JP2020522883A5 - - Google Patents

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JP2020522883A5
JP2020522883A5 JP2019565258A JP2019565258A JP2020522883A5 JP 2020522883 A5 JP2020522883 A5 JP 2020522883A5 JP 2019565258 A JP2019565258 A JP 2019565258A JP 2019565258 A JP2019565258 A JP 2019565258A JP 2020522883 A5 JP2020522883 A5 JP 2020522883A5
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ray
fabrication
tool
value
wafer processing
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JP7250705B2 (ja
JP2020522883A (ja
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JP2019565258A 2017-05-30 2018-05-29 Ｘ線スキャトロメトリでの深層構造のプロセスモニタリング Active JP7250705B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201762512297P 2017-05-30 2017-05-30
US62/512,297 2017-05-30
US201762572566P 2017-10-16 2017-10-16
US62/572,566 2017-10-16
US15/990,749 US10727142B2 (en) 2017-05-30 2018-05-28 Process monitoring of deep structures with X-ray scatterometry
US15/990,749 2018-05-28
PCT/US2018/034935 WO2018222613A1 (en) 2017-05-30 2018-05-29 Process monitoring for deep structures with x-ray scatterometry

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JP2020522883A JP2020522883A (ja) 2020-07-30
JP2020522883A5 true JP2020522883A5 (OSRAM) 2021-07-26
JP7250705B2 JP7250705B2 (ja) 2023-04-03

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JP2019565258A Active JP7250705B2 (ja) 2017-05-30 2018-05-29 Ｘ線スキャトロメトリでの深層構造のプロセスモニタリング

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US (3) US10727142B2 (OSRAM)
JP (1) JP7250705B2 (OSRAM)
KR (2) KR102722474B1 (OSRAM)
CN (1) CN110603435A (OSRAM)
WO (1) WO2018222613A1 (OSRAM)

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