JP2020521060A5 - - Google Patents

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Publication number
JP2020521060A5
JP2020521060A5 JP2020515821A JP2020515821A JP2020521060A5 JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5 JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5
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JP
Japan
Prior art keywords
noble metal
salt formulation
organic
metal salt
aqueous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020515821A
Other languages
English (en)
Japanese (ja)
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JP2020521060A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2017/062434 external-priority patent/WO2018215057A1/en
Publication of JP2020521060A publication Critical patent/JP2020521060A/ja
Publication of JP2020521060A5 publication Critical patent/JP2020521060A5/ja
Pending legal-status Critical Current

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JP2020515821A 2017-05-23 2017-05-23 貴金属塩調合物、それの製造方法及び電気メッキのための使用 Pending JP2020521060A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/062434 WO2018215057A1 (en) 2017-05-23 2017-05-23 Noble metal salt preparation, a method for production thereof and use for electroplating

Publications (2)

Publication Number Publication Date
JP2020521060A JP2020521060A (ja) 2020-07-16
JP2020521060A5 true JP2020521060A5 (zh) 2020-08-27

Family

ID=58772561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020515821A Pending JP2020521060A (ja) 2017-05-23 2017-05-23 貴金属塩調合物、それの製造方法及び電気メッキのための使用

Country Status (7)

Country Link
US (1) US20200095693A1 (zh)
EP (1) EP3443146B1 (zh)
JP (1) JP2020521060A (zh)
KR (1) KR20200010340A (zh)
CN (1) CN110770371A (zh)
ES (1) ES2773771T3 (zh)
WO (1) WO2018215057A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897603B (zh) * 2021-08-31 2023-09-05 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663005A (en) * 1985-11-15 1987-05-05 Edson Gwynne I Electropolishing process
JPS6324089A (ja) * 1986-07-16 1988-02-01 Tanaka Kikinzoku Kogyo Kk 金の電解液
US5302278A (en) 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
JP3365866B2 (ja) 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
DE19928047A1 (de) 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen
JP3697181B2 (ja) * 2001-07-27 2005-09-21 日本高純度化学株式会社 無電解金メッキ液
KR100442519B1 (ko) * 2002-04-09 2004-07-30 삼성전기주식회사 모듈화 인쇄회로기판의 표면처리용 합금 도금액
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
TWI426157B (zh) * 2011-05-18 2014-02-11 Uwin Nanotech Co Ltd 剝金組成物以及使用方法
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
DE102012004348B4 (de) * 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen
US20150137356A1 (en) 2012-10-04 2015-05-21 Electroplating Engineers Of Japan Limited Non-cyanide electrolytic gold plating solution
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
CN105316718A (zh) 2014-07-31 2016-02-10 无锡永发电镀有限公司 一种亚硫酸盐无氰镀金的电镀液及电镀方法
CN105745355B (zh) 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法
PL3159435T3 (pl) * 2015-10-21 2018-10-31 Umicore Galvanotechnik Gmbh Dodatek do elektrolitów do stopu srebro-palladowego

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