JP2009059812A - Transfer mold type power module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure a necessary insulating distance with a heat sink, and reduce a size in a horizontal direction to reduce an installation space on the substrate on a solid state relay side, and furthermore to prevent attachment of sealing resin on an externally exposed side end part of an external connection terminal in forming the sealing resin. <P>SOLUTION: The power module includes the external connection terminals 1, 2 installed so as to rise in a crossing direction respectively with respect to a power module substrate 4, and includes projecting flange parts integrally formed as sealing resin leakage preventing parts 8 for preventing leakage of the sealing resin 3 to the externally exposed side end parts 1-1, 2-1 in forming the sealing resin 3 at boundaries of sealing resin side end parts 1-2, 2-2, and externally exposed side end parts 1-1, 2-1 of the external connection terminals 1, 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a power module to be incorporated in a solit state relay, and more particularly to a transfer mold type power module configured by resin sealing by transfer molding.

  As power modules for use in solit state relays, those having a resin-sealed structure by transfer molding are widely used.

  Therefore, as shown in FIG. 22, for example, a conventional transfer mold type power module includes a power module substrate a made of a green plate such as ceramic and a power semiconductor element bonded on one surface of the power module substrate a. b, a pair of external connection terminals c and d that are electrically connected to each other through a conductor layer (not shown) formed on one surface of the power module substrate a with respect to the power semiconductor element b; And a heat plate e made of a metal plate bonded to the other surface of the power module substrate a, and the other end side of the external connection terminals c and d and the other surface side of the heat plate e are exposed to the outside. In this state, the power module substrate a, the power semiconductor element b, the external connection terminals c and d, and the heat plate e are sealed together by molding a sealing resin f. And, on the other side of the heat plate e is the heat sink g is joined.

  Each of the external connection terminals c and d is joined so that one end side is along one surface of the power module substrate a, and then the other end side is bent so as to stand upright to be exposed to the outside. .

  In such a configuration, the external connection terminals c and d are formed so as to be along one surface of the power module substrate a and then bent vertically, so that the insulation distance h from the heat sink g Will become smaller.

Therefore, in the prior art, as shown in FIG. 23, the external connection terminals c and d are first raised vertically on the power module substrate a and then bent horizontally along the power module substrate a. In addition, it is configured to be exposed to the outside in a state of being vertically raised upward (see Patent Document 1).
JP 2001-85613 A.

  In order to resin-mold the conventional transfer mold type power module configured as described above with a sealing resin, it has been as shown in FIGS.

  That is, first, as shown in FIG. 24, the transfer mold type power module first raises the external connection terminals c and d vertically on the power module substrate a, and then horizontally extends along the power module substrate a. As shown in FIG. 25, an upper mold is prepared in a state in which a semi-finished product j in a bent state is prepared and set between the upper mold K and the lower mold L in the mold open state. By closing the mold K and the lower mold L, forming a cavity between the molds K, L and the semi-finished product j, and filling the fluidized sealing resin f into the cavity Then, the semi-finished product j is manufactured while being sealed, and then, as shown in FIG. 26, the portions of the external connection terminals c and d that are exposed to the outside from the sealing resin f stand vertically upward, for example, manually. It was raised and completed.

  Then, in the transfer mold type power module described above, when the sealing resin f is molded, the external connection terminals c and d are arranged in a state of a semi-finished product j, and the tips of the external connection terminals c and d are arranged in a horizontal state. As shown in FIG. 2, the upper mold K and the lower mold L are clamped between the upper mold K and the lower mold L, and the upper mold K and the lower mold are clamped. The degree of adhesion between the molding dies L is improved, and the fluidized sealing resin f is less likely to leak to the distal end side of the external connection terminals c and d. Therefore, in the completed transfer mode type power module, the external connection terminal c The sealing resin f does not adhere to the exposed portion of d, which is convenient from the viewpoint of quality, and the sealing resin attached to the external connection terminals c and d is removed by post-processing. Since it does not require a, it can be said that it is preferable from the production efficiency.

  However, in the conventional transfer mold type power module shown in FIG. 23, after the sealing resin f is sealed and molded, the portions exposed from the sealing resin in the external connection terminals c and d are moved upward by manual work or the like. In this respect, the production efficiency is lowered because a manufacturing process that stands up vertically is required.

  Further, in the conventional spher mold type power module shown in FIG. 23, the external connection terminals c and d protrude from the side of the sealing resin f to the outside in a horizontal state and then rise vertically upward. In the point where it is formed, it spreads in the horizontal direction, which increases the installation space on the substrate on the solid state relay side.

  Therefore, the conventional transformer mold type power module has a configuration in which the external connection terminals c and d protrude upward from the side of the sealing resin f and then rises upward. From the viewpoint of securing the necessary insulation distance between d and the heat sink g joined to the other side of the heat plate e, there is a limit to downsizing and saving installation space. It is not possible to adequately answer the market demanded for downsizing and space saving on the board.

  Accordingly, the present inventors have proposed a transfer mold type power module in which external connection terminals 1 and 2 are externally exposed in an upright state on the upper surface of the sealing resin 3 as shown in FIG. .

  According to the transfer mold type power module configured as described above, the external connection terminals 1 and 2 formed in a straight shape stand upright on the upper surface of the sealing resin 3, and although not shown in the sealing resin 3, the power module substrate Since it is installed upright in the crossing direction, it can be reduced in size in the horizontal direction and reduced in installation space on the board on the solid state relay side, and a sufficient insulation distance from the heat sink can be secured. It can fully respond to market demands.

  However, as shown in FIG. 27, when the sealing resin 3 is molded, when the upper molding die 11 and the lower molding die 12 are clamped, the externally exposed side end portions 1-1 of the external connection terminals 1 and 2. It is necessary to mold the sealing resin 3 in a state in which 1 and 2-1 are fitted to the fitting portion 11-1 formed on the upper molding surface of the upper mold 11.

  When the upper mold 11 and the lower mold 12 are clamped, the externally exposed end portions 1-1 and 2-1 of the external connection terminals 1 and 2 come into contact with the inner wall of the fitting portion 11-1. In order to fit smoothly without being bent, it is necessary to take the fitting clearance of the fitting part 11-1 with respect to the outer exposed side end parts 1-1 and 1-2.

  When the upper mold 11 and the lower mold 12 are clamped, the upper mold 11 and the lower mold 12 are formed due to insufficient clamping between the upper mold 11 and the lower mold 12. The cavity 13 to be engaged and the fitting portion 11-1 communicate with each other, and the gap formed by the clearance between the fitting portion 11-1 and the external connection terminals 1 and 2 when the sealing resin 3 is molded. The fluidized sealing resin 3 leaks as shown by the arrow.

  As a result, when the upper molding die 11 and the lower molding die 12 are opened after the molding of the sealing resin 3, the sealing resin 3 leaks from the externally exposed end portions 1-1 and 2-1. As a result of sticking to the fitting part 11-1 and making it difficult for the upper mold 11 and the lower mold 12 to open, the sealing resin 3 leaks to the fitting part 11-1, A nest may occur on the main body side of the sealing resin 3, and the sealing resin 3 adheres to the externally exposed end portions 1-1 and 1-2 after the molding of the sealing resin 3. Since the external connection terminals 1 and 2 are poorly connected to the external device together with the appearance failure, the sealing resin adhered to the external exposed side end parts 1-1 and 1-2 by manual work in a later process or the like. The work which peels 3 will be needed.

  Therefore, the present invention secures a necessary insulation distance from the heat sink and reduces the installation space on the substrate on the solid state relay side by reducing the size in the horizontal direction. During molding, the cavity formed by the upper molding die and the lower molding die communicates with the fitting portion of the upper molding die to which the externally exposed end of the external connection terminal is fitted, and the sealing resin is fitted into the fitting portion. It is an object of the present invention to provide a transfer molding type power module that prevents the sealing resin from adhering to the externally exposed side end portion of the external connection terminal when molding the sealing resin.

  A transfer mold type power module according to the present invention includes a power module substrate made of an insulating plate such as ceramic, a power semiconductor element bonded on one surface of the power module substrate, and one end side with respect to the power semiconductor element At least one pair of external connection terminals in which the element side connection end portion is electrically connected via a conductor layer formed on the one surface of the power module substrate, and the one surface side is on the other surface of the power module substrate A power plate of a metal plate to be joined and disposed, and the power module in a state where the externally exposed end portion on the other end side of the external connection terminal and the other surface side of the gold side plate are respectively exposed. The substrate, the semiconductor element, the element-side connection end of the external connection terminal, and the metal plate are sealed together by resin molding to form a transfer module. A power module having the external connection terminals formed in a straight shape and erected in a direction crossing the surface of the power module substrate; A sealing resin leakage prevention portion for preventing the sealing resin from leaking to the external exposed side end side at the time of molding the sealing resin is provided at a boundary portion with the exposed side end portion. To do.

  By having such a configuration, the external connection terminals are each formed in a straight shape and installed so as to stand up in a direction crossing the power module substrate. It is possible to reduce the installation space on the board on the side, secure a sufficient insulation distance from the heat sink, and respond sufficiently to market requirements, and connect the external connection terminals to the element side By forming the sealing resin leakage prevention part at the boundary between the end part and the external exposed side end part, the sealing resin leakage prevention part prevents leakage of the sealing resin when molding the sealing resin. Since it can be prevented from adhering to the exposed end portion side, there is no appearance defect, and the sealing resin adhering to the external exposed end portion is peeled off in a later process. Ku, will be able to successfully connect the external connection terminal to an external device.

  In the transfer mold type power module according to the present invention, the element side connection end of the external connection terminal may be connected to the power module substrate.

  With this configuration, when the upper molding die and the lower molding die are clamped at the time of molding the sealing resin, the tip of the element side connection end of the external connection terminal comes into contact with the power module substrate, and the sealing resin The leakage preventing portion can be brought into close contact with the mold, and the sealing resin can be more completely prevented from adhering to the external exposed side end portion of the external terminal connection terminal.

  Further, in the transfer mold type power module according to the present invention, the sealing resin leakage prevention portion may be constituted by a protruding jaw portion formed by integrally extending the boundary portion of the external connection terminal.

  With this configuration, the zippered jaw portion is in close contact with the molding die, so that the fitting portion of the molding die into which the externally exposed side end portion of the external connection terminal is fitted can be sealed. In addition to preventing the sealing resin from adhering to the external exposed side end, the overhanging jaw is formed integrally with the external connection terminal to facilitate installation on the power module substrate. it can.

  Further, in the transfer mold type power module according to the present invention, the sealing resin leakage preventing portion is constituted by a stepped jaw portion formed by molding the element side connection end portion of the external connection terminal into a thick shape. May be.

  With such a configuration, the stepped jaw formed by molding the element-side connection end portion into a thick shape is in close contact with the molding die, so that the externally exposed end portion of the external connection terminal is fitted. The sealing portion can be sealed, the sealing resin can be prevented from adhering to the external exposed side end after molding of the sealing resin, and a thick element side connection end portion is provided. As a result, the current capacity of the external connection terminal can be increased.

  In the transfer mold type power module according to the present invention, the external connection terminals are connected by installing a separate resin plate or substrate so that the sealing resin leakage prevention portion is attached to the boundary portion of the external connection terminals. It can be constituted as follows.

  With this configuration, a separate resin plate or substrate can be brought into close contact with the molding die, so that the fitting portion of the molding die into which the externally exposed terminal of the external connection terminal is fitted can be sealed. In addition to preventing the sealing resin from adhering to the external exposed side end after molding, other electronic elements can be mounted using a separate resin plate as a substrate. The power module can be further reduced in size.

  In addition, the transfer mold type power module according to the present invention includes a protruding jaw portion in which a sealing resin leakage prevention portion is integrally extended to the boundary portion of the external connection terminal, and the external connection terminals are positioned on the extension jaw portion. You may make it comprise with the separate resin board connected.

  With this configuration, the projecting jaw portion integrally formed with the external connection terminal and the separate resin plate are in close contact with the molding die, so that the externally exposed end portion of the external connection terminal fits. The sealing resin can be prevented from adhering to the outer exposed side end after molding the sealing resin, and other electronic elements can be used by using a separate resin plate as a substrate. Thus, the transfer mold power module can be further miniaturized.

  In addition, the transfer mold type power module according to the present invention can be configured to mount other electronic elements on a substrate.

  With this configuration, the transfer mold power module can be further reduced in size.

  In addition, the transfer mold type power module according to the present invention may be configured to install a resin plate on the external terminal by insert molding.

  With this configuration, when the sealing resin is molded, the resin plate, which is insert-molded to the external connection terminal when the upper mold and the lower mold are clamped, is brought into close contact with the mold so that the externally exposed side of the external connection terminal The fitting part of the molding die into which the end part fits can be sealed, and the sealing resin can be prevented from adhering to the externally exposed end part after molding the sealing resin.

  Further, the transfer mold type power module according to the present invention is constituted by a separate insulator ring such as a rubber ring press-fitted so that the sealing resin leakage prevention portion is positioned at the boundary portion of the external connection terminal. You may make it do.

  With this configuration, when the sealing resin is molded, the insulator ring appropriately slides when the upper mold and the lower mold are clamped, so that the dimensions of the mold are maintained while the insulator ring is in close contact with the mold. A difference etc. can be absorbed and the fitting part of the shaping | molding die which the external display side edge part of an external connection terminal fits can be sealed more reliably.

  According to the present invention configured as described above, the external connection terminals are each formed in a straight shape and installed so as to stand in a direction crossing the power module substrate, thereby reducing the size in the horizontal direction. This reduces the installation space on the board on the solid-state relay side, secures a sufficient insulation distance from the heat sink, and can fully respond to market demands. By forming a sealing resin leakage prevention portion at the boundary between the element side connection end portion and the external exposure side end portion, the sealing resin leakage prevention portion leaks the sealing resin during molding of the sealing resin. Can be prevented from adhering to the external exposed side end side, so that there is no appearance defect and the sealing resin adhering to the external exposed side end part is peeled off in a later process. It not, will be able to successfully connect to the external connection terminal to an external device.

  Next, embodiments according to the present invention will be described with reference to the drawings.

  First, a transfer mold type power module employing the first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a longitudinal sectional view of a transfer mold type power module according to the first embodiment of the present invention when a heat sink is mounted on a product and FIG. 2 is a semi-finished product of the transfer mold type power module in FIG. Fig. 3 is a longitudinal sectional view showing a state where the mold is set between the upper mold and the lower mold in the mold open state for sealing molding with resin, and Fig. 3 shows that the upper mold and the lower mold are similarly clamped. FIG. 4 is a longitudinal sectional view illustrating a state in which a cavity is formed around a semi-finished product of a transfer mold power module. FIG. 4 is a longitudinal section illustrating a state in which a sealing resin is sealed in the cavity in FIG. FIG.

  Referring to FIG. 1, a transfer mold type power module according to a first embodiment of the present invention includes a power module substrate 4 made of an insulating plate such as ceramic, and a power semiconductor element bonded on one surface of the power module substrate 4. 5 and a pair of external connection terminals 1 and 2 electrically connected to each other through a conductor layer (not shown) formed on one surface of the power module substrate 4 with respect to the power semiconductor element 5. And a heat plate 6 made of a metal plate (or copper pattern) bonded to the other surface of the power module substrate 4, the other end of the external connection terminals 1 and 2, and the other surface of the heat plate 6. The power module substrate 4, the power semiconductor element 5, the external connection terminals 1 and 2, and the heat plate 6 are molded together with the sealing resin 3 with the side exposed to the outside. Constitutes sealed by, the other surface of the heat plate 6, the heat sink 7 are joined.

  The external connection terminals 1 and 2 are each formed in a straight shape (straight) and are installed so as to stand in a direction crossing the power module substrate 4, and are sealed in the external connection terminals 1 and 2. At the boundary between the externally exposed end portions 1-1 and 2-1 exposed from the resin 3 and the element side connecting end portions 1-2 and 2-2 sealed by the sealing resin 3, The overhanging jaw portion 8-1 that constitutes the sealing resin leakage preventing portion 8 that prevents the sealing resin from leaking to the externally exposed end portions 1-1 and 2-1 when the sealing resin 3 is molded. Is formed.

  The tip ends of the element side connection ends 1-2 and 2-2 of the external connection terminals 1 and 2 are connected and installed by soldering or the like in contact with the power module substrate 4.

  The overhanging jaw 8-1 is configured by bulging and forming a part of the external connection terminals 1 and 2 in a plate shape.

  With this configuration, in order to mold the sealing resin 3, as shown in FIG. 2, the external connection terminals 1 and 2 and the element side connection end portions 1-2 and 2-2 at the front end portions are previously connected to the power module substrate. The semi-finished product 9 is created by standing upright by soldering or the like on the power module substrate 4 while being in contact with a conductor pattern (not shown) formed on the semi-finished product 4. It is set between the upper mold 11 and the lower mold 12, and a cavity 13 is formed so as to surround the latter half product 9.

  At this time, since the element side connection ends 1-2 of the external connection terminals 1 and 2 are installed on the power module substrate 4, the overhanging jaw portion 8-1 is in close contact with the molding surface 11 b of the upper mold 11. Thus, the fitting portion 11a into which the externally exposed end portions 1-1 and 2-1 of the external connection terminals 1 and 2 are fitted is closed.

  Therefore, when the semifinished product 9 is molded from such a state by pouring the sealing resin 3 into the cavity 13 as shown in FIG. -1 is prevented and does not leak into the fitting portion 11a.

  As a result, as shown in FIG. 1, the transfer mold type power module is manufactured in a state where the sealing resin 3 is not attached to the externally exposed end portions 1-1 and 2-1 of the external connection terminals 1 and 2. After that, the heat sink 7 is joined to the surface of the heat plate 6 exposed to the outside.

  With the configuration as described above, the transfer molding type power module can be reduced in size and solid in the horizontal direction by installing the external connection terminals 1 and 2 so as to stand up in the direction crossing the power module substrate 4. In addition to saving space on the board on the state relay side, the insulation distance from the heat sink 7 can be secured sufficiently, so that it can fully respond to market demands, and the external connection terminal 1, The protruding jaw portion 8-1 as the sealing resin leakage prevention portion 8 is formed at the boundary portion between the element side connection end portions 1-2, 2-2 and the externally exposed side end portions 1-1, 2-1. By doing so, the overhanging jaw portion 8-1 is prevented from leaking out of the sealing resin 3 at the time of molding the sealing resin 3, and is prevented from adhering to the external exposed side end portions 1-1 and 2-1 side. Can Therefore, it is not necessary to peel off the sealing resin 3 attached to the externally exposed side end portions 11-1, 2-1 in the subsequent process, and the external connection terminals 1, 2 are normally connected to the external device. Will be able to.

  Further, when the upper molding die 11 and the lower molding die 12 are clamped at the time of molding the sealing resin 3, the tips of the element side connection ends 1-2, 2-2 of the external connection terminals 1, 2 are The overhanging jaw 8-1 can be brought into close contact with the molding surface of the upper mold 11 in contact with the conductor pattern of the power module substrate 4, and the externally exposed side end 1-1 of the external connection terminals 1 and 2 It is possible to more completely prevent the sealing resin 3 from adhering to the 2-1 side.

  Further, since the overhanging jaw portion 8-1 is formed integrally with the external connection terminals 1 and 2, it can be easily installed on the power module substrate 4.

  Further, the overhanging jaw portion 8-1 can be selected by appropriately selecting the thickness dimension thereof, as shown in FIG. 5, when the upper mold 11 and the lower mold 12 are both clamped. When pressure is applied to the lower mold 12 side by the clamping force of the mold 11, it can be configured to be deformed downward V-shaped from the center to both ends as shown in FIG. In addition, the degree of adhesion of the upper mold 11 to the molding surface can be increased, and the dimensional accuracy of the mold and components can be absorbed by the deformation of the jaw 8-1. The fitting part 11a of the molding die into which the two external exposed side end parts 1-1 and 2-1 are fitted can be more reliably sealed.

  Furthermore, since the fitting portion 11a can be sealed by the overhanging jaw portion 8-1 coming into contact with the molding surface of the upper mold 11, the fitting portion 11a is made large in a concave shape instead of a hole shape. It can be formed, and a large relief portion of the external connection terminals 1 and 2 can be secured during mold clamping.

  In addition, the shape of the sealing resin leakage prevention part 8 formed in the external terminal connection terminals 1 and 2 according to the present invention is not limited to the integrally formed plate-like overhanging jaw part 8-1. Various modes as shown in FIGS. 7 to 11 are conceivable.

  For example, as shown in FIG. 7, the upper molding die 11 and the lower molding die 12 are formed by forming tapered portions 8-1a at the upper and lower portions at the tip of the plate-like protruding jaw portion 8-1. When clamped, the centering is performed while moving in the horizontal direction Q by the clamping force P of both molding dies 11 and 12, thereby increasing the accuracy of the set position when clamping the external terminal connection terminals 1 and 2. Therefore, reliability can be improved.

  From such a viewpoint, the sealing resin leakage preventing portion 8 can be formed in a mountain shape as shown in FIG. 8 or an umbrella shape as shown in FIG.

  Further, as shown in FIGS. 10 and 11, the sealing resin leakage preventing portion 8 is a stepped jaw formed by forming the entire element side connection end 1-2 (2-2) into a thick shape. You may make it comprise by the part 8-2.

  In this case, the stepped jaw portion 8-2 shown in FIG. 10 has a tip formed in a mountain shape, and the stepped jaw portion 8-2 shown in FIG. 11 has a tip formed in an umbrella shape. In either case, as a result of the entire element side connection end 1-2 (2-2) being thick, the current capacity of the external connection terminal 1 (2) can be increased.

  Furthermore, as shown in FIGS. 12 to 14, the present invention can be configured with a resin plate or substrate 8-3 having an insulating property for the sealing resin leakage preventing portion 8.

  That is, first, as shown in FIG. 12, in order to mold the sealing resin 3, the external exposed side end portions 1-1 and 2-1 and the element side connecting end portion 1 in the external connecting terminals 1 and 2 are previously formed. -2, 2-2 is formed at the boundary between the resin plate or the substrate 8-3 and the resin plate or the substrate 8-3 is positioned on the protruding jaw 8-1. 3 is fixed to the external connection terminals 1 and 2 by press-fitting or soldering, and a semi-finished product 9 is created by forming a sealing resin leakage prevention portion 8. 11 and the lower mold 12, and then, as shown in FIG. 13, a cavity 13 is formed so as to surround the upper mold 11, the lower mold 12 and the semi-finished product 9.

  At this time, the tip of the element side connection end 1-2 (2-2) of the external connection terminals 1 and 2 may be in contact with the power module substrate 4, and the shoulder of the resin plate or the substrate 8-3 Close to the molding surface 11b of the upper mold 11 and closes the fitting part 11a of the upper mold 11 to which the externally exposed end parts 1-1 and 2-1 of the external connection terminals 1 and 2 are fitted. Will be.

  Therefore, from this state, as shown in FIG. 14, when the semifinished product 9 is molded by pouring the sealing resin or the substrate 3 into the cavity 13, the sealing resin 3 is a resin plate. Or it is blocked by the board 8-3 and does not leak into the fitting portion 11a.

  As a result, as shown in FIG. 1, the transfer mold type power module is manufactured in a state where the sealing resin 3 is not attached to the externally exposed side ends 1-1, 2-1 of the external connection terminals 1, 2. Then, the heat sink 7 is joined to the surface of the heat plate 6 exposed to the outside.

  In addition, by using the resin plate or substrate 8-3 as a substrate, other electronic elements (not shown) can be mounted, and as a result, the transfer mold type power module can be further reduced in size. Can do.

  Furthermore, since the resin plate or the substrate 8-3 can block the fitting portion 11a in the upper mold 11 by contacting the shoulder of the resin plate or the substrate 8-3 with the molding surface 11b of the upper mold 11, the fitting recess 11a. Can be formed large in a concave shape instead of a hole shape, and a large relief portion of the external connection terminals 1 and 2 can be secured during mold clamping.

  The resin plate or board 8-3 is attached to the external connection terminals 1 and 2 by press-fitting or soldering the resin board or board 8-3 disposed on the overhanging jaw 8-1 to the power module board 4. For example, as shown in FIG. 15, when the resin plate or the substrate 8-3 is fixed to the power module substrate 4 by press-fitting or soldering, as shown in FIG. As shown in FIG. 16, the resin plate or substrate 8-3 is placed on the stepped jaw-shaped jaw 8-2 formed by molding the entire resin-sealed chest 1-2, 2-2 into a thick shape. In a state where the sealing resin leakage preventing portion 8 is configured by fixing the resin plate or the substrate 8-3 to the external connection terminals 1 and 2 by press-fitting or soldering in the positioned state, as shown in FIG. The overhanging jaw 8 formed relatively thick With the resin plate or substrate 8-3 positioned on 1, the resin plate or substrate 8-3 is fixed to the external connection terminals 1 and 2 by press-fitting or soldering, so that the sealing resin leakage prevention portion 8 is A configuration is conceivable.

  In such a case, the shape of the stepped jaw portion 8-2 and the overhanging jaw portion 8-1 is formed in a substantially cross-beam shape as shown in FIG. 18 in plan view, or as shown in FIG. Thus, it may be formed in a star shape.

  Moreover, although the above-mentioned overhanging jaw part 8-1 was formed by expanding the boundary part of the external connection terminals 1 and 2 integrally, it is not limited to this, for example, as shown in FIG. It can be configured by press-fitting a separate insulator ring 8-4 such as a rubber ring into the boundary portion of the external connection terminals 1 and 2.

  In this case, when the sealing resin 3 is molded, the insulator ring 8-4 and the insulator ring 8-3 slide appropriately when the upper mold 11 and the lower mold 12 are clamped. 8-4 can absorb the dimensional difference of the mold while adhering to the mold, and the externally exposed terminals 1-1 and 2-1 of the external connection terminals 1 and 2 are more reliable than the fitting part 11 a. Can be blocked.

  In the above embodiment, the resin plate or substrate 8-3 is fixedly attached to the external connection terminals 1 and 2 by press-fitting or soldering. However, the present invention is not limited to this, as shown in FIG. The external connection terminals 1 and 2 may be formed by insert molding.

  As described above, the present invention can be reduced in size in the horizontal direction by forming the external connection terminals in a straight shape and installing the external connection terminals so as to stand in a direction crossing the power module substrate. In addition to reducing the installation space on the board on the solid state relay side, the insulation distance from the heat sink can also be secured sufficiently, so that it can fully respond to market demands, and the external connection terminal By forming the sealing resin leakage prevention part at the boundary between the element side connection end and the external exposure side end, the sealing resin leakage prevention part prevents the sealing resin from leaking when molding the sealing resin. Since it can be prevented from adhering to the external exposed side end portion side, there is no appearance defect and the sealing resin adhering to the external exposed side end portion is peeled off in a later process. In addition, since the external connection terminal can be normally connected to the external device, the power module to be incorporated in the solit state relay, particularly a transfer mold type power module configured by resin sealing by transfer molding, etc. It can be said that it is preferable.

It is a longitudinal cross-sectional view at the time of mounting a heat sink on the transfer mold type power module in 1st Example based on this invention, and commercializing. FIG. 2 is a longitudinal sectional view showing a state in which a mold is opened and set in an upper mold and a lower mold in order to encapsulate a sealing resin in a semi-finished product of the transfer mold power module in FIG. 1. FIG. 6 is a longitudinal sectional view depicting a state in which a cavity is formed around a semi-finished product of a transfer mold power module by similarly clamping an upper mold and a lower mold. FIG. 4 is a longitudinal sectional view depicting a state in which a sealing resin is sealed in a cavity in FIG. 3 and molded. It is a figure explaining the relationship between the external connection terminal used for the transfer mold power module in FIG. 1, and the upper mold and the lower mold during clamping. Similarly, it is a figure explaining the effect | action of the external connection terminal at the time of clamping of an upper side shaping | molding die and a lower side shaping | molding die. It is a front view which shows the 2nd Example shape of the external connection terminal used for the transfer mold type power module in FIG. It is a front view which similarly shows the 3rd Example shape of an external connection terminal. It is a front view which similarly shows the 4th Example shape of an external connection terminal. It is a front view which similarly shows the 5th Example shape of an external connection terminal. It is a front view which similarly shows the 6th Example shape of an external connection terminal. It is a longitudinal cross-sectional view which shows the state set to the upper side shaping | molding die of a mold open state, and the lower side shaping | molding die in order to carry out sealing molding of sealing resin to the semi-finished product of the transfer type power module in other embodiment which concerns on this invention is there. FIG. 6 is a longitudinal sectional view depicting a state in which a cavity is formed around a semi-finished product of a transfer mold power module by similarly clamping an upper mold and a lower mold. FIG. 14 is a longitudinal sectional view depicting a state in which a sealing resin is sealed in a cavity in FIG. 13 and molded. It is the longitudinal cross-sectional view which drew the aspect which installs the resin board in the external connection terminal in the other Example which concerns on the semi-finished product of the transfer mold type power module of this invention. It is the longitudinal cross-sectional view which drew the other aspect which installs the resin board in the other Example which concerns on the semi-finished product of the transfer mold type power module of this invention in an external connection terminal. It is the longitudinal cross-sectional view which drew the other aspect which installs the resin board in the other Example which concerns on the semi-finished product of the transfer mold type power module of this invention in an external connection terminal. FIG. 18 is a plan view depicting an example of the external connection terminal depicted in FIG. 16 or FIG. 17. FIG. 18 is a plan view illustrating another example of the external connection terminal illustrated in FIG. 16 or 17. It is a front view which shows the 7th Example shape of the external connection terminal used for the transfer mold type power module in FIG. It is a front view which shows the 8th Example shape of the external connection terminal used for the transfer mold type power module in FIG. It is a longitudinal cross-sectional view at the time of commercializing by attaching the heat sink to the transfer mold type power module in an example of a prior art. It is a longitudinal cross-sectional view at the time of commercializing by mounting | wearing a heat sink with the transfer mold type power module in the other example of a prior art. It is a longitudinal cross-sectional view which shows the state set to the upper side shaping | molding die of a mold open state, and the lower side shaping | molding die in order to carry out sealing molding of sealing resin to the semi-finished product of the transfer mold power module in FIG. FIG. 6 is a longitudinal sectional view depicting a state in which a cavity is formed around a semi-finished product of a transfer mold power module by similarly clamping an upper mold and a lower mold. It is the longitudinal cross-sectional view which similarly drawn the transfer mold type power module in FIG. 25 after shape | molding sealing resin. It is the longitudinal cross-sectional view which drawn the shaping | molding state of the prior step which completes the transfer mold type power module which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 External connection terminal 1-1, 2-1 External exposure side edge 1-2, 2-2 Element side connection edge 3 Sealing resin 4 Power module board 5 Power semiconductor element 6 Heat plate 8 Sealing resin Leakage prevention portion 8-1 Overhanging jaw portion 8-2 Stepped jaw portion 8-3 Resin plate 8-4 Insulator ring 11 Upper molding die 11a Fitting portion 12 Lower molding die 13 Cavity

Claims (9)

A power module substrate made of an insulating plate such as ceramic, a power semiconductor element bonded on one surface of the power module substrate, and an element side connection end on one end side of the power semiconductor element. At least a pair of external connection terminals that are electrically connected via a conductor layer formed on the one surface of the metal plate, and a heat plate of a metal plate whose one surface side is bonded to the other surface of the power module substrate. The power module substrate, the semiconductor element, and the external connection terminal of the external connection terminal in a state in which the external surface side end portion on the other end side of the external connection terminal and the other surface side of the gold side plate are respectively exposed. A transfer mold type power module configured by sealing the element side connection end and the metal plate by resin molding,
The external connection terminals are formed in a straight shape and are erected in a direction crossing the power module substrate surface, respectively, and a boundary between the element side connection end and the external exposure side end of the external connection terminal A transfer mold type power module characterized in that a sealing resin leakage preventing portion for preventing the sealing resin from leaking to the outer exposed side end portion side at the time of molding the sealing resin is provided in the portion.   The transfer mold type power module according to claim 1, wherein the element side connection end of the external connection terminal is connected to the power module substrate.   3. The transfer mold according to claim 1, wherein the sealing resin leakage prevention portion is configured by an extended jaw portion formed by integrally extending the boundary portion of the external connection terminal. Power module.   The said sealing resin leakage prevention part was comprised by the step-shaped jaw part formed by shape | molding the element side connection edge part in the said external connection terminal in thick shape. The transfer mold type power module as described.   The said sealing resin leakage prevention part installed the separate resin board or board | substrate so that it might be located in the said boundary part of the said external connection terminal, and connected the said external connection terminals, It is characterized by the above-mentioned. The transfer mold type power module according to claim 2.   The sealing resin leakage prevention portion includes a protruding jaw portion integrally formed on the boundary portion of the external connection vortex, and a separate resin for connecting the external connection terminals to be positioned on the protruding jaw portion. The transfer mold type power module according to claim 1, wherein the transfer mold type power module is constituted by a plate.   7. The transfer mold type power module according to claim 5, wherein another electronic element is mounted on the resin plate.   8. The transfer mold type power module according to claim 5, wherein the resin plate is installed on the external connection terminal by insert molding. The said sealing resin leakage prevention part is comprised by the separate insulator rings, such as a rubber ring press-fitted and fitted so that it may be located in the said boundary part of the said external connection terminal. 3. The transfer mold type power module according to 2.

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