JP2020514996A5 - - Google Patents

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Publication number
JP2020514996A5
JP2020514996A5 JP2019542168A JP2019542168A JP2020514996A5 JP 2020514996 A5 JP2020514996 A5 JP 2020514996A5 JP 2019542168 A JP2019542168 A JP 2019542168A JP 2019542168 A JP2019542168 A JP 2019542168A JP 2020514996 A5 JP2020514996 A5 JP 2020514996A5
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JP
Japan
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column
electron
optical
columns
electro
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JP2019542168A
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English (en)
Japanese (ja)
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JP6971322B2 (ja
JP2020514996A (ja
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Priority claimed from US15/879,120 external-priority patent/US10777377B2/en
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JP2019542168A 2017-02-05 2018-02-03 フォトマスク及びレチクル検査並びにウェハプリントチェック検証のためのマルチカラム間隔 Active JP6971322B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762454807P 2017-02-05 2017-02-05
US62/454,807 2017-02-05
US15/879,120 2018-01-24
US15/879,120 US10777377B2 (en) 2017-02-05 2018-01-24 Multi-column spacing for photomask and reticle inspection and wafer print check verification
PCT/US2018/016761 WO2018144959A1 (en) 2017-02-05 2018-02-03 Multi-column spacing for photomask and reticle inspection and wafer print check verification

Publications (3)

Publication Number Publication Date
JP2020514996A JP2020514996A (ja) 2020-05-21
JP2020514996A5 true JP2020514996A5 (https=) 2021-03-11
JP6971322B2 JP6971322B2 (ja) 2021-11-24

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Application Number Title Priority Date Filing Date
JP2019542168A Active JP6971322B2 (ja) 2017-02-05 2018-02-03 フォトマスク及びレチクル検査並びにウェハプリントチェック検証のためのマルチカラム間隔

Country Status (8)

Country Link
US (1) US10777377B2 (https=)
JP (1) JP6971322B2 (https=)
KR (1) KR102272445B1 (https=)
CN (1) CN110431488B (https=)
DE (1) DE112018000672T5 (https=)
IL (1) IL268436B2 (https=)
TW (1) TWI746788B (https=)
WO (1) WO2018144959A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7126355B2 (ja) * 2018-02-21 2022-08-26 株式会社ニューフレアテクノロジー 荷電粒子ビーム検査方法
DE102020103339A1 (de) * 2020-02-10 2021-08-12 Carl Zeiss Microscopy Gmbh Verfahren zum Betrieb eines Teilchenstrahlgeräts, Computerprogrammprodukt und Teilchenstrahlgerät zur Durchführung des Verfahrens
JP7477364B2 (ja) * 2020-05-19 2024-05-01 株式会社ホロン マルチビーム画像生成装置およびマルチビーム画像生成方法
US11899375B2 (en) 2020-11-20 2024-02-13 Kla Corporation Massive overlay metrology sampling with multiple measurement columns

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384463A (en) * 1991-06-10 1995-01-24 Fujisu Limited Pattern inspection apparatus and electron beam apparatus
JPH10134757A (ja) * 1996-10-31 1998-05-22 Nikon Corp マルチビーム検査装置
WO1999050651A1 (fr) * 1998-03-27 1999-10-07 Hitachi, Ltd. Dispositif de verification de motifs
WO2001039243A1 (en) 1999-11-23 2001-05-31 Ion Diagnostics, Inc. Electron optics for multi-beam electron beam lithography tool
WO2001060456A1 (en) * 2000-02-19 2001-08-23 Ion Diagnostics, Inc. Multi-beam multi-column electron beam inspection system
US6855929B2 (en) * 2000-12-01 2005-02-15 Ebara Corporation Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former
KR20040062609A (ko) * 2001-11-02 2004-07-07 가부시키 가이샤 에바라 세이사꾸쇼 내장형 검사장치를 구비한 반도체 제조장치 및 그것을위한 방법
KR101279028B1 (ko) * 2005-02-17 2013-07-02 가부시키가이샤 에바라 세이사꾸쇼 전자선장치
EP2122655A2 (en) * 2007-02-22 2009-11-25 Applied Materials Israel Ltd. High throughput sem tool
JP2010519697A (ja) 2007-02-22 2010-06-03 アプライド マテリアルズ イスラエル リミテッド 高スループットｓｅｍツール
US8455838B2 (en) * 2011-06-29 2013-06-04 Kla-Tencor Corporation Multiple-column electron beam apparatus and methods
JP2013125652A (ja) * 2011-12-14 2013-06-24 Samsung Yokohama Research Institute Co Ltd 電子線装置
JP2013128069A (ja) * 2011-12-19 2013-06-27 Hitachi High-Technologies Corp 電子線検査装置、及び検査方法
US8806392B2 (en) * 2012-12-03 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Distinguishable IC patterns with encoded information
JP6090690B2 (ja) * 2012-12-04 2017-03-08 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 電子線装置
US9040910B2 (en) * 2013-05-23 2015-05-26 Tao Luo Multi-column electron beam inspection that uses custom printing methods
TWI658543B (zh) * 2013-12-05 2019-05-01 Stats Chippac, Ltd. 在半導體封裝中使用標準化載體的半導體裝置及方法
JP6677657B2 (ja) * 2015-02-05 2020-04-08 株式会社荏原製作所 検査装置

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