JP2012243862A - Electronic device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable electronic device.SOLUTION: The electronic device 1 comprises: an electronic component 3 having an electrode 31 on the outer surface; a substrate body 21; and a wiring board 2 including the electric wiring 22 provided on one principal surface of the substrate body 21 and connected electrically with the electrode 31 of the electronic component 3. The surface of the substrate body 21 and the lower surface of the electronic component 3 are bonded directly. No separate member exists between the electronic component 3 and the wiring board 2. Since the boundary of different members is decreased, possibility of peeling can be reduced.

Description

  The present invention relates to an electronic device and a method for manufacturing the same.

  In the conventional electronic device, a resin material such as underfill is disposed between the lower surface of the electronic component and the upper surface of the wiring board on which the electronic component is mounted. This resin material has strengthened the adhesion between the electronic component and the wiring board.

JP 2001-24029

  However, in the conventional electronic device, there are two boundaries where different members contact each other between the electronic component and the wiring board. That is, the boundary surface between the electronic component and the underfill and the boundary surface between the wiring board and the underfill. Therefore, when an impact, stress, or the like is applied to these boundary surfaces, there are a plurality of boundary surfaces, and there is a possibility that peeling occurs at any of the boundary surfaces. As a result, the force with which the electronic component is fixed to the wiring board is weakened, and there is a possibility that electrical conduction between the electronic component and the wiring board cannot be obtained.

  An electronic device according to the present invention includes an electronic component having an electrode on an outer surface, a substrate body, and an electrical wiring provided on one main surface of the substrate body and electrically connected to the electrode of the electronic component. The surface of the substrate body and the lower surface of the electronic component are directly joined.

  The method of manufacturing an electronic device according to the present invention includes a step of forming the electrical wiring on a surface of a resin material that is cured to be the substrate body, and placing the electronic component by directly contacting a lower surface of the resin material. And a step of curing the resin material to form the wiring substrate and bonding the lower surface of the electronic component directly to the surface of the substrate body.

  The method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device in which an electronic component having an electrode on an outer surface is directly bonded to a wiring board having an electric wiring and a substrate body provided with the electric wiring on one main surface. A method of forming a conductor layer that reacts with the surface of a resin material that is cured to be the substrate body, and a lower surface is directly contacted on the resin material, thereby the electronic component And the step of reacting the conductor layer while curing the resin material to form the wiring substrate and directly bonding the lower surface of the electronic component to the surface of the substrate body.

According to the electronic device of the present invention, the electronic device includes an electronic component having an electrode on the outer surface, a substrate body, and an electrical wiring provided on one main surface of the substrate body and electrically connected to the electrode of the electronic component. Since the wiring board is provided and the surface of the board body and the lower surface of the electronic component are directly joined, there is no separate member between the electronic component and the wiring board. Therefore, for example, compared with the case where a resin material such as underfill is disposed between the electronic component and the wiring board, the boundary between different members is reduced, and one of the boundaries between the electronic component and the wiring board is reduced. Become one. Accordingly, since the number of boundaries where peeling may occur can be reduced, the fixing force of the electronic component to the wiring board can be maintained even when an impact, stress, or the like is applied to the electronic device. As a result, it is possible to prevent the electronic component from being unable to be electrically connected to the wiring board.

  According to the method for manufacturing an electronic device of the present invention, the step of forming the electrical wiring on the surface of the resin material that is cured to become the substrate body, and the lower surface is brought into direct contact with the resin material, thereby the electronic component And forming the wiring substrate by curing the resin material, and directly bonding the lower surface of the electronic component to the surface of the substrate body. The electronic component can be adhered to the wiring board. Therefore, the manufacturing efficiency of the electronic device can be improved.

  According to the method of manufacturing an electronic device of the present invention, an electronic device in which an electronic component having an electrode on the outer surface is directly joined to a wiring board having an electrical wiring and a substrate body provided with the electrical wiring on one main surface. And a step of forming a conductor layer that reacts and forms an electrical wiring on the surface of the resin material that is cured to form the substrate body, the lower surface is brought into direct contact with the resin material, A step of arranging an electronic component; and a step of reacting the conductor layer while curing the resin material to form the wiring substrate, and directly bonding a lower surface of the electronic component to a surface of the substrate body. Therefore, it is possible to form the wiring board and adhere the electronic component to the wiring board. Therefore, the manufacturing efficiency of the electronic device can be improved.

It is sectional drawing which shows an example of embodiment of the electronic device of this invention. It is a top view which shows an example of embodiment of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the electronic device of this invention.

  Hereinafter, an exemplary embodiment of an electronic device according to the present invention will be described in detail with reference to the drawings. An electronic device 1 shown in FIG. 1 includes an electronic component 3 and a wiring board 2 as a basic configuration.

  In the example shown in FIG. 1, the wiring board 2 includes a board main body 21 and an electric wiring 22 provided on one main surface of the board main body 21 and electrically connected to the electrode 31 of the electronic component 2. Yes.

The substrate body 21 is made of an ultraviolet curable or thermosetting resin material such as a phenolic resin, a polyimide resin, or an epoxy resin. A thermoplastic resin such as polyetheretherketone can also be used. The substrate body 21 can also be a composite material obtained by blending an inorganic material such as ceramics or glass with an organic resin material such as an epoxy resin. The substrate body 21 is preferably made of a resin sheet material having a thickness of about 50 to 300 μm from the viewpoint of thinning. From the viewpoint of mechanical strength, it is preferable to use a resin sheet material obtained by impregnating the above-mentioned resin material into a fiber cloth made of glass, aramid or the like. Moreover, the dimension of the wiring board 2 is about 10-50 mm in length, and is about 10-50 mm in width.

The electrical wiring 22 is made of, for example, a metal material such as Cu, Ag, or Au, a composite material of these metal materials and a resin, or a conductive resin material containing particles of these metal materials. The electrical wiring 22 has a length of about 2 to 10 mm and a width of about 0.2 to 2 mm. The thickness of the electrical wiring 22 is about 1 to 20 μm. Further, when the electric wiring 22 is formed of Cu or Ag, it is preferable from the viewpoint of corrosion resistance that the surface of the electric wiring 22 is subjected to Ni plating and Au plating thereon.

  Further, in the electrical connection between the electrode 31 of the electronic component 3 and the electrical wiring 22 which will be described later, the electrical connection resistance can be reduced by interposing a conductive compound or the like between them. Moreover, in order to increase the fixing force between the two, solder or a conductive adhesive can be interposed.

The electronic component 3 has an electrode 31 on the outer surface. Further, the electrode 31 of the electronic component 3 is electrically connected to the electrical wiring 22 on one main surface of the wiring board 2. In the example shown in FIG. 1, one electrode 31 is provided at each end of the lower surface of the electronic component 3. The electrode 31 has a length of about 0.2 to 0.5 mm, a width of about 0.3 to 3 mm, and a thickness of about 5 to 20 μm.
The material of the electrode 31 is the same as the material used for the electrical wiring 22 described above. Further, it is preferable that the same plating treatment as that for the electric wiring 22 is performed. Examples of the electronic component 3 include a capacitor, a resistor, a diode, a coil, an IC, and a transistor. The electronic component 3 may be a piezoelectric oscillation component such as a SAW resonator, a ceramic resonator, or a crystal resonator. Further, it may be a module part including these piezoelectric oscillation parts.

In the example shown in FIG. 1, the surface of the substrate body 21 in the wiring board 2 and the lower surface of the electronic component 3 are directly joined, so that a separate body is provided between the electronic component 3 and the wiring board 2. There is no member. Therefore, for example, the boundary between different members decreases compared to the case where a resin material such as underfill is disposed between the electronic component 3 and the wiring board 2. That is, it becomes one of the boundaries between the electronic component 3 and the wiring board 2. Accordingly, since the number of boundaries where peeling may occur can be reduced, the fixing force of the electronic component 3 to the wiring board 2 is maintained even when an impact, stress, or the like is applied to the electronic device 1. it can. As a result, it is possible to prevent the electronic component 3 from being unable to be electrically connected to the wiring board 2.

  Here, in the example shown in FIG. 1, a part of the surface of the substrate body 21 is a convex portion, and this convex portion is in contact with the lower surface of the electronic component 3. This is because the electrical wiring 22 is embedded in the substrate body 21 and is substantially flush with the surface of the substrate body 21.

  Further, even if the surface of the substrate body 21 is the broken line portion A shown in FIG. 1, it can be configured to be in direct contact with the lower surface of the electronic component 3. This is because the electrical wiring 22 is actually a thin member having a thickness of about 1 to 20 μm, and the surface of the electrical wiring 22 and the surface of the wiring board 3 are substantially flush with each other.

  Below, the manufacturing method of the electronic device 1 is shown. First, the electrical wiring 22 is formed on the surface of the resin material that is cured to become the substrate body 21. As a method for forming the electrical wiring 22, means for depositing a metal thin film layer by metallization, plating, vapor deposition or the like is used. Further, a metal foil having a predetermined shape can be transferred to an uncured resin material. When adopting the method for transferring the metal foil in this way, it is preferable that the metal foil is preliminarily bonded onto the resin material by holding the uncured resin material at a predetermined temperature and softening it. As a result, handling such as storage or transportation of the uncured resin material in which the metal foil is disposed as the electrical wiring 22 becomes easy.

  Next, the lower surface is brought into direct contact with the resin material, and the electronic component 3 is disposed. At this time, it is preferable that the electronic component 3 is temporarily bonded to the resin material in advance by holding the resin material at a predetermined temperature and softening it.

Next, the resin material is cured to form the wiring board 2, and the lower surface of the electronic component 3 is directly bonded to the surface of the board body 21. For example, when a thermosetting resin is used as the resin material, heat treatment is performed at a predetermined temperature and time in order to cure the resin material. At this time, the electrical wiring 22 and the electronic component can be firmly bonded to each other by the resin sheet material by bonding the electronic component 3 while pressing it from the upper surface. The electronic device 1 can be obtained by the steps as described above. In addition to the heating means, the resin material can be cured by irradiating predetermined infrared rays, electromagnetic waves, or the like.

  Further, another example of the method for manufacturing the electronic device 1 will be described below. First, a conductor layer that reacts to form the electrical wiring 22 is formed on the surface of the resin material that is cured to form the substrate body 21. As a method for forming the conductor layer, for example, there is a method in which an ink containing metal nanoparticles such as Ag and Cu is applied to the surface of an uncured resin material by inkjet or the like. For forming the conductor layer, a method of forming a conductive resin paste containing metal particles by screen printing can also be employed.

  Next, the lower surface is brought into direct contact with the resin material, and the electronic component 3 is disposed. This step is the same as the example of the manufacturing method described above.

  Next, the conductor layer is reacted while the resin material is cured to form the wiring substrate 2, and the lower surface of the electronic component 3 is directly bonded to the surface of the substrate body 21. Here, as the curing means and the reaction means, the same means as in the above-described example of the manufacturing method is employed. The electronic device 1 can be obtained by the steps as described above.

  According to the manufacturing method as described above, in the step of forming the wiring board 2, the electronic component 3 can be bonded to the wiring board 2 at the same time. Further, the step of arranging a separate resin such as underfill for bonding the electronic component 3 and the wiring board 2 can be omitted. Therefore, the manufacturing efficiency of the electronic device 1 can be improved. Also, since the curing of the resin material that becomes the substrate body 21 and the reaction of the conductor layer that becomes the electrical wiring 22 are simultaneously performed, those materials are combined in the vicinity of the boundary between the resin material and the conductor layer. Since a layer (composite layer) bonded to the wiring body 2 can be formed, the wiring substrate 2 can be obtained in which the adhesion of the electrical wiring 22 to the substrate body 21 is increased.

  The present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention.

  For example, it is preferable that the lower surface of the electronic component 3 has an appropriate surface roughness. For example, it is about 2 to 12 μm. In this case, due to the anchor effect, the resin material to be the substrate body 21 is firmly bonded to the lower surface of the electronic component 3 having roughness. Therefore, the surface of the substrate body 21 and the electronic component 3 are bonded with high bondability. Moreover, sandblasting etc. can be used in order to provide surface roughness.

  Further, for example, as in the example illustrated in FIG. 3, in the electronic device 1, the lower surface of the wiring substrate 2 may be bonded to the upper surface of the holding body 4. As the material of the holding body 4, an ultraviolet curable resin material or a thermosetting resin material such as a phenol resin, a polyimide resin, or an epoxy resin is used. A thermoplastic resin such as polyetheretherketone can also be used. Further, as the material of the holding body 4, ceramic materials such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body may be used. it can. Alternatively, a composite material obtained by mixing an inorganic material such as ceramics or glass with an organic resin material such as an epoxy resin may be used. Further, a metal material or the like may be used.

Here, as a method of adhering the wiring board 2 to the holding body 4, a method of adhering the lower surface of the wiring board 2 in the electronic device 1 to the upper surface of the holding body 4 through an adhesive can be employed. For example,
An uncured resin sheet can be used as the adhesive. In this case, it is preferable that an uncured resin sheet is temporarily bonded to the lower surface of the wiring board 2 and a pet film is provided on the lower surface of the resin sheet. If it does in this way, the electronic apparatus 1 of the state provided with the pet film is stored, and then the pet film is peeled off at a desired timing, adhered to the desired holding body 4, and cured by means such as heating. be able to. Moreover, as an adhesive for bonding the wiring board 2 and the holding body 4, an adhesive resin material that does not require curing may be used.

  Another method for bonding the electronic device 1 to the holder 4 will be described below. First, an uncured resin material to be the wiring board 2 is disposed on the upper surface of the holding body 4 by temporary adhesion, and the electrical wiring 22 (or a conductor layer that reacts to become an electrical wiring) is formed on the uncured resin material. Form. Next, the electronic component 3 is disposed on the resin material. Next, the resin material is cured, and the electronic component 3 and the wiring board 2 are directly bonded, and at the same time, the wiring board 2 and the holding body 4 are bonded. Thereby, the electronic device 1 bonded to the holding body 4 can be obtained. When this method is adopted, since the uncured resin material is softened by heating, the wiring board 2 can be bonded to the holding body 4 having a curved surface or unevenness. Therefore, the electronic device 1 can be bonded to the holder 4 having flexibility such as clothing.

  The electronic device 1 of the present invention may be formed on both main surfaces of the holding body 4. In this case, the electrical wirings 22 on both main surfaces of the holding body 4 may be connected to each other by electrodes provided on the surface of the holding body 4 or inside thereof. Examples of the electrode provided inside the holding body 4 include a through conductor.

  For example, as in the example shown in FIG. 4, it is preferable to provide the resin material 5 so as to cover the surface of the wiring board 2 and the electronic component 3. By setting it as such a structure, the adhesion | attachment to the wiring board 2 of the electronic component 3 can be strengthened. Moreover, since the electrode wiring 22 can be covered with the resin material 5, even when the electrical wirings 22 are close to each other, insulation between the electrical wirings 22 can be ensured. Further, the electronic component 3 can be prevented from being exposed to the outside, and the electronic component 3 can be protected from an impact or the like.

  As the material of the resin material 5, the same material as that used for the substrate body 21 can be used. Further, when the resin material 5 is a resin sheet material, it is preferable because the resin material 5 adheres in accordance with the shape of the electronic component 3 and the electronic component 3 can be firmly bonded to the wiring board 2. Further, the resin material 5 may cover the entire surface of the wiring board 2 or may cover a part thereof.

  Further, for example, as shown in the example shown in FIG. 5, electrodes 31 and 32 are provided on the upper surface and the lower surface of the electronic component 3, respectively, and the resin material 5 is electrically connected to the boundary with the electronic component 3 on the lower surface. Wiring 51 is provided, and it is preferable that the electric wiring 51 is electrically connected to the upper surface electrode 32 and the electric wiring 22 of the wiring board 2. In this case, the electrical connection between the electronic component 3 and the electrical circuit 22 can be further ensured by the electrical wiring 51.

  Further, for example, as in the example illustrated in FIG. 6, the electrode 32 may be provided only on the upper surface of the electronic component 3. In this case, in order to electrically connect the electrode 32 and the electric wiring 22 of the wiring board 2, the conductive resin 6 may be used. As the conductive resin 6, a resin paste containing conductive particles may be used. Further, wire bonding can be used for electrical connection between the electrode 32 and the electrical wiring 22.

Further, for example, the through hole 23 may be provided in the wiring board 2, and the electronic component 3 may be mounted on the wiring board 2 so that the outer peripheral portion thereof is bonded to the opening of the through hole 23. In the example shown in FIG. 7, both end portions of the electronic component 3 are joined to the opening portion of the through hole 23. In this case,
Since the central part of the electronic component 3 is not in contact with the wiring board 2, it is suitable for an application for holding a piezoelectric vibration element, for example.

  The through hole 23 can be formed by punching an uncured resin sheet material with a mold or the like. A laser or the like may be used. The piezoelectric vibration element is provided with vibration electrodes 31 and 32 facing each other through the piezoelectric substrate on both main surfaces of the piezoelectric substrate. The electrode 31 on the lower surface of the piezoelectric substrate is drawn out to the upper surface of the piezoelectric substrate through the end surface of the piezoelectric substrate. These vibration electrodes 31 and 32 are electrically connected to the electrical wiring 22 by the conductive resin 6 at both ends of the piezoelectric substrate.

  Further, the piezoelectric vibration element may be a laminated substrate having internal electrodes. Furthermore, a piezoelectric vibration element bonded to a shim made of metal or the like may be used. In this case, the peripheral edge of the shim can be mounted on the wiring board 2 by holding it around the opening of the through hole 23.

  Further, for example, the substrate body 21 of the wiring board 2 is not limited to a resin material, but an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. A ceramic material such as a body may be used. In this case, by selecting the electronic component 3 made of ceramics or glass, the electronic component 3 can be fired at the same time as the wiring board 2 is fired. Further, the electronic component 3 can also be directly joined to the substrate body 21. Therefore, in this case, the manufacturing efficiency of the entire electronic device 1 including the electronic component 3 can be improved. Further, when the substrate body 21 made of a ceramic material is selected, it is desirable from the viewpoint of firing that a metal material having a high melting point such as W or Ag—Pd is used as the electrical wiring 22.

1: Electronic device 2: Wiring board
21: Board body
22: Electrical wiring 3: Electronic component 4: Holding body 5: Resin material

Claims (5)

An electronic component having an electrode on the outer surface;
A board body, and a wiring board including electrical wiring provided on one main surface of the board body and electrically connected to the electrode of the electronic component;
The electronic device according to claim 1, wherein a surface of the substrate body and a lower surface of the electronic component are directly joined.   The electronic device according to claim 1, wherein a resin material is provided so as to cover a surface of the wiring board and the electronic component.   The through-hole is provided in the said wiring board, The said electronic component is mounted in the said wiring board so that the outer peripheral part may be joined to the opening part of the said through-hole. The electronic device according to claim 2. An electronic device manufacturing method in which an electronic component having an electrode on an outer surface is directly bonded to a wiring board having an electric wiring and a substrate body provided on one main surface of the electric wiring,
Forming the electrical wiring on the surface of the resin material to be cured to form the substrate body;
Placing the electronic component in direct contact with the lower surface on the resin material;
A step of curing the resin material to form the wiring substrate, and directly bonding a lower surface of the electronic component to a surface of the substrate body. An electronic device manufacturing method in which an electronic component having an electrode on an outer surface is directly bonded to a wiring board having an electric wiring and a substrate body provided on one main surface of the electric wiring,
A step of forming a conductor layer that reacts and becomes electrical wiring on the surface of the resin material that is cured and becomes the substrate body;
Placing the electronic component in direct contact with the lower surface on the resin material;
Forming the wiring substrate by reacting the conductor layer while curing the resin material, and directly bonding the lower surface of the electronic component to the surface of the substrate body.

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