JP2020155688A - バックグラインドテープ - Google Patents
バックグラインドテープ Download PDFInfo
- Publication number
- JP2020155688A JP2020155688A JP2019054573A JP2019054573A JP2020155688A JP 2020155688 A JP2020155688 A JP 2020155688A JP 2019054573 A JP2019054573 A JP 2019054573A JP 2019054573 A JP2019054573 A JP 2019054573A JP 2020155688 A JP2020155688 A JP 2020155688A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- resin
- back grind
- grind tape
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 30
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
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- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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Abstract
Description
1つの実施形態においては、上記基材の引っ張り弾性率は1500MPa以上である。
1つの実施形態においては、上記基材の厚みは30μm〜200μmである。
1つの実施形態においては、上記基材を構成する樹脂は、ポリエチレンテレフタレート樹脂、ポリイミド系樹脂、ポリエーテルエーテルケトン樹脂、ポリアミドイミド樹脂、ポリエチレンナフタレート樹脂、ポリフェニルサルファイド樹脂、ポリエーテルイミド樹脂からなる群より選択される少なくとも1種である。
1つの実施形態においては、上記粘着剤層は活性エネルギー線硬化型粘着剤組成物で形成される。
図1は本発明の1つの実施形態におけるバックグラインドテープの概略断面図である。図示例のバックグラインドテープ100は、基材20と、該基材20の一方の面に形成された粘着剤層10とを備える。実用的には、使用までの間、粘着剤層10を適切に保護するために、粘着剤層10にはセパレーターが剥離可能に仮着される。バックグラインドテープ100は、通常、半導体ウエハ作製の工程が終了した後、粘着剤層10に活性エネルギーが照射され、粘着剤層が硬化することによって粘着力が小さくなり、被着体(半導体ウエハ)から剥離される。
粘着剤層は任意の適切な粘着剤組成物を用いて形成され得る。粘着剤組成物は、好ましくは活性エネルギー線硬化型粘着剤組成物である。活性エネルギー線硬化型粘着剤組成物は、活性エネルギー線を照射されることにより粘着力が低下し得る。活性エネルギー線硬化型粘着剤組成物を用いることにより、軽剥離性のバックグラインドテープが得られ得る。活性エネルギー線としては、例えば、ガンマ線、紫外線、可視光線、赤外線(熱線)、ラジオ波、アルファ線、ベータ線、電子線、プラズマ流、電離線、粒子線等が挙げられる。好ましくは、紫外線である。
上記基材20は、曲げ剛性が0.2N・mm2以上、かつ、波長400nmにおける光線透過率が10%以上である。基材20を構成する樹脂は融点が200℃以上である。このような基材を備えることにより、バックグラインドテープの耐熱性が向上し、高真空高温処理にも好適に用いることができる。
I=E×w×h3/12
(式中、Iは曲げ剛性(N・mm2)を、Eは引っ張り弾性率(MPa)を、wは試験片幅(mm)を、hは試験片厚み(mm)をそれぞれ表す)。
本発明のバックグラインドテープは、上記基材上に、上記粘着剤組成物を塗工することにより製造され得る。粘着剤の塗工方法としては、バーコーター塗工、エアナイフ塗工、グラビア塗工、グラビアリバース塗工、リバースロール塗工、リップ塗工、ダイ塗工、ディップ塗工、オフセット印刷、フレキソ印刷、スクリーン印刷等の種々の方法を採用することができる。また、別途、セパレータに粘着剤層を形成した後、それを基材に貼り合せる方法等を採用してもよい。
アクリル酸ブチル100重量部と、アクリル酸−2−ヒドロキシルエチル8重量部と、重合開始剤(2,2’−アゾビス−イソブチロニトリル(AIBN))0.3重量部と、溶媒(メチルエチルケトン(MEK))とを混合してモノマー組成物を調製した。
該モノマー組成物を、1L丸底セパラブルフラスコに、セパラブルカバー、分液ロート、温度計、窒素導入管、リービッヒ冷却器、バキュームシール、撹拌棒、撹拌羽が装備された重合用実験装置に投入し、撹拌しながら、常温で6時間、窒素置換した。その後、窒素を流入下、撹拌しながら、65℃下で6時間保持して重合し、樹脂溶液を得た。
得られた樹脂溶液を室温まで冷却した。その後、該樹脂溶液に、重合性炭素−炭素二重結合を有する化合物として、2−イソシアナトエチルメタクリレート(昭和電工社製、商品名:カレンズMOI)4重量部を加えた。さらに、ジラウリン酸ジブチルスズIV(和光純薬工業社製)0.11重量部を添加し、空気雰囲気下、50℃で24時間撹拌し、ポリマー溶液を得た。
得られたポリマー溶液100重量部に、架橋剤(東ソー社製、商品名:コロネートL)1重量部、開始剤(BASF社製、商品名:イルガキュア369)1重量部、重合禁止剤(BASF社製、商品名:イルガノックス1010)0.1重量部、硬化補助剤1(ADEKA社製、商品名:EDP300)0.5重量部、硬化補助剤2(ADEKA社製、商品名:EDP1100)2.5重量部を混合し、粘着剤組成物を得た。
ポリエチレンナフタレートフィルム1(帝人デュポン社製、商品名:テオネックス(登録商標)Q51、厚み50μm)の一方の面にコロナ処理を施したものを基材として用いた。
製造例1で調製した粘着剤組成物をセパレーター(ポリエステル系フィルム(三菱化学社製、商品名:MRF38、厚み:38μm)の一方の面にシリコーン系剥離剤を塗布したもの)の剥離処理面に塗布し、120℃で2分間加熱して、粘着剤層(厚み:50μm)を形成した。
上記基材のコロナ処理面と上記セパレーターに形成した粘着剤層とを貼り合わせ、50℃で2日間エージングを行い、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリエステル系フィルム(クラボウ社製、商品名:トルセナ、厚み50μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリイソシアネート系フィルム1(I.S.T社製、商品名:TORMED TypeX、厚み50μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリエチレンナフタレートフィルム2(帝人デュポン社製、商品名:テオネックス(登録商標)Q83、厚み25μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリエーテルエーテルケトンフィルム(クラボウ社製、商品名:エクスピーク、厚み25μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリイソシアネート系フィルム2(I.S.T社製、商品名:TORMED TSypeS、厚み25μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
ポリエチレンナフタレートフィルム1に代えて、ポリイソシアネート系フィルム3(東レデュポン社製、商品名:カプトン 200V、厚み50μm)を用いた以外は実施例1と同様にして、バックグラインドテープを得た。
実施例および比較例で用いた基材、または、得られたバックグラインドテープを下記(1)〜(5)の評価に供した。結果を表1に示す。
基材として用いた各フィルムの波長400nmの光線透過率を紫外可視分光光度計(島津製作所製、商品名:SolidSpec−3700)を用いて測定した。
示差走査熱量計(TA Instrument社製、製品名:Q2000)を用いて、基材として用いたフィルムの融点を測定した。なお、400℃まで融解ピークが検出されないものは溶解不可とした。
基材として用いたフィルムを幅10mm×長さ100mmのサイズに切り出し、試験片として用いた。各試験片の引っ張り弾性率をJIS K 7161に準拠して測定した。試験片のサイズおよび引っ張り弾性率の結果から、以下の式により曲げ剛性を算出した。
I=E×w×h3/12
(式中、Iは曲げ剛性(N・mm2)を、Eは引っ張り弾性率(MPa)を、wは試験片幅(mm)を、hは試験片厚み(mm)をそれぞれ表す)。
得られたバックグラインドテープを幅20mmにカットし、シリコンミラーウエハに貼り付け、高圧水銀ランプ(70mW/cm2)を10秒間照射した。次いで、JIS Z 0237(2000)に準じた方法(貼り合わせ条件:2kgローラー1往復、剥離速度:300mm/min、剥離角度:180°)で粘着力を測定した。粘着力が1N/20mm未満であれば〇、粘着力が1N/20mm以上であれば×とした。
得られたバックグラインドテープをシリコンミラーウエハに貼り付け、真空オーブン(ヤマト科学社製、製品名:DP−31)に投入し、加温250℃、真空度0.1torrの状態に10分間置いた。その後、真空オーブンから取り出し、粘着剤層とシリコンミラーウエハとの間のデラミの有無を目視で確認した。デラミが生じていないものを○、デラミが生じているものを×とした。
20 基材
100 バックグラインドテープ
Claims (5)
- 基材と、該基材の一方の面に形成された粘着剤層とを備え、
該基材の曲げ剛性が0.2N・mm2以上、かつ、波長400nmにおける光線透過率が10%以上であり、
該基材を構成する樹脂の融点が200℃以上である、バックグラインドテープ。 - 前記基材の引っ張り弾性率が1500MPa以上である、請求項1に記載のバックグラインドテープ。
- 前記基材の厚みが30μm〜200μmである、請求項1または2に記載のバックグラインドテープ。
- 前記基材を構成する樹脂が、ポリエチレンテレフタレート樹脂、ポリイミド系樹脂、ポリエーテルエーテルケトン樹脂、ポリアミドイミド樹脂、ポリエチレンナフタレート樹脂、ポリフェニルサルファイド樹脂、ポリエーテルイミド樹脂からなる群より選択される少なくとも1種である、請求項1から3のいずれかに記載のバックグラインドテープ。
- 前記粘着剤層が活性エネルギー線硬化型粘着剤組成物で形成されている、請求項1から4のいずれかに記載のバックグラインドテープ。
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