JP2020522132A5 - - Google Patents

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Publication number
JP2020522132A5
JP2020522132A5 JP2019564957A JP2019564957A JP2020522132A5 JP 2020522132 A5 JP2020522132 A5 JP 2020522132A5 JP 2019564957 A JP2019564957 A JP 2019564957A JP 2019564957 A JP2019564957 A JP 2019564957A JP 2020522132 A5 JP2020522132 A5 JP 2020522132A5
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JP
Japan
Prior art keywords
opening
nozzle
liner
connector
cross
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JP2019564957A
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English (en)
Japanese (ja)
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JP2020522132A (ja
JP7125427B2 (ja
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Priority claimed from PCT/US2018/024539 external-priority patent/WO2018222256A1/en
Publication of JP2020522132A publication Critical patent/JP2020522132A/ja
Publication of JP2020522132A5 publication Critical patent/JP2020522132A5/ja
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Publication of JP7125427B2 publication Critical patent/JP7125427B2/ja
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JP2019564957A 2017-05-31 2018-03-27 遠隔プラズマ酸化チャンバ Active JP7125427B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762513200P 2017-05-31 2017-05-31
US62/513,200 2017-05-31
PCT/US2018/024539 WO2018222256A1 (en) 2017-05-31 2018-03-27 Remote plasma oxidation chamber

Publications (3)

Publication Number Publication Date
JP2020522132A JP2020522132A (ja) 2020-07-27
JP2020522132A5 true JP2020522132A5 (cg-RX-API-DMAC7.html) 2021-05-06
JP7125427B2 JP7125427B2 (ja) 2022-08-24

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ID=64455931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019564957A Active JP7125427B2 (ja) 2017-05-31 2018-03-27 遠隔プラズマ酸化チャンバ

Country Status (6)

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US (1) US11615944B2 (cg-RX-API-DMAC7.html)
JP (1) JP7125427B2 (cg-RX-API-DMAC7.html)
KR (2) KR20230047477A (cg-RX-API-DMAC7.html)
CN (1) CN110612593B (cg-RX-API-DMAC7.html)
TW (1) TWI798210B (cg-RX-API-DMAC7.html)
WO (1) WO2018222256A1 (cg-RX-API-DMAC7.html)

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USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
US10847337B2 (en) 2018-01-24 2020-11-24 Applied Materials, Inc. Side inject designs for improved radical concentrations
WO2020131214A1 (en) * 2018-12-20 2020-06-25 Applied Materials, Inc. Method and apparatus for supplying improved gas flow to a processing volume of a processing chamber
WO2020205203A1 (en) * 2019-04-05 2020-10-08 Applied Materials, Inc. Process system with variable flow valve
KR20210094694A (ko) * 2020-01-21 2021-07-30 삼성전자주식회사 기판 처리 장치, 물질막 증착 장치, 및 상압 화학 기상 증착 장치
JP7700158B2 (ja) * 2020-07-24 2025-06-30 ラム リサーチ コーポレーション 低減された内部容積を有するシャワーヘッド
KR102522687B1 (ko) * 2020-10-20 2023-04-18 에이피시스템 주식회사 박막 제조 장치
TWI876185B (zh) * 2022-07-14 2025-03-11 美商應用材料股份有限公司 對稱半導體處理腔室

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JPH0729827A (ja) * 1993-07-13 1995-01-31 Kawasaki Steel Corp 半導体基板の製造方法および装置
US5620523A (en) * 1994-04-11 1997-04-15 Canon Sales Co., Inc. Apparatus for forming film
US6170428B1 (en) * 1996-07-15 2001-01-09 Applied Materials, Inc. Symmetric tunable inductively coupled HDP-CVD reactor
US5935334A (en) * 1996-11-13 1999-08-10 Applied Materials, Inc. Substrate processing apparatus with bottom-mounted remote plasma system
US6450116B1 (en) 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
JP2001118799A (ja) * 1999-10-22 2001-04-27 Matsushita Electric Ind Co Ltd ガスの導入と流れの制御方法およびその装置
JP2002151486A (ja) * 2000-10-30 2002-05-24 Applied Materials Inc 基体処理方法及び装置並びに基体処理装置の運転方法
US6576564B2 (en) * 2000-12-07 2003-06-10 Micron Technology, Inc. Photo-assisted remote plasma apparatus and method
JP3676680B2 (ja) * 2001-01-18 2005-07-27 東京エレクトロン株式会社 プラズマ装置及びプラズマ生成方法
EP1310466A3 (en) * 2001-11-13 2003-10-22 Tosoh Corporation Quartz glass parts, ceramic parts and process of producing those
JP2004091848A (ja) * 2002-08-30 2004-03-25 Tokyo Electron Ltd 薄膜形成装置の原料ガス供給系および薄膜形成装置
US20070051471A1 (en) * 2002-10-04 2007-03-08 Applied Materials, Inc. Methods and apparatus for stripping
US20050221618A1 (en) * 2004-03-31 2005-10-06 Amrhein Frederick J System for controlling a plenum output flow geometry
JP4572100B2 (ja) * 2004-09-28 2010-10-27 日本エー・エス・エム株式会社 プラズマ処理装置
WO2006078666A2 (en) * 2005-01-18 2006-07-27 Asm America, Inc. Reaction system for growing a thin film
JP2007157885A (ja) * 2005-12-02 2007-06-21 Mitsui Eng & Shipbuild Co Ltd 原料ガス供給装置
US8067061B2 (en) * 2007-10-25 2011-11-29 Asm America, Inc. Reaction apparatus having multiple adjustable exhaust ports
KR101864132B1 (ko) * 2010-10-05 2018-07-13 에바텍 아크티엔게젤샤프트 폴리머 기판의 진공 처리를 위한 현장 컨디셔닝
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WO2013051248A1 (ja) * 2011-10-07 2013-04-11 東京エレクトロン株式会社 プラズマ処理装置
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KR102376982B1 (ko) * 2015-04-14 2022-03-21 삼성전자주식회사 세라믹을 이용하여 파티클 저감 효과를 가지는 원격 플라즈마 발생장치
KR101692697B1 (ko) * 2015-04-21 2017-01-04 (주)뉴젠텍 정렬 키 구조의 원격 플라즈마 소스 블록

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