JP2020164760A - 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 Download PDF

Info

Publication number
JP2020164760A
JP2020164760A JP2019069268A JP2019069268A JP2020164760A JP 2020164760 A JP2020164760 A JP 2020164760A JP 2019069268 A JP2019069268 A JP 2019069268A JP 2019069268 A JP2019069268 A JP 2019069268A JP 2020164760 A JP2020164760 A JP 2020164760A
Authority
JP
Japan
Prior art keywords
refractive index
resin
silica
resin composition
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019069268A
Other languages
English (en)
Japanese (ja)
Inventor
千穂 植田
Chiho Ueda
千穂 植田
岡田　和也
Kazuya Okada
和也 岡田
知哉 工藤
Tomoya Kudou
知哉 工藤
沙和子 嶋田
Sawako Shimada
沙和子 嶋田
将太郎 種
Shotaro Shu
将太郎 種
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2019069268A priority Critical patent/JP2020164760A/ja
Priority to PCT/JP2019/049159 priority patent/WO2020202656A1/ja
Priority to KR1020217032878A priority patent/KR20210148177A/ko
Priority to CN201980094329.XA priority patent/CN113631603A/zh
Priority to TW108147323A priority patent/TWI814970B/zh
Publication of JP2020164760A publication Critical patent/JP2020164760A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019069268A 2019-03-29 2019-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 Pending JP2020164760A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019069268A JP2020164760A (ja) 2019-03-29 2019-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
PCT/JP2019/049159 WO2020202656A1 (ja) 2019-03-29 2019-12-16 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
KR1020217032878A KR20210148177A (ko) 2019-03-29 2019-12-16 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품
CN201980094329.XA CN113631603A (zh) 2019-03-29 2019-12-16 固化性树脂组合物、干膜、固化物和电子部件
TW108147323A TWI814970B (zh) 2019-03-29 2019-12-24 硬化性樹脂組成物、乾膜、硬化物及電子零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019069268A JP2020164760A (ja) 2019-03-29 2019-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Publications (1)

Publication Number Publication Date
JP2020164760A true JP2020164760A (ja) 2020-10-08

Family

ID=72668460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019069268A Pending JP2020164760A (ja) 2019-03-29 2019-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Country Status (5)

Country Link
JP (1) JP2020164760A (zh)
KR (1) KR20210148177A (zh)
CN (1) CN113631603A (zh)
TW (1) TWI814970B (zh)
WO (1) WO2020202656A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117882497A (zh) * 2021-07-01 2024-04-12 株式会社力森诺科 电路连接用黏合剂膜、电路连接结构体及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941180B2 (ja) * 1976-01-19 1984-10-05 三菱製紙株式会社 多層ハロゲン化銀カラ−写真材料
JPH06210060A (ja) 1993-01-19 1994-08-02 Adachi Raito Kogyosho Kk パチンコ機の球受皿
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
TWI584070B (zh) * 2012-04-23 2017-05-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法
JP7418941B2 (ja) * 2016-08-19 2024-01-22 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP7066634B2 (ja) * 2016-12-28 2022-05-13 太陽インキ製造株式会社 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
JP6987011B2 (ja) * 2018-03-30 2021-12-22 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
CN113631603A (zh) 2021-11-09
TWI814970B (zh) 2023-09-11
TW202035595A (zh) 2020-10-01
KR20210148177A (ko) 2021-12-07
WO2020202656A1 (ja) 2020-10-08

Similar Documents

Publication Publication Date Title
KR102369508B1 (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
KR101256553B1 (ko) 감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
KR20170017999A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6951323B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6770131B2 (ja) 硬化性組成物、ドライフィルム、硬化物およびプリント配線板
CN112034680A (zh) 固化性树脂组合物、干膜、固化物和印刷电路板
JP2020166207A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2020166215A (ja) ドライフィルム、硬化物、および、電子部品
JPWO2020066601A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
JP7066634B2 (ja) 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
TWI814970B (zh) 硬化性樹脂組成物、乾膜、硬化物及電子零件
TW201902973A (zh) 感光性樹脂組成物、乾膜、及印刷線路板
JP6724097B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
WO2021157282A1 (ja) 硬化性組成物、そのドライフィルムおよび硬化物
WO2020202690A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP7101513B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2021044387A (ja) 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP7339103B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2019178303A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2022122104A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2021144097A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2021044386A (ja) 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
WO2023190393A1 (ja) 硬化物およびプリント配線板
WO2021210570A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2024054101A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板