JP2020150278A - Light emitting module - Google Patents

Abstract

To provide a light emitting module that can be thinned.SOLUTION: A light emitting module includes: a light guide plate having a first main surface and a second main surface opposite to the first main surface; a plurality of light source members disposed on a second main surface side, each of the light source members including a light emitting element having a main light emitting surface, an electrode formation surface located opposite to the main light emitting surface, and a side surface between the main light emitting surface and the electrode formation surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element; and a sealing member covering the light source members and the second main surface of the light guide plate. The light guide plate has a plurality of first recesses located at the second main surface, and each of the light source members is disposed such that at least a part of the side surface of the light emitting element is located in the first recess in a cross-sectional view.SELECTED DRAWING: Figure 1B

Description

The present disclosure relates to a light emitting module.

A light emitting device using a light emitting element such as a light emitting diode is widely used as a backlight of a liquid crystal display or various light sources such as a display.
For example, the light source device disclosed in Patent Document 1 consists of a plurality of light emitting elements mounted on a mounting substrate, a hemispherical lens member that seals each of the plurality of light emitting elements, and a light emitting element arranged on the hemispherical lens member. It is provided with a diffusing member to which the light of

JP-A-2015-323373

However, in a light source device such as Patent Document 1, it is necessary to make the distance between the mounting substrate and the diffuser plate larger than the thickness of the lens member, and there is a possibility that sufficient thinning cannot be achieved.

Therefore, an object of the present disclosure is to provide a light emitting module including a light guide plate and a light emitting element, which can be made thinner.

The method for manufacturing a light emitting module according to the present disclosure includes the following configurations.
A light guide plate having a first main surface and a second main surface opposite to the first main surface, and a light source member arranged on the second main surface side, on the opposite side of the main light emitting surface and the main light emitting surface. A plurality of light source members including a light emitting element having an electrode forming surface, a main light emitting surface, and a side surface between the electrode forming surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element, and a light source member. And a sealing member covering the second main surface of the light guide plate, the light guide plate has a plurality of first recesses located on the second main surface, and at least a part of the side surface of the light emitting element in a cross-sectional view. A light source module arranged so as to be located in the first recess.

This makes it possible to provide a light emitting module including a light guide plate and a light emitting element, which can be made thinner.

It is a schematic plan view which shows an example of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic plan view and a partially enlarged schematic side view which shows an example of the light guide plate which concerns on Embodiment 1. FIG. It is a partially enlarged schematic cross-sectional view which shows an example of the light guide plate which concerns on Embodiment 1. FIG. It is a partially enlarged schematic cross-sectional view which shows an example of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic cross-sectional view which shows an example of the light emitting module which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows an example of the light source member of the light emitting module which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows an example of the light source member of the light emitting module which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows an example of the light source member of the light emitting module which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows an example of the light source member of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic cross-sectional view which shows an example of the manufacturing process of a light source member. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic plan view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic plan view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view which shows an example of the manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. It is a partially enlarged schematic sectional view of the light emitting module which concerns on Embodiment 2. FIG. 9 is a schematic cross-sectional view showing a part of FIG. 9A in an enlarged manner. It is a schematic cross-sectional view which shows an example of the light source member of the light emitting module which concerns on Embodiment 2. FIG. It is a schematic sectional view of the light source member of the modification 1 of the light emitting module which concerns on Embodiment 2. FIG. It is a schematic sectional view of the light source member of the modification 2 of the light emitting module which concerns on Embodiment 2. FIG. It is a schematic sectional view of the light source member of the modification 3 of the light emitting module which concerns on Embodiment 2. FIG. FIG. 5 is an enlarged schematic cross-sectional view of a part of the light emitting module when the light source member of the third modification is used in the light emitting module according to the second embodiment.

Hereinafter, the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including those terms) are used as necessary, but the use of these terms is used. This is for facilitating the understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Further, the parts having the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members. Further, each member shall use the same name even if the state, shape, etc. are different before and after curing, before and after cutting, and the like.

Further, the embodiments shown below exemplify a light emitting module for embodying the technical idea of the present invention, and the present invention is not limited to the following. Further, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention to that alone, but are exemplified. It was intended. Further, the contents described in one embodiment and the embodiment can be applied to other embodiments and the embodiments. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation.

Embodiment 1
The configuration of the light emitting module of the first embodiment is mainly shown in FIGS. 1A to 1D.
FIG. 1A is a schematic plan view of the light emitting module 100 according to the first embodiment. FIG. 1B is a partially enlarged schematic cross-sectional view showing a light emitting module 100 according to the first embodiment, and here, a cross-sectional view taken along the line IB (IB) shown in the region S shown in FIG. 1A is shown. FIG. 1C is an enlarged view of a portion of FIG. 1B including one light source member 20 and a second recess 122, and FIG. 1D is an enlarged view of one light source member 20.

The light emitting module 100 includes a light guide plate 10, a plurality of light source members 20 joined to the light guide plate 10, and a sealing member 50. The light guide plate 10 includes a first main surface 11 that serves as a light extraction surface, and a second main surface 12 that is opposite to the first main surface 11. The light guide plate 10 includes a plurality of first recesses 121 arranged in a matrix on the second main surface 12. The light source member 20 includes a light emitting element 21 and a wavelength conversion member 26. The plurality of light source members 20 are joined by a joining member 40 on the bottom surface 121a of the first recess 121 of the second main surface 12 of the light guide plate 10. The sealing member 50 is arranged so as to cover the light source member 20 and the second main surface 12 of the light guide plate 10.

The light source member 20 is arranged so that at least a part of the side surface 21c of the light emitting element 21 is located in the first recess 121 in a cross-sectional view. In other words, the light source member 20 is arranged so that the main light emitting surface 21a of the light emitting element 21 is located below the second main surface 12 around the first recess 121 in a cross-sectional view.

The light emitted from the main light emitting surface 21a of the light emitting element 21 irradiates the wavelength conversion member 26 covering the main light emitting surface 21a of the light emitting element 21. Then, the light from the light source member 20 is incident into the light guide plate 10 from the bottom surface 121a of the first recess 121 as a mixed color light from the light emitting element 21 and the wavelength conversion member 26.

The light emitted from the side surface 21c of the light emitting element 21 irradiates the wavelength conversion member 26 covering the side surface 21c of the light emitting element 21. Then, the light from the light source member 20 is incident into the light guide plate 10 from the side surface 121b of the first recess 121 as a mixed color light of the light from the light emitting element 21 and the light from the wavelength conversion member 26.

By locating at least a part of the light emitting element 21 in the first recess 121 of the light guide plate 10, the light emitted from the light source member 20 can be efficiently spread laterally in the light guide plate 10. Therefore, it is possible to provide a light emitting module capable of surface emission with less brightness unevenness on the entire surface of the first main surface 11 of the light guide plate 10.

In cross-sectional view, the length To such that the side surface 21c of the light emitting element 21 and the side surface 121b of the first recess 121 face each other is the length Tc of the side surface 21c of the light emitting element 21 (distance between the main light emitting surface 21a and the electrode forming surface 21b). ) Is preferably 20% to 100%, and more preferably 50% to 100%.

When the light emitting element 21 includes the semiconductor laminate 22 including the element substrate 22s, 20% to 100% of the length of the side surface of the element substrate 22s faces the side surface 121b of the first recess 121 in a cross-sectional view. It is preferable, and more preferably 50% to 100%.

Each member constituting the light emitting module will be described in detail below.

[Light guide plate 10]
FIG. 2A is an enlarged view of a region S which is a part of the light guide plate 10 shown in FIG. 1A, and shows a cross-sectional view taken along the first main surface 11, the second main surface 12, and the IB (IB) line, respectively. FIG. 2B is an enlarged cross-sectional view showing the cross-sectional view of FIG. 2A. The light guide plate 10 is a translucent plate-shaped member that emits light in a planar manner when light from the light source member 20 is incident on the light guide plate 10. The light guide plate 10 includes a first main surface 11 that serves as a light extraction surface, and a second main surface 12 that is opposite to the first main surface 11. The first main surface 11 is provided with a first recess 121 in which the light source member 20 is arranged.

When the light guide plate 10 has a quadrangular shape in a plan view, the size in the plan view can be, for example, about 1 cm to 200 cm on a side, preferably about 3 cm to 30 cm. The thickness of the light guide plate 10 can be about 0.1 mm to 5 mm, preferably 0.5 mm to 3 mm. The "thickness" here means, for example, the thickness when it is assumed that the first main surface 11 and the second main surface 12 have recesses and protrusions, which are not present. ..
The planar shape of the light guide plate 10 can be, for example, a substantially rectangular shape, a substantially circular shape, or the like.

As the material of the light guide plate 10, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate and polyester, a resin material such as a thermosetting resin such as epoxy and silicone, and an optically transparent material such as glass are used. be able to. In particular, a thermoplastic resin material is preferable because it can be efficiently produced by injection molding. Of these, polycarbonate, which has high transparency and is inexpensive, is preferable. When a step of attaching the wiring board after joining the light source member 20 to the light guide plate 10 is provided, a step of applying a high temperature such as solder reflow can be omitted, so that a material having high thermoplasticity and low heat resistance such as polycarbonate can be used. It can be used even if it exists.

The light guide plate 10 may be formed of a single layer, or may be formed by stacking a plurality of translucent layers. When a plurality of translucent layers are laminated, layers having different refractive indexes, such as an air layer, may be provided between arbitrary layers. This makes it easier to diffuse the light, and it is possible to obtain a light emitting module with reduced luminance unevenness.

(1st recess: light source member arrangement part)
The light guide plate 10 is provided with a first recess 121 on the second main surface 12 side. The first recess 121 is a portion where the light source member 20 is arranged.

The plurality of first recesses 121 are arranged two-dimensionally in the plan view of the light guide plate 10. Preferably, the plurality of first recesses 121 are arranged two-dimensionally along two orthogonal directions, that is, the x direction (horizontal direction) and the y direction (longitudinal direction). As shown in FIG. 1A, the arrangement pitch in the x direction and the arrangement pitch in the y direction of the first recess 121 may be the same or different. Also, the two directions of the array do not have to be orthogonal. Further, the arrangement pitch in the x-direction or the y-direction is not limited to equal intervals, and may be unequal intervals. For example, the first recesses 121 may be arranged so that the distance from the center of the light guide plate 10 becomes wider toward the periphery.

The size (area of the opening) of the first recess 121 in a plan view is preferably substantially the same as or larger than the plan view shape of the light source member 20. For example, the size of the opening of the first recess 121 in a plan view can be 100% to 200% with respect to the area of the light source member 20 in a plan view.

The plan view shape of the opening of the first recess 121 can be, for example, a substantially rectangular shape or a substantially circular shape. The plan-view shape of the opening of the first recess 121 can be adjusted according to the arrangement pitch of the first recess 121 (the distance between the centers (optical axes) of the two closest first recesses 121) and the like. For example, when the arrangement pitch of the first recess 121 is substantially uniform, a substantially circular shape or a substantially square shape is preferable. In particular, by making it substantially circular, the light from the light source member 20 can be satisfactorily spread.

For example, when the plan view shape of the opening of the first recess 121 is quadrangular, the light emitting element 21 has a vertical and horizontal dimension of about 1000 μm or less in a plan view, and wavelength conversion covering the side surface 21c of the light emitting element 21. When the thickness of the member 26 is about 0.1 mm to 5 mm, the arrangement pitch between the first recesses 121 can be, for example, about 0.5 mm to 50 mm, preferably about 3 mm to 30 mm.

The plan view shape of the bottom surface 121a of the first recess 121 is preferably the same as the plan view shape of the opening. However, the present invention is not limited to this, and the plan view shape of the bottom surface 121a of the first recess 121 may be different from the plan view shape of the opening. Further, the bottom surface 121a of the first recess 121 may be the same size as the opening or smaller than the opening.

The depth Tr1 of the first recess 121, that is, the distance from the bottom surface 121a of the first recess 121 to the opening (second main surface) is such that at least a part of the side surface 21c of the light emitting element 21 is located in the first recess 121. It is preferable that the depth is such that it is possible. In other words, it is preferable that at least a part of the side surface 121b of the first recess 121 is located on the side of the side surface 21c of the light emitting element 21.

Further, in the first recess 121, the light emitting element 21 is arranged on the bottom surface 121a of the first recess 121 via a wavelength conversion member 26 that covers the main light emitting surface 21a. Therefore, in order for the side surface 21c of the light emitting element 21 to be located in the first recess 121, the depth Tr1 of the first recess 121 is between the main light emitting surface 21a of the light emitting element 21 and the bottom surface 121a of the first recess 121. It is preferable that the thickness is larger than the thickness of the wavelength conversion member 26 of.

When the translucent joining member 40 is arranged between the wavelength conversion member 26 and the bottom surface 121a of the first recess 121, the depth Tr1 of the first recess 121 is with the main light emitting surface 21a of the light emitting element 21. It is preferably larger than the sum of the thickness of the wavelength conversion member 26 and the thickness of the joining member 40 between the first recess 121 and the bottom surface 121a.

For example, the length of the side surface 21c of the light emitting element 21 (distance between the main light emitting surface 21a and the electrode forming surface 21b) is about 50 μm to 200 μm, and the thickness of the wavelength conversion member 26 or the thickness of the wavelength conversion member 26 When the total thickness of the joining members 40 is about 50 μm to 600 μm, the depth Tr1 of the first recess 121 can be 50 μm to 5000 μm, preferably 100 μm to 350 μm. When the light guide plate 10 includes the optical function unit 111 described later, the distance between the optical function unit 111 and the first recess 121 can be appropriately set within a range in which the optical function unit 111 and the recess 121 are separated from each other.

Further, the side surface 121b of the first recess 121 may be a surface perpendicular to or inclined with respect to the bottom surface 121a of the first recess 121. The inclination angle of the side surface 121b can be 45 to 90 degrees from the bottom surface 121a. Further, the side surface 121b of the first recess 121 may be a straight line or a curved line in a cross-sectional view.

(2nd recess: reflector)
The light guide plate 10 preferably has a second recess 122 located on the second main surface 12. The second recess 122 can function as a reflector that reflects the light from the light source member 20 arranged in the first recess 121 toward the first main surface 11. Therefore, it is preferable that the second recess 122 is arranged so as to surround one first recess 121 in which the light source member 20 is arranged in the top view.

When the second recess 122 is arranged so as to surround one first recess 121 in which the light source member 20 is arranged, for example, the second recess is provided so as to divide the second main surface of the light guide plate into a plurality of regions. The first recess 121 may be provided in each of the divided regions. In this case, in the top view, a part of the second recess 122 surrounding one first recess 121 may also serve as a part of the second recess 122 surrounding the adjacent first recess 121. That is, in a cross-sectional view, a part of the second recess 122 is located between the two first recesses 121, and a part of the second recess 122 is shared by the two adjacent first recesses 121. For example, as shown in FIG. 2B, the side surface 122b located on the right side of the bottom portion 122a of the second recess 122 reflects light from the light source member arranged in the first recess 121 located on the right side. Similarly, the side surface 122b located on the left side of the bottom surface 122a of the second recess 122 reflects light from the light source member arranged in the first recess 121 located on the left side.

In this way, the second recess 122 that surrounds the first recess 121 also functions as a part of the second recess 122 that surrounds the adjacent first recess 121, so that the second recess 122 is shown in FIG. 2A. As such, it can be a grid-like bottom 122a.

The side surface 122b of the second recess 122 may be a straight line or a curved surface in a cross-sectional view, and further, these may be combined. Further, when the side surface of the second recess 122 is a curved surface, the curvature may be constant, and it may have an arbitrary curvature depending on the position. For example, the second recess 122 shown in FIG. 1C or the like exemplifies the side surface 122b of a curved surface whose curvature gradually changes in a portion continuous with the second main surface 12. In the case of such a second recess 122, the boundary between the second recess 122 and the second main surface 12 may be difficult to clearly see.

A low refractive index member having a lower refractive index than the light guide plate 10 can be arranged in the second recess 122. As the low refractive index member, for example, air, a resin material, or a glass material can be used. Further, a light reflecting member may be arranged in the second recess 122. As the light-reflecting member, a light-reflecting member similar to the sealing member 50 described later can be used. Further, a part of the sealing member 50 can be arranged in the second recess 122.

As shown in FIG. 1C, the depth Tr2 of the bottom portion 122a of the second recess 122 can be about the same as the depth Tr1 of the first recess 121. Further, the bottom portion 122a of the second recess 122 can be positioned at a position similar to the position of the light emitting surface 20a of the light source member 20.

(Optical function unit)
The light guide plate 10 may be provided with an optical function unit 111 on the first main surface 11 side. The optical function unit 111 can have, for example, a function of spreading light in the plane of the light guide plate 10.

It is preferable that the optical function unit 111 is provided at a position corresponding to each of the first recesses 121, that is, at a position opposite to the light source member 20 arranged on the second main surface 12 side. In particular, it is preferable that the optical axis of the light source member 20 and the optical axis of the optical functional unit 111 substantially coincide with each other. For example, when the recess of the optical function unit 111 is a cone or a weight base, it is preferable that the top or the central axis thereof substantially coincides with the optical axis of the light source member 20. When the recess of the optical function unit 111 is a cone base, it is preferable that the surface corresponding to the top portion is located on the optical axis of the light source member 20.

The optical function unit 111 may be a cone-shaped or frustum-shaped recess provided on the first main surface 11 side. Specifically, the pyramid-shaped dents include polygonal pyramids such as cones, quadrangular pyramids, and hexagonal pyramids, and the pyramid-shaped dents include cones, quadrangular pyramids, and hexagonal pyramids. A polygonal pyramid trapezoid can be mentioned. The side surface 111b of the optical function unit 111 may be a straight line or a curved line in a cross-sectional view.

The size of the opening of the optical function unit 111 in a plan view can be appropriately set. The size of the opening of the optical function unit 111 can be, for example, 100% to 300% of the area of the bottom surface 121a of the first recess 121. When the optical function unit 111 has a cone-shaped recess, the size of the bottom surface 111a (the surface corresponding to the top of the cone table) in a plan view is, for example, 50, which is the size of the light source member 20 in a plan view. It can be% to 100%, or it can be 20% to 100% of the area of the bottom surface 121a of the first recess 121. The optical function unit 111 shown in FIGS. 1A to 1D is a truncated cone-shaped recess having a circular opening on the first main surface 11, and the diameter of the opening is larger than that of the light source member 20 and further from the first recess 121. Also shows a large example.

As shown in FIG. 3A, a material having a refractive index different from that of the light guide plate 10 (for example, air, a low refractive index member 112, etc.) can be arranged in the recess used as the optical functional unit 111. Further, as shown in FIG. 3B, the first reflecting member 113 that reflects the light from the light source member 20 may be arranged on the inner surface of the recess. For the first reflective member 113, for example, a metal, a white resin material, a DBR film, or the like can be used.

[Light source member]
The light source member 20 includes a light emitting element 21 and a wavelength conversion member 26. The wavelength conversion member 26 is a member that covers the main light emitting surface 22a and the side surface 22c of the light emitting element 21, and mainly includes a resin material and a wavelength conversion substance.

As the light source member 20, a light source member 30 including a light emitting element 21 and a wavelength conversion member 26 as shown in FIGS. 4A to 4C in advance can be used as the light source member 20. Alternatively, the light source member 20 may be formed by arranging the wavelength conversion member 26 in the first recess 121 of the light guide plate 10 and arranging the light emitting element 21 so as to be embedded in the wavelength conversion member 26.

The light emitting device 30 may have a structure as shown in FIGS. 4A to 4C, for example. All of the light emitting devices are common in that the wavelength conversion member 26 is arranged so as to cover the main light emitting surface 21a and the side surface 21c of the light emitting element 21.

The light emitting device 30 shown in FIG. 4A includes a wavelength conversion member 26 that covers the main light emitting surface 21a and the side surface 21c of the light emitting element 21. In this case, the electrode forming surface 21b of the light emitting element 21 is not covered with the wavelength conversion member 26 and is exposed. The bottom surface and side surfaces of the pair of electrodes 24 are also exposed. Since the electrode forming surface 21b is covered with the sealing member 50 after being incorporated as a part of the light emitting module, there is no problem even if it is exposed to the outside in the state of the light emitting device 30.

In the light emitting device 30A shown in FIG. 4B, the wavelength conversion member 26 is arranged so as to cover the electrode forming surface 21b in addition to the main light emitting surface 21a and the side surface 21c of the light emitting element 21. The side surfaces of the pair of electrodes 24 are also covered with the wavelength conversion member 26. Further, the bottom surfaces of the pair of electrodes 24 are not covered by the wavelength conversion member 26, but are covered by the first metal film 25. The area of the first metal film 25 can be larger than the size of the electrode 24. This makes it easier to inspect the light emitting characteristics of the light emitting device 30A, for example. Therefore, when incorporating the light emitting device as a part of the light emitting module, it becomes easy to select the chromaticity and the brightness of the light emitting device, and the light emitting module with less color unevenness and brightness unevenness can be obtained.

The light emitting device 30B shown in FIG. 4C includes a wavelength conversion member 26 that covers the main light emitting surface 21a and the side surface 21c of the light emitting element 21. The electrode forming surface 21b and the side surfaces of the pair of electrodes 24 are covered with the second reflective member 27. The bottom surfaces of the pair of electrodes 24 are exposed without being covered by the wavelength conversion member 26 and the second reflection member 27. The bottom surface of the electrode 24 exposed from these is covered with the first metal film 25. By covering the electrode forming surface 21b with the second reflecting member 27, it is possible to reduce the absorption of light by the electrode 24. Further, by using the first metal film 25 having an area larger than that of the electrode 24, it is easy to inspect the light emitting characteristics and to obtain a light emitting module with less color unevenness and brightness unevenness as in the light emitting device 30A shown in FIG. 4B. can do.

(Light emitting element)
As the light emitting element 21, a known semiconductor light emitting element can be used. In the first embodiment, a light emitting diode is exemplified as the light emitting element 21.

The light emitting element 21 includes, for example, a semiconductor laminate 22 including a translucent element substrate 22s such as sapphire and a semiconductor layer laminated on the element substrate 22s. The semiconductor laminate 22 includes a light emitting layer 22a, an n-type semiconductor layer 22n and a p-type semiconductor layer 22p sandwiching the light emitting layer 22a, and n as a pair of electrodes 24 on the n-type semiconductor layer 22n and the p-type semiconductor layer 22p. The electrode 24n and the p-electrode 24p are electrically connected to each other. The light emitting element 21 is arranged so that, for example, the main light emitting surface 22a including the element substrate 22s faces the bottom surface 121a of the first recess 121 of the light guide plate 10.

As the light emitting element 21, an element that emits light having an arbitrary wavelength can be selected. For example, blue, as the device that emits green light, using the light emitting device using nitride semiconductor _{(In x Al y Ga 1-} x-y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) be able to. Various emission wavelengths can be selected depending on the material of the semiconductor laminate and its mixed crystallinity. The composition, emission color, size, number, and the like of the light emitting elements to be used may be appropriately selected according to the purpose. The light emitting device 21 is a nitride semiconductor (In _x Al _y Ga _1-xy N, 0 ≦ X, 0 ≦ Y, X + Y ≦) capable of emitting short wavelength light capable of efficiently exciting a wavelength conversion member. It is preferable to provide 1).

The shape of the light emitting element 21 can be a quadrangle such as a square or a rectangle, or a polygon such as a triangle or a hexagon. The size of the light emitting element 21 is preferably, for example, 1000 μm or less in the vertical and horizontal dimensions in a plan view, more preferably 500 μm or less in the vertical and horizontal dimensions, and further preferably the vertical and horizontal dimensions. Is 200 μm or less. When such a light emitting element is used, a high-definition image can be realized when the liquid crystal display device is locally dimmed.

(Wavelength conversion member)
The wavelength conversion member 26 includes a wavelength conversion substance such as a phosphor that converts the wavelength of light emitted from the light emitting element 21 into light having a different wavelength. For example, the wavelength conversion member 26 may be a single layer or a plurality of layers.

The wavelength conversion member 26 includes a translucent material as a base material and a particulate phosphor as a wavelength conversion substance.

The translucent material is translucent so as to transmit at least the light from the light emitting element 21, transmits 60% or more of the light emitted from the light emitting element 21, preferably 90% or more. As the material of the wavelength conversion member 26, a translucent thermosetting resin material such as an epoxy resin or a silicone resin can be used.

Examples of the phosphor include an yttrium aluminum garnet-based phosphor (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce) and a terbium aluminum garnet-based phosphor (for example, Lu ₃ (Al, Ga) ₅ O). ₁₂ : Ce), terbium aluminum garnet-based phosphor (for example, Tb ₃ (Al, Ga) ₅ O ₁₂ : Ce) -based phosphor, silicate-based phosphor (for example, (Ba, Sr) ₂ SiO ₄ : Eu), Examples thereof include chlorosilicate-based phosphors (for example, Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu). Further, as the nitride-based phosphor, a β-sialon-based phosphor (for example, Si _6-z Al _{z Oz} N _8-z : Eu (0 <z <4.2)) and an α-sialon-based phosphor (for example, Mz (for example)) Si, Al) ₁₂ (O, N) ₁₆ (where 0 <z≤2, M is a lanthanide element excluding Li, Mg, Ca, Y, and La and Ce), nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphor (e.g. _{(Sr, Ca) AlSiN 3:} . Eu) and the like general formula _{(I) Ma x Mb y Al} 3 N z: phosphor represented by Eu (provided that the general formula ( In I)), Ma is at least one element selected from the group consisting of Ca, Sr and Ba, and Mb is at least one element selected from the group consisting of Li, Na and K. , X, y and z satisfy 0.5 ≦ x ≦ 1.5, 0.5 ≦ y ≦ 1.2 and 3.5 ≦ z ≦ 4.5, respectively). Further, SGS-based phosphors (for example, SrGa ₂ S ₄ : Eu) can be mentioned. In addition, a manganese-activated fluoride-based phosphor represented by a manganese-activated fluoride-based phosphor (general formula (II) A ₂ [M _1-a Mn _a F ₆ ] (however, in the above general formula (II), A is K, It is at least one selected from the group consisting of Li, Na, Rb, Cs and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a is 0. <A <0.2 is satisfied)). Typical examples of the manganese-activated fluoride phosphors, phosphor manganese-activated fluoride potassium silicate (e.g. _{KSF (K 2 SiF 6: Mn} )) is.

One wavelength conversion member may contain one or more types of phosphors. The plurality of types of phosphors may be used in a mixed manner, or may be used in a laminated manner. For example, a light emitting element 21 that emits blue light may be used, and the phosphor may include a β-sialon phosphor that emits green light and a fluoride phosphor such as a KSF phosphor that emits red light. it can. By using these two types of phosphors, the color reproduction range of the light emitting module can be expanded. Further, the phosphor may be a quantum dot.

The phosphor may be arranged in any way inside the wavelength conversion member. For example, the phosphors may be distributed substantially uniformly inside the wavelength conversion member, or may be unevenly distributed in a part thereof.

The wavelength conversion member may contain a light diffusing substance. Examples of the light diffusing substance include fine particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , and ZnO.

In the light emitting device shown in FIGS. 4A to 4C, the thickness of the wavelength conversion member 26 covering the main light emitting surface 21a of the light emitting element 21 can be 30 μm to 50 μm. Further, the thickness of the wavelength conversion member 26 covering the side surface 21c of the light emitting element 21 can be 10 μm to 1000 μm. It is preferable that the thickness of the wavelength conversion member 26 covering the main light emitting surface 21a of the light emitting element 21 and the thickness of the wavelength conversion member 26 covering the side surface 21c of the light emitting element 21 are the same. However, the thickness is not limited to this, and different thicknesses may be used.

In the light emitting device 30A shown in FIG. 4B, the thickness of the wavelength conversion member 26 covering the electrode forming surface 21b of the light emitting element 21 can be about 5 μm to 50 μm. Further, the thickness of the wavelength conversion member 26 covering the electrode forming surface 21b of the light emitting element 21 can be made about the same as the thickness of the pair of electrodes 24.

The wavelength conversion member 26 in the case where the wavelength conversion member 26 is arranged in the first recess 121 of the light guide plate 10 without using the light emitting device 30 as the light source member 20 will be described.

As shown in FIG. 5, the wavelength conversion member 26 is preferably arranged in the entire region sandwiched between the main light emitting surface 21a of the light emitting element 21 and the bottom surface 121a of the first recess 121. Further, the wavelength conversion member 26 is preferably arranged so as to cover the entire bottom surface 121a of the first recess 121. It is preferable that the light emitting element 21 is arranged in the entire region sandwiched between the side surface 21c and the side surface 121b of the first recess 121.

(Second reflective member)
When a light emitting device 30B as shown in FIG. 4C is used as the light source member 20, a second reflecting member 27 that covers the electrode forming surface 22b of the light emitting element 21 and the side surfaces of the pair of electrodes 24 is provided. The thickness of the second reflective member 27 can be, for example, about 5 μm to 200 μm. Further, the second reflective member 27 can be set to the same height as the pair of electrodes 24.

The second reflecting member 27 has a reflectance of 60% or more, preferably 90% or more, with respect to the light emitted from the light emitting element 21. The material of the second reflective member 27 is preferably a resin material containing a white pigment or the like. In particular, a silicone resin containing titanium oxide is preferable.

(1st metal film)
When the light emitting devices 30A and 30B as shown in FIGS. 4B and 4C are used as the light source member 20, that is, when the electrode forming surface 21b of the light emitting element 21 is covered with the wavelength conversion member 26 or the second reflecting member 27. The light emitting devices 30A and 30B may be provided with a metal film 25 that is electrically connected to the pair of electrodes 24 and covers the bottom surfaces of the pair of electrodes 24, respectively. The material of the metal film 25 can be, for example, a laminated structure in which Cu / Ni / Au are laminated in this order. The metal film 25 may be arranged so as to continuously cover the second reflection member 27 or the wavelength conversion member 26 that covers the side surfaces of the pair of electrodes 24, and the electrodes 24.

[Joining member]
When the light emitting device shown in FIGS. 4A to 4C is used as the light source member 20, the light emitting device and the light guide plate 10 are joined by a translucent joining member 40. The joining member 40 has a role of propagating the light emitted from the light emitting device 30 which is the light source member 20 to the light guide plate 10. The joining member 40 is arranged between the bottom surface 121a of the first recess 121 on the second main surface 12 side of the light guide plate 10 and the light emitting device 30. Further, it is arranged between the light emitting device 30 and the side surface 121b of the first recess 121. Further, the joining member 40 may extend to the second main surface 12 of the light guide plate 10.

The joining member 40 is translucent, and transmits 60% or more, preferably 90% or more of the light emitted from the light source member 20 (light emitting device 30). Further, the joining member 40 is preferably made of a material having a refractive index similar to that of the material of the light guide plate 10. For example, as the material of the base material, an epoxy resin, a silicone resin, a resin in which these are mixed, or a translucent material such as glass can be used. From the viewpoint of light resistance and moldability of the connecting member 40, it is beneficial to select a silicone resin as the base material of the connecting member 40.

[Sealing member 50]
The sealing member 50 is a light-reflecting member that covers the plurality of light source members 20 and the second main surface 12 of the light guide plate 10. By using the sealing member 50 as a light reflecting member, light emitted from the light source member 20 can be efficiently taken into the light guide plate 10.

The sealing member 50 has a reflectance of 60% or more, preferably 90% or more, with respect to the light emitted from the light source member 20. The material of the sealing member 50 is preferably a resin material containing a white pigment or the like. In particular, a silicone resin containing titanium oxide is preferable. As a result, the light emitting module 100 can be made inexpensive by using a large amount of an inexpensive raw material such as titanium oxide as a material used in a relatively large amount to cover one surface of the light guide plate 10.

[Second metal film]
The light emitting module 100 may be provided with a second metal film 60 that is electrically connected to the electrodes 24 of the plurality of light source members 20 on the sealing member 50. The second metal film 60 may be arranged on the sealing member 50. When a light emitting device including the first metal film 25 as shown in FIGS. 4B and 4C is used as the light source member 20, the second metal film 60 is arranged so as to be electrically connected to the first metal film 25. You may. Further, even when a light emitting device including the first metal film 25 is used, the second metal film 60 may be formed so as to be in contact with the electrode 24 after removing the first metal film 25 in the process. The material of the second metal film 60 can be, for example, a laminated structure in which Cu / Ni / Au are laminated in this order.

[Wiring board]
As shown in FIG. 1B, the light emitting module 100 may have a wiring board 70. The wiring board 70 is a board including an insulating base material 71, wiring 72 electrically connected to a plurality of light source members 20, and the like. By providing the wiring board 70, complicated wiring required for local dimming or the like can be easily formed. In this wiring board 70, after the light source member 20 is connected to the light guide plate 10 to form the sealing member 50 and the second metal film 60, the wiring 72 of the wiring board 70 prepared separately and the second metal film 60 are connected. , Can be joined.

The wiring board 70 includes, for example, a conductive member filled in a plurality of via holes provided in the insulating base material 71, and a wiring 72 electrically connected to the conductive member on both sides of the base material 71. , Equipped with.

The wiring board 70 may have a laminated structure. For example, as the wiring board 70, a metal plate having an insulating layer on its surface may be used. Further, the wiring board 70 may be a TFT board having a plurality of TFTs (Thin-Film Transistors).

As the material of the base material 71 of the wiring board 70, for example, ceramics or resin can be used. A resin may be selected as the material of the base material 71 from the viewpoint of low cost and ease of molding. Examples of the resin include composite materials such as phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), polyethylene terephthalate (PET), unsaturated polyester, and glass epoxy. Further, it may be a rigid substrate or a flexible substrate.

The wiring 72 is, for example, a conductive foil (conductor layer) provided on the base material 71, and is electrically connected to a plurality of light source members 20. The material of the wiring 72 preferably has high thermal conductivity. Examples of such a material include a conductive material such as copper. Further, the wiring 72 can be formed by plating, coating a conductive paste, printing, or the like, and the thickness of the wiring 62 is, for example, about 5 to 50 μm.

The wiring board 70 may be joined to the light guide plate 10 or the like by any method. For example, a sheet-shaped adhesive sheet can be joined by arranging it between the surface of the sealing member 50 provided on the opposite side of the light guide plate 10 and the surface of the wiring board 70 and crimping it. Further, the wiring 72 of the wiring board 70 and the light source member 20 may be electrically connected by any method. For example, the conductive member, which is a metal embedded in the via hole, can be melted by pressurization and heating and joined to the second metal film 60.

The following steps can be mentioned as an example of a method for manufacturing such a light emitting module.
(1) Step of preparing a light source member including a light emitting element and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element (2) A first main surface to be a light extraction surface and opposite to the first main surface Step of preparing a light guide plate having a second main surface having a plurality of recesses, which is the second main surface on the side (3) The bottom surface of the recess so that the side surface of the recess and the side surface of the light emitting element are at least opposed to each other. Step of placing the light source member on top (4) Step of arranging the light source member and the sealing member that covers the second main surface

Each step of the manufacturing method of the light emitting module 100 will be described in detail below.

(1) Step of preparing a light source member (light emitting device) including a light emitting element and a wavelength conversion member

The light source member 20 can be manufactured, for example, by the steps shown in FIGS. 6A to 6D, 7A, and 7B. First, as shown in FIG. 6A, a plurality of light emitting elements 21 are arranged on the support 80 with the pair of electrodes facing down. Then, the wavelength conversion member 26 is formed so as to fill the light emitting element 21. The wavelength conversion member 26 can be formed, for example, by arranging the wavelength conversion member 26 before curing on the support 80, printing with a squeegee 81 or the like, and then curing.

Further, as shown in FIG. 7A, the wavelength conversion member 26 is formed by spraying the wavelength conversion member 26 before curing using the spray nozzle 83 so as to fill the light emitting element 21 as shown in FIG. 7B. It can be formed by a curing method.

Next, as shown in FIG. 6C, the wavelength conversion member 26 can be cut with a cutting blade 82 such as a dicer to obtain a light emitting device 30 serving as a light source member 20.

(2) A step of preparing a light guide plate having a first main surface to be a light emitting surface and a second main surface opposite to the first main surface and having a second main surface having a plurality of recesses.

The light guide plate 10 is prepared. As shown in FIG. 8A, the second main surface 12 of the light guide plate 10 is provided with a plurality of first recesses 121 having a substantially quadrangular opening. Further, the second main surface 12 is provided with a second recess 122 between the adjacent first recess 121. As shown in FIG. 2A, the second recess 122 is arranged so as to surround the first recess 121 in a top view. The first main surface 11 on the opposite side of the second main surface 12 is provided with an optical functional unit 111 which is a conical trapezoidal recess.

Such a light guide plate 10 can be prepared, for example, by molding by injection molding, transfer molding, thermal transfer, or the like. Further, the first recess 121 and the second recess 122 of the light guide plate 10 and the optical functional unit 111 can be collectively formed by a mold at the time of molding the light guide plate 10. As a result, the misalignment during molding can be reduced. Further, the light guide plate 10 may be prepared by preparing and processing a plate having no first recess 121, a second recess 122, and an optical function portion 111. Alternatively, the light guide plate 10 provided with the first recess 121, the second recess 122, and the optical function unit 111 may be purchased and prepared.

(3) A step of placing a light source member (light emitting device) on the bottom surface of the recess so that the side surface of the first recess and the side surface of the light emitting element are at least opposed to each other. Next, as shown in FIG. 8B, the first A liquid joining member 40 is arranged on the bottom surface 121a of the recess 121. The joining member 40 can be applied by a method such as potting, transfer, or printing. FIG. 8B illustrates a case where the joining member 40 is arranged by potting using the dispense nozzle 84. Further, the joining member 40 may be provided on the light emitting device 30 side. For example, a method may be used in which the light emitting device 30 is picked up by a suction member such as a suction collet, and the light emitting surface of the light emitting device 30 is immersed in the liquid bonding member 40 to attach the bonding member 40.

Next, as shown in FIG. 8C, the light emitting device 30 is placed on the joining member 40 in the first recess 121. At this time, the light emitting device 30 is placed with the electrode 24 facing up. At this time, at least a part of the side surface of the light emitting element 21 of the light emitting device 30 is made to face the side surface of the first recess 121. That is, a part of the light emitting device 30 is embedded in the joining member 40. After that, the light emitting device 30 and the light guide plate 10 are joined by curing the joining member 40.

(4) Step of Arranging the Light Source Member and the Sealing Member that Covers the Second Main Surface Next, as shown in FIG. 8D, the seal that covers the second main surface 12 of the light guide plate 10 and the plurality of light emitting devices 30. The stop member 50 is formed. The sealing member 50 can be formed by a method such as transfer molding, potting, printing, or spraying. FIG. 8D shows an example in which the sealing member 50 is thickly formed so as to cover the electrode 24 of the light emitting device 320 by using the dispense nozzle 84. In other words, the sealing member 50 may be formed so that at least a part of the electrode 24 is exposed so as not to fill the electrode 24.

(5) Step of removing the sealing member until the electrode is exposed Next, as shown in FIG. 8E, the surface of the sealing member 50 is removed over the entire surface. As a result, as shown in FIG. 8G, the electrode 24 of the light emitting device 30 is exposed from the sealing member 50. Examples of the grinding method include a method of grinding the sealing member 50 in a planar shape using a grinding member 90 such as a grindstone. Alternatively, as shown in FIG. 8F, the blast nozzle 91 may be used to eject the hard particles 92 to remove a part of the sealing member 50.

When the light emitting device 30 includes the first metal film 25 connected to the electrode 24, the sealing member 50 may be removed until the first metal film 25 is exposed. In either case, the sealing member 50 is removed until the conductive member capable of supplying power to the light emitting element 21 of the light source member 20 is exposed. Further, when the sealing member 50 is formed so as not to fill the electrode 24 in advance, this step can be omitted.

(6) Step of Forming a Metal Film for Electrically Connecting to a Multiple Light Emitting Elements Next, as shown in FIG. 8H, a second metal film is formed on substantially the entire surface of the electrode 24 of the light emitting device 30 and the sealing member 50. Form 60. The second metal film 60 may have, for example, a laminated structure in which Cu / Ni / Au are laminated in this order from the light guide plate 10 side. Examples of the method for forming the second metal film 60 include sputtering, plating, and the like, and it is preferable to form the second metal film 60 by sputtering.

Next, as shown in FIG. 8I, the second metal film 60 is irradiated with the laser beam 94 from the laser light source 93, and patterning is performed by laser ablation to remove the second metal film 60 of the irradiated portion. As a result, a separated second metal film 60 is formed as shown in FIG. 8J. The second metal film 60 is electrically connected to the electrode 24 of the light emitting device 30.

In this way, the light emitting module 100A can be obtained. Further, the second metal film 60 and the wiring 72 of the wiring board 70 prepared separately can be adhered to each other, whereby the light emitting module 100 provided with the wiring board 70 as shown in FIG. 1B can be obtained.

The plurality of light source members 20 can be wired so as to be driven independently of each other. Further, the light guide plate 10 is divided into a plurality of ranges, and a plurality of light emitting devices 30 mounted in one range are grouped into one group, and the plurality of light emitting devices 30 in one group are electrically connected in series or in parallel. It may be connected to the same circuit by connecting to, and a plurality of such light emitting device (light source member) groups may be provided. By performing such grouping, it is possible to obtain a light emitting module capable of local dimming.

Embodiment 2
Next, the light emitting module 100B of the second embodiment according to the present invention will be described with reference to FIGS. 9A to 9C. 9A is a sectional view of the light emitting module 100B, FIG. 9B is an enlarged sectional view showing one light source member and its vicinity in the sectional view of FIG. 9A, and FIG. 9C shows a configuration of the light source member 120. It is sectional drawing which shows.

As shown in FIGS. 9A to 9C, the light emitting module 100B of the second embodiment is configured in the same manner as the first embodiment except that the configuration of the light source member 120 is different from that of the first embodiment. Here, in FIGS. 9A to 9C, the same members as those described in the first embodiment are designated by the same reference numerals, and specific description of the same members will be omitted.
Hereinafter, the light emitting module 100B of the second embodiment will be described as being different from the first embodiment.

In the light emitting module 100B of the second embodiment, the light source member 120 has a light diffusion light guide member 127 provided on the upper surface of the wavelength conversion member 126. The light diffusing light guide member 127 is a light transmissive member containing a light diffusing substance, and diffuses the light emitted from the upper surface of the wavelength conversion member 126 in the lateral direction to emit the light.

In the example shown in FIG. 9C, a third recess 126r is formed on the upper surface of the wavelength conversion member 126, and the light diffusion light guide member 127 is a wavelength conversion member 126 inside the third recess 126r and around the third recess 126r. It is provided on the upper surface. Here, in the example shown in FIG. 9C, the upper surface of the wavelength conversion member 126 includes the inner surface of the third recess 126r and the upper surface of the wavelength conversion member 126 around the third recess 126r. Further, in FIG. 9C and the like, the size of the third recess 126r is drawn to be the same size as the main light emitting surface 21a of the light emitting element 21, but the present invention is not limited to this, and the third recess 126r The plan view shape may be larger or smaller than the main light emitting surface 21a.

In the light emitting module 100B of the second embodiment, the light diffusion light guide member 127 has a function of spreading light in the plane of the light guide plate 10 as in the optical function unit 111 described in the first embodiment. The light diffusion light guide member 127 is preferably provided so that the central axis of the light diffusion light guide member 127 coincides with the central axis of the main light emitting surface of the light emitting element 21, thereby transmitting light to the surface of the light guide plate 10. Light can be spread uniformly within, in other words, within the plane, without being biased in a particular direction.

The light diffusion light guide member 127 preferably emits light emitted from the upper surface of the wavelength conversion member 126 without absorbing it, and transmits, for example, 60% or more of the light emitted from the upper surface of the wavelength conversion member 126. , Preferably 90% or more. In order for the light diffusion light guide member 127 to have the above-mentioned translucency and light diffusivity, for example, the light diffusion light guide member 127 transmits light wavelength-converted by the light emitting element 21 and the wavelength conversion member 126, for example. The translucent member, which is a base material composed of a translucent material that transmits 60% or more, preferably 90% or more, contains a light diffusing substance that reflects the light without absorbing it. ..

As the translucent material constituting the translucent member, a translucent thermosetting resin material such as an epoxy resin or a silicone resin can be used. Examples of the light diffusing substance include fine particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , and ZnO.

In the light diffusing light guide member 127, the ratio of the light diffusing material contained in the light transmitting member is based on the characteristics required for the light emitting module 100B, and the light reflectivity, particle size and particle size distribution of the material used as the light diffusing material. It is appropriately set in consideration of the shape of the light guide plate 10 and the like.

In the light emitting module 100B configured as described above, the light wavelength-converted by the light emitting element 21 and the wavelength conversion member 126 can be uniformly spread in the plane of the light guide plate 10 without using the optical function unit.
Therefore, according to the light emitting module 100B of the second embodiment, light having less color unevenness and brightness unevenness can be emitted from the main light emitting surface 11 of the light guide plate 10 without using the optical function unit.

Further, according to the light emitting module 100B of the second embodiment, since the light can be uniformly spread and emitted from the light source member 120 into the plane of the light guide plate 10, the main light emission of the light guide plate 10 is performed without using the optical function unit. Light with less color unevenness and brightness unevenness can be emitted from the surface 11, and a thin surface emitting light source can be provided.

Further, in the light emitting module 100B of the second embodiment, an optical function unit may be further provided on the light guide plate 10 in addition to the light source member 120 including the light diffusion light guide member 127.

The light emitting module 100B of the second embodiment can be manufactured by the same method as the light emitting module 100A of the first embodiment except that the step of forming the light diffusion light guide member 127 is included in the step of manufacturing the light source member 120. ..

In the second embodiment, the light source member 120 is manufactured, for example, as follows.
As shown in FIG. 6A referred to in the first embodiment, the plurality of light emitting elements 21 are arranged on the support 80 with the pair of electrodes facing down.
Then, the uncured wavelength conversion member 126 is formed so as to fill the light emitting element 21.
Next, for example, a third recess 126r is formed on the upper surface of the wavelength conversion member 126 before curing at a position facing the light emitting element 21 by using a mold. The wavelength conversion member 126 is cured while maintaining the shape of the third recess 126r.
Next, an uncured translucent resin material containing a light diffusing substance is formed on the upper surface of the wavelength conversion member 126 cured so as to fill the third recess 126r.
Then, by curing the translucent resin material, a light-reflecting light guide member layer integrated on the wavelength conversion member 126 is formed.
Next, as described with reference to FIG. 6C, cutting is performed using a cutting blade 82 such as a dicer. As described above, the light source member 120 can be obtained.

Modification 1 of the second embodiment
In the light emitting module 100B of the second embodiment, the example using the light source member 120 shown in FIG. 9C has been described. However, the light emitting module 100B of the second embodiment may be configured by using the light source member 120a shown in FIG. 10A. The light source member 120a shown in FIG. 10A includes a wavelength conversion member 126a not provided with the third recess 126r instead of the wavelength conversion member 126 having the third recess 126r shown in FIG. 9C, and the wavelength conversion member 126a is flat. It is different from the light source member 120 shown in FIG. 9C in that it has a light diffusion light guide member 127a having a substantially constant thickness on the upper surface.

The light emitting module 100B of the second embodiment can also be configured by using the light source member 120a configured as described above.

Modification 2 of the second embodiment
In the light emitting module 100B of the second embodiment, the example using the light source member 120 shown in FIG. 9C has been described. However, the light emitting module 100B of the second embodiment may be configured by using the light source member 120b shown in FIG. 10B. The light source member 120b shown in FIG. 10B is the same as FIG. 9C in that it has a wavelength conversion member 126 provided with the third recess 126r shown in FIG. 9C, but the light source member 120b shown in FIG. 10B has a third light source member 120b. It differs from the light source member 120 shown in FIG. 9C in that the light diffusion light guide member 127b is provided only inside the recess 126r.

The light emitting module 100B of the second embodiment can also be configured by using the light source member 120b configured as described above.

As described above in Modifications 1 and 2, in the light source member, the light diffusion light guide member can be formed in various forms on the upper surface of the wavelength conversion member. Other than those illustrated in FIGS. 9C, 10A and 10B, for example, a third recess is formed in the shape of a cone or a weight trap, and light extends only inside or around the inside thereof. A diffused light guide member may be formed.
Further, the third recess may be a polygonal pyramid such as a quadrangular pyramid or a hexagonal pyramid.

Modification 3 of the second embodiment
The light emitting module 100B of the second embodiment may be configured by using the light source member 120c shown in FIG. 11A. The light source member 120c shown in FIG. 11A is different from the light source member 120b shown in FIG. 10B in that the side surface of the wavelength conversion member 126c is inclined. The light source member 120c is the same as the light source member 120b shown in FIG. 10B except that the side surface of the wavelength conversion member 126c is inclined.

More specifically, the thickness of the wavelength conversion member 126c covering the side surface of the light emitting element 21 is almost zero in the vicinity of the electrode forming surface of the light emitting element 21, and the electrode forming surface of the light emitting element 21 becomes the main light emitting surface 21a. The thickness is gradually increasing toward it.
Further, FIG. 11B is an enlarged cross-sectional view showing a part of the cross section of the light emitting module when the light source member 120c shown in FIG. 11A is mounted.

In the light emitting module configured including the light source member 120c of the modification 3 configured as described above, since the side surface of the wavelength conversion member 126c is inclined in the light source member 120c, the area of the side surface of the optical member 120c is large. , Can be made larger than when not tilted. As a result, the amount of light emitted to the light guide plate 10 can be increased, and the brightness of the light emitting module can be increased.

One of the light emitting modules 100 and the light emitting module 100 of the present embodiment may be used as a backlight of one liquid crystal display device. Further, a plurality of light emitting modules 100 may be arranged side by side and used as a backlight of one liquid crystal display device.

One light emitting module 100 may be bonded to one wiring board 70. Further, a plurality of light emitting modules 100 may be joined to one wiring board 70. As a result, the electrical connection terminals (for example, connectors) to the outside can be integrated (that is, it is not necessary to prepare each light emitting module), so that the structure of the liquid crystal display device can be simplified.

Further, one wiring board 70 to which the plurality of light emitting modules 100 are joined may be arranged side by side to serve as a backlight of one liquid crystal display device. At this time, for example, a plurality of wiring boards 70 can be placed on a frame or the like and each can be connected to an external power source by using a connector or the like.

The light emitting module according to the present disclosure can be used, for example, as a backlight of a liquid crystal display device.

100, 100B ... Light emitting module 10 ... Light guide plate 11 ... First main surface (light extraction surface)
111 ... Optical function unit 111a ... Bottom surface of optical function unit 111b ... Side surface of optical function unit 112 ... Low refractive index member 113 ... First reflection member 12 ... Second main surface 121 ... First recess 121a ... Bottom surface of first recess 121b ... Side surface of the first recess 122 ... Second recess 122a ... Bottom of the second recess 122b ... Side surface of the second recess 20, 120, 120a, 120b, 120c ... Light source member 20a ... Light source member 20b ... Light source member electrode Formed surface 20c ... Side surface of light source member 21 ... Light emitting element 21a ... Main light emitting surface 21b ... Electrode forming surface 21c ... Side surface 22 ... Semiconductor laminate 22p ... P-type semiconductor layer 22n ... n-type semiconductor layer 22a ... Light emitting layer 22s ... Element substrate 24 ... Electrode 24p ... p Electrode 24n ... n Electrode 25 ... First metal film 26, 126, 126a, 126c ... Wavelength conversion member 27 ... Second reflection member 30, 30A, 30B ... Light source 40 ... Joining member 50 ... Sealing Member 60 ... Second metal film 70 ... Wiring substrate 71 ... Base material 72 ... Wiring 80 ... Support 81 ... Squeegee 82 ... Cutting blade 83 ... Spray nozzle 84 ... Dispens nozzle 90 ... Grinding member 91 ... Blast nozzle 92 ... Particle 93 ... Laser light source 94 ... Laser light 126r ... Third recess 127, 127a, 127b ... Light diffusion light guide member

Claims (9)

A light guide plate having a first main surface and a second main surface opposite to the first main surface and having a first recess.
A light source member arranged on the second main surface side, the electrode forming surface located on the opposite side of the main light emitting surface and the main light emitting surface, and the side surface between the main light emitting surface and the electrode forming surface. A plurality of light source members including a light emitting element having the light emitting element, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element.
The light source member and the sealing member covering the second main surface of the light guide plate are provided.
The light source member is joined to the light guide plate by a joining member arranged between the bottom surface of the first recess and the light source member and between the side surface of the first recess and the light source member, and the joining member is joined to the light guide plate. A light source module that extends to the second main surface. The depth of the first recess is the thickness of the wavelength conversion member between the main light emitting surface of the light emitting element and the bottom surface of the first recess, and the bottom surface of the first recess and the wavelength conversion member. The light emitting module according to claim 1, which is larger than the sum of the thickness of the joining member between the two. The first or second aspect of the light emitting element, wherein the light emitting element includes a semiconductor laminate including an element substrate, and 20% or more of the length of the side surface of the element substrate faces the side surface of the first recess in a cross-sectional view. The light emitting module described. According to claim 1 or 2, the light emitting device includes a semiconductor laminate including an element substrate, and 50% or more of the length of the side surface of the element substrate faces the side surface of the first recess in a cross-sectional view. The light emitting module described. Claims 1 to claim that the light guide plate has a second recess surrounding the first recess, and a low refractive index member having a refractive index lower than that of the light guide plate is arranged in the second recess. The light emitting module according to any one of 3. The light emitting module according to any one of claims 1 to 5, wherein the light guide plate includes an optical function unit located on the first main surface and located at a position corresponding to the first recess. The light emitting module according to claim 6, wherein the optical functional unit includes a first reflective member. The light emitting module according to claim 6 or 7, wherein the optical functional unit is a cone-shaped or pyramidal-shaped recess whose cross section becomes smaller toward the light emitting surface of the light emitting element. The light emitting module according to any one of claims 1 to 8, wherein the light source member includes a second reflecting member that covers the electrode forming surface of the light emitting element.

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