JP2020501352A - トランジスタセル - Google Patents
トランジスタセル Download PDFInfo
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- JP2020501352A JP2020501352A JP2019528090A JP2019528090A JP2020501352A JP 2020501352 A JP2020501352 A JP 2020501352A JP 2019528090 A JP2019528090 A JP 2019528090A JP 2019528090 A JP2019528090 A JP 2019528090A JP 2020501352 A JP2020501352 A JP 2020501352A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 150
- 239000002184 metal Substances 0.000 claims abstract description 150
- 230000005669 field effect Effects 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 9
- 150000004767 nitrides Chemical class 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 abstract 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 12
- 229910002601 GaN Inorganic materials 0.000 description 11
- 230000037230 mobility Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
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- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/435—Resistive materials for field effect devices, e.g. resistive gate for MOSFET or MESFET
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (4)
- 長手方向の寸法を有する複数のトランジスタセルを備えるGaN電界効果トランジスタ(FET)であって、前記トランジスタセルの各々は、
シリコン基板と、
III−V窒化物半導体層と、
オーミック金属ソース端子及びオーミック金属ドレイン端子を備えるオーミック金属層と、
ゲート−ドレインオーバーハング、ゲート−ソースオーバーハング及び前記トランジスタセルの各々の狭端部におけるワイドニングを備えるゲート金属層であって、前記ゲート−ドレインオーバーハングの幅が0.2μm〜2.5μmであり、前記ゲート−ソースオーバーハングの幅が0.3μm〜1μmであり、前記ゲート金属層の前記ワイドニングの幅が2〜5μmである、ゲート金属層と、
金属0層と、
ゲートバスを備え、前記金属0層を超え、前記トランジスタセルの前記長手方向寸法に沿って、前記トランジスタセルの中心に向かって延びて第2のフィールドプレートを定める金属1層であって、前記第2のフィールドプレートの幅が3〜6μmであり、前記金属1層と前記金属0層との間の重なりが−1μm〜7μmである、金属1層と、
各々が台形形状を有するドレインプレート及びソースプレートを備える最終金属層と、
各々が、前記ゲート金属層のワイドニングに配置され、前記ゲート金属層を前記ゲートバスに電気的に接続するための、2つの第1のビア1アレイであって、各々が2つより多くのビアを含む、2つの第1のビア1アレイと、
前記トランジスタセルの長手方向寸法に沿って分布し、前記金属1層を前記金属0層に電気的に接続するための、6つより多くのタイプ1ビアと、
前記金属1層からのドレイン領域を前記最終金属層内の前記ドレインプレートに電気的に接続し、前記金属1層からのソース領域を前記最終金属層内の前記ソースプレートに電気的に接続する、複数のタイプ2ビアと、
を備え、
ゲート金属層、金属0層及び金属1層は誘電物質によって絶縁される、
GaN FET。 - 前記GaN FETは、Dモード又はEモードGaN FETである、請求項1に記載のGaN FET。
- 前記金属1層は、前記トランジスタセルの各々の前記長手方向寸法に沿って延びる開口を含む、請求項1に記載のGaN FET。
- 前記金属1層からのドレイン領域を前記最終金属層内の前記ドレインプレートに電気的に接続するタイプ2ビアの数は、前記ドレインプレートの幅に適合させられ、前記金属1層からのソース領域を前記最終金属層内の前記ソースプレートに電気的に接続するタイプ2ビアの数は、前記ソースプレートの幅に適合させられる、請求項1に記載のGaN FET。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023150223A JP2023166570A (ja) | 2016-11-24 | 2023-09-15 | トランジスタセル |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201662426257P | 2016-11-24 | 2016-11-24 | |
US62/426,257 | 2016-11-24 | ||
PCT/IL2017/051281 WO2018096537A1 (en) | 2016-11-24 | 2017-11-23 | Transistor cell |
Related Child Applications (1)
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JP2023150223A Division JP2023166570A (ja) | 2016-11-24 | 2023-09-15 | トランジスタセル |
Publications (1)
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JP2020501352A true JP2020501352A (ja) | 2020-01-16 |
Family
ID=62194833
Family Applications (2)
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JP2019528090A Pending JP2020501352A (ja) | 2016-11-24 | 2017-11-23 | トランジスタセル |
JP2023150223A Pending JP2023166570A (ja) | 2016-11-24 | 2023-09-15 | トランジスタセル |
Family Applications After (1)
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JP2023150223A Pending JP2023166570A (ja) | 2016-11-24 | 2023-09-15 | トランジスタセル |
Country Status (5)
Country | Link |
---|---|
US (1) | US10930737B2 (ja) |
EP (1) | EP3545623A4 (ja) |
JP (2) | JP2020501352A (ja) |
CN (1) | CN110168936B (ja) |
WO (1) | WO2018096537A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020501352A (ja) * | 2016-11-24 | 2020-01-16 | ヴィジック テクノロジーズ リミテッド | トランジスタセル |
IT201800010195A1 (it) * | 2018-11-09 | 2020-05-09 | St Microelectronics Srl | Dispositivo elettronico a conduzione laterale basato su gan con layout degli strati metallici migliorato |
JP2021089934A (ja) * | 2019-12-03 | 2021-06-10 | 株式会社東芝 | 半導体装置 |
US20220376070A1 (en) * | 2020-06-30 | 2022-11-24 | Innoscience (Zhuhai) Technology Co., Ltd. | Semiconductor device and fabrication method thereof |
US11398557B2 (en) * | 2020-08-18 | 2022-07-26 | Vanguard International Semiconductor Corporation | Semiconductor device |
CN116344589B (zh) * | 2023-05-22 | 2023-09-15 | 深圳智芯微电子科技有限公司 | GaN器件及其制备方法 |
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-
2017
- 2017-11-23 JP JP2019528090A patent/JP2020501352A/ja active Pending
- 2017-11-23 WO PCT/IL2017/051281 patent/WO2018096537A1/en unknown
- 2017-11-23 US US16/462,645 patent/US10930737B2/en active Active
- 2017-11-23 EP EP17873165.9A patent/EP3545623A4/en active Pending
- 2017-11-23 CN CN201780082687.XA patent/CN110168936B/zh active Active
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- 2023-09-15 JP JP2023150223A patent/JP2023166570A/ja active Pending
Patent Citations (6)
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US20150028384A1 (en) * | 2013-07-29 | 2015-01-29 | Efficient Power Conversion Corporation | GaN TRANSISTORS WITH POLYSILICON LAYERS FOR CREATING ADDITIONAL COMPONENTS |
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US20170104064A1 (en) * | 2015-10-09 | 2017-04-13 | Sanken Electric Co., Ltd. | Nitride semiconductor device with asymmetric electrode tips |
Also Published As
Publication number | Publication date |
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US20190280089A1 (en) | 2019-09-12 |
WO2018096537A1 (en) | 2018-05-31 |
EP3545623A1 (en) | 2019-10-02 |
CN110168936A (zh) | 2019-08-23 |
JP2023166570A (ja) | 2023-11-21 |
CN110168936B (zh) | 2023-06-09 |
EP3545623A4 (en) | 2020-05-13 |
US10930737B2 (en) | 2021-02-23 |
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