WO2020188955A1 - Electronic module, electronic device, and manufacturing methods therefor - Google Patents

Abstract

An electronic module (10) comprises: a resin molded body (12); a wiring circuit (30) formed on an upper surface (121) of the resin molded body (12); and a contact pin (20) for electrically connecting the wiring circuit (30) to an external circuit. The contact pin (20) includes a rod-shaped section (21), and a protruding structure section (22) that protrudes from a peripheral surface of the rod-shaped section (21). The contact pin (20) is embedded in the resin molded body (12) such that a portion of the rod-shaped section (21) protrudes from the resin molded body (12), and such that an upper surface (23) that is a surface of the protruding structure section (22) is exposed at the upper surface (121). The wiring circuit (30) is also formed on the upper surface (23) of the protruding structure section (22). As a result of the above, it is possible to provide an electronic module with high connection reliability between a contact pin and a wiring circuit.

Description

Electronic modules, electronic devices and their manufacturing methods

This technology relates to electronic modules, electronic devices and their manufacturing methods.

In recent years, electronic devices such as sensors composed of electronic circuits consisting of active elements (for example, semiconductor elements) and passive elements (for example, capacitors, resistors, etc.), IoT (Internet of Things) terminals equipped with wireless functions, wearable devices, etc. There is an increasing demand for ultra-miniaturization. In order to meet this demand, the integration and three-dimensionalization (three-dimensionalization) of electronic circuits are being actively promoted.

For example, Japanese Patent Application Laid-Open No. 2009-267050 (Patent Document 1) discloses a functional module connected to an electronic circuit board provided with a socket portion. The functional module includes a plurality of electronic components, a laminated wiring board that supports and interconnects the plurality of electronic components, and a connection pin that is connected to the electronic circuit board as a part of the laminated wiring board. The connection pin is composed of an anchor portion embedded in the laminated wiring board and a rod portion integrally formed with the anchor portion and protruding outward from an opening provided in the laminated wiring board.

JP-A-2009-267050

In the functional module disclosed in Patent Document 1, the electrical connection of the connection pin to the wiring circuit formed on the wiring board is performed by mechanical contact with the metal plating layer on the surface of the opening formed on the wiring board. Therefore, the connection reliability of the connection pin with the wiring circuit is low.

Further, the functional module disclosed in Patent Document 1 is manufactured by a process of embedding a connection pin in a laminated wiring board. In the embedding process, it is necessary to stack a plurality of wiring boards while aligning the openings formed in the wiring boards of each layer with the connection pins. Therefore, the embedding process becomes very complicated and the manufacturing cost increases.

The present disclosure has focused on the above problems, and an object of the present disclosure is to provide an electronic module and an electronic device having high connection reliability between a connection pin and a wiring circuit. Furthermore, it is an object of the present disclosure to provide a method for manufacturing an electronic module and an electronic device having high connection reliability between a connection pin and a wiring circuit, which can suppress an increase in manufacturing cost.

In one example of the present disclosure, the electronic module electrically connects the first resin molded body, the first wiring circuit formed on the first surface of the first resin molded body, and the first wiring circuit to an external circuit. It is equipped with a connection pin for The connecting pin includes a rod-shaped portion and a convex structure portion protruding from the peripheral surface of the rod-shaped portion. The connection pin is embedded in the first resin molded body so that a part of the rod-shaped portion protrudes from the first resin molded body and the second surface of the convex structure portion is exposed to the first surface. The first wiring circuit is also formed on the second surface.

According to this disclosure, the first wiring circuit is formed on the second surface of the convex structure portion. Therefore, the connection reliability between the first wiring circuit and the connection pin can be improved.

In the above disclosure, the convex structure portion has a disk shape with the longitudinal direction of the rod-shaped portion as the central axis. The second surface is a plane orthogonal to the longitudinal direction of the rod-shaped portion.

According to this disclosure, the degree of freedom in selecting the connection position between the first wiring circuit and the convex structure portion is increased. As a result, the degree of freedom in designing the shape of the first wiring circuit is increased.

In the above disclosure, a part of the rod-shaped portion protrudes from the first surface of the first resin molded product.

According to this disclosure, the electronic module can be electrically connected to another circuit arranged above the first surface on which the first wiring circuit is formed via a connection pin. As a result, an electronic circuit having a three-dimensional structure can be constructed.

In the above disclosure, a part of the rod-shaped portion protrudes from a third surface different from the first surface in the first resin molded product.

According to this disclosure, the electronic module can be electrically connected via a connection pin to another circuit located above a third surface that is different from the first surface on which the first wiring circuit is formed. ..

In the above disclosure, the convex structure portion is a rectangular plate shape in a plan view orthogonal to the longitudinal direction of the rod-shaped portion. The second surface is an end face parallel to the longitudinal direction of the rod-shaped portion in the convex structure portion.

According to this disclosure, the contact area between the first wiring circuit and the second surface can be increased, and the connection reliability between the first wiring circuit and the connection pin can be further improved.

In the above disclosure, the first resin molded body is plate-shaped. The first surface is orthogonal to the thickness direction of the first resin molded product. The end face of the rod-shaped portion opposite to the above-mentioned part is exposed to the fourth surface on the back side of the first surface of the first resin molded product. The electronic module further comprises a second wiring circuit formed on the fourth surface and the end face.

According to this disclosure, the first wiring circuit and the second wiring circuit provided on the first surface and the fourth surface of the first resin molded product can be electrically connected by the connection pin. This makes it possible to increase the degree of freedom in designing the electronic circuit.

In the above disclosure, the electronic module further includes an electronic component embedded in the first resin molded body so that the electrodes are exposed from the first surface. The first wiring circuit is also formed on the electrodes of the electronic component.

According to this disclosure, it is possible to construct an electronic circuit having a three-dimensional structure without considering the influence of the thickness of the electronic component. Further, the electronic module can be miniaturized as compared with the case where the electronic component is mounted on the surface of the first resin molded product.

In one example of the present disclosure, the electronic device includes a first electronic module and a second electronic module. The first electronic module is composed of the above electronic modules. The second electronic module is a connection socket embedded in a second resin molded body, a third wiring circuit formed on the surface of the second resin molded body, and a second resin molded body, and connected to the third wiring circuit. And include. The connection pin of the first electronic module is fitted into the connection socket of the second electronic module.

Even with this disclosure, the first wiring circuit is formed on the second surface of the convex structure portion. Therefore, the connection reliability between the first wiring circuit and the connection pin can be improved.

Further, the electrical connection between the first wiring circuit formed on the first resin molded body and the third wiring circuit formed on the second resin molded body is embedded in the first resin molded body. It is obtained by mechanical fitting the connection pin and the connection socket embedded in the second resin molded body. Therefore, the connection between the first wiring circuit and the third wiring circuit does not require a thermosetting step of a bonding material such as solder. As a result, the manufacturing cost of the electronic device can be reduced.

In one example of the present disclosure, the method of manufacturing an electronic module includes a step of molding a resin molded body so that a connection pin is embedded. The connecting pin includes a rod-shaped portion and a convex structure portion protruding from the peripheral surface of the rod-shaped portion. The step of molding the resin molded body includes a step of projecting a part of the rod-shaped portion from the resin molded body and a step of exposing a part of the surface of the convex structure portion from the resin molded body. The method for manufacturing an electronic module further includes a step of forming a wiring circuit on the surface of the resin molded product and on the surface of the part of the convex structure portion.

According to this disclosure, the wiring circuit can be formed on the surface of the resin molded product and on the surface exposed from the resin molded product in the convex structure portion by using a simple method such as a printing method of spraying nanoink or the like. .. Further, unlike Patent Document 1, there is no step of aligning the opening formed in the substrate with the connection pin. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic module. Further, the wiring circuit is formed on the surface of a part of the convex structure portion. Therefore, the connection reliability between the wiring circuit and the connection pin can be improved.

In the above disclosure, the step of molding the resin molded body further includes a step of injecting the resin into the molding mold by an injection molding method or a step of laminating the resin on the mold plate by a laminated molding method. The protruding step includes a step of inserting a part of the rod-shaped portion into a hole formed in the molding die or the template. The exposing step includes a step in which the surface of the portion of the convex structure is brought into contact with the surface of the molding or template.

According to this disclosure, a part of the rod-shaped portion inserted into the hole can be easily projected from the resin molded body, and the surface of the convex structure portion that was in contact with the surface of the molding die or the template is resin molded. It can be easily exposed from the body. Further, a part of the rod-shaped portion is inserted into the hole, and the convex structure portion comes into contact with the surface of the molding die or the mold plate, so that the connecting pin is prevented from falling when the resin molded body is molded. As a result, it is possible to suppress the occurrence of poor inclination of the connection pin.

In the above disclosure, the step of molding the resin molded body further includes a step of embedding an electronic component in the resin molded body so that the electrode is exposed from the resin molded body. The step of forming the wiring circuit described above includes a step of forming the wiring circuit on the electrode.

According to this disclosure, the electronic component and the connection pin can be electrically connected. Further, since the electronic component is embedded in the resin molded body 12, it does not become an obstacle when the connection pin is connected to another circuit.

In one example of the present disclosure, the method of manufacturing an electronic device includes a step of molding a first resin molded body so that a connection pin is embedded. The connecting pin includes a rod-shaped portion and a convex structure portion protruding from the peripheral surface of the rod-shaped portion. The step of molding the first resin molded body includes a step of projecting a part of the rod-shaped portion from the first resin molded body and a step of exposing a part of the surface of the convex structure portion from the first resin molded body. The method for manufacturing the electronic device further includes a step of forming a first wiring circuit on the surface of the first resin molded product and on the surface of the above-mentioned part of the convex structure portion, and a second resin so that the connection socket is embedded. A step of molding the molded body, a step of forming a second wiring circuit electrically connected to the connection socket on the surface of the second resin molded body, and a second rod-shaped portion protruding from the first resin molded body. It includes a step of fitting into a connection socket embedded in a resin molded body.

Even with this disclosure, the wiring circuit can be formed by using a simple method such as a printing method. Further, unlike Patent Document 1, there is no step of aligning the opening formed in the substrate with the connection pin. Therefore, it is possible to suppress an increase in the manufacturing cost of the electronic device.

Further, the electrical connection between the first wiring circuit and the second wiring circuit is such that the connection pin embedded in the first resin molded body and the connection socket embedded in the second resin molded body are mechanically fitted. Obtained by. Therefore, the connection between the first wiring circuit and the second wiring circuit does not require a thermosetting step of a bonding material such as solder. As a result, the manufacturing cost of the electronic device can be reduced. Further, the wiring circuit is formed on the surface of a part of the convex structure portion. Therefore, the connection reliability between the wiring circuit and the connection pin can be improved.

According to the present disclosure, it is possible to provide an electronic module and an electronic device having high connection reliability between a connection pin and a wiring circuit. Further, according to the present disclosure, it is possible to provide a method for manufacturing an electronic module and an electronic device having high connection reliability between a connection pin and a wiring circuit, which can suppress an increase in manufacturing cost.

It is a top view which shows typically an example of the electronic module which concerns on this embodiment. It is a cross-sectional view taken along the line AA of FIG. It is an external perspective view which shows the connection pin provided in the electronic module shown in FIG. It is sectional drawing which shows typically an example of the electronic device which concerns on this embodiment. It is a figure explaining the manufacturing process of the electronic module 10 included in the electronic device which concerns on this embodiment. It is a figure explaining the manufacturing process of the electronic module 50 included in the electronic device which concerns on this embodiment. It is a figure explaining the assembly process of an electronic module 10 and an electronic module 50. It is a top view which shows typically an example of the electronic module which concerns on modification 1. FIG. It is a cross-sectional view taken along the line AA of FIG. It is an external perspective view which shows the connection pin provided in the electronic module shown in FIG. It is a figure explaining the molding process of the resin molded body which concerns on modification 2. FIG.

Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as “the present embodiment”) will be described with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals and the description thereof will not be repeated.

<A. Application example>
An example of a situation in which the present invention is applied will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view schematically showing an example of an electronic module according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is an external perspective view showing a connection pin provided in the electronic module shown in FIG.

As shown in FIGS. 1 and 2, the electronic module 10 according to the present embodiment includes a resin molded body 12, a wiring circuit 30 formed on the upper surface 121 of the resin molded body 12, and a lower surface of the resin molded body 12. A wiring circuit 33 formed on the 122 and a connection pin 20 are provided. In the examples shown in FIGS. 1 and 2, the resin molded body 12 has a plate shape. The upper surface 121 is one of two planes orthogonal to the thickness direction of the resin molded body 12.

The connection pin 20 is a member for electrically connecting the wiring circuits 30 and 33 to an external circuit, and is made of a metal such as brass. As shown in FIG. 3, the connecting pin 20 includes a rod-shaped portion 21 and a convex structure portion 22 protruding from the peripheral surface of the rod-shaped portion 21. The rod-shaped portion 21 and the convex structure portion 22 are integrally formed. In the example shown in FIG. 3, the convex structure portion 22 has a disk shape with the longitudinal direction of the rod-shaped portion 21 as the central axis.

The connection pin 20 is embedded in the resin molded body 12 so that a part of the rod-shaped portion 21 protrudes from the resin molded body 12 and a part of the surface of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. Will be done. In the example shown in FIG. 2, the rod-shaped portion 21 protrudes from the upper surface 121 of the resin molded body 12, and the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. The upper surface 23 of the convex structure portion 22 is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21.

The wiring circuit 30 is also formed on the upper surface 23 of the convex structure portion 22 exposed on the upper surface 121 of the resin molded body 12. As a result, the wiring circuit 30 can be electrically connected to the external circuit via the connection pin 20. As a result, the electronic circuit can be made three-dimensional. Further, the connection reliability between the wiring circuit 30 and the connection pin 20 can be improved.

The wiring circuit 30 can be formed by using a simple method such as a printing method of spraying nanoink or the like. As a result, an increase in the manufacturing cost of the electronic module 10 can be suppressed.

As shown in FIG. 2, the end face 24 of the rod-shaped portion 21 of the connection pin 20 opposite to the part protruding from the resin molded body 12 may be exposed on the lower surface 122 of the resin molded body 12. In this case, the wiring circuit 33 formed on the lower surface 122 of the resin molded body 12 may also be formed on the end surface 24 of the rod-shaped portion 21. As a result, the wiring circuit 33 can be electrically connected to the external circuit via the connection pin 20. As a result, further three-dimensionalization of the electronic circuit can be realized.

<B. Specific example>
(B-1. Structure of electronic device)
A specific example of the electronic device in which the electronic module 10 according to the present embodiment is incorporated will be described below. FIG. 4 is a cross-sectional view schematically showing an example of the electronic device according to the present embodiment. As shown in FIG. 4, the electronic device 1 includes electronic modules 10 and 50 and an adhesive layer 40.

Each of the electronic modules 10 and 50 includes an electronic circuit configured by connecting one or more electronic components with a wiring circuit. The electronic circuit included in the electronic module 10 and the electronic circuit included in the electronic module 50 are electrically connected by fitting a connection pin provided in the electronic module 10 and a connection socket provided in the electronic module 50.

The electronic module 10 protects the resin molded body 12, the electronic components 14a, 14b, 16a, 16b, the two connection pins 20 (connection pins 20a, 20b), the wiring circuits 30a, 30b, 31, 33, 34, and the like. It includes films 32 and 35.

The electronic module 50 includes a resin molded body 52, electronic components 54a, 54b, 56a, 56b, connection sockets 60a, 60b, wiring circuits 70a, 70b, 71, 73, 74, and protective films 72, 75. ..

Each of the resin molded bodies 12 and 52 is, for example, plate-shaped and is made of a resin such as acrylonitrile butadiene styrene (ABS). However, the materials of the resin molded bodies 12 and 52 are not particularly limited. The thickness of the resin molded bodies 12 and 52 is not particularly limited.

Electronic components 14a, 14b, 16a, 16b, 54a, 54b, 56a, 56b are passive components (resistors, capacitors, etc.), active components (LSI (Large-Scale Integration), IC (Integrated Circuit), etc.), power supply devices ( It is a component selected from batteries, etc.), display devices (LED (Light Emitting Diode), etc.), sensors, switches, etc. In the example shown in FIG. 4, the electronic components 14a, 16a, 54a, 56a are chip type capacitors, inductors or resistors, and the electronic components 14b, 16b, 54b, 56b are ICs. The types of electronic components are not limited.

The electronic components 14a, 14b, 16a, 16b, 54a, 54b, 56a, 56b have electrodes 15a, 15b, 17a, 17b, 55a, 55b, 57a, 57b, respectively.

The electronic components 14a and 14b are embedded in the resin molded body 12 so that the electrodes 15a and 15b are exposed from the upper surface 121 of the resin molded body 12, respectively. The surfaces of the electrodes 15a and 15b are continuous with the upper surface 121 of the resin molded body 12. Here, when the two surfaces are "continuous", it means that the step between the two surfaces is so small that the wiring formed on the two surfaces is not cut. Specifically, the surfaces of the electrodes 15a and 15b are flush with the upper surface 121 of the resin molded body 12.

The electronic components 16a and 16b are embedded in the resin molded body 12 so that the electrodes 17a and 17b are exposed from the lower surface 122 of the resin molded body 12, respectively. The surfaces of the electrodes 17a and 17b are continuous with the lower surface 122 of the resin molded body 12. Specifically, the surfaces of the electrodes 17a and 17b are flush with the lower surface 122 of the resin molded body 12.

The electronic components 54a and 54b are embedded in the resin molded body 52 so that the electrodes 55a and 55b are exposed from the lower surface 521 of the resin molded body 52, respectively. The surfaces of the electrodes 55a and 55b are continuous with the lower surface 521 of the resin molded body 52. Specifically, the surfaces of the electrodes 55a and 55b are flush with the lower surface 521 of the resin molded body 52.

The electronic components 56a and 56b are embedded in the resin molded body 52 so that the electrodes 57a and 57b are exposed from the upper surface 522 of the resin molded body 52, respectively. The surfaces of the electrodes 57a and 57b are continuous with the upper surface 522 of the resin molded body 52. Specifically, the surfaces of the electrodes 57a and 57b are flush with the upper surface 522 of the resin molded body 52.

The connection pin 20a includes a rod-shaped portion 21a and a convex structure portion 22a protruding from the peripheral surface of the rod-shaped portion 21a. The connecting pin 20b includes a rod-shaped portion 21b and a convex structure portion 22b protruding from the peripheral surface of the rod-shaped portion 21b. The convex structure portions 22a and 22b are disk-shaped with the longitudinal directions of the rod-shaped portions 21a and 21b as the central axes, respectively.

The connection pin 20a is embedded in the resin molded body 12 so that the upper portion of the rod-shaped portion 21a protrudes from the upper surface 121 of the resin molded body 12 and the upper surface 23a of the convex structure portion 22a is exposed on the upper surface 121 of the resin molded body 12. Will be done. The upper surface 23a is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21a. The upper surface 23a of the convex structure portion 22a is continuous with the upper surface 121 of the resin molded body 12. Specifically, the upper surface 23a of the convex structure portion 22a is flush with the upper surface 121 of the resin molded body 12. The length from the upper surface 23a to the lower part of the convex structure portion 22a in the rod-shaped portion 21a is the same as the thickness of the resin molded body 12. Therefore, the lower end surface 24a of the rod-shaped portion 21a is exposed on the lower surface 122 of the resin molded body 12. The end surface 24a of the rod-shaped portion 21a is continuous with the lower surface 122 of the resin molded body 12. Specifically, the end surface 24a of the rod-shaped portion 21a is flush with the lower surface 122 of the resin molded body 12.

The connection pin 20b is embedded in the resin molded body 12 so that the upper portion of the rod-shaped portion 21b projects from the upper surface 121 of the resin molded body 12 and the upper surface 23b of the convex structure portion 22b is exposed on the upper surface 121 of the resin molded body 12. Will be done. The upper surface 23b is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21b. The upper surface 23b of the convex structure portion 22b is continuous with the upper surface 121 of the resin molded body 12. Specifically, the upper surface 23b of the convex structure portion 22b is on the same plane as the upper surface 121 of the resin molded body 12.

The connection sockets 60a and 60b have holes 61a and 61b that can be fitted with the connection pins 20a and 20b, respectively. The connection sockets 60a and 60b are made of a metal such as brass.

The connection socket 60a has a bottomed cylindrical shape, and is embedded in the resin molded body 52 so that the end surface 62a on the opening side of the hole 61a is exposed on the lower surface 521 of the resin molded body 52. The end surface 62a of the connection socket 60a is continuous with the lower surface 521 of the resin molded body 52. Specifically, the end surface 62a of the connection socket 60a is flush with the lower surface 521 of the resin molded body 52.

The connection socket 60b is cylindrical and is embedded in the resin molded body 52 so that one end surface 62b is exposed on the lower surface 521 of the resin molded body 52 and the other end surface 63b is exposed on the upper surface 522 of the resin molded body 52. Will be done. The end surface 62b of the connection socket 60b is continuous with the lower surface 521 of the resin molded body 52. Specifically, the end surface 62b of the connection socket 60b is flush with the lower surface 521 of the resin molded body 52. Further, the end surface 63b of the connection socket 60b is continuous with the upper surface 522 of the resin molded body 52. Specifically, the end surface 63b of the connection socket 60b is flush with the upper surface 522 of the resin molded body 52.

The wiring circuits 30a, 30b, 31 are formed on the upper surface 121 of the resin molded body 12. The wiring circuit 30a is also formed on the electrode 15a of the electronic component 14a and the upper surface 23a of the convex structure portion 22a. Therefore, the electronic component 14a and the connection pin 20a are electrically connected to each other via the wiring circuit 30a. The wiring circuit 30b is also formed on the electrode 15b of the electronic component 14b and the upper surface 23b of the convex structure portion 22b. Therefore, the electronic component 14b and the connection pin 20b are electrically connected via the wiring circuit 30b. The wiring circuit 31 is also formed on the electrode 15a of the electronic component 14a and the electrode 15b of the electronic component 14b. Therefore, the electronic component 14a and the electronic component 14b are electrically connected to each other via the wiring circuit 31.

In this way, since the wiring circuits 30a and 30b are formed on the upper surfaces 23a and 23b of the convex structure portions 22a and 22b, respectively, the connection reliability between the wiring circuits 30a and 30b and the connection pins 20a and 20b is improved. Can be done. Further, since the upper surfaces 23a and 23b and the upper surface 121 of the resin molded body 12 are continuous, it is possible to prevent the wiring circuits 30a and 30b from being disconnected on the boundary, and the wiring circuits 30a and 30b and the connection pins 20a and 20b are connected to each other. The reliability of each connection can be further improved.

The wiring circuits 33 and 34 are formed on the lower surface 122 of the resin molded body 12. The wiring circuit 33 is also formed on the electrode 17a of the electronic component 16a and the end surface 24a of the rod-shaped portion 21a. Therefore, the electronic component 16a and the connection pin 20a are electrically connected via the wiring circuit 33. The wiring circuit 34 is also formed on the electrode 17a of the electronic component 16a and the electrode 17b of the electronic component 16b. Therefore, the electronic component 16a and the electronic component 16b are electrically connected to each other via the wiring circuit 34.

Since the wiring circuit 33 is formed on the end surface 24a of the rod-shaped portion 21a in this way, the connection reliability between the wiring circuit 33 and the connection pin 20a can be improved. Further, since the end surface 24a and the lower surface 122 of the resin molded body 12 are continuous, it is possible to prevent disconnection of the wiring circuit 33 on the boundary, and further improve the connection reliability between the wiring circuit 33 and the connection pin 20a. it can.

The wiring circuits 70a, 70b, 71 are formed on the lower surface 521 of the resin molded body 52. The wiring circuit 70a is also formed on the electrode 55a of the electronic component 54a and the end surface 62a of the connection socket 60a. Therefore, the electronic component 54a and the connection socket 60a are electrically connected via the wiring circuit 70a. The wiring circuit 70b is also formed on the electrode 55b of the electronic component 54b and the end surface 62b of the connection socket 60b. Therefore, the electronic component 54b and the connection socket 60b are electrically connected via the wiring circuit 70b. The wiring circuit 71 is also formed on the electrode 55a of the electronic component 54a and the electrode 55b of the electronic component 54b. Therefore, the electronic component 54a and the electronic component 54b are electrically connected via the wiring circuit 71.

In this way, since the wiring circuits 70a and 70b are formed on the end faces 62a and 62b of the connection sockets 60a and 60b, respectively, it is possible to improve the connection reliability between the wiring circuits 70a and 70b and the connection sockets 60a and 60b, respectively. it can. Further, since the end faces 62a and 62b and the lower surface 521 of the resin molded body 52 are continuous, it is possible to prevent the wiring circuits 70a and 70b from being disconnected on the boundary, and the wiring circuits 70a and 70b and the connection sockets 60a and 60b are connected. The reliability of each connection can be further improved.

The wiring circuits 73 and 74 are formed on the upper surface 522 of the resin molded body 52. The wiring circuit 73 is also formed on the electrode 57a of the electronic component 56a and the end surface 63b of the connection socket 60b. Therefore, the electronic component 56a and the connection socket 60b are electrically connected via the wiring circuit 73. The wiring circuit 74 is also formed on the electrode 57a of the electronic component 56a and the electrode 57b of the electronic component 56b. Therefore, the electronic component 56a and the electronic component 56b are electrically connected to each other via the wiring circuit 74.

Since the wiring circuit 73 is formed on the end surface 63b of the connection socket 60b in this way, the connection reliability between the wiring circuit 73 and the connection socket 60b can be improved. Further, since the end surface 63b and the upper surface 522 of the resin molded body 52 are continuous, it is possible to prevent disconnection of the wiring circuit 73 on the boundary, and further improve the connection reliability between the wiring circuit 73 and the connection socket 60b. it can.

The wiring circuits 30a, 30b, 31, 33, 34, 70a, 70b, 71, 73, 74 use, for example, an inkjet printing method to apply a liquid conductive ink (for example, silver (Ag) nano ink) to a resin molded product. It can be easily formed by applying it to a surface. The inkjet printing method is a printing method in which liquid ink is ejected from a nozzle and the ink is deposited on the surface to be ejected. The wiring circuits 30a, 30b, 31, 33, 34, 70a, 70b, 71, 73, 74 may be made of a material other than Ag, may be formed by another method, and have a width, a thickness, and the like. It is not particularly limited.

The protective film 32 is formed on the upper surface 121 of the resin molded body 12 so as to cover the wiring circuits 30a, 30b, 31. The protective film 35 is formed on the lower surface 122 of the resin molded body 12 so as to cover the wiring circuits 33 and 34. The protective film 72 is formed on the lower surface 521 of the resin molded body 52 so as to cover the wiring circuits 70a, 70b, 71. The protective film 75 is formed on the upper surface 522 of the resin molded body 52 so as to cover the wiring circuits 73 and 74. The protective films 32, 35, 72, 75 are made of an insulating material and impart moisture resistance and insulating properties to the wiring circuit. The protective films 32, 35, 72, 75 are formed by, for example, an inkjet printing method.

The electronic module 50 is stacked on the electronic module 10 so that the connection pins 20a and 20b are fitted into the connection sockets 60a and 60b, respectively. The adhesive layer 40 is interposed between the electronic module 10 and the electronic module 50, and adheres the electronic module 10 and the electronic module 50. The adhesive layer 40 is made of a known adhesive. As a result, the electronic module 50 is fixed to the electronic module 10.

According to the example shown in FIG. 4, an electronic circuit including electronic components 14a and 14b and wiring circuits 30a, 30b and 31 is formed on the upper surface of the electronic module 10. An electronic circuit including electronic components 16a and 16b and wiring circuits 33 and 34 is formed on the lower surface of the electronic module 10. An electronic circuit including electronic components 54a, 54b and wiring circuits 70a, 70b, 71 is formed on the lower surface of the electronic module 50. An electronic circuit including electronic components 56a and 56b and wiring circuits 73 and 74 is formed on the upper surface of the electronic module 50. The plurality of electronic circuits formed on the plurality of surfaces are electrically connected to each other in the direction orthogonal to the plurality of surfaces via the connection pins 20a and 20b and the connection sockets 60a and 60b. As a result, the electronic circuit can be integrated and three-dimensionalized, and a small electronic device 1 can be realized.

(B-2. Manufacturing method of electronic device)
Next, a method of manufacturing the electronic device 1 will be described with reference to FIGS. 5 to 7. FIG. 5 is a diagram illustrating a manufacturing process of the electronic module 10 included in the electronic device according to the present embodiment. FIG. 6 is a diagram illustrating a manufacturing process of the electronic module 50 included in the electronic device according to the present embodiment. FIG. 7 is a diagram illustrating an assembly process of the electronic module 10 and the electronic module 50. Hereinafter, each of the electronic components 14a and 14b will be referred to as an "electronic component 14". Each of the electronic components 16a and 16b is referred to as an "electronic component 16". Each of the electronic components 54a and 54b is referred to as an "electronic component 54". Each of the electronic components 56a and 56b is referred to as an "electronic component 56". Each of the connection pins 20a and 20b is referred to as a "connection pin 20". Each of the connection sockets 60a and 60b is referred to as a "connection socket 60". Each of the wiring circuits 30a and 30b is referred to as a "wiring circuit 30". Each of the wiring circuits 70a and 70b is referred to as a "wiring circuit 70".

(B-2-1. Manufacturing process of electronic module 10)
[B-2-1-1. Molding process]
As shown in FIG. 5A, the electronic component 14 is attached to the temporary fixing sheet 80 using an adhesive (not shown). At this time, the electronic component 14 is attached to the temporary fixing sheet 80 so that the electrode 15 comes into contact with the temporary fixing sheet 80. Similarly, the electronic component 16 is attached to the temporary fixing sheet 81 using an adhesive (not shown) so that the electrode 17 comes into contact with the temporary fixing sheet 81.

As the material of the temporary fixing sheets 80 and 81, for example, polyethylene terephthalate (PET) or the like can be used. The temporary fixing sheets 80 and 81 are preferably made of a material that transmits ultraviolet rays.

The electronic component 14 can be attached to the temporary fixing sheet 80, for example, by using an ultraviolet curable adhesive applied to the temporary fixing sheet 80. For example, an ultraviolet curable adhesive is applied to one surface of a temporary fixing sheet 80 made of transparent PET having a thickness of 50 μm to a thickness of 2 to 3 μm. This coating is performed using a method such as an inkjet printing method. After that, the electronic component 14 is placed in a predetermined position. The adhesive is cured by irradiating the other surface of the temporary fixing sheet 80 (that is, the surface opposite to the surface on which the electronic component 14 is placed) with ultraviolet rays having an intensity of, for example, 3000 mJ / cm ² . The electronic component 14 is attached to the temporary fixing sheet 80. The electronic component 16 can be attached to the temporary fixing sheet 81 by using the same method.

Next, as shown in FIG. 5B, the temporary fixing sheets 80 and 81 are arranged in the molding die 82. The molding die 82 is composed of an upper die 83 and a lower die 84, and a space is formed between the upper die 83 and the lower die 84. The temporary fixing sheet 80 is arranged in the molding die 82 so that the surface of the electronic component 14 on the non-attached side is in contact with the flat inner surface of the upper die 83. The temporary fixing sheet 81 is arranged in the molding die 82 so that the surface of the electronic component 16 on the non-attached side is in contact with the flat inner surface of the lower die 84. As a result, a space is formed between the surface on which the electronic component 14 of the temporary fixing sheet 80 is attached and the surface on which the electronic component 16 of the temporary fixing sheet 81 is attached.

Further, a connection pin 20 is also arranged in the molding die 82. A hole 85 is formed in the upper mold 83. The rod-shaped portion 21 of the connecting pin 20 is inserted into the hole 85 until the upper surface 23 of the convex structure portion 22 of the connecting pin 20 contacts the inner surface of the upper mold 83.

Further, in the rod-shaped portion 21 of the connection pin 20, the end surface 24 on the side not inserted into the hole 85 may come into contact with the temporary fixing sheet 81 arranged on the inner surface of the lower mold 84. That is, the length H1 of the portion 21 of the rod-shaped portion 21 of the connection pin 20 that is not inserted into the hole 85 is designed to be slightly shorter than the distance between the inner surface of the upper mold 83 and the inner surface of the lower mold 84. Has been done.

The molten resin is injected into the space inside the molding die 82 by the injection molding method. The resin is filled so as to surround the electronic components 14, 16 and the connecting pin 20. The conditions for injection molding are appropriately selected according to the resin material. For example, when acrylonitrile butadiene styrene (ABS) is used, injection molding is performed at an injection resin temperature of 210 to 240 ° C. and an injection pressure of 100 MPa. As a result, the resin molded body 12 in which the electronic components 14 and 16 and the connection pin 20 are embedded is molded (see FIG. 5C). The resin molded body 12 is taken out from the molding die 82.

The temporary fixing sheets 80 and 81 are deformed by the temperature of the resin during injection molding and peeled off from the resin molded body 12. The thickness of the temporary fixing sheets 80 and 81 is smaller than the thickness of the resin molded body 12. Therefore, in the resin molded body 12, the step between the surface that was in contact with the temporary fixing sheets 80 and 81 and the surface that is not in contact with the temporary fixing sheets 80 and 81 is so small that it can be ignored.

When the temporary fixing sheet 80 is peeled off from the resin molded body 12, the portion of the upper surface 121 of the resin molded body 12 that is in contact with the temporary fixing sheet 80 is exposed. As shown in FIG. 5A, the electronic component 14 is attached to the temporary fixing sheet 80 so that the electrode 15 comes into contact with the temporary fixing sheet 80. Therefore, the electrode 15 of the electronic component 14 is exposed on the upper surface 121 of the resin molded body 12. Since the surface of the electrode 15 and the upper surface 121 of the resin molded body 12 around the electrode 15 were in contact with the temporary fixing sheet 80, the surface of the electrode 15 was continuous with the upper surface 121 of the resin molded body 12 and was the same as the upper surface 121. It will be on a plane.

Further, the connection pin 20 is arranged in the molding die 82 so that the upper surface 23 of the convex structure portion 22 comes into contact with the inner surface of the upper die 83. Therefore, the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. Since the upper surface 23 of the convex structure 22 and the upper surface 121 of the resin molded body 12 around the upper surface 23 were in contact with the inner surface of the upper mold 83, the upper surface 23 of the convex structure 22 was placed on the upper surface 121 of the resin molded body 12. It is continuous and is on the same plane as the upper surface 121.

The hole 85 of the upper mold 83 is closed by the convex structure portion 22 of the connection pin 20. Therefore, the molten resin does not enter the hole 85. Therefore, the portion of the rod-shaped portion 21 inserted into the hole 85 protrudes from the upper surface 121 of the resin molded body 12.

By peeling the temporary fixing sheet 81 from the resin molded body 12, the portion of the lower surface 122 of the resin molded body 12 that was in contact with the temporary fixing sheet 81 is exposed. As shown in FIG. 5A, the electronic component 16 is attached to the temporary fixing sheet 81 so that the electrode 17 comes into contact with the temporary fixing sheet 81. Therefore, the electrode 17 of the electronic component 16 is exposed on the lower surface 122 of the resin molded body 12. Since the surface of the electrode 17 and the lower surface 122 of the resin molded body 12 were in contact with the temporary fixing sheet 81, the surface of the electrode 17 is continuous with the lower surface 122 of the resin molded body 12 and is coplanar with the lower surface 122.

Further, as described above, the end face 24 of the rod-shaped portion 21 of the connection pin 20 may come into contact with the temporary fixing sheet 81. Therefore, the end face 24 that was in contact with the temporary fixing sheet 81 is exposed on the lower surface 122 of the resin molded body 12. The end surface 24 that was in contact with the temporary fixing sheet 81 is continuous with the lower surface 122 of the resin molded body 12 and is on the same plane as the lower surface 122.

As described above, the steps of molding the resin molded body 12 in which the electronic components 14 and 16 and the connection pin 20 are embedded (see FIGS. 5A to 5C) are carried out. The step of molding the resin molded body 12 is a step of inserting the rod-shaped portion 21 into the hole 85 of the upper mold 83 as a step of projecting a part of the rod-shaped portion 21 from the resin molded body 12 (see FIG. 5B). )including. Further, the step of molding the resin molded body 12 is a step of exposing the upper surface 23 of the convex structure portion 22 from the resin molded body 12, and the upper surface 23 of the convex structure portion 22 is brought into contact with the inner surface of the upper mold 83 for molding. The step of arranging in the mold 82 (see FIG. 5B) is included.

[B-2-1-2. Wiring circuit formation process]
Next, as shown in FIG. 5D, the wiring circuits 30 and 31 are formed on the upper surface 121 of the resin molded body 12, and the wiring circuits 33 and 34 are formed on the lower surface 122 of the resin molded body 12.

The wiring circuits 30, 31, 33, 34 are formed by, for example, a printing method. Specifically, a method of injecting a conductive material (for example, silver ink or the like) with an inkjet printer or the like for printing, a method of using an aerosol, a method of printing a silver paste with a dispenser or the like may be used.

When using an inkjet printer, the height H2 of the connection pin 20 protruding from the resin molded body 12 is preferably a height that does not interfere with the print head (for example, 1.5 mm or less).

The wiring circuit 30 is also formed on the electrode 15 of the electronic component 14 and on the upper surface 23 of the convex structure portion 22. As a result, the electronic component 14 and the connection pin 20 are connected.

When the convex structure portion 22 has a disk shape with the longitudinal direction of the rod-shaped portion 21 as the central axis, as shown in FIG. 1, the connection position between the wiring circuit 30 and the convex structure portion 22 is the circumference of the rod-shaped portion 21. It may be in any position in the direction. Therefore, the degree of freedom in designing the shape of the wiring circuit 30 can be increased.

The wiring circuit 31 is also formed on the electrodes 15 of the plurality of electronic components 14. As a result, the plurality of electronic components 14 are connected to each other. The wiring circuit 33 is also formed on the electrode 17 of the electronic component 16 and on the end surface 24 of the rod-shaped portion 21. As a result, the electronic component 16 and the connection pin 20 are connected. The wiring circuit 34 is also formed on the electrodes 17 of the plurality of electronic components 16. As a result, the plurality of electronic components 16 are connected to each other.

When the printing method as described above is used, the wiring circuits 30, 31, 33, 34 are formed by firing the printed conductive material. The intermetallic diffusion bonding by the firing enhances the reliability of the connection between the wiring circuits 30, 31, 33, 34 and the electrodes or connection pins 20 of the electronic component.

[B-2-1-3. Protective film forming process]
As shown in FIG. 5 (e), a protective film 32 is formed on the upper surface 121 of the resin molded body 12 so as to cover the wiring circuits 30 and 31, and resin molding is performed so as to cover the wiring circuits 33 and 34. A protective film 35 is formed on the lower surface 122 of the body 12. As a result, the wiring circuits 30, 31, 33, 34 are protected from outside air and external force.

The protective films 32 and 35 are formed by using a known technique such as a method of printing an ultraviolet curable protective material with an inkjet printer or the like and irradiating it with ultraviolet rays to cure it.

(B-2-2. Manufacture of electronic module 50)
[B-2-2-1. Molding process]
As shown in FIG. 6A, the electronic component 54 is attached to the temporary fixing sheet 90 using an adhesive (not shown). At this time, the electronic component 54 is attached to the temporary fixing sheet 90 so that the electrode 55 comes into contact with the temporary fixing sheet 90. Similarly, the electronic component 56 is attached to the temporary fixing sheet 91 using an adhesive (not shown) so that the electrode 57 comes into contact with the temporary fixing sheet 91. The materials of the temporary fixing sheets 90 and 91 are the same as those of the temporary fixing sheets 80 and 81. The method of attaching the electronic components to the temporary fixing sheets 90 and 91 is the same as the method of attaching the electronic components to the temporary fixing sheets 80 and 81.

The connection socket 60 is also attached to the temporary fixing sheet 90. At this time, one end surface 62 of the connection socket 60 is attached to the temporary fixing sheet 90. The other end surface 63 of the connection socket 60 may be attached to the temporary fixing sheet 91. The connection socket 60 (that is, the connection socket 60 whose height is shorter than the distance between the temporary fixing sheets 90 and 91), which is attached only to the temporary fixing sheet 90, has a bottomed cylindrical shape to prevent the resin from flowing into the hole 61. Is.

Next, as shown in FIG. 6B, the temporary fixing sheets 90 and 91 are arranged in the molding die 92. The molding die 92 is composed of an upper die 93 and a lower die 94, and a space is formed between the upper die 93 and the lower die 94. The temporary fixing sheet 90 is arranged in the molding die 92 so that the surface of the electronic component 54 on the non-attached side is in contact with the flat inner surface of the lower die 94. The temporary fixing sheet 91 is arranged in the molding die 92 so that the surface of the electronic component 56 on the non-attached side is in contact with the flat inner surface of the upper die 83. Therefore, a space is formed between the surface of the temporary fixing sheet 90 to which the electronic component 54 is attached and the surface of the temporary fixing sheet 91 to which the electronic component 56 is attached.

The molten resin is injected into the space inside the molding die 92 by the injection molding method. The resin is filled so as to surround the electronic components 54 and 56 and the connection socket 60. The conditions for injection molding the resin are appropriately selected according to the material of the resin, and are the same conditions as those of the resin molded body 12. As a result, the resin molded body 52 in which the electronic components 54 and 56 and the connection socket 60 are embedded is molded (see FIG. 6C). The resin molded body 52 is taken out from the molding die 92.

The temporary fixing sheets 90 and 91 are deformed by the temperature of the resin during injection molding and peeled off from the resin molded body 52. When the temporary fixing sheet 90 is peeled off from the resin molded body 52, the lower surface 521 of the resin molded body 52 that has been in contact with the temporary fixing sheet 90 is exposed. As shown in FIG. 6A, the electronic component 54 is attached to the temporary fixing sheet 90 so that the electrode 55 comes into contact with the temporary fixing sheet 90. Therefore, the electrode 55 of the electronic component 54 is exposed on the lower surface 521 of the resin molded body 52. Since the surface of the electrode 55 and the lower surface 521 of the resin molded body 52 were in contact with the temporary fixing sheet 90, the surface of the electrode 55 is continuous with the lower surface 521 of the resin molded body 52 and is flush with the lower surface 521.

Further, one end surface 62 of the connection socket 60 is attached to the temporary fixing sheet 90. Therefore, the end surface 62 of the connection socket 60 is exposed on the lower surface 521 of the resin molded body 52. Since the end surface 62 of the connection socket 60 and the lower surface 521 of the resin molded body 52 were in contact with the temporary fixing sheet 90, the end surface 62 of the connection socket 60 was continuous with the lower surface 521 of the resin molded body 52 and was flush with the lower surface 521. It will be on top.

By peeling the temporary fixing sheet 91 from the resin molded body 52, the upper surface 522 of the resin molded body 52 that was in contact with the temporary fixing sheet 91 is exposed. As shown in FIG. 6A, the electronic component 56 is attached to the temporary fixing sheet 91 so that the electrode 57 comes into contact with the temporary fixing sheet 91. Therefore, the electrode 57 of the electronic component 56 is exposed on the upper surface 522 of the resin molded body 52. Since the surface of the electrode 57 and the upper surface 522 of the resin molded body 52 were in contact with the temporary fixing sheet 91, the surface of the electrode 57 is continuous with the upper surface 522 of the resin molded body 52 and is flush with the upper surface 522.

Further, the other end surface 63 of the connection socket 60 may be attached to the temporary fixing sheet 91. In this case, the end face 63 attached to the temporary fixing sheet 91 is exposed on the upper surface 522 of the resin molded body 52. The end surface 63 attached to the temporary fixing sheet 81 is continuous with the upper surface 522 of the resin molded body 52 and is on the same plane as the upper surface 522.

[B-2-2-2. Wiring circuit formation process]
Next, as shown in FIG. 6D, the wiring circuits 70 and 71 are formed on the lower surface 521 of the resin molded body 52, and the wiring circuits 73 and 74 are formed on the upper surface 522 of the resin molded body 52. The wiring circuits 70, 71, 73, 74 are formed by using the same method as the wiring circuits 30, 31, 33, 34.

The wiring circuit 70 is also formed on the electrode 15 of the electronic component 54 and on the end surface 62 of the connection socket 60. As a result, the electronic component 54 and the connection socket 60 are connected. The wiring circuit 71 is also formed on the electrodes 15 of the plurality of electronic components 54. As a result, the plurality of electronic components 54 are connected to each other. The wiring circuit 73 is also formed on the electrode 57 of the electronic component 56 and on the end surface 63 of the connection socket 60. As a result, the electronic component 56 and the connection socket 60 are connected. The wiring circuit 74 is also formed on the electrodes 57 of the plurality of electronic components 56. As a result, the plurality of electronic components 56 are connected to each other.

[B-2-2-3. Protective film forming process]
Next, as shown in FIG. 6E, a protective film 72 is formed on the lower surface 521 of the resin molded body 52 so as to cover the wiring circuits 70 and 71, and the protective film 72 is formed so as to cover the wiring circuits 73 and 74. A protective film 75 is formed on the upper surface 522 of the resin molded body 52. As a result, the wiring circuits 70, 71, 73, 74 are protected from outside air and external force. The protective films 72 and 75 are formed by using the same method as the protective films 32 and 35.

(B-2-3. Assembly process of electronic module 10 and electronic module 50)
As shown in FIG. 7, the electronic module 50 is stacked on the electronic module 10 so that the connection pin 20 fits into the connection socket 60. At this time, the adhesive layer 40 is applied to at least one of the electronic module 50 and the electronic module 10.

On the lower surface of the electronic module 50, the unevenness and steps due to the electronic component 54 and the connection socket 60 are negligibly small. Similarly, on the upper surface of the electronic module 10, the unevenness and the step caused by the electronic component 14 are so small that they can be ignored, except for the connecting pin 20 that protrudes. Therefore, firm fixing between the resin molded bodies 12 and 52 can be obtained only by applying the adhesive layer 40.

Further, as described above, the height H2 of the connection pin 20 protruding from the resin molded body 12 is set to a height that does not interfere with the print head (for example, 1.5 mm or less) (see FIG. 5D). The upper surface 121 of the resin molded body 12 on which the connection pin 20 projects is a flat surface without unevenness due to the electronic component 14 or the like. Therefore, even if the height H2 of the connection pin 20 protruding from the resin molded body 12 is set to, for example, about 1.5 mm, the connection pin 20 can be securely fitted with the connection socket 60. As a result, the connection reliability between the connection pin 20 and the connection socket 60 can be ensured.

The electronic device 1 manufactured by the above manufacturing method can have a circuit having a three-dimensional structure in which a plurality of electronic circuits formed on a plurality of surfaces are stacked in a direction orthogonal to the plurality of surfaces.

(B-3. Advantages)
As described above, the electronic module 10 according to the present embodiment electrically connects the resin molded body 12, the wiring circuit 30 formed on the upper surface 121 of the resin molded body 12, and the wiring circuit 30 to an external circuit. A connection pin 20 is provided for this purpose. The connection pin 20 includes a rod-shaped portion 21 and a convex structure portion 22 protruding from the peripheral surface of the rod-shaped portion 21. The connection pin 20 is embedded in the resin molded body 12 so that a part of the rod-shaped portion 21 protrudes from the resin molded body 12 and the upper surface 23 which is the surface of the convex structure portion 22 is exposed on the upper surface 121. The wiring circuit 30 is also formed on the upper surface 23 of the convex structure portion 22.

Further, the electronic device 1 according to the present embodiment includes an electronic module 10 and an electronic module 50. The electronic module 50 is a connection socket embedded in the resin molded body 52, wiring circuits 70 and 73 formed on the surface of the resin molded body 52, and connected to the wiring circuit 70 or the wiring circuit 73. 60 and. The connection pin 20 of the electronic module 10 is fitted into the connection socket 60 of the electronic module 50.

According to the above configuration, the wiring circuit 30 is formed on the upper surface 23 of the convex structure portion 22. Therefore, the connection reliability between the wiring circuit 30 and the connection pin 20 can be improved.

By embedding the convex structure portion 22 in the resin molded body 12, the convex structure portion 22 acts as an anchor, and the mechanical stress resistance of the connecting pin 20 (for example, resistance to pulling out, falling, etc.) can be enhanced.

Since the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12, the wiring circuit 30 can be formed by a simple method such as a printing method by spraying a nanoink liquid.

Further, the wiring circuit 30 formed on the upper surface 23 of the convex structure portion 22 and the upper surface 121 of the resin molded body 12 can have a flat shape without a large step. Therefore, the wiring circuit 30 does not become an obstacle when the electronic module 50 is stacked on the electronic module 10.

The convex structure portion 22 has a disk shape with the longitudinal direction of the rod-shaped portion 21 as the central axis. The upper surface 23 of the convex structure portion 22 is a plane orthogonal to the longitudinal direction of the rod-shaped portion 21. As a result, as shown in FIG. 1, the degree of freedom in selecting the connection position between the wiring circuit 30 and the convex structure portion 22 is increased. As a result, the degree of freedom in designing the shape of the wiring circuit 30 is increased.

A part of the rod-shaped portion 21 protrudes from the upper surface 121 of the resin molded body 12. As a result, the electronic module 10 can be electrically connected to another electronic module 50 arranged above the upper surface 121 on which the wiring circuit 30 is formed via the connection pin 20. As a result, an electronic circuit having a three-dimensional structure can be constructed.

The resin molded body 12 is plate-shaped. The upper surface 121 is orthogonal to the thickness direction of the resin molded body 12. The end surface 24 of the rod-shaped portion 21 on the side opposite to the part protruding from the resin molded body 12 may be exposed on the lower surface 122 on the back side of the upper surface 121 of the resin molded body 12. The electronic module 10 further includes a wiring circuit 33 formed on the lower surface 122 and the end surface 24.

Such a configuration is made by designing the length of the portion of the connection pin 20 to be embedded in the resin molded body 12 (length H1 in FIG. 5B) to be the same as the thickness of the resin molded body 12. It will be realized. With this configuration, the wiring circuits 30 and 33 provided on the upper surface 121 and the lower surface 122 of the resin molded body 12 can be electrically connected by the connection pins 20. This makes it possible to increase the degree of freedom in designing the electronic circuit.

Further, the electronic module 10 further includes an electronic component 14 embedded in the resin molded body 12 so that the electrode 15 is exposed from the upper surface 121. The wiring circuit 30 is also formed on the electrode 15 of the electronic component 14.

This makes it possible to construct an electronic circuit having a three-dimensional structure without considering the influence of the thickness of the electronic component 14 in addition to the thickness of the resin molded body 12. Further, the thickness of the electronic device 1 in which the electronic modules 10 and 50 are stacked can be reduced as compared with the case where the electronic component 14 is mounted on the upper surface 121 of the resin molded body 12.

When the electronic component 14 is mounted on the upper surface 121 of the resin molded body 12, the height H2 of the portion of the connection pin 20 protruding from the upper surface 121 of the resin molded body 12 in consideration of the thickness of the electronic component 14 (FIG. 5 (FIG. 5). d) See) needs to be higher. However, since the electronic component 14 is embedded in the resin molded body 12, the height H2 can be lowered. Thereby, the mechanical strength of the connection pin 20 can be increased.

Further, since the electronic component 14 is embedded in the resin molded body 12, the upper surface 121 of the resin molded body 12 can be flattened. Similarly, in the electronic module 50 as well, the lower surface 521 of the resin molded body 52 can be flattened by embedding the electronic component 54 in the resin molded body 52. Therefore, when the electronic modules 50 are stacked on the electronic module 10 so that the upper surface 121 of the resin molded body 12 and the lower surface 521 of the resin molded body 52 face each other, the electronic module 50 and the electronic module 10 can be brought into close contact with each other. it can. As a result, one of the electronic modules 10 and 50 works to prevent the other from tilting, so that the stress such as bending applied to the connection pin 20 is reduced.

Further, by fixing the interface of the electronic modules 10 and 50 with the adhesive layer 40 or the like, it is possible to prevent the occurrence of shear stress applied to the connection pin 20 due to the displacement of the other of the electronic modules 10 and 50 with respect to the other. ..

The manufacturing method of the electronic device 1 according to the present embodiment includes a manufacturing process of the electronic module 10, a manufacturing process of the electronic module 50, and an assembly process of the electronic module 10 and the electronic module 50. The manufacturing process of the electronic module 10 includes a step of molding the resin molded body 12 so that the connection pin 20 is embedded ([B-2-1-1. Molding step]). The steps of molding the resin molded body 12 include a step of projecting a part of the rod-shaped portion 21 from the resin molded body 12 and a step of exposing the upper surface 23 which is a part of the surface of the convex structure portion 22 from the resin molded body 12. including. The manufacturing process of the electronic module 10 is a step of forming a wiring circuit 30 on the upper surface 121 of the resin molded body 12 and on the upper surface 23 of the convex structure portion 22 ([B-2-1-2. Wiring circuit forming step]). Including further.

The manufacturing process of the electronic module 50 includes the following steps.
-Step of molding the resin molded body 52 in which the connection socket 60 is embedded ([B-2-2-1. Molding step]).
Steps of forming wiring circuits 70 and 73 electrically connected to the connection socket 60 on the surfaces (upper surface 522 and lower surface 521) of the resin molded body 52 ([B-2-2-2. Wiring circuit forming step). ]).

The step of assembling the electronic module 10 and the electronic module 50 includes a step of fitting the rod-shaped portion 21 protruding from the resin molded body 12 into the connection socket 60 embedded in the resin molded body 52.

By the above manufacturing method, the wiring circuit 30 uses a simple method such as a printing method of spraying nanoink or the like on the upper surface 121 of the resin molded body 12 and the upper surface 23 of the convex structure portion 22 exposed on the upper surface 121. Can be formed using. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic module 10 and the electronic device 1.

Further, the electrical connections between the wiring circuit 30 formed on the resin molded body 12 and the wiring circuits 70 and 73 formed on the resin molded body 52 are embedded in the resin molded bodies 12 and 52, respectively. Obtained by mechanical fitting of the connection pin 20 and the connection socket 60. Therefore, the connection between the wiring circuit 30 and the wiring circuits 70 and 73 does not require a thermosetting step of a bonding material such as solder. As a result, the manufacturing cost of the electronic device 1 can be reduced.

In the above manufacturing method, since the resin molded body 12 is molded so that the connection pin 20 is embedded, there is no step of aligning the opening formed in the substrate with the connection pin as in Patent Document 1. As a result, the manufacturing cost of the electronic module 10 and the electronic device 1 can be further reduced.

The step of molding the resin molded body 12 further includes a step of injecting resin into the molding die 82 by an injection molding method. The step of projecting a part of the rod-shaped portion 21 from the resin molded body 12 includes a step of inserting a part of the rod-shaped portion 21 into the hole 85 formed in the molding die 82. The step of exposing the upper surface 23 of the convex structure portion 22 from the resin molded body 12 includes a step of bringing the upper surface 23 of the convex structure portion 22 into contact with the surface of the molding die 82.

According to the above manufacturing method, a part of the rod-shaped portion 21 inserted into the hole 85 can be easily projected from the resin molded body 12, and the convex structure portion 22 that is in contact with the surface of the molding die 82. The upper surface 23 can be easily exposed from the resin molded body 12.

Further, a part of the rod-shaped portion 21 is inserted into the hole 85, and the convex structure portion 22 comes into contact with the surface of the molding die 82, so that the connecting pin 20 is prevented from falling when the resin molded body 12 is molded. Will be done. As a result, it is possible to suppress the occurrence of poor inclination of the connection pin 20.

The step of molding the resin molded body 12 further includes a step of embedding the electronic component 14 in the resin molded body 12 so that the electrode 15 is exposed from the resin molded body 12. The step of forming the wiring circuit 30 includes a step of forming the wiring circuit 30 on the electrode 15.

According to the above manufacturing method, the electronic component 14 and the connection pin 20 can be electrically connected. Further, since the electronic component 14 is embedded in the resin molded body 12, it does not hinder the fitting of the connection pin 20 and the connection socket 60. As a result, the connection pin 20 and the connection socket 60 can be more reliably connected.

<C. Modification example>
(C-1. Modification 1)
In the example shown in FIG. 2, the rod-shaped portion 21 of the connecting pin 20 is assumed to protrude from the upper surface 121 of the resin molded body 12 where the upper surface 23 of the convex structure portion 22 is exposed. However, the rod-shaped portion 21 of the connection pin 20 may protrude from a surface different from the upper surface 121 where the upper surface 23 of the convex structure portion 22 is exposed in the resin molded body 12.

FIG. 8 is a plan view schematically showing an example of the electronic module according to the modified example 1. FIG. 9 is a cross-sectional view taken along the line AA of FIG. FIG. 10 is an external perspective view showing a connection pin provided in the electronic module shown in FIG.

As shown in FIG. 10, in the connection pin 20 according to the first modification, the convex structure portion 22 has a rectangular plate shape in a plan view orthogonal to the longitudinal direction of the rod-shaped portion 21.

As shown in FIGS. 8 and 9, in the connection pin 20, a part of the rod-shaped portion 21 protrudes from the side surface 123 of the resin molded body 12, and the end surface 25 of the convex structure portion 22 is the upper surface 121 of the resin molded body 12. It is embedded in the resin molded body 12 so as to be exposed to. The side surface 123 is a surface that is connected to the upper surface 121 of the resin molded body 12 on which the wiring circuit 30 is formed and is orthogonal to the upper surface 121. The end face 25 is a plane parallel to the longitudinal direction of the rod-shaped portion 21.

The wiring circuit 30 is also formed on the end surface 25 of the convex structure portion 22 exposed on the upper surface 121 of the resin molded body 12. As a result, the connection reliability between the wiring circuit 30 and the connection pin 20 can be improved.

The end surface 25 of the convex structure portion 22 is continuous with the upper surface 121 of the resin molded body 12, and specifically, is on the same plane as the upper surface 121. Therefore, the connection reliability between the wiring circuit 30 and the connection pin 20 can be further improved.

Since the convex structure portion 22 has a rectangular plate shape in a plan view, the flat end surface 25 can be exposed on the upper surface 121 of the resin molded body 12. As a result, the contact area between the wiring circuit 30 and the end face 25 can be increased, and the connection reliability between the wiring circuit 30 and the connection pin 20 can be further improved.

(C-2. Modification 2)
In the above description, it is assumed that the resin molded body 12 is molded by the injection molding method. However, instead of the injection molding method, the resin molded body 12 may be molded by using a layered manufacturing method in which resin materials are laminated in a three-dimensional shape.

FIG. 11 is a diagram illustrating a molding process of the resin molded product according to the second modification. First, as shown in FIG. 11A, the temporary fixing sheet 80 to which the electronic component 14 is attached is arranged on the template 101. The method of attaching the electronic component 14 to the temporary fixing sheet 80 is described in [B-2-1-1. Molding process]. The template 101 is made of metal or resin (for example, polycarbonate (PC)).

A hole 102 is formed in the template 101. The rod-shaped portion 21 of the connection pin 20 is inserted into the hole 102 until the surface of the convex structure portion 22 of the connection pin 20 contacts the upper surface of the template 101.

Next, as shown in FIG. 11B, the ink material is coated with, for example, about 14 μm to 20 μm in thickness using a 3D printer and cured by repeating the process until the specified height H3 is reached. Is laminated to form the resin molded body 12.

The ink material is, for example, acrylonitrile butadiene styrene (ABS) or digital ABS (manufactured by Stratasys), which is an ink material produced by kneading ABS with an ultraviolet curable substance. When an ink material composed of ABS is used, the ink material may be cooled and cured after the ink material is applied. When an ink material composed of digital ABS is used, the ink material may be applied and then irradiated with ultraviolet rays to cure the ink material.

The height H3 of the laminated ink material (that is, the thickness of the resin molded body 12) may be set lower than the height of the tip of the connection pin 20. As a result, one end and the other end of the connection pin 20 project from the upper surface and the lower surface of the resin molded body 12, respectively.

Next, as shown in FIG. 11C, the resin molded body 12 is removed from the template 101. Note that FIG. 11C shows the resin molded body 12 turned inside out when it was removed from the template 101. The temporary fixing sheet 80 is deformed by the temperature of the ink material applied at the time of molding the resin molded body 12. Therefore, the temporary fixing sheet 80 can be easily peeled off from the resin molded body 12. The thickness of the temporary fixing sheet 80 is smaller than the thickness of the resin molded body 12. Therefore, in the resin molded body 12, the step between the surface that was in contact with the temporary fixing sheet 80 and the surface that is not in contact with the temporary fixing sheet 80 is so small that it can be ignored.

When the temporary fixing sheet 80 is peeled off from the resin molded body 12, the electrode 15 of the electronic component 14 is exposed on the upper surface 121 of the resin molded body 12 that was in contact with the temporary fixing sheet 80. The surface of the electrode 15 is continuous with the upper surface 121 of the resin molded body 12 that was in contact with the temporary fixing sheet 80, and is flush with the upper surface 121.

Further, the connection pin 20 is arranged on the template 101 so that the upper surface 23 of the convex structure portion 22 comes into contact with the template 101. Therefore, the upper surface 23 of the convex structure portion 22 is exposed on the upper surface 121 of the resin molded body 12. Since the upper surface 23 of the convex structure 22 and the portion of the upper surface 121 of the resin molded body 12 surrounding the upper surface 23 were in contact with the upper surface of the template 101, the upper surface 23 of the convex structure 22 is the upper surface of the resin molded body 12. It is continuous with 121 and is on the same plane as the upper surface 121.

As described above, in the modification 2, the step of molding the resin molded body 12 includes the step of laminating the resin on the template 101 by the additive manufacturing method. The step of molding the resin molded body 12 is a step of inserting the rod-shaped portion 21 into the hole 102 of the template 101 as a step of projecting a part of the rod-shaped portion 21 from the resin molded body 12 (see FIG. 11A). )including. Further, the step of molding the resin molded body 12 is a step of bringing the upper surface 23 of the convex structure portion 22 into contact with the upper surface of the template 101 as a step of exposing the upper surface 23 of the convex structure portion 22 from the resin molded body 12. (See FIG. 11 (a)).

With respect to the resin molded body 12 molded in this way, the above [B-2-1-2. Wiring circuit formation process] and [B-2-1-3. The process of forming the protective film] is carried out to manufacture the electronic module 10.

The resin molded body 52 may also be manufactured by a layered manufacturing method using a 3D printer, similarly to the resin molded body 12.

(C-3. Modification 3)
In the example shown in FIG. 4, it is assumed that two electronic modules 10 and 50 are stacked. However, three or more electronic modules may be stacked. In this case, one electronic module of two adjacent electronic modules is provided with a connection pin 20, the other is provided with a connection socket 60, and the connection pin is fitted into the connection socket. This makes it possible to construct an electronic circuit having a more complicated three-dimensional structure.

<D. Addendum>
As described below, the present embodiment includes the following disclosures.

(Structure 1)
The first resin molded body (12) and
The first wiring circuit (30, 30a, 30b) formed on the first surface (121) of the first resin molded body (12), and
A connection pin (20, 20a, 20b) for electrically connecting the first wiring circuit (30, 30a, 30b) to an external circuit is provided.
The connection pins (20, 20a, 20b) are
Rod-shaped parts (21, 21a, 21b) and
A convex structure portion (22, 22a, 22b) protruding from the peripheral surface of the rod-shaped portion (21,21a, 21b) is included.
In the connection pins (20, 20a, 20b), a part of the rod-shaped portion (21,21a, 21b) protrudes from the first resin molded body (12), and the convex structure portion (22, 22a, 22b) ) Is embedded in the first resin molded body (12) so that the second surface (23, 23a, 23b, 25) is exposed on the first surface (121).
The electronic module (10) is also formed on the second surface (23, 23a, 23b, 25) of the first wiring circuit (30, 30a, 30b).

(Structure 2)
The convex structure portion (22, 22a, 22b) has a disk shape centered on the longitudinal direction of the rod-shaped portion (21,21a, 21b).
The electronic module (10) according to configuration 1, wherein the second surface (23, 23a, 23b) is a plane orthogonal to the longitudinal direction of the rod-shaped portion (21,21a, 21b).

(Structure 3)
The electronic module (10) according to the configuration 1 or 2, wherein a part of the rod-shaped portion (21, 21a, 21b) protrudes from the first surface (121) of the first resin molded product (12).

(Structure 4)
The electronic module according to configuration 1, wherein the part of the rod-shaped portion (21) protrudes from a third surface (123) different from the first surface (121) of the first resin molded body (12). 10).

(Structure 5)
The convex structure portion (22) has a rectangular plate shape in a plan view orthogonal to the longitudinal direction of the rod-shaped portion (21).
The electronic module (10) according to configuration 1, wherein the second surface (25) is an end face of the rod-shaped portion (21) in the convex structure portion (22) parallel to the longitudinal direction.

(Structure 6)
The first resin molded body (12) has a plate shape and has a plate shape.
The first surface (121) is orthogonal to the thickness direction of the first resin molded product (12).
The end faces (24, 24a) of the rod-shaped portions (21, 21a) opposite to the part are the fourth surface (122) on the back side of the first surface (121) of the first resin molded product (12). ),
The electronic module (10)
The electronic module (10) according to configuration 3, further comprising a second wiring circuit (33) formed on the fourth surface (122) and on the end faces (24, 24a).

(Structure 7)
An electronic component (14, 14a, 14b) embedded in the first resin molded body (12) is further provided so that the electrodes (15, 15a, 15b) are exposed from the first surface (121).
The first wiring circuit (30, 30a, 30b) is also formed on the electrodes (15, 15a, 15b) of the electronic component (14, 14a, 14b), according to any one of configurations 1 to 6. Electronic module (10).

(Structure 8)
An electronic device including a first electronic module (10) and a second electronic module (50).
The first electronic module (10) is composed of the electronic module according to any one of configurations 1 to 7.
The second electronic module (50) is
The second resin molded body (52) and
With the third wiring circuit (70, 70a, 70b, 73) formed on the surface (521, 522) of the second resin molded body (52),
A connection socket (60, 60a, 60b) embedded in the second resin molded body (52) and connected to the third wiring circuit (70, 70a, 70b, 73) is included.
The connection pins (20, 20a, 20b) of the first electronic module (10) are fitted into the connection sockets (60, 60a, 60b) of the second electronic module (50). ).

(Structure 9)
It is a manufacturing method of the electronic module (10).
A step of molding the resin molded body (12) so that the connecting pin (20) is embedded is provided.
The connection pin (20) is
Rod-shaped part (21) and
The convex structure portion (22) protruding from the peripheral surface of the rod-shaped portion (21) is included.
The step of molding the resin molded body (12) is
A step of projecting a part of the rod-shaped portion (21) from the resin molded body (12),
A step of exposing a part of the surface (23, 25) of the convex structure portion (22) from the resin molded body (12) is included.
Further, the method for manufacturing the electronic module (10) is further described.
Manufacture of an electronic module (10) comprising a step of forming a wiring circuit (30) on the surface of the resin molded body (12) and on the partial surface (23, 25) of the convex structure portion (22). Method.

(Structure 10)
The step of molding the resin molded body (12) further includes a step of injecting the resin into the molding die (82) by the injection molding method or a step of laminating the resin on the template (101) by the laminated molding method. ,
The projecting step includes a step of inserting a part of the rod-shaped portion (21) into a hole (85, 102) formed in the molding mold (82) or the mold plate (101).
The exposing step has the step of bringing the partial surface (23, 25) of the convex structure portion (22) into contact with the surface of the molding die (82) or the mold plate (101). The method for manufacturing the electronic module (10) described.

(Structure 11)
The step of molding the resin molded body (12) further includes a step of embedding an electronic component (14) in the resin molded body (12) so that the electrode (15) is exposed from the resin molded body (12). ,
The method for manufacturing an electronic module (10) according to the configuration 9 or 10, wherein the step of forming the wiring circuit (30) includes a step of forming the wiring circuit (3) on the electrode (15).

(Structure 12)
It is a manufacturing method of the electronic device (1).
A step of molding the first resin molded body (12) so that the connecting pin (20) is embedded is provided.
The connection pin (20) is
Rod-shaped part (21) and
The convex structure portion (22) protruding from the peripheral surface of the rod-shaped portion (21) is included.
The step of molding the first resin molded body (12) is
A step of projecting a part of the rod-shaped portion (21) from the first resin molded body (12),
A step of exposing a part of the surface (23, 25) of the convex structure portion (22) from the first resin molded body (12) is included.
Further, the method for manufacturing the electronic device (1) is further described.
A step of forming the first wiring circuit (30) on the surface (121) of the first resin molded body (12) and on the surface (23, 25) of the part of the convex structure portion (22).
The step of molding the second resin molded body (52) so that the connection socket (60) is embedded,
A step of forming a second wiring circuit (70, 73) electrically connected to the connection socket (60) on the surface (521, 522) of the second resin molded body (52).
An electronic device including a step of fitting the rod-shaped portion (21) protruding from the first resin molded body (12) into the connection socket (60) embedded in the second resin molded body (52). The manufacturing method of (1).

The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

1 Electronic device, 10, 50 Electronic module, 12, 52 Resin molded body, 14, 14a, 14b, 16, 16a, 16b, 54, 54a, 54b, 56, 56a, 56b Electronic components, 15, 15a, 15b, 17 , 17a, 17b, 55, 55a, 55b, 57, 57a, 57b electrodes, 20, 20a, 20b connection pins, 21,21a, 21b rod-shaped parts, 22, 22a, 22b convex structure parts, 23, 23a, 23b, 121 , 522 Top surface, 24, 24a, 25, 62, 62a, 62b, 63, 63b End face, 30, 30a, 30b, 31, 33, 34, 70, 70a, 70b, 71, 73, 74 Wiring circuit, 32, 35 , 72, 75 protective film, 40 adhesive layer, 60, 60a, 60b connection socket, 61, 61a, 61b, 85, 102 holes, 80, 81, 90, 91 temporary fixing sheet, 82, 92 molding mold, 83, 93 Upper mold, 84,94 lower mold, 101 template, 122,521 lower surface, 123 side surface.

Claims (12)

1. The first resin molded body and
   A first wiring circuit formed on the first surface of the first resin molded body and
   A connection pin for electrically connecting the first wiring circuit to an external circuit is provided.
   The connection pin
   With a rod-shaped part
   Including a convex structure portion protruding from the peripheral surface of the rod-shaped portion,
   The connection pin is embedded in the first resin molded body so that a part of the rod-shaped portion protrudes from the first resin molded body and the second surface of the convex structure portion is exposed to the first surface. Being done
   The first wiring circuit is an electronic module that is also formed on the second surface.
2. The convex structure portion has a disk shape with the longitudinal direction of the rod-shaped portion as the central axis.
   The electronic module according to claim 1, wherein the second surface is a plane orthogonal to the longitudinal direction of the rod-shaped portion.
3. The electronic module according to claim 1 or 2, wherein the part of the rod-shaped portion protrudes from the first surface of the first resin molded product.
4. The electronic module according to claim 1, wherein the part of the rod-shaped portion protrudes from a third surface different from the first surface of the first resin molded product.
5. The convex structure portion has a rectangular plate shape in a plan view orthogonal to the longitudinal direction of the rod-shaped portion.
   The electronic module according to claim 1, wherein the second surface is an end surface of the rod-shaped portion in the convex structure portion parallel to the longitudinal direction.
6. The first resin molded body has a plate shape and has a plate shape.
   The first surface is orthogonal to the thickness direction of the first resin molded product.
   The end face of the rod-shaped portion opposite to the part thereof is exposed to the fourth surface on the back side of the first surface of the first resin molded product.
   The electronic module
   The electronic module according to claim 3, further comprising a second wiring circuit formed on the fourth surface and the end face.
7. An electronic component embedded in the first resin molded body is further provided so that the electrode is exposed from the first surface.
   The electronic module according to any one of claims 1 to 6, wherein the first wiring circuit is also formed on the electrodes of the electronic component.
8. An electronic device including a first electronic module and a second electronic module.
   The first electronic module is composed of the electronic module according to any one of claims 1 to 7.
   The second electronic module is
   The second resin molded body and
   A third wiring circuit formed on the surface of the second resin molded body and
   Including a connection socket embedded in the second resin molded body and connected to the third wiring circuit.
   An electronic device in which the connection pin of the first electronic module is fitted into the connection socket of the second electronic module.
9. It is a manufacturing method of electronic modules.
   With the step of molding the resin molded body so that the connection pin is embedded,
   The connection pin
   With a rod-shaped part
   Including a convex structure portion protruding from the peripheral surface of the rod-shaped portion,
   The step of molding the resin molded body is
   A step of projecting a part of the rod-shaped portion from the resin molded body,
   Including a step of exposing a part of the surface of the convex structure portion from the resin molded body.
   The method of manufacturing the electronic module further
   A method for manufacturing an electronic module, comprising a step of forming a wiring circuit on the surface of the resin molded body and on the surface of the part of the convex structure portion.
10. The step of molding the resin molded body further includes a step of injecting the resin into the molding mold by an injection molding method or a step of laminating the resin on the mold plate by a laminated molding method.
    The projecting step includes a step of inserting a part of the rod-shaped portion into a hole formed in the molding die or the template.
    The method for manufacturing an electronic module according to claim 9, wherein the exposed step includes a step in which the surface of the part of the convex structure is brought into contact with the surface of the molding die or the template.
11. The step of molding the resin molded body further includes a step of embedding an electronic component in the resin molded body so that the electrode is exposed from the resin molded body.
    The method for manufacturing an electronic module according to claim 9 or 10, wherein the step of forming the wiring circuit includes a step of forming the wiring circuit on the electrode.
12. It is a manufacturing method of electronic devices.
    A step of molding the first resin molded body so that the connection pin is embedded is provided.
    The connection pin
    With a rod-shaped part
    Including a convex structure portion protruding from the peripheral surface of the rod-shaped portion,
    The step of molding the first resin molded body is
    A step of projecting a part of the rod-shaped portion from the first resin molded body,
    Including a step of exposing a part of the surface of the convex structure portion from the first resin molded body.
    The method for manufacturing the electronic device further describes.
    A step of forming a first wiring circuit on the surface of the first resin molded product and on the surface of the part of the convex structure portion,
    The step of molding the second resin molded body so that the connection socket is embedded,
    A step of forming a second wiring circuit electrically connected to the connection socket on the surface of the second resin molded body, and
    A method for manufacturing an electronic device, comprising a step of fitting the rod-shaped portion protruding from the first resin molded body into the connection socket embedded in the second resin molded body.

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