CN110691861A - 用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法 - Google Patents

用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法 Download PDF

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Publication number
CN110691861A
CN110691861A CN201880005013.4A CN201880005013A CN110691861A CN 110691861 A CN110691861 A CN 110691861A CN 201880005013 A CN201880005013 A CN 201880005013A CN 110691861 A CN110691861 A CN 110691861A
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CN
China
Prior art keywords
nozzle
plume
evaporation source
nozzles
section
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Pending
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CN201880005013.4A
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English (en)
Chinese (zh)
Inventor
安德烈亚斯·洛普
D·哈斯
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587—Mechanical means for changing the gas flow
    • C23C16/45591—Fixed means, e.g. wings, baffles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45578—Elongated nozzles, tubes with holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201880005013.4A 2018-05-04 2018-05-04 用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法 Pending CN110691861A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/061543 WO2019210972A1 (en) 2018-05-04 2018-05-04 Evaporation source for depositing an evaporated material, vacuum deposition system, and method for depositing an evaporated material

Publications (1)

Publication Number Publication Date
CN110691861A true CN110691861A (zh) 2020-01-14

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CN201880005013.4A Pending CN110691861A (zh) 2018-05-04 2018-05-04 用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法

Country Status (4)

Country Link
JP (1) JP2020521039A (ko)
KR (1) KR20190127661A (ko)
CN (1) CN110691861A (ko)
WO (1) WO2019210972A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230047440A (ko) * 2020-08-04 2023-04-07 어플라이드 머티어리얼스, 인코포레이티드 증기 소스, 증기 소스를 위한 노즐, 진공 증착 시스템, 및 증발된 재료를 증착하기 위한 방법

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01139758A (ja) * 1987-11-25 1989-06-01 Mitsubishi Electric Corp 薄膜蒸着方法および薄膜蒸着装置
US20100189929A1 (en) * 2009-01-28 2010-07-29 Neal James W Coating device and deposition apparatus
US20120237679A1 (en) * 2011-03-17 2012-09-20 Kateeva, Inc. Apparatus and methods for depositing one or more organic materials on a substrate
CN103261468A (zh) * 2010-12-21 2013-08-21 太阳能光电股份公司 蒸发源、蒸发室、涂覆方法以及喷嘴板
JP2014198863A (ja) * 2013-03-29 2014-10-23 株式会社日立ハイテクノロジーズ 蒸発源及び真空蒸着装置及び有機ｅｌ表示装置の製造方法
WO2015122977A1 (en) * 2014-02-11 2015-08-20 Applied Materials, Inc. Extended precursor gas injection method
JP2015209559A (ja) * 2014-04-25 2015-11-24 日本精機株式会社 蒸着装置
KR101578655B1 (ko) * 2014-06-30 2015-12-28 주식회사 선익시스템 분사노즐 어셈블리 및 이를 포함하는 증발원
WO2016070942A1 (en) * 2014-11-07 2016-05-12 Applied Materials, Inc. Material deposition arrangement and material distribution arrangement for vacuum deposition
CN107435139A (zh) * 2016-05-26 2017-12-05 灿美工程股份有限公司 气体分配器及基板处理装置
CN107592889A (zh) * 2016-05-10 2018-01-16 应用材料公司 用于沉积已蒸发材料的蒸发源与用于沉积已蒸发材料的方法
WO2018054472A1 (en) * 2016-09-22 2018-03-29 Applied Materials, Inc. Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101182265B1 (ko) * 2009-12-22 2012-09-12 삼성디스플레이 주식회사 증발원 및 이를 포함하는 증착 장치
CN106133183B (zh) * 2014-03-21 2020-03-03 应用材料公司 用于有机材料的蒸发源

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01139758A (ja) * 1987-11-25 1989-06-01 Mitsubishi Electric Corp 薄膜蒸着方法および薄膜蒸着装置
US20100189929A1 (en) * 2009-01-28 2010-07-29 Neal James W Coating device and deposition apparatus
CN103261468A (zh) * 2010-12-21 2013-08-21 太阳能光电股份公司 蒸发源、蒸发室、涂覆方法以及喷嘴板
US20120237679A1 (en) * 2011-03-17 2012-09-20 Kateeva, Inc. Apparatus and methods for depositing one or more organic materials on a substrate
JP2014198863A (ja) * 2013-03-29 2014-10-23 株式会社日立ハイテクノロジーズ 蒸発源及び真空蒸着装置及び有機ｅｌ表示装置の製造方法
WO2015122977A1 (en) * 2014-02-11 2015-08-20 Applied Materials, Inc. Extended precursor gas injection method
JP2015209559A (ja) * 2014-04-25 2015-11-24 日本精機株式会社 蒸着装置
KR101578655B1 (ko) * 2014-06-30 2015-12-28 주식회사 선익시스템 분사노즐 어셈블리 및 이를 포함하는 증발원
WO2016070942A1 (en) * 2014-11-07 2016-05-12 Applied Materials, Inc. Material deposition arrangement and material distribution arrangement for vacuum deposition
CN107502858A (zh) * 2014-11-07 2017-12-22 应用材料公司 真空沉积腔室
CN107592889A (zh) * 2016-05-10 2018-01-16 应用材料公司 用于沉积已蒸发材料的蒸发源与用于沉积已蒸发材料的方法
CN107435139A (zh) * 2016-05-26 2017-12-05 灿美工程股份有限公司 气体分配器及基板处理装置
WO2018054472A1 (en) * 2016-09-22 2018-03-29 Applied Materials, Inc. Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material

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Publication number Publication date
KR20190127661A (ko) 2019-11-13
WO2019210972A1 (en) 2019-11-07
JP2020521039A (ja) 2020-07-16

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Application publication date: 20200114