method of the electronic device 1 of this embodiment includes the manufacturing steps of the electronic module 10, the manufacturing steps of the electronic module 50, and the assembling steps of the electronic module 10 and the electronic module 50. The manufacturing step of the electronic module 10 includes a step of molding the resin molded body 12 so that the connecting pins 20 are embedded ([B-2-1-1. molding step]). The step of molding the resin molded body 12 includes a step of protruding a part of the rod-shaped portion 21 from the resin molded body 12 and a step of exposing the upper surface 23 that is a part of the convex structure portion 22 from the resin molded body 12. The manufacturing step of the electronic module 10 further includes the step of forming the wiring circuit 30 on the upper surface 121 of the resin molded body 12 and the upper surface 23 of the convex structure portion 22 ([B-2-1-2. Formation step of wiring circuit ]).

The manufacturing steps of the electronic module 50 include the following steps. ・The step of molding the resin molded body 52 in which the connection socket 60 is embedded ([B-2-2-1. Molding step]). ・Step of forming wiring circuit 70 and wiring circuit 73 electrically connected to connection socket 60 on the surface (upper surface 522 and lower surface 521) of resin molded body 52 ([B-2-2-2. Formation of wiring circuit step]).

The assembling step of the electronic module 10 and the electronic module 50 includes a step of fitting the rod-shaped portion 21 protruding from the resin molded body 12 into the connection socket 60 embedded in the resin molded body 52.

According to the manufacturing method, the wiring circuit 30 can be used in a simple method such as a printing method such as spraying nano ink on the upper surface 121 of the resin molded body 12 and the upper surface 23 of the convex structure 22 exposed on the upper surface 121 To form. As a result, an increase in the manufacturing cost of the electronic module 10 and the electronic device 1 can be suppressed.

In addition, the electrical connection between the wiring circuit 30 formed on the resin molded body 12 and the wiring circuit 70 and the wiring circuit 73 formed on the resin molded body 52 is achieved by embedding in the resin molded body 12 and the resin molded body 52, respectively. The connecting pin 20 and the connecting socket 60 are mechanically fitted to obtain. Therefore, the connection between the wiring circuit 30, the wiring circuit 70, and the wiring circuit 73 does not require a thermal hardening step of bonding materials such as solder. As a result, the manufacturing cost of the electronic device 1 can be reduced.

In the above-mentioned manufacturing method, since the resin molded body 12 is molded to embed the connecting pin 20, there is no step of aligning the opening formed in the substrate with the connecting pin as in Patent Document 1. Thereby, the manufacturing cost of the electronic module 10 and the electronic device 1 can be further reduced.

The step of molding the resin molded body 12 further includes a step of injecting resin to the molding die 82 by an injection molding method. The step of making a part of the rod-shaped portion 21 protrude from the resin molded body 12 includes a step of inserting a part of the rod-shaped portion 21 into the hole 85 formed in the molding die 82. The step of exposing the upper surface 23 of the convex structure portion 22 from the resin molded body 12 includes a step of bringing the upper surface 23 of the convex structure portion 22 into contact with the surface of the mold 82.

According to the manufacturing method, a part of the rod-shaped portion 21 of the insertion hole 85 can be easily protruded from the resin molded body 12, and the upper surface 23 of the convex structure portion 22 that is in contact with the surface of the mold 82 can be easily removed from the resin. The molded body 12 is exposed.

In addition, since a part of the rod-shaped portion 21 is inserted into the hole 85 and the convex structure portion 22 is in contact with the surface of the mold 82, the connecting pin 20 is prevented from falling when the resin molded body 12 is molded. As a result, it is possible to suppress the occurrence of inclination defects of the connecting pin 20.

The step of molding the resin molded body 12 further includes a step of embedding the electronic component 14 in the resin molded body 12 so that the electrode 15 is exposed from the resin molded body 12. The step of forming the wiring circuit 30 includes the step of forming the wiring circuit 30 on the electrode 15.

According to the manufacturing method, the electronic component 14 and the connecting pin 20 can be electrically connected. In addition, since the electronic component 14 is embedded in the resin molded body 12, it does not become an obstacle when the connection pin 20 and the connection socket 60 are fitted. As a result, the connection pin 20 and the connection socket 60 can be connected more reliably.

＜C. Modifications＞ (C-1. Modification 1) In the example shown in FIG. 2, it is assumed that the rod-shaped portion 21 of the connecting pin 20 protrudes from the upper surface 121 of the resin molded body 12 exposed on the upper surface 23 of the convex structure portion 22. However, the rod-shaped portion 21 of the connecting pin 20 may protrude from a surface different from the upper surface 121 exposed on the upper surface 23 of the convex structure portion 22 in the resin molded body 12.

FIG. 8 is a plan view schematically showing an example of an electronic module of Modification Example 1. FIG. Fig. 9 is an arrow sectional view taken along line A-A in Fig. 8. Fig. 10 is an external perspective view showing a connecting pin included in the electronic module shown in Fig. 8.

As shown in FIG. 10, in the connecting pin 20 of Modification 1, the convex structure portion 22 has a rectangular plate shape in plan view orthogonal to the longitudinal direction of the rod-shaped portion 21.

As shown in FIGS. 8 and 9, the connecting pin 20 is embedded in such a manner that a part of the rod-shaped portion 21 protrudes from the side surface 123 of the resin molded body 12, and the end surface 25 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. In the resin molded body 12. The side surface 123 is a surface that is connected to the upper surface 121 of the resin molded body 12 on which the wiring circuit 30 is formed and is orthogonal to the upper surface 121. The end surface 25 is a plane parallel to the longitudinal direction of the rod-shaped portion 21.

The wiring circuit 30 is also formed on the end surface 25 of the convex structure portion 22 exposed on the upper surface 121 of the resin molded body 12. Thereby, the connection reliability between the wiring circuit 30 and the connection pin 20 can be improved.

The end surface 25 of the convex structure portion 22 is continuous with the upper surface 121 of the resin molded body 12, and specifically, is on the same plane as the upper surface 121. Therefore, the reliability of the connection between the wiring circuit 30 and the connection pin 20 can be further improved.

Since the convex structure portion 22 has a rectangular plate shape in plan view, the flat end surface 25 can be exposed on the upper surface 121 of the resin molded body 12. As a result, the contact area between the wiring circuit 30 and the end face 25 can be increased, and the reliability of the connection between the wiring circuit 30 and the connection pin 20 can be further improved.

(C-2. Modification 2) In the above description, it is assumed that the resin molded body 12 is molded by an injection molding method. However, instead of the injection molding method, a build-up method in which resin materials are layered in a three-dimensional shape may be used to mold the resin molded body 12.

FIGS. 11( a) to 11 (c) are diagrams for explaining the molding procedure of the resin molded body of Modification 2. FIG. First, as shown in FIG. 11( a ), the temporary fixing sheet 80 to which the electronic component 14 is pasted is arranged on the template 101. The method of attaching the electronic component 14 to the temporary fixing sheet 80 is as described in [B-2-1-1. Forming Step]. The template 101 includes metal or resin (for example, polycarbonate (PC)).

A hole 102 is formed in the template 101. The rod-shaped portion 21 of the connecting pin 20 is inserted into the hole 102 until the surface of the convex structure portion 22 of the connecting pin 20 contacts the upper surface of the template 101.

Next, as shown in Figure 11(b), using a three dimensional (3D) printer, repeat the steps of applying and curing ink material with a thickness of, for example, about 14 μm to 20 μm until it reaches a predetermined level. In this way, the ink material is layered and the resin molded body 12 is molded.

The ink material is, for example, acrylonitrile-butadiene-styrene (ABS) or digital ABS (manufactured by Stratasys) which is an ink material prepared by kneading an ultraviolet curable substance with ABS. In the case of using an ink material containing ABS, it is only necessary to cool and harden the ink material after coating the ink material. In the case of using an ink material containing digital ABS, it is only necessary to irradiate the ink material with ultraviolet rays to harden the ink material.

The height H3 of the stack of ink materials (that is, the thickness of the resin molded body 12) may be set to be lower than the height of the tip of the connecting pin 20. Thereby, one end and the other end of the connecting pin 20 protrude from the upper surface and the lower surface of the resin molded body 12, respectively.

Next, as shown in FIG. 11( c ), the resin molded body 12 is removed from the template 101. In addition, in (c) of FIG. 11, the resin molded body 12 turned over when it is removed from the template 101 is shown. The temporary fixing piece 80 is deformed due to the temperature of the ink material applied when the resin molded body 12 is molded. Therefore, the temporary fixing sheet 80 can be easily peeled from the resin molded body 12. The thickness of the temporary fixing piece 80 is slightly thinner than the thickness of the resin molded body 12. Therefore, in the resin molded body 12, the level difference between the surface in contact with the temporary fixing sheet 80 and the surface not in contact with the temporary fixing sheet 80 is so small that it can be ignored.

When the temporary fixing sheet 80 is peeled from the resin molded body 12, the electrode 15 of the electronic component 14 is exposed on the upper surface 121 of the resin molded body 12 that is in contact with the temporary fixing sheet 80. The surface of the electrode 15 and the upper surface 121 of the resin molded body 12 in contact with the temporary fixing sheet 80 are continuous, and are on the same plane as the upper surface 121.

In addition, the connecting pin 20 is arranged on the template 101 such that the upper surface 23 of the convex structure portion 22 is in contact with the template 101. Therefore, the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. The upper surface 23 of the convex structure portion 22 and the upper surface 121 of the resin molded body 12 around the upper surface 23 are in contact with the upper surface of the template 101, so the upper surface 23 of the convex structure portion 22 and the upper surface 121 of the resin molded body 12 It is continuous and is on the same plane as the upper surface 121.

As described above, in Modification 2, the step of molding the resin molded body 12 includes the step of laminating resin on the template 101 by the build-up method. The step of molding the resin molded body 12 includes a step of inserting the rod-shaped portion 21 into the hole 102 of the template 101 (see FIG. 11( a )) as a step for making a part of the rod-shaped portion 21 protrude from the resin molded body 12. In addition, the step of molding the resin molded body 12 includes a step of bringing the upper surface 23 of the convex structure portion 22 into contact with the upper surface of the template 101 (refer to FIG. 11(a)) as a step for making the upper surface 23 of the convex structure portion 22 The step of exposing from the resin molded body 12.

By performing the above-mentioned [B-2-1-2. Wiring circuit formation step] and [B-2-1-3. Protective film formation step] on the resin molded body 12 molded in the above manner, an electronic mold is manufactured Group 10.

In addition, similarly to the resin molded body 12, the resin molded body 52 can also be manufactured by the build-up method using a 3D printer.

(C-3. Modification 3) In the example shown in FIG. 4, it is assumed that two electronic modules 10 and 50 are stacked. However, more than three electronic modules can also be stacked. In this case, one of the two adjacent electronic modules includes a connecting pin 20, and the other includes a connecting socket 60, and the connecting pin is fitted into the connecting socket. In this way, an electronic circuit with a more complicated three-dimensional structure can be constructed.

＜D. Supplements＞ As described below, the present embodiment includes the following disclosures.

(Composition 1) An electronic module (10), including: The first resin molded body (12); The first wiring circuit (30, 30a, 30b) is formed on the first surface (121) of the first resin molded body (12); and The connecting pins (20, 20a, 20b) are used to electrically connect the first wiring circuit (30, 30a, 30b) with an external circuit, The connecting pins (20, 20a, 20b) include: Rod-shaped parts (21, 21a, 21b); and The convex structure portion (22, 22a, 22b) protrudes from the peripheral surface of the rod-shaped portion (21, 21a, 21b), The connecting pin (20, 20a, 20b) protrudes from the first resin molded body (12) with a part of the rod-shaped portion (21, 21a, 21b), and the convex structure portion (22, 22a, The second surface (23, 23a, 23b, 25) of 22b) is embedded in the first resin molded body (12) in such a way that the second surface (23, 23a, 23b, 25) is exposed on the first surface (121), The first wiring circuit (30, 30a, 30b) is also formed on the second surface (23, 23a, 23b, 25).

(Composition 2) The electronic module (10) according to composition 1, wherein The convex structure portion (22, 22a, 22b) is in the shape of a circular plate with the longitudinal direction of the rod-shaped portion (21, 21a, 21b) as the central axis, The second surface (23, 23a, 23b) is a plane orthogonal to the longitudinal direction of the rod-shaped portion (21, 21a, 21b).

(Composition 3) The electronic module (10) according to the configuration 1 or the configuration 2, wherein the part of the rod-shaped portion (21, 21a, 21b) is derived from the first surface of the first resin molded body (12) (121) Outstanding.

(Composition 4) The electronic module (10) according to Configuration 1, wherein the part of the rod-shaped portion (21) is different from the first surface (121) of the first resin molded body (12) Three surfaces (123) protrude.

(Composition 5) The electronic module (10) according to composition 1, wherein The convex structure portion (22) has a rectangular plate shape in plan view orthogonal to the longitudinal direction of the rod-shaped portion (21), The second surface (25) is an end surface of the convex structure portion (22) that is parallel to the length direction of the rod-shaped portion (21).

(Composition 6) The electronic module (10) according to composition 3, wherein The first resin molded body (12) is plate-shaped, The first surface (121) is orthogonal to the thickness direction of the first resin molded body (12), The end surface (24, 24a) of the rod-shaped portion (21, 21a) opposite to the part is located at the fourth back side of the first surface (121) of the first resin molded body (12) The surface (122) is exposed, The electronic module (10) further includes a second wiring circuit (33) formed on the fourth surface (122) and on the end surface (24, 24a).

(Composition 7) The electronic module (10) according to any one of the composition 1 to the composition 6, further comprising being embedded in the first resin in such a manner that the electrodes (15, 15a, 15b) are exposed from the first surface (121) Electronic parts (14, 14a, 14b) of the molded body (12), The first wiring circuit (30, 30a, 30b) is also formed on the electrode (15, 15a, 15b) of the electronic component (14, 14a, 14b).

(Composition 8) An electronic device (1), comprising a first electronic module (10) and a second electronic module (50), The first electronic module (10) includes the electronic module as described in any one of Composition 1 to Composition 7, The second electronic module (50) includes: The second resin molded body (52); The third wiring circuit (70, 70a, 70b, 73) is formed on the surface (521, 522) of the second resin molded body (52); and Connection sockets (60, 60a, 60b) are embedded in the second resin molded body (52) and connected to the third wiring circuit (70, 70a, 70b, 73), The connecting pins (20, 20a, 20b) of the first electronic module (10) are fitted into the connecting sockets (60, 60a, 60b) of the second electronic module (50).

(Composition 9) A method for manufacturing an electronic module (10) includes the step of forming a resin molded body (12) by embedding a connecting pin (20), The connecting pin (20) includes: Rod (21); and The convex structure part (22) protrudes from the peripheral surface of the rod-shaped part (21), The step of forming the resin molded body (12) includes: The step of making a part of the rod-shaped portion (21) protrude from the resin molded body (12); and The step of exposing a part of the surface (23, 25) of the convex structure portion (22) from the resin molded body (12), The manufacturing method of the electronic module (10) further includes: A step of forming a wiring circuit (30) on the surface of the resin molded body (12) and the surface (23, 25) of the part of the convex structure portion (22).

(Composition 10) The manufacturing method of the electronic module (10) as described in the composition 9, wherein The step of molding the resin molded body (12) further includes the step of injecting resin to the molding die (82) by the injection molding method, or the step of laminating the resin on the template (101) by the layered molding method, The protruding step includes the step of inserting a part of the rod-shaped portion (21) into the hole (85, 102) formed in the forming die (82) or the template (101), The exposing step includes the step of bringing the surface (23, 25) of the part of the convex structure portion (22) into contact with the surface of the forming die (82) or the template (101).

(Composition 11) The manufacturing method of the electronic module (10) according to the composition 9 or the composition 10, wherein The step of molding the resin molded body (12) further includes a step of embedding electronic components (14) in the resin molded body (12) in such a way that the electrodes (15) are exposed from the resin molded body (12), The step of forming the wiring circuit (30) includes the step of forming the wiring circuit (30) on the electrode (15).

(Composition 12) A manufacturing method of an electronic device (1), including the step of forming a first resin molded body (12) by embedding a connecting pin (20), The connecting pin (20) includes: Rod (21); and The convex structure part (22) protrudes from the peripheral surface of the rod-shaped part (21), The step of forming the first resin molded body (12) includes: The step of making a part of the rod-shaped portion (21) protrude from the first resin molded body (12); and The step of exposing a part of the surface (23, 25) of the convex structure portion (22) from the first resin molded body (12), The manufacturing method of the electronic device (1) further includes: A step of forming a first wiring circuit (30) on the surface (121) of the first resin molded body (12) and the surface (23, 25) of the part of the convex structure portion (22); The step of forming the second resin molded body (52) by embedding the connection socket (60); Forming a second wiring circuit (70, 73) electrically connected to the connection socket (60) on the surface (521, 522) of the second resin molded body (52); and The step of fitting the rod-shaped portion (21) protruding from the first resin molded body (12) into the connection socket (60) embedded in the second resin molded body (52).

The embodiments disclosed this time should be regarded as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the scope of the patent application rather than the description, and it is intended to include the meaning equivalent to the scope of the patent application and all changes within the scope.

1: Electronic device 10: Electronic module (the first electronic module) 12: Resin molded body (first resin molded body) 14, 14a, 14b, 16, 16a, 16b, 54, 54a, 54b, 56, 56a, 56b: electronic parts 15, 15a, 15b, 17, 17a, 17b, 55, 55a, 55b, 57, 57a, 57b: electrodes 20, 20a, 20b: connecting pin 21, 21a, 21b: rod-shaped part 22, 22a, 22b: convex structure part 23, 23a, 23b: upper surface (second surface, surface) 24, 24a, 62, 62a, 62b, 63, 63b: end face 25: End surface (second surface, surface) 30, 30a, 30b: wiring circuit (first wiring circuit) 31, 34, 71, 74: Wiring circuit 32, 35, 72, 75: protective film 33: Wiring circuit (second wiring circuit) 40: Next layer 50: Electronic module (second electronic module) 52: Resin molded body (second resin molded body) 60, 60a, 60b: connection socket 61, 61a, 61b, 85, 102: holes 70, 73: Wiring circuit (second wiring circuit, third wiring circuit) 70a, 70b: Wiring circuit (third wiring circuit) 80, 81, 90, 91: Temporary fixing piece 82, 92: forming die 83, 93: upper die 84, 94: Lower die 101: template 121: Upper surface (first surface, surface) 122: lower surface (fourth surface) 123: Side (third surface) 521: Lower surface (surface) 522: Upper surface (surface) H1: length H2, H3: height

FIG. 1 is a plan view schematically showing an example of the electronic module of this embodiment. Fig. 2 is an arrow sectional view taken along the line A-A of Fig. 1. Fig. 3 is an external perspective view showing a connecting pin included in the electronic module shown in Fig. 1. FIG. 4 is a cross-sectional view schematically showing an example of the electronic device of this embodiment. FIGS. 5( a) to 5 (e) are diagrams illustrating the manufacturing process of the electronic module 10 included in the electronic device of the present embodiment. FIGS. 6( a) to 6 (e) are diagrams illustrating the manufacturing process of the electronic module 50 included in the electronic device of the present embodiment. FIG. 7 is a diagram illustrating the steps of assembling the electronic module 10 and the electronic module 50. FIG. 8 is a plan view schematically showing an example of an electronic module of Modification Example 1. FIG. Fig. 9 is an arrow sectional view taken along line A-A in Fig. 8. Fig. 10 is an external perspective view showing a connecting pin included in the electronic module shown in Fig. 8. FIGS. 11( a) to 11 (c) are diagrams for explaining the molding procedure of the resin molded body of Modification 2. FIG.

12: Resin molded body (first resin molded body)

14, 16: electronic parts

15, 17: Electrode

20: connecting pin

21: Rod

22: Convex structure

23: Upper surface (second surface, surface)

24: end face

30: Wiring circuit (first wiring circuit)

31, 34: Wiring circuit

32, 35: protective film

33: Wiring circuit (second wiring circuit)

80, 81: Temporary fixing piece

82: Forming die

83: upper die

84: Lower die

85: hole

121: Upper surface (first surface, surface)

122: lower surface (fourth surface)

H1: length

H2: height

Claims (12)

An electronic module includes: a first resin molded body; a first wiring circuit formed on a first surface of the first resin molded body; and a connecting pin for connecting the first wiring circuit with an external circuit For electrical connection, the connecting pin includes: a rod-shaped portion; and a convex structure portion protruding from a peripheral surface of the rod-shaped portion, and the connecting pin is derived from the first resin molded body with a part of the rod-shaped portion Protruding, and the second surface of the convex structure part is embedded in the first resin molded body in such a way that the second surface of the convex structure is exposed on the first surface, the second surface and the first surface are on the same plane, the A wiring circuit is also formed on the second surface. The electronic module according to claim 1, wherein the convex structure portion is in the shape of a circular plate with the longitudinal direction of the rod-shaped portion as a central axis, and the second surface is the same as the rod-shaped portion. A plane perpendicular to the length direction. The electronic module according to claim 1 or 2, wherein the part of the rod-shaped portion protrudes from the first surface of the first resin molded body. The electronic module according to claim 1, wherein the rod-shaped portion The part protrudes from a third surface of the first resin molded body that is different from the first surface. The electronic module according to claim 1, wherein the convex structure portion is a rectangular plate shape in plan view orthogonal to the longitudinal direction of the rod-shaped portion, and the second surface is the sum of the convex structure portion The end surface of the rod-shaped portion that is parallel to the longitudinal direction. The electronic module according to claim 3, wherein the first resin molded body has a plate shape, the first surface is orthogonal to the thickness direction of the first resin molded body, and the rod-shaped portion is The part of the opposite end surface is exposed on the fourth surface on the back side of the first surface of the first resin molded body, and the electronic module further includes formed on the fourth surface and the end surface The second wiring circuit. The electronic module according to claim 1, further comprising an electronic component embedded in the first resin molded body such that electrodes are exposed from the first surface, and the first wiring circuit is also formed on the electronic component On the electrode. An electronic device, comprising a first electronic module and a second electronic module, the first electronic module including the electronic module according to any one of claim 1 to 7, The second electronic module includes: a second resin molded body; a third wiring circuit formed on the surface of the second resin molded body; and a connection socket buried in the second resin molded body and connected to the The third wiring circuit is connected, and the connecting pin of the first electronic module is fitted into the connecting socket of the second electronic module. A method of manufacturing an electronic module includes the step of forming a resin molded body by embedding a connecting pin, the connecting pin comprising: a rod-shaped portion; The step of the resin molded body includes: a step of making a part of the rod-shaped portion protrude from the resin molded body; Mode, the step of exposing the surface of the part of the convex structure portion from the resin molded body, the method of manufacturing the electronic module further includes: on the surface of the resin molded body and the convex A step of forming a wiring circuit on the surface of the part of the structure part. The method of manufacturing an electronic module according to claim 9, wherein the step of molding the resin molded body further includes a normal molding die by injection molding The step of injecting the resin or the step of laminating the resin on the template by the lamination method, the protruding step includes the step of inserting a part of the rod-shaped portion into a hole formed in the mold or the template, the The exposing step includes the step of bringing the surface of the part of the convex structure part into contact with the surface of the forming mold or the template. The method of manufacturing an electronic module according to claim 9 or claim 10, wherein the step of molding the resin molded body further includes embedding electronic components in the resin molded body so that electrodes are exposed from the resin molded body The step of forming the wiring circuit includes the step of forming the wiring circuit on the electrode. A method of manufacturing an electronic device includes the step of forming a first resin molded body by embedding a connecting pin, the connecting pin comprising: a rod-shaped portion; The step of the first resin molded body includes: a step of making a part of the rod-shaped portion protrude from the first resin molded body; The step of exposing the surface of the part of the convex structure part from the first resin molded body in such a way that the surface of the convex structure part is on the same plane, The manufacturing method of the electronic device further includes: forming a first wiring circuit on the surface of the first resin molded body and on the surface of the part of the convex structure part; and embedding a connection socket A step of molding a second resin molded body; a step of forming a second wiring circuit electrically connected to the connection socket on the surface of the second resin molded body; and making all protruding from the first resin molded body The step of fitting the rod-shaped portion to the connection socket embedded in the second resin molded body.

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