JP2020522127A5 - - Google Patents

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Publication number
JP2020522127A5
JP2020522127A5 JP2019564033A JP2019564033A JP2020522127A5 JP 2020522127 A5 JP2020522127 A5 JP 2020522127A5 JP 2019564033 A JP2019564033 A JP 2019564033A JP 2019564033 A JP2019564033 A JP 2019564033A JP 2020522127 A5 JP2020522127 A5 JP 2020522127A5
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JP
Japan
Prior art keywords
zonal analysis
computer
metric
zonal
analysis
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JP2019564033A
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English (en)
Japanese (ja)
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JP2020522127A (ja
JP6864122B2 (ja
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Priority claimed from PCT/US2017/065629 external-priority patent/WO2018217232A1/en
Publication of JP2020522127A publication Critical patent/JP2020522127A/ja
Publication of JP2020522127A5 publication Critical patent/JP2020522127A5/ja
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Publication of JP6864122B2 publication Critical patent/JP6864122B2/ja
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JP2019564033A 2017-05-22 2017-12-11 レシピ最適化及び計測のためのゾーナル分析 Active JP6864122B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762509679P 2017-05-22 2017-05-22
US62/509,679 2017-05-22
PCT/US2017/065629 WO2018217232A1 (en) 2017-05-22 2017-12-11 Zonal analysis for recipe optimization and measurement

Publications (3)

Publication Number Publication Date
JP2020522127A JP2020522127A (ja) 2020-07-27
JP2020522127A5 true JP2020522127A5 (cg-RX-API-DMAC7.html) 2021-01-28
JP6864122B2 JP6864122B2 (ja) 2021-04-21

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ID=64396977

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JP2019564033A Active JP6864122B2 (ja) 2017-05-22 2017-12-11 レシピ最適化及び計測のためのゾーナル分析

Country Status (7)

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US (1) US10763146B2 (cg-RX-API-DMAC7.html)
JP (1) JP6864122B2 (cg-RX-API-DMAC7.html)
KR (1) KR102301556B1 (cg-RX-API-DMAC7.html)
CN (1) CN110622287B (cg-RX-API-DMAC7.html)
DE (1) DE112017007576T5 (cg-RX-API-DMAC7.html)
TW (1) TWI768046B (cg-RX-API-DMAC7.html)
WO (1) WO2018217232A1 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10962951B2 (en) 2018-06-20 2021-03-30 Kla-Tencor Corporation Process and metrology control, process indicators and root cause analysis tools based on landscape information
WO2020123014A1 (en) 2018-12-14 2020-06-18 Kla Corporation Per-site residuals analysis for accurate metrology measurements
KR20230014360A (ko) 2021-07-21 2023-01-30 에스케이플래닛 주식회사 생산적 적대 신경망을 기반으로 하는 복합체 생산 레시피를 추론하기 위한 장치 및 이를 위한 방법
KR20230052529A (ko) 2021-10-13 2023-04-20 에스케이플래닛 주식회사 오토인코더 특성 추출을 통한 복합체 특성과 복합체 생산 조건을 상호 추론하기 위한 방법 및 이를 위한 장치
EP4538797A1 (en) * 2023-10-11 2025-04-16 ASML Netherlands B.V. Method of determining a sampling scheme and associated metrology method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7161669B2 (en) 2005-05-06 2007-01-09 Kla- Tencor Technologies Corporation Wafer edge inspection
KR101885585B1 (ko) * 2005-11-18 2018-08-07 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7324193B2 (en) * 2006-03-30 2008-01-29 Tokyo Electron Limited Measuring a damaged structure formed on a wafer using optical metrology
US7576851B2 (en) * 2006-03-30 2009-08-18 Tokyo Electron Limited Creating a library for measuring a damaged structure formed on a wafer using optical metrology
JP2008004863A (ja) * 2006-06-26 2008-01-10 Hitachi High-Technologies Corp 外観検査方法及びその装置
US8611639B2 (en) * 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
US8254661B2 (en) * 2008-06-02 2012-08-28 Applied Materials Israel, Ltd. System and method for generating spatial signatures
JP2012150065A (ja) 2011-01-21 2012-08-09 Hitachi High-Technologies Corp 回路パターン検査装置およびその検査方法
US9177370B2 (en) * 2012-03-12 2015-11-03 Kla-Tencor Corporation Systems and methods of advanced site-based nanotopography for wafer surface metrology
US9064823B2 (en) * 2013-03-13 2015-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for qualifying a semiconductor wafer for subsequent processing
SG11201703585RA (en) * 2014-11-25 2017-06-29 Kla Tencor Corp Analyzing and utilizing landscapes
TWI780741B (zh) * 2016-02-24 2022-10-11 美商克萊譚克公司 光學計量之準確度提升

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