JP2020190742A - リソグラフィ装置 - Google Patents
リソグラフィ装置 Download PDFInfo
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- JP2020190742A JP2020190742A JP2020124840A JP2020124840A JP2020190742A JP 2020190742 A JP2020190742 A JP 2020190742A JP 2020124840 A JP2020124840 A JP 2020124840A JP 2020124840 A JP2020124840 A JP 2020124840A JP 2020190742 A JP2020190742 A JP 2020190742A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
[001] 本出願は、2016年5月25日に出願された欧州特許出願第16171338.3号の優先権を主張し、この特許出願は、参照によりその全体において本明細書で援用される。
基板を保持するための保持面を有する基板ホルダと、
基板上に画像を投影するための投影システムと、
基板ホルダの位置を表す信号を供給するためのエンコーダシステムと、
測定フレームと、
リソグラフィ装置の特性を測定するための測定システムと、
を含み、
保持面が、平面に沿い、
投影システムが、平面の第1の側にあり、
測定フレームが、第1の側と異なる平面の第2の側において、エンコーダシステムの少なくとも一部、及び測定システムの少なくとも一部を支持するように配置されるリソグラフィ装置が提供される。
Claims (15)
- リソグラフィ装置であって、
基板を保持するための保持面を有する基板テーブルと、
前記基板上に画像を投影するための投影システムと、
前記基板テーブルの位置を表す信号を供給するためのエンコーダシステムと、
測定フレームと、
前記リソグラフィ装置の特性を測定するための測定システムと、
を含み、
前記保持面が、平面に沿い、
前記投影システムが、前記平面の第1の側にあり、
前記測定フレームが、前記第1の側と異なる前記平面の第2の側において、前記エンコーダシステムの少なくとも一部と、前記測定システムの少なくとも一部とを支持するリソグラフィ装置。 - 前記測定システムが、前記測定フレーム上に検出器を含み、前記検出器が、放射ビームを受光する、請求項1に記載のリソグラフィ装置。
- マークであって、前記投影システムが、前記マークを介して前記放射ビームを前記検出器上に供給するマークを含む、請求項2に記載のリソグラフィ装置。
- パターニングデバイスを支持するためのサポート構造であって、前記サポート構造及び前記パターニングデバイスの1つが、パターニングマークを有し、前記投影システムが、前記パターニングマークに基づいた画像を前記マーク上に投影するサポート構造を含む、請求項3に記載のリソグラフィ装置。
- 前記測定システムが、前記放射ビームに基づいて、前記投影システムの画質を決定する、請求項2〜4の何れか一項に記載のリソグラフィ装置。
- 前記マークが、前記基板テーブル上に配置される、請求項3〜5の何れか一項に記載のリソグラフィ装置。
- 前記基板テーブルが、前記平面に沿った方向に前記放射ビームを少なくとも部分的に伝播する光学システムを含む、請求項6に記載のリソグラフィ装置。
- 更なるステージであって、前記基板が前記投影システムから離れている場合に、前記更なるステージが、前記投影システムの所にあるように配置され、前記マークが、前記更なるステージ上に配置される更なるステージを含む、請求項3〜5の何れか一項に記載のリソグラフィ装置。
- 液体供給システムであって、前記基板が前記投影システムの所にある場合に、前記液体供給システムが、前記投影システムと前記基板との間で液体を供給し、前記基板が前記投影システムから離れている場合に、前記液体供給システムが、前記投影システムと前記更なるステージとの間で液体を供給する液体供給システムを含む、請求項8に記載のリソグラフィ装置。
- 前記エンコーダシステム用に位置基準を提供するための基準マークであって、前記検出器が、前記基準マークを介して前記放射ビームを受光する基準マークを含む、請求項2に記載のリソグラフィ装置。
- 前記エンコーダシステムが、前記基板テーブル上にスケールを含み、前記基準マークが、前記スケール上に配置される、請求項10に記載のリソグラフィ装置。
- 前記基板が、基板マークが設けられた表面を有し、前記検出器が、前記基板マークを介して前記放射ビームを受光する、請求項2に記載のリソグラフィ装置。
- 前記測定システムが、前記マークの位置に対して前記基板マークの位置を決定する、請求項12に記載のリソグラフィ装置。
- 前記測定システムが、前記放射ビームを供給するための放射源を含み、前記放射源が、前記測定フレーム上に配置される、請求項2〜13の何れか一項に記載のリソグラフィ装置。
- 前記信号と前記測定システムからの出力とに基づいて、前記基板テーブルの位置を制御するための制御システムを含む、請求項1〜14の何れか一項に記載のリソグラフィ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16171338.3 | 2016-05-25 | ||
EP16171338 | 2016-05-25 | ||
JP2018555613A JP6740370B2 (ja) | 2016-05-25 | 2017-04-20 | リソグラフィ装置 |
Related Parent Applications (1)
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JP2018555613A Division JP6740370B2 (ja) | 2016-05-25 | 2017-04-20 | リソグラフィ装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020190742A true JP2020190742A (ja) | 2020-11-26 |
JP6957692B2 JP6957692B2 (ja) | 2021-11-02 |
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JP2018555613A Active JP6740370B2 (ja) | 2016-05-25 | 2017-04-20 | リソグラフィ装置 |
JP2020124840A Active JP6957692B2 (ja) | 2016-05-25 | 2020-07-22 | リソグラフィ装置 |
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JP2018555613A Active JP6740370B2 (ja) | 2016-05-25 | 2017-04-20 | リソグラフィ装置 |
Country Status (6)
Country | Link |
---|---|
US (5) | US10466599B2 (ja) |
JP (2) | JP6740370B2 (ja) |
CN (1) | CN109154782B (ja) |
NL (1) | NL2018755A (ja) |
TW (1) | TWI751165B (ja) |
WO (1) | WO2017202546A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6740370B2 (ja) | 2016-05-25 | 2020-08-12 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置 |
EP3531206A1 (en) * | 2018-02-23 | 2019-08-28 | ASML Netherlands B.V. | Systems and methods for improving resist model predictions |
CN111290217B (zh) * | 2018-12-06 | 2022-12-13 | 苏州苏大维格科技集团股份有限公司 | 用于光刻基片的承载台、光刻机及基片光刻的方法 |
US11550227B2 (en) | 2019-01-18 | 2023-01-10 | Asml Netherlands B.V. | Projection system and lithographic apparatus comprising said projection system |
KR20230023004A (ko) * | 2020-07-10 | 2023-02-16 | 에이에스엠엘 네델란즈 비.브이. | 광학 장치를 컨디셔닝하기 위한 시스템 및 방법 |
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JP6740370B2 (ja) * | 2016-05-25 | 2020-08-12 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置 |
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2017
- 2017-04-20 JP JP2018555613A patent/JP6740370B2/ja active Active
- 2017-04-20 CN CN201780032309.0A patent/CN109154782B/zh active Active
- 2017-04-20 WO PCT/EP2017/059383 patent/WO2017202546A1/en active Application Filing
- 2017-04-20 US US16/099,733 patent/US10466599B2/en active Active
- 2017-04-20 NL NL2018755A patent/NL2018755A/en unknown
- 2017-05-24 TW TW106117086A patent/TWI751165B/zh active
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2019
- 2019-08-22 US US16/547,933 patent/US10571815B2/en active Active
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