JP2020188203A - Positioning jig for soldering - Google Patents

Positioning jig for soldering Download PDF

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Publication number
JP2020188203A
JP2020188203A JP2019093006A JP2019093006A JP2020188203A JP 2020188203 A JP2020188203 A JP 2020188203A JP 2019093006 A JP2019093006 A JP 2019093006A JP 2019093006 A JP2019093006 A JP 2019093006A JP 2020188203 A JP2020188203 A JP 2020188203A
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plate
positioning jig
insulating substrate
shaped member
soldering
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JP7050718B2 (en
Inventor
吉田　健治
Kenji Yoshida
健治 吉田
佑樹 矢野
Yuki Yano
佑樹 矢野
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2019093006A priority Critical patent/JP7050718B2/en
Priority to DE102020112058.3A priority patent/DE102020112058A1/en
Priority to CN202010393122.7A priority patent/CN111954393B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

To provide a positioning jig for soldering, capable of reducing an amount of variation in the position of electronic components even if a dimension of an insulating substrate changes due to manufacturing variations in insulating substrates.SOLUTION: A positioning jig 1 for soldering includes a plate-like member 2 which is set onto an insulating substrate 11 while being brought into contact with the top faces of circuit patterns 14a, 14b, 14, 14d. The plate like member 2 includes: an opening 4 formed in the plate-like member 2 such that an electronic component 15 can be exposed; and a pair of protrusions 5 formed at a peripheral part of the opening 4 in the plate-like member 2 and projecting toward an insulating substrate 11 side such that the pair of protrusions can be inserted into a groove 16 formed between the circuit patterns 14a, 14b in the insulating substrate 11.SELECTED DRAWING: Figure 2

Description

本発明は、はんだ付け用位置決め治具に関するものである。 The present invention relates to a soldering positioning jig.

パワーモジュールの組み立てにおいて、絶縁基板上に形成された複数の回路パターンとの間に橋渡しされたチップ抵抗およびコンデンサなどの電子部品の接合材として一般的にはんだ材が使用されている。従来は、はんだ材としてフラックスと球状のはんだとを混練したペーストはんだが使用されていた。この場合、回路パターン上の一部に、印刷によりペーストはんだを塗布後、電子部品を搭載してリフローを行うことではんだを溶融させ、その後、フラックスを除去するために洗浄していた。 In assembling a power module, a solder material is generally used as a bonding material for electronic components such as chip resistors and capacitors bridged between a plurality of circuit patterns formed on an insulating substrate. Conventionally, paste solder, which is a mixture of flux and spherical solder, has been used as the solder material. In this case, paste solder was applied to a part of the circuit pattern by printing, and then electronic components were mounted and reflowed to melt the solder, and then cleaning was performed to remove the flux.

近年は、ペーストはんだを使用せずに板はんだを使用したはんだ付け工程が広がっており、フラックスを使用しないため洗浄が不要となり、製造コストの低減が可能となる。 In recent years, the soldering process using plate solder without using paste solder has become widespread, and since no flux is used, cleaning becomes unnecessary and the manufacturing cost can be reduced.

但し、ペーストはんだから板はんだに変わることより電子部品を保持する機能が低下するため、はんだ付け時に電子部品をアライメントするためのはんだ付け用位置決め治具が必要になる。はんだ付け用位置決め治具は回路パターンまたはベース板の外形により位置決めされるが、これらの製造ばらつきにより、電子部品に位置ずれが発生し電子部品が傾いたりする。そのため、電子部品と回路パターンとの接合が不完全になることがあり、このような問題を解消するために、電子部品が搭載される回路パターンの周辺で位置決めすることが考えられる。 However, since the function of holding electronic components deteriorates due to the change from paste solder to plate solder, a soldering positioning jig for aligning electronic components at the time of soldering is required. The positioning jig for soldering is positioned according to the circuit pattern or the outer shape of the base plate, but due to these manufacturing variations, the electronic components may be displaced and the electronic components may be tilted. Therefore, the connection between the electronic component and the circuit pattern may be incomplete, and in order to solve such a problem, it is conceivable to position the electronic component around the circuit pattern on which the electronic component is mounted.

例えば特許文献１には、固定器具には回路基板に固定するための枠と小型電子部品を固定するための凹部が設けられ、はんだ付け時の小型電子部品の端子と基板上の電極との位置ずれを防ぐ固定器具により小型電子部品の実装を行う方法が開示されている。 For example, in Patent Document 1, the fixing device is provided with a frame for fixing to a circuit board and a recess for fixing a small electronic component, and the positions of the terminal of the small electronic component and the electrode on the board during soldering are provided. A method of mounting a small electronic component with a fixing device for preventing displacement is disclosed.

また、例えば特許文献２には、位置決め治具を位置決めする位置決め部として、基板に位置決め治具の下部が嵌合する凹部が設けられる構造が開示されている。 Further, for example, Patent Document 2 discloses a structure in which a recess for fitting the lower portion of the positioning jig is provided on the substrate as a positioning portion for positioning the positioning jig.

特開昭６２−２５０６８７号公報Japanese Unexamined Patent Publication No. 62-250686 特開２００９−２３１３７９号公報JP-A-2009-231379

しかしながら、特許文献１に記載の技術では、回路基板の製造ばらつきにより回路基板の寸法が変化した場合、固定器具の位置がずれるため、電子部品の位置ばらつき量が大きくなるという問題があった。 However, the technique described in Patent Document 1 has a problem that when the size of the circuit board changes due to the manufacturing variation of the circuit board, the position of the fixing device shifts, so that the amount of the position variation of the electronic component becomes large.

また、特許文献２に記載の技術では、基板の端部から端部まで複数の箇所で位置決めするため、はんだ付け時の基板の熱膨張を考慮して位置決め治具とのクリアランスが必要となる。そのため、電子部品の位置ばらつき量が大きくなるという問題があった。 Further, in the technique described in Patent Document 2, since positioning is performed at a plurality of locations from one end to the other of the substrate, a clearance with the positioning jig is required in consideration of thermal expansion of the substrate during soldering. Therefore, there is a problem that the amount of positional variation of electronic components becomes large.

そこで、本発明は、絶縁基板の製造ばらつきにより絶縁基板の寸法が変化した場合にも、電子部品の位置ばらつき量を小さくすることが可能なはんだ付け用位置決め治具を提供することを目的とする。 Therefore, an object of the present invention is to provide a soldering positioning jig capable of reducing the amount of positional variation of electronic components even when the dimensions of the insulating substrate change due to manufacturing variation of the insulating substrate. ..

本発明に係るはんだ付け用位置決め治具は、絶縁基板上に形成された複数の回路パターンの間に橋渡しされた電子部品をはんだ付けする工程において前記絶縁基板にセットされるはんだ付け用位置決め治具であって、前記回路パターンの上面に接触させた状態で前記絶縁基板にセットされる板状部材を備え、前記板状部材は、前記電子部品が露出可能なように前記板状部材に形成された開口部と、前記板状部材における前記開口部の周縁部に形成され、かつ、前記絶縁基板における複数の前記回路パターンの間に形成された溝に挿入可能なように、前記絶縁基板側に突出する一対の突起部とを有するものである。 The soldering positioning jig according to the present invention is a soldering positioning jig set on the insulating substrate in the step of soldering electronic components bridged between a plurality of circuit patterns formed on the insulating substrate. The plate-shaped member is provided on the insulating substrate in contact with the upper surface of the circuit pattern, and the plate-shaped member is formed on the plate-shaped member so that the electronic component can be exposed. On the insulating substrate side so that it can be inserted into a groove formed on the peripheral portion of the opening in the plate-shaped member and between the plurality of circuit patterns in the insulating substrate. It has a pair of protruding portions.

本発明によれば、絶縁基板の製造ばらつきにより絶縁基板の寸法が変化した場合にも、電子部品の位置ばらつき量を小さくすることができる。 According to the present invention, the amount of positional variation of electronic components can be reduced even when the dimensions of the insulating substrate change due to manufacturing variation of the insulating substrate.

実施の形態１に係るはんだ付け用位置決め治具の背面斜視図である。It is a rear perspective view of the soldering positioning jig which concerns on Embodiment 1. FIG. はんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the positioning jig for soldering on an insulating substrate. はんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the positioning jig for soldering on an insulating substrate. 絶縁基板に電子部品が実装された状態を示す斜視図である。It is a perspective view which shows the state which the electronic component is mounted on the insulating substrate. 実施の形態２に係るはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 2 on an insulating substrate. 実施の形態３に係るはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 3 on an insulating substrate. 実施の形態４に係るはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 4 on an insulating substrate. 実施の形態４の変形例に係るはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which concerns on the modification of Embodiment 4 on an insulating substrate. 実施の形態５に係るはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 5 on an insulating substrate. 実施の形態６に係るはんだ付け用位置決め治具の断面図である。It is sectional drawing of the soldering positioning jig which concerns on Embodiment 6. 突起部が設けられていないはんだ付け用位置決め治具を絶縁基板にセットした状態を示す断面図である。It is sectional drawing which shows the state which set the soldering positioning jig which does not provide a protrusion on the insulating substrate.

＜実施の形態１＞
本発明の実施の形態１について、図面を用いて以下に説明する。図１は、実施の形態１に係るはんだ付け用位置決め治具１の背面斜視図である。図２は、はんだ付け用位置決め治具１を絶縁基板１１にセットした状態を示す断面図であり、具体的には、図１を上下逆にしてＡ−Ａ線で切断した断面形状と絶縁基板１１の断面形状を示す図である。図３は、はんだ付け用位置決め治具１を絶縁基板１１にセットした状態を示す断面図であり、具体的には、図１を上下逆にしてＢ−Ｂ線で切断した断面形状と絶縁基板１１の断面形状を示す図である。 <Embodiment 1>
Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is a rear perspective view of the soldering positioning jig 1 according to the first embodiment. FIG. 2 is a cross-sectional view showing a state in which the soldering positioning jig 1 is set on the insulating substrate 11. Specifically, FIG. 1 is turned upside down and cut along the line AA. It is a figure which shows the cross-sectional shape of 11. FIG. 3 is a cross-sectional view showing a state in which the soldering positioning jig 1 is set on the insulating substrate 11. Specifically, FIG. 1 is turned upside down and cut along the BB line, and the cross-sectional shape and the insulating substrate are shown. It is a figure which shows the cross-sectional shape of 11.

図１〜図３に示すように、はんだ付け用位置決め治具１は、電子部品１５をはんだ付けする工程において絶縁基板１１にセットされる治具である。 As shown in FIGS. 1 to 3, the soldering positioning jig 1 is a jig set on the insulating substrate 11 in the step of soldering the electronic component 15.

最初に、図４を用いて絶縁基板１１と電子部品１５について説明する。図４は、絶縁基板１１に電子部品１５が実装された状態を示す斜視図である。絶縁基板１１は、ベース板１２、およびベース板１２の上面に形成された絶縁層１３を備えている。絶縁基板１１の上面には回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄが形成されている。電子部品１５は、例えばチップ抵抗またはコンデンサなどであり、平面視にて矩形状である。電子部品１５は、回路パターン１４ａ，１４ｂの間に橋渡しされた状態で配置され、この状態で回路パターン１４ａ，１４ｂにはんだ付けされることで接合される。 First, the insulating substrate 11 and the electronic component 15 will be described with reference to FIG. FIG. 4 is a perspective view showing a state in which the electronic component 15 is mounted on the insulating substrate 11. The insulating substrate 11 includes a base plate 12 and an insulating layer 13 formed on the upper surface of the base plate 12. Circuit patterns 14a, 14b, 14c, and 14d are formed on the upper surface of the insulating substrate 11. The electronic component 15 is, for example, a chip resistor or a capacitor, and has a rectangular shape in a plan view. The electronic component 15 is arranged in a state of being bridged between the circuit patterns 14a and 14b, and is joined by being soldered to the circuit patterns 14a and 14b in this state.

はんだ付け用位置決め治具１の説明に戻る。図１〜図３に示すように、はんだ付け用位置決め治具１は、平面視にて矩形状の板状部材２を備えている。板状部材２は、回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄの上面に接触させた状態で絶縁基板１１にセットされ、枠部３、開口部４、および一対の突起部５を有している。 Returning to the description of the soldering positioning jig 1. As shown in FIGS. 1 to 3, the soldering positioning jig 1 includes a rectangular plate-shaped member 2 in a plan view. The plate-shaped member 2 is set on the insulating substrate 11 in a state of being in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, and 14d, and has a frame portion 3, an opening 4, and a pair of protrusions 5.

枠部３は、板状部材２の周縁部の全周に渡って形成されている。枠部３は、板状部材２の周縁部の下面から下方に突出し、はんだ付け用位置決め治具１が絶縁基板１１にセットされた状態で絶縁基板１１の上面に当接している。開口部４は、平面視にて矩形状であり、板状部材２の中央部に形成されている。開口部４の平面視輪郭は、電子部品１５の平面視輪郭よりも大きな形状であり、電子部品１５は開口部４から露出可能である。 The frame portion 3 is formed over the entire circumference of the peripheral edge portion of the plate-shaped member 2. The frame portion 3 projects downward from the lower surface of the peripheral edge portion of the plate-shaped member 2, and is in contact with the upper surface of the insulating substrate 11 in a state where the soldering positioning jig 1 is set on the insulating substrate 11. The opening 4 has a rectangular shape in a plan view and is formed in the central portion of the plate-shaped member 2. The plan view contour of the opening 4 has a shape larger than the plan view contour of the electronic component 15, and the electronic component 15 can be exposed from the opening 4.

一対の突起部５は、板状部材２における開口部４の周縁部において互いに対向する位置、すなわち、図１の紙面の前後方向の位置に形成されている。一対の突起部５は、この位置から絶縁基板１１側である下方に突出しており、回路パターン１４ａ，１４ｂの間に形成された溝１６に挿入可能である。なお、図１の紙面の前後方向を前後方向、図１の紙面の左右方向を左右方向として説明する。 The pair of protrusions 5 are formed at positions facing each other on the peripheral edge of the opening 4 of the plate-shaped member 2, that is, at positions in the front-rear direction of the paper surface of FIG. The pair of protrusions 5 project downward from this position on the insulating substrate 11 side, and can be inserted into the grooves 16 formed between the circuit patterns 14a and 14b. The front-back direction of the paper surface of FIG. 1 will be described as the front-rear direction, and the left-right direction of the paper surface of FIG. 1 will be described as the left-right direction.

次に、絶縁基板１１に対するはんだ付け用位置決め治具１の位置決め方法について説明する。図２に示すように、板状部材２における左右方向の端は、回路パターン１４ａ，１４ｂの外周端よりも外周側に位置しており、枠部３の内壁と回路パターン１４ａ，１４ｂの外周端との間にはクリアランスが形成されている。一対の突起部５が回路パターン１４ａ，１４ｂの間に形成された溝１６に挿入されることで、はんだ付け用位置決め治具１の横方向の位置決めがなされている。 Next, a method of positioning the soldering positioning jig 1 with respect to the insulating substrate 11 will be described. As shown in FIG. 2, the left-right ends of the plate-shaped member 2 are located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14a and 14b, and the inner wall of the frame portion 3 and the outer peripheral ends of the circuit patterns 14a and 14b. A clearance is formed between the two. By inserting the pair of protrusions 5 into the grooves 16 formed between the circuit patterns 14a and 14b, the soldering positioning jig 1 is positioned in the lateral direction.

図３に示すように、板状部材２における前後方向の端は、回路パターン１４ｃ，１４ｄの外周端よりも外周側に位置しており、枠部３の内壁は回路パターン１４ｃ，１４ｄの外周端に当接している。板状部材２の枠部３の内壁が回路パターン１４ｃ，１４ｄの外周端に当接することで、はんだ付け用位置決め治具１の前後方向の位置決めがなされている。 As shown in FIG. 3, the front-rear end of the plate-shaped member 2 is located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14c and 14d, and the inner wall of the frame portion 3 is the outer peripheral end of the circuit patterns 14c and 14d. Is in contact with. The inner wall of the frame portion 3 of the plate-shaped member 2 comes into contact with the outer peripheral ends of the circuit patterns 14c and 14d, so that the soldering positioning jig 1 is positioned in the front-rear direction.

このように、絶縁基板１１に対してはんだ付け用位置決め治具１が位置決めされた状態で、電子部品１５は開口部４を通って、回路パターン１４ａ，１４ｂの間を橋渡しするように配置され、回路パターン１４ａ，１４ｂにはんだ付けされることで接合される。ここで、電子部品１５は、回路パターン１４ａ，１４ｂの間を橋渡しするように実装されるため、左右方向の位置決めが前後方向の位置決めよりも重要となる。 In this way, with the soldering positioning jig 1 positioned with respect to the insulating substrate 11, the electronic component 15 is arranged so as to bridge between the circuit patterns 14a and 14b through the opening 4. It is joined by being soldered to the circuit patterns 14a and 14b. Here, since the electronic component 15 is mounted so as to bridge between the circuit patterns 14a and 14b, positioning in the left-right direction is more important than positioning in the front-rear direction.

次に、実施の形態１に係るはんだ付け用位置決め治具１の効果について、突起部５が設けられていないはんだ付け用位置決め治具１０１を絶縁基板１１にセットした場合と比較して説明する。図１１は、突起部５が設けられていないはんだ付け用位置決め治具１０１を絶縁基板１１にセットした状態を示す断面図である。 Next, the effect of the soldering positioning jig 1 according to the first embodiment will be described in comparison with the case where the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11. FIG. 11 is a cross-sectional view showing a state in which the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11.

図１１に示すように、突起部５が設けられていないはんだ付け用位置決め治具１０１は、電子部品１５が搭載される回路パターン１４ａ，１４ｂの外周端を基準にして絶縁基板１１にセットされるため、絶縁基板１１の製造ばらつきにより絶縁基板１１の寸法が変化した場合、はんだ付け用位置決め治具１０１の位置がずれるため、電子部品１５に位置ずれが発生し電子部品１５が傾いたりして電子部品１５と回路パターン１４ａ，１４ｂとの接合が不完全になることがある。 As shown in FIG. 11, the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11 with reference to the outer peripheral ends of the circuit patterns 14a and 14b on which the electronic component 15 is mounted. Therefore, when the dimensions of the insulating substrate 11 change due to the manufacturing variation of the insulating substrate 11, the position of the soldering positioning jig 101 shifts, so that the electronic component 15 is displaced and the electronic component 15 is tilted. The connection between the component 15 and the circuit patterns 14a and 14b may be incomplete.

これに対して、実施の形態１に係るはんだ付け用位置決め治具１では、回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄの上面に接触させた状態で絶縁基板１１にセットされる板状部材２を備え、板状部材２は、電子部品１５が露出可能なように板状部材２に形成された開口部４と、板状部材２における開口部４の周縁部に形成され、かつ、絶縁基板１１における回路パターン１４ａ，１４ｂの間に形成された溝１６に挿入可能なように、絶縁基板１１側に突出する一対の突起部５とを有している。 On the other hand, the soldering positioning jig 1 according to the first embodiment includes a plate-shaped member 2 set on the insulating substrate 11 in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, 14d. The plate-shaped member 2 is formed in an opening 4 formed in the plate-shaped member 2 so that the electronic component 15 can be exposed, and a peripheral edge portion of the opening 4 in the plate-shaped member 2, and is formed in the insulating substrate 11. It has a pair of protrusions 5 protruding toward the insulating substrate 11 so that it can be inserted into the groove 16 formed between the circuit patterns 14a and 14b.

したがって、絶縁基板１１における回路パターン１４ａ，１４ｂの間に形成された溝１６に一対の突起部５が挿入されることで、絶縁基板１１に対するはんだ付け用位置決め治具１の位置決めがなされるため、絶縁基板１１の製造ばらつきの影響を受けることなく電子部品１５の位置ばらつき量が小さくなり、電子部品１５の位置が安定する。これにより、電子部品１５と回路パターン１４ａ，１４ｂとが安定した状態で接合されるため、絶縁基板１１の回路パターン１４ａ，１４ｂに電子部品１５が実装された製品の歩留りが向上する。 Therefore, by inserting the pair of protrusions 5 into the grooves 16 formed between the circuit patterns 14a and 14b of the insulating substrate 11, the soldering positioning jig 1 is positioned with respect to the insulating substrate 11. The amount of positional variation of the electronic component 15 is reduced without being affected by the manufacturing variation of the insulating substrate 11, and the position of the electronic component 15 is stabilized. As a result, the electronic component 15 and the circuit patterns 14a and 14b are joined in a stable state, so that the yield of the product in which the electronic component 15 is mounted on the circuit patterns 14a and 14b of the insulating substrate 11 is improved.

そして、はんだ付け用位置決め治具１は、電子部品１５が実装される絶縁基板１１の中央部付近の２箇所で位置決めするため、はんだ付け用位置決め治具１に高い寸法精度は不要である。これにより、はんだ付け用位置決め治具１の製造コストが上昇することを抑制できる。また、この位置決め方法は絶縁基板１１の熱膨張による影響を受けにくいことから、絶縁基板１１とはんだ付け用位置決め治具１とのクリアランスを小さくすることができる。これによっても電子部品１５の位置ばらつき量が小さくなり、電子部品１５の位置が安定する。 Since the soldering positioning jig 1 is positioned at two locations near the central portion of the insulating substrate 11 on which the electronic component 15 is mounted, the soldering positioning jig 1 does not need to have high dimensional accuracy. As a result, it is possible to suppress an increase in the manufacturing cost of the soldering positioning jig 1. Further, since this positioning method is not easily affected by the thermal expansion of the insulating substrate 11, the clearance between the insulating substrate 11 and the soldering positioning jig 1 can be reduced. This also reduces the amount of positional variation of the electronic component 15, and stabilizes the position of the electronic component 15.

＜実施の形態２＞
次に、実施の形態２に係るはんだ付け用位置決め治具１Ａについて説明する。図５は、実施の形態２に係るはんだ付け用位置決め治具１Ａを絶縁基板１１にセットした状態を示す断面図である。なお、実施の形態２において、実施の形態１で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 2>
Next, the soldering positioning jig 1A according to the second embodiment will be described. FIG. 5 is a cross-sectional view showing a state in which the soldering positioning jig 1A according to the second embodiment is set on the insulating substrate 11. In the second embodiment, the same components as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

図５に示すように、実施の形態２では、電子部品１５が２つ実装され、これに合わせて板状部材２は、開口部４を２つ有し、かつ、一対の突起部５を２つ有している。一方の電子部品１５は回路パターン１４ａ，１４ｅの間に橋渡しされた状態で配置され、他方の電子部品１５は回路パターン１４ｅ，１４ｂの間に橋渡しされた状態で配置されている。なお、電子部品１５が３つ以上実装された場合、これに合わせて開口部４および一対の突起部５の個数を調整してもよい。 As shown in FIG. 5, in the second embodiment, two electronic components 15 are mounted, and the plate-shaped member 2 has two openings 4 and a pair of protrusions 5 in accordance with the two electronic components 15. I have one. One electronic component 15 is arranged in a state of being bridged between the circuit patterns 14a and 14e, and the other electronic component 15 is arranged in a state of being bridged between the circuit patterns 14e and 14b. When three or more electronic components 15 are mounted, the number of openings 4 and a pair of protrusions 5 may be adjusted accordingly.

以上のように、実施の形態２に係るはんだ付け用位置決め治具１Ａでは、板状部材２は、開口部４を複数有し、かつ、一対の突起部５を複数有する。したがって、電子部品１５が２つ以上実装される場合にも、絶縁基板１１の製造ばらつきの影響を受けることなく電子部品１５の位置ばらつき量が小さくなり、電子部品１５の位置が安定する。 As described above, in the soldering positioning jig 1A according to the second embodiment, the plate-shaped member 2 has a plurality of openings 4 and a plurality of a pair of protrusions 5. Therefore, even when two or more electronic components 15 are mounted, the amount of positional variation of the electronic component 15 is small without being affected by the manufacturing variation of the insulating substrate 11, and the position of the electronic component 15 is stabilized.

＜実施の形態３＞
次に、実施の形態３に係るはんだ付け用位置決め治具１Ｂについて説明する。図６は、実施の形態３に係るはんだ付け用位置決め治具１Ｂを絶縁基板１１にセットした状態を示す断面図である。なお、実施の形態３において、実施の形態１，２で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 3>
Next, the soldering positioning jig 1B according to the third embodiment will be described. FIG. 6 is a cross-sectional view showing a state in which the soldering positioning jig 1B according to the third embodiment is set on the insulating substrate 11. In the third embodiment, the same components as those described in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

熱の影響で絶縁基板１１と回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄが下凸形状に反った場合に、はんだ付け用位置決め治具１の中央部が回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄから浮いてしまうと、搭載される電子部品１５が中央部にあるときは、電子部品１５に位置ずれが発生し製品が外観不良品となる可能性がある。 When the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, 14d warp in a downward convex shape due to the influence of heat, the central portion of the soldering positioning jig 1 floats from the circuit patterns 14a, 14b, 14c, 14d. Then, when the mounted electronic component 15 is located in the central portion, the electronic component 15 may be misaligned and the product may have a defective appearance.

このような問題を解消するために、図６に示すように、実施の形態３では、板状部材２における開口部４の周縁部の一部を含む部分を着脱可能としている。 In order to solve such a problem, as shown in FIG. 6, in the third embodiment, the portion including a part of the peripheral edge portion of the opening 4 in the plate-shaped member 2 is removable.

はんだ付け用位置決め治具１Ｂは、板状部材２に対して着脱可能な着脱部材６をさらに備えている。着脱部材６は、板状部材２に装着された状態で、板状部材２における開口部４の周縁部の一部を含む部分を構成している。具体的には、着脱部材６は、開口部４における突起部５が形成されていない辺の周縁部を構成している。着脱部材６は、板状部材２に装着された状態で、絶縁基板１１側に突出し回路パターン１４ａ，１４ｂに当接する当接部６ａと、板状部材２に取り付けられる取付部６ｂとを有している。また、当接部６ａと取付部６ｂは一体的に形成されている。 The soldering positioning jig 1B further includes a detachable member 6 that can be attached to and detached from the plate-shaped member 2. The detachable member 6 constitutes a portion including a part of the peripheral edge portion of the opening 4 in the plate-shaped member 2 in a state of being attached to the plate-shaped member 2. Specifically, the detachable member 6 constitutes a peripheral edge portion of the opening 4 where the protrusion 5 is not formed. The detachable member 6 has a contact portion 6a that protrudes toward the insulating substrate 11 and abuts on the circuit patterns 14a and 14b while being mounted on the plate-shaped member 2, and a mounting portion 6b that is attached to the plate-shaped member 2. ing. Further, the contact portion 6a and the mounting portion 6b are integrally formed.

板状部材２は、着脱部材６の外周部を保持する周溝７をさらに有している。周溝７は、板状部材２における着脱部材６の取付部６ｂに対応する位置に形成されている。周溝７の上下方向の幅は取付部６ｂの厚みよりも大きいため、着脱部材６は板状部材２に装着された状態で上下方向に移動させることが可能である。これにより、絶縁基板１１と回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄが下凸形状に反った場合にも、着脱部材６の当接部６ａを絶縁基板１１の回路パターン１４ａ，１４ｂの上面に当接させることができる。 The plate-shaped member 2 further has a peripheral groove 7 for holding the outer peripheral portion of the detachable member 6. The peripheral groove 7 is formed at a position corresponding to the attachment portion 6b of the detachable member 6 in the plate-shaped member 2. Since the width of the peripheral groove 7 in the vertical direction is larger than the thickness of the mounting portion 6b, the detachable member 6 can be moved in the vertical direction while being mounted on the plate-shaped member 2. As a result, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, 14d are warped in a downward convex shape, the contact portion 6a of the detachable member 6 is brought into contact with the upper surface of the circuit patterns 14a, 14b of the insulating substrate 11. Can be made to.

以上のように、実施の形態３に係るはんだ付け用位置決め治具１Ｂは、板状部材２に対して着脱可能な着脱部材６をさらに備え、着脱部材６は、板状部材２に装着された状態で、板状部材２における開口部４の周縁部の一部を含み、かつ、絶縁基板１１側に突出し回路パターン１４ａ，１４ｂに当接する当接部６ａを有し、板状部材２は、着脱部材６の外周部を保持する周溝７をさらに有している。 As described above, the soldering positioning jig 1B according to the third embodiment further includes a detachable member 6 that can be attached to and detached from the plate-shaped member 2, and the detachable member 6 is attached to the plate-shaped member 2. In this state, the plate-shaped member 2 includes a part of the peripheral edge of the opening 4 in the plate-shaped member 2 and has a contact portion 6a that protrudes toward the insulating substrate 11 and abuts on the circuit patterns 14a and 14b. It further has a peripheral groove 7 for holding the outer peripheral portion of the detachable member 6.

したがって、熱の影響で絶縁基板１１と回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄが下凸形状に反った場合にも、着脱部材６の当接部６ａを絶縁基板１１の回路パターン１４ａ，１４ｂの上面に当接させることで電子部品１５の位置が安定し、製品が外観不良品となることを抑制できる。 Therefore, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, 14d are warped in a downward convex shape due to the influence of heat, the contact portion 6a of the detachable member 6 is placed on the upper surface of the circuit patterns 14a, 14b of the insulating substrate 11. The position of the electronic component 15 is stabilized by abutting against the electronic component 15, and it is possible to prevent the product from becoming a defective product.

また、着脱部材６において当接部６ａは取付部６ｂと一体的に形成されているため、当接部６ａと取付部６ｂがバラバラになることがなく、絶縁基板１１に対するはんだ付け用位置決め治具１Ｂのセット時および取り外し時における作業性向上につながる。 Further, since the contact portion 6a of the detachable member 6 is integrally formed with the mounting portion 6b, the contact portion 6a and the mounting portion 6b do not fall apart, and a positioning jig for soldering to the insulating substrate 11 This leads to improved workability when setting and removing 1B.

＜実施の形態４＞
次に、実施の形態４に係るはんだ付け用位置決め治具１Ｃおよび実施の形態４の変形例に係るはんだ付け用位置決め治具１Ｄについて説明する。図７は、実施の形態４に係るはんだ付け用位置決め治具１Ｃを絶縁基板１１にセットした状態を示す断面図である。図８は、実施の形態４の変形例に係るはんだ付け用位置決め治具１Ｄを絶縁基板１１にセットした状態を示す断面図である。なお、実施の形態４において、実施の形態１〜３で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 4>
Next, the soldering positioning jig 1C according to the fourth embodiment and the soldering positioning jig 1D according to the modified example of the fourth embodiment will be described. FIG. 7 is a cross-sectional view showing a state in which the soldering positioning jig 1C according to the fourth embodiment is set on the insulating substrate 11. FIG. 8 is a cross-sectional view showing a state in which the soldering positioning jig 1D according to the modified example of the fourth embodiment is set on the insulating substrate 11. In the fourth embodiment, the same components as those described in the first to third embodiments are designated by the same reference numerals, and the description thereof will be omitted.

回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄは通常エッチングにより形成されるが、製造時のエッチング条件によっては、回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄの断面形状は上底が下底よりも広い台形になったり、下底が上底よりも広い台形になったりすることがある。この場合、突起部５が矩形断面形状を有していると、回路パターン１４ａ，１４ｂの間に形成された溝１６との噛み合わせが悪くなるため、電子部品１５に位置ずれが発生し電子部品１５が傾いたりして電子部品１５と回路パターン１４ａ，１４ｂとの接合が不完全になることがある。 The circuit patterns 14a, 14b, 14c, 14d are usually formed by etching, but depending on the etching conditions at the time of manufacture, the cross-sectional shape of the circuit patterns 14a, 14b, 14c, 14d is trapezoidal in which the upper base is wider than the lower base. Or the lower bottom may be trapezoidal wider than the upper bottom. In this case, if the protrusion 5 has a rectangular cross-sectional shape, the meshing with the groove 16 formed between the circuit patterns 14a and 14b becomes poor, so that the electronic component 15 is displaced and the electronic component 15 is displaced. The 15 may be tilted and the connection between the electronic component 15 and the circuit patterns 14a and 14b may be incomplete.

このような問題を解消するために、実施の形態４では、突起部５の先端面を曲面としている。具体的には、図７に示すように、突起部５の先端面は蒲鉾状である。または、図８に示すように、突起部５の先端面は半球状であってもよい。これにより、突起部５と回路パターン１４ａ，１４ｂの間に形成された溝１６との噛み合わせが良好となる。なお、図７と図８では、回路パターン１４ａ，１４ｂの断面形状において下底が上底よりも広い台形の場合を示しているが、上底が下底よりも広い台形の場合も同様の効果が得られる。 In order to solve such a problem, in the fourth embodiment, the tip surface of the protrusion 5 is a curved surface. Specifically, as shown in FIG. 7, the tip surface of the protrusion 5 has a semi-cylindrical shape. Alternatively, as shown in FIG. 8, the tip surface of the protrusion 5 may be hemispherical. As a result, the meshing between the protrusion 5 and the groove 16 formed between the circuit patterns 14a and 14b is improved. Note that FIGS. 7 and 8 show the case where the lower base is a trapezoid wider than the upper base in the cross-sectional shape of the circuit patterns 14a and 14b, but the same effect is obtained when the upper base is a trapezoid wider than the lower base. Is obtained.

以上のように、実施の形態４に係るはんだ付け用位置決め治具１Ｃおよび実施の形態４の変形例に係るはんだ付け用位置決め治具１Ｄでは、突起部５の先端面は曲面である。したがって、突起部５が回路パターン１４ａ，１４ｂの間に形成された溝１６の両側の内壁に均等に当接することにより、突起部５を溝１６の中央に移動させる動作であるセンタリングが容易となり、電子部品１５の位置が安定する。 As described above, in the soldering positioning jig 1C according to the fourth embodiment and the soldering positioning jig 1D according to the modified example of the fourth embodiment, the tip surface of the protrusion 5 is a curved surface. Therefore, by evenly contacting the protrusions 5 with the inner walls on both sides of the groove 16 formed between the circuit patterns 14a and 14b, centering, which is an operation of moving the protrusions 5 to the center of the grooves 16, becomes easy. The position of the electronic component 15 is stable.

＜実施の形態５＞
次に、実施の形態５に係るはんだ付け用位置決め治具１Ｅについて説明する。図９は、実施の形態５に係るはんだ付け用位置決め治具１Ｅを絶縁基板１１にセットした状態を示す断面図である。なお、実施の形態５において、実施の形態１〜４で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 5>
Next, the soldering positioning jig 1E according to the fifth embodiment will be described. FIG. 9 is a cross-sectional view showing a state in which the soldering positioning jig 1E according to the fifth embodiment is set on the insulating substrate 11. In the fifth embodiment, the same components as those described in the first to fourth embodiments are designated by the same reference numerals and the description thereof will be omitted.

回路パターン１４ａ，１４ｂ，１４ｃ，１４ｄの製造時のエッチング精度が悪い場合、突起部５と回路パターン１４ａ，１４ｂとの間のクリアランスが大きくなり、電子部品１５に位置ずれが発生し電子部品１５が傾いたりして電子部品１５と回路パターン１４ａ，１４ｂとの接合が不完全になることがある。 If the etching accuracy of the circuit patterns 14a, 14b, 14c, 14d during manufacturing is poor, the clearance between the protrusion 5 and the circuit patterns 14a, 14b becomes large, the electronic component 15 is displaced, and the electronic component 15 is displaced. The connection between the electronic component 15 and the circuit patterns 14a and 14b may be incomplete due to tilting.

このような問題を解消するために、図９に示すように、実施の形態５では、各突起部５は、回路パターン１４ａ，１４ｂの間に形成された溝１６に嵌合可能なように一対の鉤状に形成されている。 In order to solve such a problem, as shown in FIG. 9, in the fifth embodiment, the protrusions 5 are paired so as to be fitted into the grooves 16 formed between the circuit patterns 14a and 14b. It is formed in the shape of a hook.

各突起部５は、バネ性を有するように先端側を内側に曲げた一対の鉤状に形成されている。各突起部５は、溝１６に挿入されていない状態では一対の鉤状が溝１６の横方向の幅よりも大きな幅となるように開いた状態となり、溝１６に挿入された状態では一対の鉤状が溝１６の横方向の幅よりも小さな幅となるように閉じた状態となる。これにより、各突起部５は溝１６に嵌合可能である。 Each protrusion 5 is formed in the shape of a pair of hooks whose tip side is bent inward so as to have springiness. When the protrusions 5 are not inserted into the groove 16, the pair of hooks are opened so as to have a width larger than the lateral width of the groove 16, and when the protrusions 5 are inserted into the groove 16, the pair of hooks 5 are opened. It is in a closed state so that the hook shape has a width smaller than the lateral width of the groove 16. As a result, each protrusion 5 can be fitted into the groove 16.

以上のように、実施の形態５に係るはんだ付け用位置決め治具１Ｅでは、各突起部５は、回路パターン１４ａ，１４ｂの間に形成された溝１６に嵌合可能なように一対の鉤状に形成されている。したがって、突起部５と回路パターン１４ａ，１４ｂとの間のクリアランスが小さくなり、電子部品１５の位置が安定する。 As described above, in the soldering positioning jig 1E according to the fifth embodiment, each protrusion 5 has a pair of hooks so as to be fitted in the groove 16 formed between the circuit patterns 14a and 14b. It is formed in. Therefore, the clearance between the protrusion 5 and the circuit patterns 14a and 14b is reduced, and the position of the electronic component 15 is stabilized.

＜実施の形態６＞
次に、実施の形態６に係るはんだ付け用位置決め治具１Ｆについて説明する。図１０は、実施の形態６に係るはんだ付け用位置決め治具１Ｆの断面図である。なお、実施の形態６において、実施の形態１〜５で説明したものと同一の構成要素については同一符号を付して説明は省略する。 <Embodiment 6>
Next, the soldering positioning jig 1F according to the sixth embodiment will be described. FIG. 10 is a cross-sectional view of the soldering positioning jig 1F according to the sixth embodiment. In the sixth embodiment, the same components as those described in the first to fifth embodiments are designated by the same reference numerals, and the description thereof will be omitted.

実施の形態５では、突起部５が板状部材２に一体的に形成されているため、突起部５が摩耗または破損したときに、はんだ付け用位置決め治具１Ｅの全てを交換する必要がありはんだ付け用位置決め治具１Ｅの運用コストが上昇する。 In the fifth embodiment, since the protrusion 5 is integrally formed with the plate-shaped member 2, it is necessary to replace all of the soldering positioning jig 1E when the protrusion 5 is worn or damaged. The operating cost of the soldering positioning jig 1E increases.

このような問題を解消するために、図１０に示すように、突起部８ａおよびその基端側の取付部８ｂを別部品として板状部材２に対して着脱可能としている。 In order to solve such a problem, as shown in FIG. 10, the protrusion 8a and the attachment portion 8b on the base end side thereof are detachable from the plate-shaped member 2 as separate parts.

はんだ付け用位置決め治具１Ｆは、突起部５に代えて、板状部材２に対して着脱可能な着脱部材８を備えている。着脱部材８は、回路パターン１４ａ，１４ｂの間に形成された溝１６に嵌合可能なように一対の鉤状に形成された突起部８ａ、および突起部８ａの基端側に形成され板状部材２に取り付けられる取付部８ｂを有している。板状部材２は、着脱部材８の取付部８ｂを保持する保持穴９をさらに有している。保持穴９は板状部材２における開口部４の周縁部において互いに対向する前後方向の位置に形成され、保持穴９に着脱部材８が取り付けられる。 The soldering positioning jig 1F includes a detachable member 8 that can be attached to and detached from the plate-shaped member 2 in place of the protrusion 5. The detachable member 8 has a pair of hook-shaped protrusions 8a formed so as to be fitted in the grooves 16 formed between the circuit patterns 14a and 14b, and a plate shape formed on the base end side of the protrusions 8a. It has a mounting portion 8b that is mounted on the member 2. The plate-shaped member 2 further has a holding hole 9 for holding the attachment portion 8b of the detachable member 8. The holding holes 9 are formed at positions facing each other in the front-rear direction at the peripheral edge of the opening 4 in the plate-shaped member 2, and the detachable member 8 is attached to the holding holes 9.

以上のように、実施の形態６に係るはんだ付け用位置決め治具１Ｆでは、突起部８ａおよびその基端側の取付部８ｂは、板状部材２に対して着脱可能であり、板状部材２は、取付部８ｂを保持する保持穴９をさらに有している。 As described above, in the soldering positioning jig 1F according to the sixth embodiment, the protrusion 8a and the mounting portion 8b on the base end side thereof are removable from the plate-shaped member 2, and the plate-shaped member 2 Further has a holding hole 9 for holding the mounting portion 8b.

したがって、突起部８ａが摩耗または破損したときに、突起部８ａおよびその基端側の取付部８ｂを含む着脱部材８のみを交換すればよいため、はんだ付け用位置決め治具１Ｆの運用コストの上昇を抑制できる。 Therefore, when the protrusion 8a is worn or damaged, only the detachable member 8 including the protrusion 8a and the attachment portion 8b on the base end side thereof needs to be replaced, which increases the operating cost of the soldering positioning jig 1F. Can be suppressed.

なお、本発明は、その発明の範囲内において、各実施の形態を自由に組み合わせたり、各実施の形態を適宜、変形、省略することが可能である。 In the present invention, each embodiment can be freely combined, and each embodiment can be appropriately modified or omitted within the scope of the invention.

１，１Ａ，１Ｂ，１Ｃ，１Ｄ，１Ｅ，１Ｆ はんだ付け用位置決め治具、２ 板状部材、４ 開口部、５ 突起部、６ 着脱部材、７ 周溝、８ａ 突起部、８ｂ 取付部、９ 保持穴、１１ 絶縁基板、１４ａ，１４ｂ，１４ｃ，１４ｄ，１４ｅ 回路パターン、１５ 電子部品、１６ 溝。 1,1A, 1B, 1C, 1D, 1E, 1F Soldering positioning jig, 2 plate-shaped member, 4 opening, 5 protrusion, 6 attachment / detachment member, 7 peripheral groove, 8a protrusion, 8b mounting part, 9 Holding holes, 11 insulated boards, 14a, 14b, 14c, 14d, 14e circuit patterns, 15 electronic components, 16 grooves.

Claims (6)

絶縁基板上に形成された複数の回路パターンの間に橋渡しされた電子部品をはんだ付けする工程において前記絶縁基板にセットされるはんだ付け用位置決め治具であって、
前記回路パターンの上面に接触させた状態で前記絶縁基板にセットされる板状部材を備え、
前記板状部材は、
前記電子部品が露出可能なように前記板状部材に形成された開口部と、
前記板状部材における前記開口部の周縁部に形成され、かつ、前記絶縁基板における複数の前記回路パターンの間に形成された溝に挿入可能なように、前記絶縁基板側に突出する一対の突起部とを有する、はんだ付け用位置決め治具。 A soldering positioning jig set on the insulating substrate in the process of soldering electronic components bridged between a plurality of circuit patterns formed on the insulating substrate.
A plate-shaped member set on the insulating substrate in contact with the upper surface of the circuit pattern is provided.
The plate-shaped member is
An opening formed in the plate-shaped member so that the electronic component can be exposed,
A pair of protrusions protruding toward the insulating substrate so as to be inserted into a groove formed on the peripheral edge of the opening in the plate-shaped member and formed between a plurality of the circuit patterns in the insulating substrate. A positioning jig for soldering that has a part. 前記板状部材は、前記開口部を複数有し、かつ、一対の前記突起部を複数有する、請求項１に記載のはんだ付け用位置決め治具。 The soldering positioning jig according to claim 1, wherein the plate-shaped member has a plurality of the openings and a plurality of the pair of the protrusions. 前記板状部材に対して着脱可能な着脱部材をさらに備え、
前記着脱部材は、前記板状部材に装着された状態で、前記板状部材における前記開口部の周縁部の一部を含み、かつ、前記絶縁基板側に突出し前記回路パターンに当接する当接部を有し、
前記板状部材は、前記着脱部材の外周部を保持する周溝をさらに有する、請求項１または請求項２に記載のはんだ付け用位置決め治具。 A detachable member that can be attached to and detached from the plate-shaped member is further provided.
The detachable member includes a part of the peripheral edge of the opening in the plate-shaped member in a state of being mounted on the plate-shaped member, and is a contact portion that protrudes toward the insulating substrate and abuts on the circuit pattern. Have,
The soldering positioning jig according to claim 1 or 2, wherein the plate-shaped member further has a peripheral groove for holding an outer peripheral portion of the detachable member. 前記突起部の先端面は曲面である、請求項１または請求項２に記載のはんだ付け用位置決め治具。 The soldering positioning jig according to claim 1 or 2, wherein the tip surface of the protrusion is a curved surface. 各前記突起部は、前記溝に嵌合可能なように一対の鉤状に形成された、請求項１または請求項２に記載のはんだ付け用位置決め治具。 The soldering positioning jig according to claim 1 or 2, wherein each of the protrusions is formed in a pair of hooks so as to be fitted in the groove. 前記突起部およびその基端側の取付部は、前記板状部材に対して着脱可能であり、
前記板状部材は、前記取付部を保持する保持穴をさらに有する、請求項５に記載のはんだ付け用位置決め治具。 The protrusion and the attachment portion on the base end side thereof can be attached to and detached from the plate-shaped member.
The soldering positioning jig according to claim 5, wherein the plate-shaped member further has a holding hole for holding the mounting portion.
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