JP2020521039A - 蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法 - Google Patents

蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法 Download PDF

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Publication number
JP2020521039A
JP2020521039A JP2019541694A JP2019541694A JP2020521039A JP 2020521039 A JP2020521039 A JP 2020521039A JP 2019541694 A JP2019541694 A JP 2019541694A JP 2019541694 A JP2019541694 A JP 2019541694A JP 2020521039 A JP2020521039 A JP 2020521039A
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JP
Japan
Prior art keywords
nozzle
plume
evaporation source
nozzles
substrate
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Pending
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JP2019541694A
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English (en)
Japanese (ja)
Inventor
アンドレアス ロップ，
アンドレアス ロップ，
ディーター ハース，
ディーター ハース，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2020521039A publication Critical patent/JP2020521039A/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587—Mechanical means for changing the gas flow
    • C23C16/45591—Fixed means, e.g. wings, baffles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45578—Elongated nozzles, tubes with holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2019541694A 2018-05-04 2018-05-04 蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法 Pending JP2020521039A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/061543 WO2019210972A1 (en) 2018-05-04 2018-05-04 Evaporation source for depositing an evaporated material, vacuum deposition system, and method for depositing an evaporated material

Publications (1)

Publication Number Publication Date
JP2020521039A true JP2020521039A (ja) 2020-07-16

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JP2019541694A Pending JP2020521039A (ja) 2018-05-04 2018-05-04 蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法

Country Status (4)

Country Link
JP (1) JP2020521039A (ko)
KR (1) KR20190127661A (ko)
CN (1) CN110691861A (ko)
WO (1) WO2019210972A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230047440A (ko) * 2020-08-04 2023-04-07 어플라이드 머티어리얼스, 인코포레이티드 증기 소스, 증기 소스를 위한 노즐, 진공 증착 시스템, 및 증발된 재료를 증착하기 위한 방법

Citations (3)

* Cited by examiner, † Cited by third party
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JP2011132596A (ja) * 2009-12-22 2011-07-07 Samsung Mobile Display Co Ltd 蒸発源及びそれを用いた蒸着装置
JP2017509796A (ja) * 2014-03-21 2017-04-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 有機材料用の蒸発源
JP2017535677A (ja) * 2014-11-07 2017-11-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法

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JPH01139758A (ja) * 1987-11-25 1989-06-01 Mitsubishi Electric Corp 薄膜蒸着方法および薄膜蒸着装置
US20100189929A1 (en) * 2009-01-28 2010-07-29 Neal James W Coating device and deposition apparatus
DE102010055285A1 (de) * 2010-12-21 2012-06-21 Solarion Ag Photovoltaik Verdampferquelle, Verdampferkammer und Beschichtungsverfahren
US20120237679A1 (en) * 2011-03-17 2012-09-20 Kateeva, Inc. Apparatus and methods for depositing one or more organic materials on a substrate
JP2014198863A (ja) * 2013-03-29 2014-10-23 株式会社日立ハイテクノロジーズ 蒸発源及び真空蒸着装置及び有機ｅｌ表示装置の製造方法
WO2015122977A1 (en) * 2014-02-11 2015-08-20 Applied Materials, Inc. Extended precursor gas injection method
JP2015209559A (ja) * 2014-04-25 2015-11-24 日本精機株式会社 蒸着装置
KR101578655B1 (ko) * 2014-06-30 2015-12-28 주식회사 선익시스템 분사노즐 어셈블리 및 이를 포함하는 증발원
JP6941564B2 (ja) * 2016-05-10 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法
CN107435139A (zh) * 2016-05-26 2017-12-05 灿美工程股份有限公司 气体分配器及基板处理装置
JP6657239B2 (ja) * 2016-09-22 2020-03-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積源構成の分配アセンブリのためのノズル、材料堆積源構成、真空堆積システム、及び材料を堆積させるための方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011132596A (ja) * 2009-12-22 2011-07-07 Samsung Mobile Display Co Ltd 蒸発源及びそれを用いた蒸着装置
JP2017509796A (ja) * 2014-03-21 2017-04-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 有機材料用の蒸発源
JP2017535677A (ja) * 2014-11-07 2017-11-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法

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Publication number Publication date
KR20190127661A (ko) 2019-11-13
CN110691861A (zh) 2020-01-14
WO2019210972A1 (en) 2019-11-07

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